JP2017159382A5 - - Google Patents

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Publication number
JP2017159382A5
JP2017159382A5 JP2016044113A JP2016044113A JP2017159382A5 JP 2017159382 A5 JP2017159382 A5 JP 2017159382A5 JP 2016044113 A JP2016044113 A JP 2016044113A JP 2016044113 A JP2016044113 A JP 2016044113A JP 2017159382 A5 JP2017159382 A5 JP 2017159382A5
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JP
Japan
Prior art keywords
probe
measurement
control unit
irradiate
measurement window
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JP2016044113A
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English (en)
Japanese (ja)
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JP6622117B2 (ja
JP2017159382A (ja
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Priority to JP2016044113A priority Critical patent/JP6622117B2/ja
Priority claimed from JP2016044113A external-priority patent/JP6622117B2/ja
Priority to KR1020170023261A priority patent/KR102496905B1/ko
Priority to CN201710129352.0A priority patent/CN107160288B/zh
Priority to TW106107403A priority patent/TWI709457B/zh
Publication of JP2017159382A publication Critical patent/JP2017159382A/ja
Publication of JP2017159382A5 publication Critical patent/JP2017159382A5/ja
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Publication of JP6622117B2 publication Critical patent/JP6622117B2/ja
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JP2016044113A 2016-03-08 2016-03-08 平面研磨装置及びキャリア Active JP6622117B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016044113A JP6622117B2 (ja) 2016-03-08 2016-03-08 平面研磨装置及びキャリア
KR1020170023261A KR102496905B1 (ko) 2016-03-08 2017-02-22 평면 연마 장치 및 캐리어
CN201710129352.0A CN107160288B (zh) 2016-03-08 2017-03-06 平面研磨装置及游星轮
TW106107403A TWI709457B (zh) 2016-03-08 2017-03-07 平面研磨裝置及載具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016044113A JP6622117B2 (ja) 2016-03-08 2016-03-08 平面研磨装置及びキャリア

Publications (3)

Publication Number Publication Date
JP2017159382A JP2017159382A (ja) 2017-09-14
JP2017159382A5 true JP2017159382A5 (enExample) 2019-02-14
JP6622117B2 JP6622117B2 (ja) 2019-12-18

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ID=59848707

Family Applications (1)

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JP2016044113A Active JP6622117B2 (ja) 2016-03-08 2016-03-08 平面研磨装置及びキャリア

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JP (1) JP6622117B2 (enExample)
KR (1) KR102496905B1 (enExample)
CN (1) CN107160288B (enExample)
TW (1) TWI709457B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6760638B2 (ja) * 2016-04-14 2020-09-23 スピードファム株式会社 平面研磨装置
CN107486786A (zh) * 2017-10-01 2017-12-19 德清凯晶光电科技有限公司 防塌边游星轮
JP7035748B2 (ja) * 2018-04-11 2022-03-15 株式会社Sumco ワークの両面研磨装置
JP7046358B2 (ja) * 2018-04-17 2022-04-04 スピードファム株式会社 研磨装置
JP7364217B2 (ja) * 2019-11-05 2023-10-18 スピードファム株式会社 研磨装置
JP7651151B2 (ja) * 2019-12-25 2025-03-26 スピードファム株式会社 ワークホール検出装置及びワークホール検出方法
JP7435113B2 (ja) * 2020-03-23 2024-02-21 株式会社Sumco ワークの両面研磨装置
JP7425411B2 (ja) * 2020-10-12 2024-01-31 株式会社Sumco キャリア測定装置、キャリア測定方法、及びキャリア管理方法
JP7593492B2 (ja) * 2021-06-04 2024-12-03 株式会社Sumco ワークの両面研磨装置および両面研磨方法
CN117506703B (zh) * 2023-12-01 2024-05-10 苏州博宏源机械制造有限公司 测量装置及抛光系统
TWI880618B (zh) * 2024-01-31 2025-04-11 準力機械股份有限公司 基板研磨設備的研磨構造

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61213611A (ja) * 1985-03-19 1986-09-22 Nec Corp 結晶の研磨方法
JPH05309559A (ja) * 1992-05-12 1993-11-22 Speedfam Co Ltd 平面研磨方法及び装置
JPH0740233A (ja) * 1993-07-27 1995-02-10 Speedfam Co Ltd ワークの厚さ測定装置
JP3326443B2 (ja) * 1993-08-10 2002-09-24 株式会社ニコン ウエハ研磨方法及びその装置
EP0738561B1 (en) * 1995-03-28 2002-01-23 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection and monitoring for chemical mechanical polishing operations
JP2888339B1 (ja) * 1998-03-27 1999-05-10 直江津電子工業株式会社 被加工物保持プレート
JP2008227393A (ja) * 2007-03-15 2008-09-25 Fujikoshi Mach Corp ウェーハの両面研磨装置
US8834230B2 (en) * 2008-07-31 2014-09-16 Shin-Etsu Handotai Co., Ltd. Wafer polishing method and double-side polishing apparatus
JP2010045279A (ja) * 2008-08-18 2010-02-25 Nippon Steel Corp 半導体基板の両面研磨方法
CN201419354Y (zh) * 2009-04-29 2010-03-10 上海合晶硅材料有限公司 一种用于加工薄型硅单晶片的行星片
JP2012205258A (ja) * 2011-03-28 2012-10-22 Seiko Instruments Inc 研磨方法、圧電振動片の製造方法、圧電振動子、発振器、電子機器及び電波時計
JP5630414B2 (ja) * 2011-10-04 2014-11-26 信越半導体株式会社 ウェーハの加工方法
JP5896884B2 (ja) * 2012-11-13 2016-03-30 信越半導体株式会社 両面研磨方法
JP6003800B2 (ja) * 2013-05-16 2016-10-05 信越半導体株式会社 ウェーハの両面研磨方法及び両面研磨システム
JP6146213B2 (ja) * 2013-08-30 2017-06-14 株式会社Sumco ワークの両面研磨装置及び両面研磨方法
KR20150053049A (ko) * 2013-11-07 2015-05-15 주식회사 엘지실트론 웨이퍼의 양면 연마 방법
JP6255991B2 (ja) * 2013-12-26 2018-01-10 株式会社Sumco ワークの両面研磨装置

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