JP2017139707A - 圧電薄膜共振器、フィルタおよびデュプレクサ - Google Patents
圧電薄膜共振器、フィルタおよびデュプレクサ Download PDFInfo
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- JP2017139707A JP2017139707A JP2016020952A JP2016020952A JP2017139707A JP 2017139707 A JP2017139707 A JP 2017139707A JP 2016020952 A JP2016020952 A JP 2016020952A JP 2016020952 A JP2016020952 A JP 2016020952A JP 2017139707 A JP2017139707 A JP 2017139707A
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- 239000010409 thin film Substances 0.000 title claims abstract description 63
- 239000010408 film Substances 0.000 claims abstract description 336
- 238000003780 insertion Methods 0.000 claims abstract description 89
- 230000037431 insertion Effects 0.000 claims abstract description 89
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 230000002093 peripheral effect Effects 0.000 claims abstract description 16
- 230000001902 propagating effect Effects 0.000 claims description 9
- 239000012528 membrane Substances 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 44
- 238000000034 method Methods 0.000 description 22
- 230000004048 modification Effects 0.000 description 20
- 238000012986 modification Methods 0.000 description 20
- 238000005530 etching Methods 0.000 description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 9
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 9
- 229910052814 silicon oxide Inorganic materials 0.000 description 9
- 239000011651 chromium Substances 0.000 description 8
- 238000005229 chemical vapour deposition Methods 0.000 description 7
- 238000000206 photolithography Methods 0.000 description 7
- 239000010936 titanium Substances 0.000 description 7
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 238000001771 vacuum deposition Methods 0.000 description 5
- 239000010949 copper Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 229910052703 rhodium Inorganic materials 0.000 description 3
- 239000010948 rhodium Substances 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02118—Means for compensation or elimination of undesirable effects of lateral leakage between adjacent resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/48—Coupling means therefor
- H03H9/52—Electric coupling means
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/703—Networks using bulk acoustic wave devices
- H03H9/706—Duplexers
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
シミュレーションに用いた各材料および膜厚は以下である。
下部電極12の下層12a:膜厚が100nmのCr膜
下部電極12の上層12b:膜厚が200nmのRu膜
圧電膜14:膜厚T0が1260nmのAlN膜
下部圧電膜14a:膜厚が630nmのAlN膜
挿入膜28:膜厚が125nmの酸化シリコン膜
上部電極16:膜厚が230nmのRu膜
段差25の端面の角度θ:70°
共振領域50の幅W0:42μm
幅W2:2μm
12 下部電極
14 圧電膜
14a 下部圧電膜
14b 上部圧電膜
16 上部電極
25 段差
28 挿入膜
30 空隙
31 音響反射膜
44 送信フィルタ
46 受信フィルタ
50 共振領域
52 外周領域
54 中央領域
60 段差領域
62 薄膜領域
64 厚膜領域
Claims (13)
- 基板と、
前記基板上に設けられた下部電極と、
上面に内側の膜厚が外側の膜厚より大きくなるような段差を有し、前記下部電極上に設けられた圧電膜と、
前記圧電膜を挟み前記下部電極と上部電極とが対向する共振領域であって平面視において前記段差を含む共振領域が設けられるように、前記圧電膜上に設けられた上部電極と、
前記圧電膜内、前記圧電膜と前記下部電極との間、または前記圧電膜と前記上部電極との間において、前記共振領域内の外周領域の少なくとも一部に設けられ、前記共振領域の中央領域には設けられていない挿入膜と、
を具備する圧電薄膜共振器。 - 前記段差の側面は、傾斜している請求項1記載の圧電薄膜共振器。
- 前記挿入膜は、平面視において前記段差の内側に重ならない請求項1または2記載の圧電薄膜共振器。
- 前記挿入膜は、平面視において前記段差および前記段差の内側に重ならない請求項1から3のいずれか一項記載の圧電薄膜共振器。
- 前記上部電極は、前記段差の側面に接している請求項1から4のいずれか一項記載の圧電薄膜共振器。
- 前記外周領域における前記圧電膜は下部圧電膜と上部圧電膜を含み、
前記挿入膜は、前記下部圧電膜と上部圧電膜との間に設けられている請求項1から5のいずれか一項記載の圧電薄膜共振器。 - 前記挿入膜は、前記圧電膜と前記上部電極との間に設けられている請求項1から5のいずれか一項記載の圧電薄膜共振器。
- 前記挿入膜は、前記段差の側面に接し、前記上部電極は前記段差の側面の側方に設けられている請求項7記載の圧電薄膜共振器。
- 前記挿入膜の音響インピーダンスは前記圧電膜より小さい請求項1から8のいずれか一項記載の圧電薄膜共振器。
- 前記共振領域内の前記下部電極下に空気層が設けられている請求項1から9のいずれか一項記載の圧電薄膜共振器。
- 前記共振領域内の前記下部電極下に、前記圧電膜内を伝搬する弾性波を反射する音響反射膜が設けられている請求項1から9のいずれか一項記載の圧電薄膜共振器。
- 請求項1から11のいずれか一項記載の圧電薄膜共振器を含むフィルタ。
- 請求項12記載のフィルタを含むデュプレクサ。
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JP2016020952A JP6469601B2 (ja) | 2016-02-05 | 2016-02-05 | 圧電薄膜共振器、フィルタおよびデュプレクサ |
US15/417,725 US10680576B2 (en) | 2016-02-05 | 2017-01-27 | Piezoelectric thin film resonator, filter, and duplexer |
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JP2016020952A JP6469601B2 (ja) | 2016-02-05 | 2016-02-05 | 圧電薄膜共振器、フィルタおよびデュプレクサ |
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JP2017139707A true JP2017139707A (ja) | 2017-08-10 |
JP6469601B2 JP6469601B2 (ja) | 2019-02-13 |
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US20190252243A1 (en) * | 2018-02-12 | 2019-08-15 | Duet Microelectronics Inc. | Method of manufacturing airbridges for high performance semiconductor device |
US11082023B2 (en) | 2018-09-24 | 2021-08-03 | Skyworks Global Pte. Ltd. | Multi-layer raised frame in bulk acoustic wave device |
JP7290941B2 (ja) * | 2018-12-27 | 2023-06-14 | 太陽誘電株式会社 | 弾性波デバイス、フィルタおよびマルチプレクサ |
US11316494B2 (en) | 2019-06-14 | 2022-04-26 | Skyworks Global Pte. Ltd. | Bulk acoustic wave device with floating raised frame |
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JP2010045437A (ja) * | 2008-08-08 | 2010-02-25 | Fujitsu Ltd | 圧電薄膜共振子及びこれを用いたフィルタあるいは分波器 |
US20120218057A1 (en) * | 2011-02-28 | 2012-08-30 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Film bulk acoustic resonator comprising a bridge |
JP2014161001A (ja) * | 2013-01-28 | 2014-09-04 | Taiyo Yuden Co Ltd | 圧電薄膜共振器、フィルタおよびデュプレクサ |
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US20170230031A1 (en) | 2017-08-10 |
US10680576B2 (en) | 2020-06-09 |
JP6469601B2 (ja) | 2019-02-13 |
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