JP4424486B2 - Cathode electrode assembly, cathode electrode device, and plating device - Google Patents

Description

  The present invention relates to a cathode electrode assembly, a cathode electrode device, and a plating apparatus using these suitable for plating various electronic component substrates, IC wafers, thin film magnetic head wafers, and the like.

  In various electronic component substrates, IC wafers, thin film magnetic head wafers, etc., as a method of forming a plating film within a limited plating formation surface on the wafer to be plated, a frame plating method and a pattern are used. There is a plating method.

  In a plating apparatus using a frame plating method, a resist frame is formed on a plating formation surface on a wafer by a high-precision pattern forming technique such as photolithography, and necessary plating is performed in an area not covered by the resist frame. Electrodeposit. Also, in a plating apparatus using the pattern plating method, almost the entire plating formation surface on the wafer is covered with a resist film, a hole pattern for plating is formed in the resist film, and plating is applied to the hole pattern portion. Put on.

  Such a frame plating type plating apparatus and a pattern plating type plating apparatus have some structural differences, but they are common in that they have a cathode electrode device. As a conventional cathode electrode device of this type, for example, Patent Document 1 discloses a cathode electrode device having a holder and a cathode electrode assembly. The holder has a through-hole portion, the through-hole portion has an electrode assembly receiving portion and an insertion hole portion to be plated connected to the receiving portion, and the cathode electrode assembly has a conductive plate The conductive plate is in a ring shape having a through-hole portion, and the peripheral portion on the inner diameter side protrudes into the insertion hole portion, and the pattern forming member is disposed in the receiving portion. Is a ring shape having a through-hole portion, and is superimposed on the conductive plate, and the through-hole portion has a different pattern from the through-hole portion of the conductive plate.

  Patent Document 2 discloses a cathode electrode device having a cathode electrode assembly. The cathode electrode assembly includes a first cathode electrode member, an insulating member, and a second cathode electrode member. The first cathode electrode member has a hole surrounded by the frame portion, has a contact surface to be plated on one surface of the frame portion, and the insulating member has a hole surrounded by the frame portion, One surface of the frame portion is adjacent to the other surface of the first cathode electrode member, and the hole overlaps the hole of the first cathode electrode member, and is superimposed on the other surface of the first cathode electrode member. The second cathode electrode member has a hole surrounded by the frame part, one surface of the frame part is adjacent to the other surface of the insulating member, and the hole overlaps the hole of the insulating member. Overlaid on the other surface and electrically connected to the first cathode electrode member by a coupler made of a conductive material, the minimum hole diameter of the second cathode electrode member is smaller than the minimum hole diameter of the insulating member hole. Is also big.

  By the way, in the technique described in Patent Documents 1 and 2 described above, in the plating process performed using the cathode electrode device, a plating film is not formed on a portion where the plating solution contacts other than the plating formation surface area on the wafer. It is formed. For example, a plating film is unavoidably formed on one surface of the cathode electrode member. When a plating film is formed using a cathode electrode member with a certain amount or more of plating on one surface, problems such as deterioration of the plating film thickness distribution and fluctuations in the plating composition occur. It is preferable that the cathode electrode device used for the plating process is appropriately replaced.

  However, in the cathode electrode device used in the conventional plating apparatus, the cathode electrode member is coupled to the holder using a stop screw penetrating from one surface to the other surface. Therefore, if a plating film is formed on one surface of the cathode electrode member, the screw groove of the set screw is covered with the plating film, and it is difficult to operate the set screw and replace the cathode electrode member.

  Conventionally, in order to replace a cathode electrode member having a plating film formed on one surface, first, an operation of removing the plating film using nitric acid has been performed. Such removal of the plating film is inherently inefficient and uneconomical in view of the purpose of replacing the cathode electrode member or removing it for disposal.

The cathode electrode member functions as a cathode in the plating process, and securely fixes the wafer pushed up by the push-up device, and prevents the plating solution from leaking out from the contact interface between the plating base film and the cathode electrode. Have. Conventionally, in addition to the above-described bonding method using a retaining screw, a bonding structure in which the cathode electrode and the holder can be removed after a plurality of plating treatments and has excellent bonding strength has not been disclosed.
JP-A-5-125596 Japanese Patent No. 3257667

  SUMMARY OF THE INVENTION An object of the present invention is to provide a cathode electrode assembly, a cathode electrode device, and a plating apparatus using these having an excellent bond strength and an easily detachable bond structure.

  In order to solve the above-described problems, a cathode electrode assembly according to the present invention includes a cathode electrode member, an auxiliary electrode member, and a coupler. The cathode electrode member is a frame-like body and includes a through hole portion and a coupling hole. The through hole is surrounded by the frame. The coupling hole is a through hole provided in the frame portion, and penetrates the frame portion from one surface to the other surface. The auxiliary electrode member is a frame-like body and includes a through hole portion and a coupling hole. The through hole portion is surrounded by a frame portion and includes a hole portion having a larger diameter than the through hole portion of the cathode electrode member. The coupling hole is a through hole provided in the frame portion, and penetrates the frame portion from one surface to the other surface. In the cathode electrode member and the auxiliary electrode member, the other surface of the cathode electrode member is stacked adjacent to one surface of the auxiliary electrode member. The through hole portion of the cathode electrode member is continuous with the through hole portion of the auxiliary electrode member. The coupling hole of the cathode electrode member is continuous with the coupling hole of the auxiliary electrode member. The coupling tool includes a first coupling member and a second coupling member. The first coupling member continuously penetrates the coupling hole of the cathode electrode member and the coupling hole of the auxiliary electrode member. The second coupling member is combined with the first coupling member and integrally holds the cathode electrode member and the auxiliary electrode member together with the first coupling member.

  The cathode electrode assembly described above is used as a cathode electrode device in combination with a holder. That is, the cathode electrode device according to the present invention includes a holder, a cathode electrode assembly, and a coupler. The holder has a through hole and a connection hole. The through hole portion includes a cathode electrode assembly receiving portion and an insertion hole portion to be plated connected to the receiving portion. The connection hole is provided in the receiving portion and penetrates the receiving portion from one surface to the other surface. The cathode electrode assembly is disposed in the receiving part. The coupling tool is provided on the other surface of the receiving portion, and the insertion end penetrates the coupling hole of the holder and enters the fixing hole of the auxiliary electrode member, thereby coupling and fixing the cathode electrode assembly and the holder. is doing.

  Furthermore, the cathode electrode device described above is used in a plating apparatus in combination with a plating tank, a cathode electrode device, and an anode electrode device. The plating tank stores a plating solution. The cathode electrode device is attached to the plating tank so that an object to be plated can be brought into contact with the other surface of the frame portion of the cathode electrode member constituting the cathode electrode assembly from the outside of the plating tank. The anode electrode device has an anode electrode member, and the anode electrode member faces the cathode electrode device. The cathode electrode device and the anode electrode device constitute an electric circuit for forming a plating film on an object to be plated supported on a wafer via a plating solution in a plating tank.

  The plating apparatus according to the present invention includes the above-described cathode electrode apparatus, anode electrode apparatus, and plating tank. The cathode electrode device includes the cathode electrode assembly described above. The cathode electrode device and the anode electrode device constitute an electric circuit for forming a plating film via a plating solution in the plating tank. Therefore, when the plating process is performed using the plating apparatus according to the present invention, the electric lines of force are directed from the anode electrode member to the cathode electrode member through the plating solution, and are to be plated to be equipotential with the cathode electrode member. A required plating film is applied to the plating formation surface (conductive surface).

  In the plating apparatus described above, the electrode assembly used in the cathode electrode apparatus includes a cathode electrode member, an auxiliary electrode member, and a coupler. The cathode electrode member is a frame-like body and includes a through hole portion. The through hole portion of the cathode electrode member is surrounded by a frame portion. The auxiliary electrode member is a frame-like body and includes a through hole portion. In the cathode electrode member and the auxiliary electrode member, the other surface of the cathode electrode member is stacked adjacent to one surface of the auxiliary electrode member. The through hole portion of the cathode electrode member is continuous with the through hole portion of the auxiliary electrode member. Therefore, when the cathode electrode assembly described above is used in a cathode electrode device and a plating apparatus including these, an object to be plated can be guided to the cathode electrode member through a continuous through hole.

  The through hole portion of the auxiliary electrode member includes a hole portion having a larger diameter than the through hole portion of the cathode electrode member, and the inner peripheral edge of the through hole portion of the auxiliary electrode member is the inner peripheral edge of the through hole portion of the cathode electrode member. It is arranged at a position retracted to the outside by the gap caused by the difference in the hole diameter. According to such a structure, the object to be plated guided through the continuous through hole portion can be stably disposed in the through hole portion of the auxiliary electrode member by using the step generated by the gap, and The plating formation surface of the plated product can be electrically connected to the other surface of the frame portion of the cathode electrode member.

  Since the object to be plated is disposed in the through hole portion of the auxiliary electrode member using the step generated by the gap, the installation posture of the object to be plated is stabilized during the plating process.

  The cathode electrode member is a frame-like body and includes a coupling hole. The coupling hole of the cathode electrode member is a through hole provided in the frame portion, and penetrates the frame portion from one surface to the other surface. The auxiliary electrode member is a frame-like body and includes a coupling hole. The coupling hole of the auxiliary electrode member is a through hole provided in the frame portion, and penetrates the frame portion from one surface to the other surface. In the cathode electrode member and the auxiliary electrode member, the other surface of the cathode electrode member is stacked adjacent to one surface of the auxiliary electrode member. The coupling hole of the cathode electrode member is continuous with the coupling hole of the auxiliary electrode member.

  The coupling tool includes a first coupling member and a second coupling member. The first coupling member continuously penetrates the coupling hole of the cathode electrode member and the coupling hole of the auxiliary electrode member. The second coupling member is combined with the first coupling member and integrally holds the cathode electrode member and the auxiliary electrode member together with the first coupling member.

  According to the coupling structure of the cathode electrode assembly described above, the cathode electrode assembly can be easily disassembled by operating the second coupling tool even if the entire surface of the cathode electrode is covered with the plating film in the plating process. In addition, the cathode electrode member attached to one surface of the auxiliary electrode member can be replaced.

  Further, according to the coupling structure of the coupling device according to the present invention, the coupling device includes a first coupling member and a second coupling member, and the second coupling member is combined with the first coupling member, Since the cathode electrode member and the auxiliary electrode member are integrally sandwiched, a cathode electrode assembly is provided that has excellent bond strength during use and can be easily removed even after a plurality of plating processes. Can do.

  In a preferred embodiment of the present invention, the coupler includes a bolt and a nut. The bolt is provided in each of the cathode electrode member and the auxiliary electrode member, and passes through the continuous coupling hole. The nut is combined with the bolt, and integrally holds the cathode electrode member and the auxiliary electrode member. According to this configuration, the cathode electrode assembly has excellent bonding strength and can easily perform the operation of removing the cathode electrode member.

  In a preferred embodiment of the present invention, the auxiliary electrode member includes a first auxiliary electrode member and a second auxiliary electrode member. The first auxiliary electrode member is a frame-like body and includes a through hole portion. The second auxiliary electrode member is a frame-like body and includes a through hole portion. Each through-hole portion is surrounded by a frame portion. In the cathode electrode member and the first auxiliary electrode member, the other surface of the cathode electrode member is overlapped adjacent to one surface of the first auxiliary electrode member. The through hole portion of the cathode electrode member is continuous with the through hole portion of the first auxiliary electrode member. As for the 1st auxiliary electrode member and the 2nd auxiliary electrode member, the other surface of the 1st auxiliary electrode member is piled up adjacent to the 1st surface of the 2nd auxiliary electrode member. The through hole of the first auxiliary electrode member is continuous with the through hole of the second auxiliary electrode member.

  Therefore, when the cathode electrode assembly described above is used in a cathode electrode device and a plating apparatus including these, an object to be plated can be guided to the cathode electrode member through a continuous through hole.

  The through hole portion of the second auxiliary electrode member includes a hole portion having a larger diameter than the through hole portion of the first auxiliary electrode member. Therefore, the inner peripheral edge of the second auxiliary electrode member is disposed at a position retracted outward from the inner peripheral edge of the first auxiliary electrode member by an amount corresponding to the gap due to the difference in the hole diameter between the two. According to such a structure, the object to be plated guided through the continuous through-hole portion can be stably arranged in the through-hole portion of the second auxiliary electrode member using the step generated by the gap.

  The coupling hole of the cathode electrode member is continuous with the coupling hole of the first auxiliary electrode member. The coupling hole of the first auxiliary electrode member is continuous with the coupling hole of the second auxiliary electrode member. The coupling tool includes a first coupling member and a second coupling member. The first coupling member continuously penetrates the coupling hole of the cathode electrode member, the coupling hole of the first auxiliary electrode member, and the coupling hole of the second auxiliary electrode member. The second coupling member is combined with the first coupling member and integrally holds the cathode electrode member, the first auxiliary electrode member, and the second auxiliary electrode member together with the first coupling member. According to the coupling structure of the cathode electrode assembly described above, even if one surface of the cathode electrode member is covered with the plating film in the plating process, the cathode electrode assembly can be easily operated by operating the second coupling tool. And the cathode electrode member attached to one surface of the first auxiliary electrode member can be replaced.

  Moreover, according to the coupling structure of the coupler according to the present invention, it is possible to provide a cathode electrode assembly that has excellent coupling strength when used and can be easily removed even after a plurality of plating processes. .

  Other objects, configurations and advantages of the present invention will be described in more detail with reference to the accompanying drawings. The accompanying drawings are merely examples.

  As described above, according to the present invention, it is possible to provide a cathode electrode assembly, a cathode electrode device, and a plating apparatus using these having an excellent bond strength and an easily removable structure. .

  1 is a perspective view showing an embodiment of a cathode electrode assembly according to the present invention, FIG. 2 is a front sectional view taken along line 2-2 of FIG. 1, and FIG. 3 is a cathode electrode assembly shown in FIGS. It is a perspective view which shows the three-dimensional decomposition structure. 1 to 3, the cathode electrode assembly according to an embodiment of the present invention includes a cathode electrode member 1, an auxiliary electrode member 2, and a coupler 3.

  The cathode electrode member 1 is a frame-like body having a frame portion 10, and is preferably configured using a conductive material such as a copper plate. The cathode electrode member 1 includes a through hole portion 13 and a coupling hole 15.

  The through-hole portion 13 is surrounded by the frame portion 10 and has a maximum hole diameter D1. The coupling hole 15 is a through hole provided in the frame portion 10 and penetrates the frame portion 10 from one surface 11 (upper surface in the drawing) to the other surface 12 (lower surface in the drawing).

  In the cathode electrode device according to the embodiment of the present invention shown in FIGS. 1 to 3, the auxiliary electrode member 2 preferably includes a first auxiliary electrode member 21 and a second auxiliary electrode member 22. However, the auxiliary electrode member 2 may be only the first auxiliary electrode member 21 or may have three or more auxiliary electrode members.

  The first auxiliary electrode member 21 is a frame-like body having a frame portion 210, and is preferably configured using a conductive material such as a copper plate. The first auxiliary electrode member 21 includes a through hole 213 and a coupling hole 215. The through hole portion 213 is surrounded by the frame portion 210. The maximum hole diameter D21 of the through hole portion 213 is preferably substantially the same as the maximum hole diameter D1 of the through hole portion 13 provided in the cathode electrode member 1. The coupling hole 215 is a through-hole provided in the frame part 210 and penetrates the frame part 210 from the one surface 211 to the other surface 212. The other surface 212 of the frame part 210 functions as a contact surface that contacts the object to be plated.

  The second auxiliary electrode member 22 is a frame-like body having a frame portion 220, and is preferably configured using a conductive material such as a copper plate. The second auxiliary electrode member 22 includes a through hole 223 and a coupling hole 225. The through hole portion 223 is surrounded by the frame portion 220 and includes a hole portion D22 having a larger diameter than the through hole portion 213 of the first auxiliary electrode member 21. The coupling hole 225 is a through hole provided in the frame part 220 and penetrates the frame part 220 from the one surface 221 to the other surface 222. Further, the second auxiliary electrode member 22 has a fixing hole 226. The fixing hole 226 opens on the other surface 222 of the frame portion 220.

  The cathode electrode member 1 and the first auxiliary electrode member 21 are such that the other surface 12 of the cathode electrode member 1 is adjacent to the one surface 211 of the first auxiliary electrode member 21. In the arrangement state described above, the through hole 13 of the cathode electrode member 1 is coaxially continuous with the through hole 213 of the first auxiliary electrode member 21. Similarly, the coupling hole 15 of the cathode electrode member 1 is coaxially continuous with the coupling hole 215 of the first auxiliary electrode member 21.

  Further, the first auxiliary electrode member 21 and the second auxiliary electrode member 22 are overlapped with the other surface 212 of the first auxiliary electrode member 21 adjacent to the one surface 221 of the second auxiliary electrode member 22. ing. In the arrangement state described above, the through hole portion 213 of the first auxiliary electrode member 21 is coaxially continuous with the through hole portion 223 of the second auxiliary electrode member 22. Similarly, the coupling hole 215 of the first auxiliary electrode member 21 is coaxially continuous with the coupling hole 225 of the second auxiliary electrode member 22.

  In the positional relationship among the cathode electrode member 1, the first auxiliary electrode member 21, and the second auxiliary electrode member 22 described above, the maximum hole diameter D21 of the through hole portion 213 provided in the first auxiliary electrode member 21. Is substantially the same as the maximum hole diameter D1 of the through hole portion 13 provided in the cathode electrode member 1, and the through hole portion 223 of the second auxiliary electrode member 22 is the through hole of the first auxiliary electrode member 21. A hole portion D22 having a diameter larger than that of the portion 213 is included. Therefore, the inner peripheral edge 224 of the through hole portion 223 is different from the inner peripheral edge 214 of the maximum hole diameter D21 of the through hole portion 213 and the inner peripheral edge 14 of the maximum hole diameter D1 of the through hole portion 13 (D22−D1). ) / 2 or (D22-D21) / 2, and is disposed at a position retracted outward by the gap g. The dimension of the gap g can be set in the range of 0.5 to 2 mm, preferably about 1 mm.

  Unlike FIG. 1 to FIG. 3, when the dimension of the maximum hole diameter D21 of the through hole portion 213 is smaller than the maximum hole diameter D1 of the through hole portion 13, the inner peripheral edge 224 of the through hole portion 223 is the through hole portion. It is arranged at a position retracted outward by the gap g caused by the maximum hole diameter difference (D22−D21) / 2 of the inner peripheral edge 214 of the maximum hole diameter D21 of 213.

  The coupler 3 includes a first coupling member 31 and a second coupling member 32. The first coupling member 31 continuously includes the coupling hole 15 of the cathode electrode member 1, the coupling hole 215 of the first auxiliary electrode member 21, and the coupling hole 225 of the second auxiliary electrode member 22. It penetrates.

  The second coupling member 32 is combined with the first coupling member 31, and together with the first coupling member 31, the cathode electrode member 1, the first auxiliary electrode member 21, and the second auxiliary electrode member 22 are combined. Hold it together. In the cathode electrode assembly shown in FIGS. 1 to 3, in the coupler 3, the first coupling member 31 is a bolt 31 and the second coupling member 32 is a nut 32. Therefore, the bolt 31 continuously passes through the coupling hole 15 of the cathode electrode member 1, the coupling hole 215 of the first auxiliary electrode member 21, and the coupling hole 225 of the second auxiliary electrode member 22. ing. The nut 32 is combined with the bolt 31, and integrally holds the cathode electrode member 1 and the auxiliary electrode member 2 together with the bolt 31.

  The coupler 3 is preferably made of a conductive material such as stainless steel or titanium. With this coupler 3, the cathode electrode member 1, the first auxiliary electrode member 21, the second auxiliary electrode member 22, and the like. Are electrically conducted.

  The cathode electrode assembly described above is combined with a holder to constitute a cathode electrode device. Next, a cathode electrode device using the cathode electrode assembly shown in FIGS. 1 to 3 will be described. 4 is a perspective view showing an exploded structure of an embodiment of the cathode electrode device according to the present invention, FIG. 5 is a front sectional view showing an internal coupling structure of the embodiment of the cathode electrode device shown in FIG. 4, and FIG. FIG. 5 is a front sectional view showing an internal coupling structure of an embodiment of the cathode electrode device shown in FIG.

  A cathode electrode device 40 according to an embodiment of the present invention shown in FIGS. 4 to 6 includes a holder 41, a cathode electrode assembly 100, and a connector 45.

  The holder 41 is made of an electrically insulating material such as a fluororesin polytetrafluoroethylene, polypropylene (PP), or vinyl chloride resin (PVC), and has a through-hole portion 42 that is open at both ends in the axial direction. And a hole 43.

  The through-hole portion 42 includes a cathode electrode assembly receiving portion 421 and an insertion hole portion 422 for an object to be plated. The receiving portion 421 shown in FIGS. 4 to 6 has an annular groove on the surface, and holds the cathode electrode assembly 100 accommodated through the through-hole portion 42 inside the groove. The to-be-plated object insertion hole 422 is continuous with the receiving portion 421.

  The connection hole 43 is provided on the bottom surface of the annular groove of the receiving portion 421 and penetrates the receiving portion 421 from the one surface 411 to the other surface 412. That is, the through-hole portion 42 includes a receiving portion 421 and an insertion hole portion 422 to be plated. The electrode assembly 100 is accommodated inside the receiving portion 421 and the insertion hole portion 422 to be plated is inserted. A wafer can be inserted.

  The holder 41 preferably has a collar portion 413 and an O-ring 44. The collar portion 413 has a ring groove 414 on one end surface side of the holder 41. The O-ring 44 is a planar annular packing containing an elastic material, and is disposed inside the ring groove 414.

  The cathode electrode assembly 100 is as shown in FIGS. 1 to 3, and is disposed on one surface 411 of the receiving portion 421.

  The connecting tool 45 is provided on the other surface 412 of the receiving portion 421, and the insertion end 451 passes through the connecting hole 43 of the holder 41 and enters the fixing hole 226 of the second auxiliary electrode member 22. Thus, the cathode electrode assembly 100 and the holder 41 are connected and fixed. The connector 45 is a screw or the like made of a conductive material such as stainless steel or titanium, and fastens and fixes the electrode assembly 100 to the step surface of the holder 41.

  FIG. 7 is a front cross-sectional view showing a plating apparatus according to an embodiment of the present invention with a part thereof omitted. Referring to FIG. 7, a plating apparatus according to an embodiment of the present invention includes a plating tank 50, a cathode electrode device 40, an anode electrode device 60, a wafer 80, a power supply device 92, and a push-up device 91. Including.

  The plating tank 50 stores a plating solution 53. The plating solution 53 is selected in accordance with the plating film 530 to be obtained.

  The cathode electrode device 40 is as shown in FIGS. 4 to 6 and further includes a lead conductor 227. One end of the lead conductor 227 is coupled to the second auxiliary electrode member 22 of the cathode electrode assembly 100.

  In the plating apparatus shown in FIG. 7, the cathode electrode device 40 has a plating bath on the one surface 411 side of the holder 41 and plating on the other surface 212 of the first auxiliary electrode member 21 constituting the cathode electrode assembly 100. It is attached to the plating tank 50 so that the wafer 80 can be brought into contact from the outside of the tank 50.

  In the anode electrode device 60, an anode electrode member 61 is disposed to face the cathode electrode device 40 with the plating solution 53 interposed therebetween. The anode electrode member 61 is supported by a support electrode device 70 attached to the plating tank 50.

  The wafer 80 to be plated is, for example, various electronic component substrates, IC wafers, or thin film magnetic head wafers, and preferably includes a plating formation surface 81 (conductive surface) having a plating base film on one surface side. The wafer 80 is pushed up by the push-up device 91, and the plating formation surface 81 is in close contact with the first auxiliary electrode member 21. With the configuration described above, when the cathode electrode device 40 is guided to the bottom 51 of the plating tank 50, the plating solution 53 leaks from the contact interface between the plating forming surface 81 and the first auxiliary electrode member 21. Can be prevented.

  The cathode electrode device 40 has a ring groove 414 in the collar portion 413 of the holder 41, and an O-ring 44 is arranged in the ring groove 414. With the configuration described above, when the cathode electrode device 40 is guided to the bottom 51 of the plating tank 50, it is possible to prevent the plating solution 53 from leaking from the contact interface between the plating tank 50 and the cathode electrode device 40. it can.

  The power supply device 92 is connected between the cathode electrode device 40 and the anode electrode device 60, and applies a DC voltage therebetween. The second auxiliary electrode member 22 constituting the cathode electrode device 40 is provided with a lead conductor 227, and a lead wire led from the power supply device 92 is connected to the lead conductor 227.

  The cathode electrode device 40 and the anode electrode device 60 constitute an electric circuit for forming the plating film 530 on the plating formation surface 81 on the wafer 80 via the plating solution 53 in the plating tank 50.

  As described above, the plating apparatus according to the present invention includes the cathode electrode device 40, the anode electrode device 60, and the plating tank 50 described above. The cathode electrode device 40 and the anode electrode device 60 serve as a plating bath, and constitute an electric circuit for plating electrodeposition via a plating solution 53 in the plating tank 50. In the above plating apparatus, the required plating film 530 is applied to the plating surface 81 of the wafer 80 maintained at the same potential as the cathode electrode member 1 in accordance with the lines of electric force from the anode electrode member 61 to the cathode electrode member 1 through the plating solution 53. Is given.

  In the structure described above, the cathode electrode device 40 includes the cathode electrode assembly 100 described above. The cathode electrode assembly 100 includes a cathode electrode member 1, a first auxiliary electrode member 21, a second auxiliary electrode member 22, and a coupler 3.

  The cathode electrode member 1 is a frame-like body having a frame portion 10 and includes a through-hole portion 13. The through hole portion 13 is surrounded by the frame portion 10.

  The first auxiliary electrode member 21 is a frame-like body having a frame portion 210 and includes a through hole portion 213. The through hole portion 213 is surrounded by the frame portion 210. The second auxiliary electrode member 22 is a frame-like body having a frame portion 220 and includes a through-hole portion 223. The through hole portion 223 is surrounded by the frame portion 220.

  The cathode electrode member 1 and the first auxiliary electrode member 21 are such that the other surface 12 of the cathode electrode member 1 is adjacent to the one surface 211 of the first auxiliary electrode member 21. In the arrangement state described above, the through hole 13 of the cathode electrode member 1 is coaxially continuous with the through hole 213 of the first auxiliary electrode member 21. Further, the first auxiliary electrode member 21 and the second auxiliary electrode member 22 are overlapped with the other surface 212 of the first auxiliary electrode member 21 adjacent to the one surface 221 of the second auxiliary electrode member 22. ing. In the arrangement state described above, the through hole portion 213 of the first auxiliary electrode member 21 is coaxially continuous with the through hole portion 223 of the second auxiliary electrode member 22. That is, in the electrode assembly 100 according to the present invention, each of the cathode electrode member 1 and the first and second auxiliary electrode members 21 and 22 has through-hole portions 13, 213 and 223, and these through-hole portions. 13, 213, and 223 are adjacent to each other in this order so that they overlap each other, so that the wafer 80 can be guided to the cathode electrode member 1 through the through-hole portion 223, and the plating solution 53 is applied to the wafer 80. It can be brought into contact with the plating surface 81.

  Therefore, by applying a voltage with the anode electrode member 61 as the positive electrode and the cathode electrode member 1 as the negative electrode, the plating film 530 can be electrodeposited on the plating formation surface 81 of the wafer 80 as shown in FIG. .

  Furthermore, in the cathode electrode device according to the present invention, the through hole portion 223 of the second auxiliary electrode member 22 includes a hole portion D22 having a diameter larger than the maximum hole diameter D21 of the through hole portion 213 of the first auxiliary electrode member 21. The inner peripheral edge 224 of the through-hole portion 223 is in a position retracted to the outside by the gap g caused by the difference (D22−D21) / 2 in the maximum hole diameter from the inner peripheral edge 214 of the through-hole portion 213. Be placed. According to such a structure, the wafer 80 guided through the through-hole portion 223 can be stably disposed in the through-hole portion 223 using the step generated by the gap g, and the plating of the wafer 80 is formed. The surface 81 (conductive surface) can be brought into contact with the other surface 212 of the first auxiliary electrode member 21 that is electrically connected to the cathode electrode member 1.

  Since the wafer 80 is disposed in the through-hole portion 223 using the step generated by the gap g, the installation posture of the wafer 80 during the plating process is stabilized.

  The first auxiliary electrode member 21 is a frame-like body having a frame portion 210 and includes a coupling hole 215. The coupling hole 215 is a through-hole provided in the frame part 210 and penetrates the frame part 210 from the one surface 211 to the other surface 212. The second auxiliary electrode member 22 is a frame-like body having a frame portion 220 and includes a coupling hole 225. The coupling hole 225 is a through hole provided in the frame part 220 and penetrates the frame part 220 from the one surface 221 to the other surface 222.

  The cathode electrode member 1 and the first auxiliary electrode member 21 are such that the other surface 12 of the cathode electrode member 1 is adjacent to the one surface 211 of the first auxiliary electrode member 21. In the arrangement state described above, the coupling hole 15 of the cathode electrode member 1 is concentrically continuous with the coupling hole 215 of the first auxiliary electrode member 21. Further, the first auxiliary electrode member 21 and the second auxiliary electrode member 22 are overlapped with the other surface 212 of the first auxiliary electrode member 21 adjacent to the one surface 221 of the second auxiliary electrode member 22. ing. In the arrangement state described above, the coupling hole 215 of the first auxiliary electrode member 21 is coaxially continuous with the coupling hole 225 of the second auxiliary electrode member 22.

  The coupler 3 includes a first coupling member 31 and a second coupling member 32. The first coupling member 31 continuously includes the coupling hole 15 of the cathode electrode member 1, the coupling hole 215 of the first auxiliary electrode member 21, and the coupling hole 225 of the second auxiliary electrode member 22. It penetrates. The second coupling member 32 is combined with the first coupling member 31, and together with the first coupling member 31, the cathode electrode member 1, the first auxiliary electrode member 21, and the second auxiliary electrode member 22 are combined. Hold it together. According to the coupling structure of the cathode electrode assembly 100 described above, even if one surface 11 of the cathode electrode member 1 is covered with the plating film 530 in the plating process, it is easy to operate the second coupling tool 32. The cathode electrode assembly 100 can be disassembled and the cathode electrode member 1 attached to the one surface 211 of the first auxiliary electrode member 21 can be replaced.

  Further, according to the coupling structure of the coupler 3 according to the present invention, it is possible to provide the cathode electrode assembly 100 that has excellent coupling strength at the time of use and can be easily removed even after a plurality of plating processes. I can.

  The cathode electrode assembly 100 described above is used as the cathode electrode device 40 in combination with the holder 41. Therefore, the cathode electrode device 40 has all the advantages of the cathode electrode assembly 100 described above.

  Further, the cathode electrode device 40 includes a holder 41, a cathode electrode assembly 100, and a coupler 3. The holder 41 has a through hole 42. The through-hole portion 42 includes a receiving portion 421 and an insertion hole portion 422 that continues to the receiving portion 421. The holder 41 has a connection hole 43. The connection hole 43 is provided on the bottom surface of the annular groove of the receiving portion 421 and penetrates the receiving portion 421 from the one surface 411 to the other surface 412. The cathode electrode assembly 100 is disposed on one surface 411 of the receiving portion 421. The coupling tool 45 is provided on the other surface 412 of the receiving portion 421, penetrates the coupling hole 43, and the insertion end 451 enters the coupling hole 226 of the cathode electrode assembly 100, whereby the cathode electrode assembly 100. And the holder 41 are integrally coupled. According to the above-described structure, it is possible to provide the cathode electrode device 40 that has excellent bond strength and can be easily removed even after a plurality of plating processes.

  Although the contents of the present invention have been specifically described above with reference to the preferred embodiments, it is obvious that those skilled in the art can take various modifications based on the basic technical idea and teachings of the present invention. It is.

1 is a perspective view showing an embodiment of a cathode electrode assembly according to the present invention. FIG. 2 is a front sectional view taken along line 2-2 of FIG. FIG. 3 is a perspective view showing an exploded structure of the cathode electrode assembly shown in FIGS. 1 and 2. It is a perspective view showing an exploded structure about one embodiment of a cathode electrode device concerning the present invention. FIG. 5 is a front sectional view showing a coupling structure for one embodiment of the cathode electrode device shown in FIG. 4. FIG. 5 is a front sectional view showing a coupling structure for one embodiment of the cathode electrode device shown in FIG. 4. It is front sectional drawing which abbreviate | omits and shows one Embodiment about the plating apparatus which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Cathode electrode assembly 1 Cathode electrode member 2 Auxiliary electrode member 21 1st auxiliary electrode member 22 2nd auxiliary electrode member 3 Coupling tool 31 1st coupling member (bolt)
32 Second coupling member (nut)

Claims (8)

A cathode electrode assembly for a plating apparatus , comprising a cathode electrode member, an auxiliary electrode member, and a coupler,
The cathode electrode member is a frame-like body, and includes a through hole portion and a coupling hole.
The through hole portion is surrounded by a frame portion,
The coupling hole is a through hole provided in the frame portion, and penetrates the frame portion from one surface to the other surface;
The auxiliary electrode member is a frame-like body, and includes a through hole portion and a coupling hole.
The through hole portion is surrounded by a frame portion, includes a hole portion having a larger diameter than the through hole portion of the cathode electrode member , and the shape of the hole portion is circular,
The coupling hole is a through hole provided in the frame portion, and penetrates the frame portion from one surface to the other surface;
The cathode electrode member and the auxiliary electrode member are stacked such that the other surface of the cathode electrode member is adjacent to one surface of the auxiliary electrode member,
The through hole portion of the cathode electrode member is continuous with the through hole portion of the auxiliary electrode member, and the coupling hole of the cathode electrode member is continuous with the coupling hole of the auxiliary electrode member,
The coupler includes a first coupling member and a second coupling member,
The first coupling member continuously penetrates the coupling hole of the cathode electrode member and the coupling hole of the auxiliary electrode member,
The second coupling member is combined with the first coupling member, and integrally holds the cathode electrode member and the auxiliary electrode member together with the first coupling member.
Cathode electrode assembly. The cathode electrode assembly according to claim 1, comprising:
The first coupling member is a bolt;
The second coupling member is a nut;
Cathode electrode assembly. A cathode electrode assembly according to claim 1 or 2,
The auxiliary electrode member includes a first auxiliary electrode member and a second auxiliary electrode member,
The through hole portion of the second auxiliary electrode member includes a hole portion having a larger diameter than the through hole portion of the first auxiliary electrode member,
The cathode electrode member and the first auxiliary electrode member are stacked such that the other surface of the cathode electrode member is adjacent to one surface of the first auxiliary electrode member,
The through hole portion of the cathode electrode member is continuous with the through hole portion of the first auxiliary electrode member, and the coupling hole of the cathode electrode member is the coupling hole of the first auxiliary electrode member. Is continuous,
The first auxiliary electrode member and the second auxiliary electrode member are stacked such that the other surface of the first auxiliary electrode member is adjacent to one surface of the second auxiliary electrode member,
The through hole portion of the first auxiliary electrode member is continuous with the through hole portion of the second auxiliary electrode member, and the coupling hole of the first auxiliary electrode member is the second auxiliary electrode. Continuous with the coupling hole of the member;
Cathode electrode assembly. The cathode electrode assembly according to claim 3, wherein
The first coupling member continuously connects the coupling hole of the cathode electrode member, the coupling hole of the first auxiliary electrode member, and the coupling hole of the second auxiliary electrode member. Penetrating,
The second coupling member integrally holds the cathode electrode member, the first auxiliary electrode member, and the second auxiliary electrode member together with the first coupling member.
Cathode electrode assembly. A cathode electrode assembly according to claim 3 or 4,
Furthermore, the second auxiliary electrode member has a fixing hole that opens on the other surface of the frame portion.
Cathode electrode assembly. A cathode electrode device including a holder, a cathode electrode assembly, and a coupling tool,
The holder has a through hole portion and a connection hole,
The through hole portion includes a cathode electrode assembly receiving portion and an insertion hole portion to be plated connected to the receiving portion,
The connection hole is provided in the receiving portion and penetrates the receiving portion from one surface to the other surface,
The cathode electrode assembly is the one described in any one of claims 1 to 5, and is disposed on one surface of the receiving portion,
The connecting tool is provided on the other surface of the receiving portion, and the insertion end penetrates the connecting hole of the holder and enters the fixing hole of the auxiliary electrode member, whereby the cathode electrode The assembly and the holder are connected and fixed.
Cathode electrode device. The cathode electrode device according to claim 6, further comprising a lead conductor,
The lead conductor has one end coupled to the auxiliary electrode member of the cathode electrode assembly,
Cathode electrode device. A plating apparatus including a plating tank, a cathode electrode device, an anode electrode device, and a wafer,
The plating tank contains a plating solution,
The cathode electrode device is described in any one of claims 6 and 7, and from the outside of the plating tank to the other surface of the frame portion of the cathode electrode member constituting the cathode electrode assembly. It is attached to the plating tank so that the object to be plated can be contacted,
The anode electrode device has an anode electrode member, the anode electrode member is opposed to the cathode electrode device,
The cathode electrode device and the anode electrode device constitute an electric circuit for forming a plating film on an object to be plated supported on the wafer via the plating solution in the plating tank. ,
Plating equipment.

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