JP2017150038A - シャドーマスク及び表示装置の製造方法 - Google Patents

シャドーマスク及び表示装置の製造方法 Download PDF

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Publication number
JP2017150038A
JP2017150038A JP2016034017A JP2016034017A JP2017150038A JP 2017150038 A JP2017150038 A JP 2017150038A JP 2016034017 A JP2016034017 A JP 2016034017A JP 2016034017 A JP2016034017 A JP 2016034017A JP 2017150038 A JP2017150038 A JP 2017150038A
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JP
Japan
Prior art keywords
shadow mask
frame
mask according
film
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016034017A
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English (en)
Japanese (ja)
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JP2017150038A5 (https=
Inventor
健 大河原
Takeshi Ogawara
健 大河原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Display Inc
Original Assignee
Japan Display Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Display Inc filed Critical Japan Display Inc
Priority to JP2016034017A priority Critical patent/JP2017150038A/ja
Priority to US15/392,735 priority patent/US20170250343A1/en
Publication of JP2017150038A publication Critical patent/JP2017150038A/ja
Publication of JP2017150038A5 publication Critical patent/JP2017150038A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
JP2016034017A 2016-02-25 2016-02-25 シャドーマスク及び表示装置の製造方法 Pending JP2017150038A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016034017A JP2017150038A (ja) 2016-02-25 2016-02-25 シャドーマスク及び表示装置の製造方法
US15/392,735 US20170250343A1 (en) 2016-02-25 2016-12-28 Shadow mask and method of manufacturing a display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016034017A JP2017150038A (ja) 2016-02-25 2016-02-25 シャドーマスク及び表示装置の製造方法

Publications (2)

Publication Number Publication Date
JP2017150038A true JP2017150038A (ja) 2017-08-31
JP2017150038A5 JP2017150038A5 (https=) 2019-04-04

Family

ID=59679789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016034017A Pending JP2017150038A (ja) 2016-02-25 2016-02-25 シャドーマスク及び表示装置の製造方法

Country Status (2)

Country Link
US (1) US20170250343A1 (https=)
JP (1) JP2017150038A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026048622A1 (ja) * 2024-08-27 2026-03-05 Ｔｏｐｐａｎホールディングス株式会社 メタルマスク、積層セラミックコンデンサの内部電極パターンの形成方法、積層セラミックコンデンサの内部電極の形成方法、積層セラミックコンデンサの製造方法および積層セラミックコンデンサの内部電極形成用メタルマスクの管理方法
JP2026042157A (ja) * 2024-08-27 2026-03-11 Ｔｏｐｐａｎホールディングス株式会社 メタルマスク、積層セラミックコンデンサの内部電極パターンの形成方法、積層セラミックコンデンサの内部電極の形成方法、積層セラミックコンデンサの製造方法および積層セラミックコンデンサの内部電極形成用メタルマスクの管理方法
JP2026042475A (ja) * 2024-08-27 2026-03-11 Ｔｏｐｐａｎホールディングス株式会社 メタルマスク、積層セラミックコンデンサの内部電極パターンの形成方法、積層セラミックコンデンサの内部電極の形成方法、積層セラミックコンデンサの製造方法および積層セラミックコンデンサの内部電極形成用メタルマスクの管理方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107994054B (zh) * 2017-11-07 2020-05-29 上海天马有机发光显示技术有限公司 一种有机电致发光显示面板、其制作方法及显示装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05255846A (ja) * 1992-03-12 1993-10-05 Toshiba Corp スパッタリング装置
JP2000017422A (ja) * 1998-07-07 2000-01-18 Toray Ind Inc 導電膜パターン化用マスク
JP2002030434A (ja) * 2000-07-19 2002-01-31 Toray Ind Inc 成膜装置
JP2003253434A (ja) * 2002-03-01 2003-09-10 Sanyo Electric Co Ltd 蒸着方法及び表示装置の製造方法
JP2005290524A (ja) * 2004-04-05 2005-10-20 Seiko Epson Corp マスク、マスクの製造方法、電気光学装置の製造方法および電子機器
JP2007095324A (ja) * 2005-09-27 2007-04-12 Hitachi Displays Ltd 有機ｅｌ表示パネルの製造方法、及びこの製造方法により製造した有機ｅｌ表示パネル

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05255846A (ja) * 1992-03-12 1993-10-05 Toshiba Corp スパッタリング装置
JP2000017422A (ja) * 1998-07-07 2000-01-18 Toray Ind Inc 導電膜パターン化用マスク
JP2002030434A (ja) * 2000-07-19 2002-01-31 Toray Ind Inc 成膜装置
JP2003253434A (ja) * 2002-03-01 2003-09-10 Sanyo Electric Co Ltd 蒸着方法及び表示装置の製造方法
JP2005290524A (ja) * 2004-04-05 2005-10-20 Seiko Epson Corp マスク、マスクの製造方法、電気光学装置の製造方法および電子機器
JP2007095324A (ja) * 2005-09-27 2007-04-12 Hitachi Displays Ltd 有機ｅｌ表示パネルの製造方法、及びこの製造方法により製造した有機ｅｌ表示パネル

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026048622A1 (ja) * 2024-08-27 2026-03-05 Ｔｏｐｐａｎホールディングス株式会社 メタルマスク、積層セラミックコンデンサの内部電極パターンの形成方法、積層セラミックコンデンサの内部電極の形成方法、積層セラミックコンデンサの製造方法および積層セラミックコンデンサの内部電極形成用メタルマスクの管理方法
JP2026042157A (ja) * 2024-08-27 2026-03-11 Ｔｏｐｐａｎホールディングス株式会社 メタルマスク、積層セラミックコンデンサの内部電極パターンの形成方法、積層セラミックコンデンサの内部電極の形成方法、積層セラミックコンデンサの製造方法および積層セラミックコンデンサの内部電極形成用メタルマスクの管理方法
JP2026042475A (ja) * 2024-08-27 2026-03-11 Ｔｏｐｐａｎホールディングス株式会社 メタルマスク、積層セラミックコンデンサの内部電極パターンの形成方法、積層セラミックコンデンサの内部電極の形成方法、積層セラミックコンデンサの製造方法および積層セラミックコンデンサの内部電極形成用メタルマスクの管理方法
JP7845426B2 (ja) 2024-08-27 2026-04-14 Ｔｏｐｐａｎホールディングス株式会社 メタルマスク、積層セラミックコンデンサの内部電極パターンの形成方法、積層セラミックコンデンサの内部電極の形成方法、積層セラミックコンデンサの製造方法および積層セラミックコンデンサの内部電極形成用メタルマスクの管理方法
JP7845425B2 (ja) 2024-08-27 2026-04-14 Ｔｏｐｐａｎホールディングス株式会社 メタルマスク、積層セラミックコンデンサの内部電極パターンの形成方法、積層セラミックコンデンサの内部電極の形成方法、積層セラミックコンデンサの製造方法および積層セラミックコンデンサの内部電極形成用メタルマスクの管理方法

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