JP2017137523A5 - - Google Patents

Claims (5)

  A semiconductor wafer comprising at least two different types of metal plating laminated substantially uniformly on the entire back surface of the wafer. It is composed of a wafer holding disk and a crimping jig that crimps and fixes a wafer pressure welding board separate from the wafer holder so that the semiconductor wafer is sandwiched between them,
The wafer holder is
A fixed-width annular support plate with a suspension projecting from the outer periphery;
A positioning part formed on the annular support plate surface;
A wafer holding part formed on the inner peripheral edge of the annular support plate,
Wafer pressure welding machine
An annular plate in pressure contact with the support plate surface of the annular support plate;
A fitting portion formed on the annular plate surface so as to be freely fitted to the positioning portion of the annular support plate;
A semiconductor wafer plating jig for manufacturing the semiconductor wafer according to claim 1, further comprising:   A semiconductor wafer is clamped and fixed between a wafer holding plate and a wafer pressure bonding plate via a pressure bonding jig and immersed in a plating bath, and at least two different types of metal plating are formed on the back surface of the semiconductor wafer. 3. A semiconductor wafer plating method using the semiconductor wafer plating jig according to claim 2, wherein the semiconductor wafer plating jig is washed with water and dried.   A semiconductor device manufactured by the semiconductor wafer according to claim 1. A semiconductor device manufactured by a semiconductor wafer plated by the semiconductor wafer plating jig according to claim 2.