CN219824406U - Double-sided electroplating clamp for glass wafer - Google Patents

Abstract

The utility model provides a double-sided electroplating clamp for a glass wafer, which is used for solving the defect that the double-sided electroplating clamp for the wafer in the prior art has poor sealing effect, and a working electrode is plated due to easy infiltration of electroplating solution. The electroplating clamp comprises: the fixture body is used for supporting and positioning the glass wafer; the first annular boss and the concentric C-shaped boss are arranged on the outer ring of the first annular boss, the height of the second annular boss is larger than that of the first annular boss, and the working electrode and the electric connector are arranged on the first annular boss and the concentric C-shaped boss; the sealing ring is embedded into the groove to realize sealing, and the electrode lead is connected with the electrode. The attaching clamp plate is matched with the clamp body to clamp the wafer, and the base body is also provided with an annular boss, an electrode, an electric connector and a sealing ring. The attaching clamp plate is arranged on the clamp body through the alignment structure, the electric connector is spliced to form a current path, the sealing rings are overlapped to form an inner ring and an outer ring for sealing, and each working electrode and the electric connector are sealed in. The fastening pressing plate is used for pressing the clamp body and the attaching clamping plate through threads. The electrodes and electrical contacts in the sealed configuration may not be plated.

Description

Double-sided electroplating clamp for glass wafer

Technical Field

The utility model relates to the technical field of semiconductor packaging equipment, in particular to a double-sided electroplating clamp for a glass wafer.

Background

Semiconductor packaging technology has evolved from conventional wire bonding to three-dimensional packaging technology. Compared with the traditional wire bonding, the through hole interconnection and wafer bump technology are combined, the method has the advantages of good conductivity, low power consumption, small packaging volume and the like, and can meet the development needs of the upper-layer and lower-layer stacking technology. In the development process of the through hole interconnection technology and the wafer bump technology, an electroplating process of plating a layer of metal or alloy on the surface of a conductive material by utilizing an electrolysis principle plays a key role.

With the trend toward miniaturization of electronic products, semiconductors are also being miniaturized and highly integrated, and wafer plating is also being developed from single-sided plating to double-sided plating.

However, the inventor finds that in the process of implementing the technical solution in the embodiment of the present utility model, the existing wafer double-sided electroplating fixture has at least the following technical problems:

the existing wafer double-sided electroplating clamp has the technical problems that the sealing effect is poor, and the electroplating working electrode is plated because the electroplating liquid is easy to permeate.

Disclosure of Invention

Accordingly, an objective of the present utility model is to provide a double-sided plating jig for glass wafers, which is used for solving the defect that the double-sided plating jig for wafers in the prior art has poor sealing effect, and the plating working electrode is plated due to the easy penetration of the plating solution. According to the embodiment of the utility model, the electroplating working electrode is arranged in the sealing space formed by the inner ring seal and the outer ring seal, so that the electroplating liquid cannot enter the sealing space, the technical problem that the electroplating working electrode is plated in the electroplating process is solved, and two current channels can be provided for supplying power to the two electroplating surfaces of the glass wafer to be electroplated respectively, so that the flexibility of electroplating task selection is realized.

In order to achieve the above object, the technical scheme adopted in the embodiment of the present utility model is as follows:

the embodiment of the utility model provides a double-sided electroplating clamp for a glass wafer, which comprises the following components:

the fixture body is used for supporting and positioning the glass wafer to be electroplated;

the working face substrate of the clamp body is provided with a first annular boss and a concentric C-shaped boss, the C-shaped boss is arranged on the outer ring of the first annular boss, and the protruding height of the C-shaped boss is larger than that of the first annular boss; the first annular boss is provided with an annular working electrode, and n electrode contacts are uniformly distributed on the annular working electrode; the C-shaped boss is provided with a C-shaped working electrode, and m public electric connectors are uniformly distributed on the C-shaped working electrode;

an annular groove for embedding a first O-shaped sealing ring is formed in the inner ring wall body of the first annular boss; when the first O-shaped sealing ring is embedded on the first annular boss through the annular groove, the protruding height of the first O-shaped sealing ring is larger than that of the annular working electrode; the outer ring wall body of the C-shaped boss is provided with a C-shaped groove for embedding a second O-shaped sealing ring; when the second O-shaped sealing ring is embedded on the C-shaped boss through the C-shaped groove, the protruding height of the second O-shaped sealing ring is larger than that of the C-shaped working electrode;

the fixture comprises a fixture body, wherein a first electrode lead and a second electrode lead are arranged on a substrate of the fixture body, the first electrode lead is electrically connected with an annular working electrode, and the second electrode lead is electrically connected with a C-shaped working electrode.

The attaching clamp plate is used for clamping the glass wafer to be electroplated in a matched mode with the clamp body;

a working surface substrate of the attaching clamp plate is provided with a third annular boss, an annular working electrode is arranged on the third annular boss, and n electrode contacts are uniformly distributed on the annular working electrode;

an annular groove for embedding a third O-shaped sealing ring is formed in the inner ring wall body of the third annular boss; when the third O-shaped sealing ring is embedded on the third annular boss through the annular groove, the protruding height of the third O-shaped sealing ring is larger than that of the annular working electrode; the attaching clamp plate substrate of the outer ring of the third annular boss is provided with an annular groove for embedding a fourth O-shaped sealing ring; when the fourth O-shaped sealing ring is embedded on the attaching clamp plate base body through the annular groove, the protruding height of the fourth O-shaped sealing ring is larger than that of the annular working electrode; m female electric connectors are annularly and uniformly distributed on the attaching clamp plate base body between the third annular boss and the fourth O-shaped sealing ring, and each female electric connector is electrically connected with an annular working electrode arranged on the third annular boss;

the attaching clamp plate is arranged on the clamp body in an alignment manner through an alignment structure;

when the attaching clamp plate is arranged on the clamp body in an aligned manner, the m male electric connectors are inserted into the m female electric connectors to form a current path, the first O-shaped sealing ring is overlapped with the third O-shaped sealing ring to form an inner ring seal, and the second O-shaped sealing ring is overlapped with the fourth O-shaped sealing ring to form an outer ring seal, so that the annular working electrode, n electrode contacts on the annular working electrode, the C-shaped working electrode, m male electric connectors on the C-shaped working electrode and m female electric connectors are all positioned in a sealing space;

the fastening pressing plate is used for pressing the clamp body and the attaching clamping plate through threaded fit to fix the glass wafer to be electroplated;

wherein n is greater than or equal to 3 and m is greater than or equal to 2.

Optionally, a vacuum channel for vacuumizing is formed on the clamp body, and an opening end of the vacuum channel on the clamp body is located in the second O-shaped sealing ring.

Optionally, the device further comprises an interface board; the interface board is fixedly arranged at one end part of the fixture body, a first electrode lead interface electrically connected with the first electrode lead, a second electrode lead interface electrically connected with the second electrode lead and a vacuum interface connected with the vacuum channel pipeline are integrated on the interface board.

Optionally, the alignment structure includes seting up the alignment groove on the anchor clamps body, sets up the alignment handle on the attaching splint, the attaching splint passes through the alignment handle with the alignment groove cooperatees and counterpcates and be in on the anchor clamps body.

Optionally, the bolt holes are all formed in the fastening pressing plate and the clamp body, and the fastening pressing plate is in threaded fit with the attaching clamping plate and the clamp body through the bolts and the bolt holes.

Optionally, the materials of the clamp body, the attaching clamp plate and the fastening clamp plate are acid and alkali resistant insulating engineering materials.

Optionally, the acid-base resistant insulation engineering material is an insulation engineering plastic plate.

Based on the above technical scheme, according to the double-sided electroplating clamp for glass wafers in the embodiment of the utility model, the first O-shaped sealing ring and the third O-shaped sealing ring which are oppositely arranged and mutually overlapped in use are overlapped to form an inner ring seal, and the second O-shaped sealing ring and the fourth O-shaped sealing ring which are oppositely arranged and mutually overlapped in use are overlapped to form an outer ring seal, so that the annular working electrode on the clamp body, n electrode contacts on the annular working electrode, the C-shaped working electrode and m male electric connectors on the C-shaped working electrode, the annular working electrode on the attachment clamp plate, n electrode contacts on the annular working electrode and m female electric connectors on the annular working electrode are positioned in a sealing space formed by the inner ring seal and the outer ring seal. In the electroplating process, the electroplating liquid cannot enter the sealed space, and the technical problem that the electroplating working electrode is plated in the electroplating process is solved. According to the technical scheme, the double-sided electroplating clamp for the glass wafer can keep a high-quality working state for a long time, so that the service life of the double-sided electroplating clamp is prolonged, and the use cost is reduced; on the other hand, the quality of single-sided or double-sided electroplating of the glass wafer is improved. In the embodiment of the utility model, the annular working electrode on the attaching clamp plate is supplied with power through the first electrode lead, and is supplied with power through a circuit channel formed by sequentially and electrically connecting the second electrode lead, the C-shaped working electrode, the m male electric connectors, the m female electric connectors and the annular working electrode on the attaching clamp plate, wherein the annular working electrode on the attaching clamp plate and the annular working electrode on the attaching clamp plate are respectively arranged on and contacted with two electroplating surfaces of a glass wafer to be electroplated. According to the technical scheme, the double-sided electroplating clamp for the glass wafer can realize double-sided electroplating under the condition of realizing single-sided electroplating, and the electroplating efficiency of the wafer to be electroplated is improved. Furthermore, one electroplating clamp can be adopted to meet different electroplating requirements, so that the flexibility of electroplating task selection is realized, the applicability of the utility model is improved, and the operation difficulty of electroplating the glass wafer is also reduced. Thereby accelerating the large-scale commercial application of the double-sided electroplating clamp for the glass wafer.

Drawings

FIG. 1 shows a schematic block diagram of a double-sided plating jig for a glass wafer in an embodiment of the utility model;

FIG. 2 shows a schematic exploded view of a double-sided plating jig for a glass wafer in an embodiment of the utility model;

fig. 3 shows a schematic front view of a clamp body in an embodiment of the utility model.

Fig. 4 shows a schematic front view of the attaching clamp plate in an embodiment of the utility model.

Fig. 5 shows a schematic front view structural diagram of a fastening platen in an embodiment of the present utility model.

Wherein, the correspondence between the reference numerals and the component names in the figures is as follows:

the fixture comprises a fixture body 1, a first annular boss 101, a C-shaped boss 102, a male electric connector 103, a first electrode lead 104, a second electrode lead 105, a vacuum channel 106, an alignment groove 107, an attaching clamping plate 2, a third annular boss 201, a female electric connector 202, an alignment handle 203, a fastening pressing plate 3, an interface plate 4, a first electrode lead interface 401, a second electrode lead interface 402 and a vacuum interface 403.

Detailed Description

In the embodiment of the utility model, the double-sided electroplating clamp for the glass wafer is used for stably and reliably clamping the glass wafer to be electroplated in the electroplating bath, and simultaneously, independent, uniform and continuous power supplies are provided for two sides or one side of the glass wafer so as to realize a high-quality electroplating effect. The wafer capable of holding the plating of the double-sided plating jig for glass wafers includes, but is not limited to, glass wafers, which may also be silicon wafers, with which wafers for manufacturing microelectronic devices may be plated.

The technical scheme of the present utility model will be described below with reference to the accompanying drawings and examples.

Referring now to fig. 1 and 2, and referring to fig. 3, 4, and 5, a double-sided plating jig for a glass wafer according to an embodiment of the present utility model includes:

the fixture body 1 is used for supporting and positioning a glass wafer to be electroplated;

the working surface substrate of the clamp body 1 is provided with a first annular boss 101 and a concentric C-shaped boss 102, the C-shaped boss 102 is arranged on the outer ring of the first annular boss 101, and the protruding height of the C-shaped boss 102 is larger than that of the first annular boss 101; the first annular boss 101 is provided with an annular working electrode, and n electrode contacts are uniformly distributed on the annular working electrode; a C-shaped working electrode is arranged on the C-shaped boss 102, and m male electric connectors 103 are uniformly distributed on the C-shaped working electrode;

an annular groove for embedding a first O-shaped sealing ring is formed in the inner ring wall body of the first annular boss 101; when the first O-ring is embedded on the first annular boss 101 through an annular groove, the protruding height of the first O-ring is larger than that of the annular working electrode; the outer ring wall body of the C-shaped boss 102 is provided with a C-shaped groove for embedding a second O-shaped sealing ring; when the second O-ring is embedded on the C-shaped boss 102 through a C-shaped groove, the protruding height of the second O-ring is greater than the protruding height of the C-shaped working electrode;

a first electrode lead 104 and a second electrode lead 105 are arranged on the substrate of the clamp body 1, the first electrode lead 104 is electrically connected with the annular working electrode, and the second electrode lead 105 is electrically connected with the C-shaped working electrode.

An attaching clamping plate 2, which is used for clamping the glass wafer to be electroplated in a matching way with the clamp body 1;

a third annular boss 201 is arranged on the working surface substrate of the attaching clamp plate 2, an annular working electrode is arranged on the third annular boss 201, and n electrode contacts are uniformly distributed on the annular working electrode;

an annular groove for embedding a third O-shaped sealing ring is formed in the inner ring wall body of the third annular boss 201; when the third O-ring is embedded on the third annular boss 201 through an annular groove, the protruding height of the third O-ring is greater than that of the annular working electrode; an annular groove for embedding a fourth O-shaped sealing ring is formed in the substrate of the attaching clamp plate 2 on the outer ring of the third annular boss 201; when the fourth O-shaped sealing ring is embedded on the substrate of the attaching clamp plate 2 through the annular groove, the protruding height of the fourth O-shaped sealing ring is larger than that of the annular working electrode; m female electric connectors 202 are uniformly distributed on the substrate of the attaching clamp plate 2 between the third annular boss 201 and the fourth O-shaped sealing ring in an annular mode, and each female electric connector 202 is electrically connected with an annular working electrode arranged on the third annular boss 201;

the attaching clamp plate 2 is arranged on the clamp body 1 in an alignment manner through an alignment structure;

when the attaching clamping plate 2 is arranged on the clamp body 1 in an aligned manner, the m male electric connectors 103 are inserted into the m female electric connectors 202 to form a current path, the first O-shaped sealing ring is overlapped with the third O-shaped sealing ring to form an inner ring seal, and the second O-shaped sealing ring is overlapped with the fourth O-shaped sealing ring to form an outer ring seal, so that the annular working electrode, n electrode contacts thereon, the C-shaped working electrode, m male electric connectors 103 thereon and m female electric connectors 202 are all in a sealing space;

the fastening pressing plate 4 is used for pressing the clamp body 1 and the attaching clamping plate 2 through threaded fit to fix the glass wafer to be electroplated;

wherein n is greater than or equal to 3 and m is greater than or equal to 2.

It should be understood that, in the embodiment of the present utility model, in order to clearly show the correspondence between the O-ring and the boss, the first annular boss 101 corresponds to the first O-ring, the third annular boss 201 corresponds to the third O-ring, and the C-shaped boss 102 corresponds to the second O-ring; the first annular boss 101 and the third annular boss 201 are only technical names and do not necessarily represent the presence of the second annular boss in the embodiment of the present utility model. The description of the embodiments of the present utility model will be clearer and more easily understood by using the foregoing technical terms.

In the embodiment of the present utility model, the materials used for manufacturing the clamp body 1, the attaching clamping plate 2, and the fastening clamping plate 3 are required to have the advantages of excellent chemical stability, good electrical insulation, high mechanical strength, durability, and the like. Optionally, the materials of the clamp body 1, the attaching clamp plate 2 and the fastening clamp plate 3 are acid and alkali resistant insulating engineering materials. The acid and alkali resistant insulating engineering material can be polypropylene (PP), carbon Fiber Reinforced Polymer (CFRP), polyethylene (PE), polyetherimide (PEI) and the like. The insulation engineering plastic plate in the acid and alkali resistant insulation engineering material has been proved by a large amount of industries and is widely applied to the fields of electronics, electricity, machinery and the like. The insulating engineering plastic plate has the advantages of good acid and alkali resistance, good electrical insulation, high mechanical strength, mature molding and processing technology and low manufacturing cost. Wherein, the clamp body 1 and the attaching clamp plate 2 are integrally formed parts, for example, can be manufactured by injection molding processing technology, and the surfaces of the clamp body and the attaching clamp plate are subjected to mechanical processing and polishing treatment, so that the clamp body has a smooth working surface, and on one hand, the flow of electroplating liquid in the electroplating process is facilitated; on the other hand, the sealing performance of the electroplating solution is improved by closely contacting with the contact part of the glass wafer to be electroplated.

In the embodiment of the utility model, the fastening pressing plate 3 is provided with a plurality of bolts through the bolt holes, and the clamp body 1 and the attaching clamping plate 2 are connected through the fixing bolts, so that the distance between the two can be conveniently adjusted, and the reliable positioning and clamping of the glass wafer can be realized. Obviously, the clamp body 1 also has bolt holes corresponding to the bolt hole positions of the fastening pressing plate 3 and matched with the bolts.

In the embodiment of the utility model, the annular working electrode, the C-shaped working electrode, the electrode contact, the male electric connector 103 and the female electric connector 104 are made of corrosion-resistant conductive metal materials. They can be directly embedded into the designed setting site during setting. Wherein, the liquid crystal display device comprises a liquid crystal display device,

the annular working electrode can be composed of an annular conducting ring and n electrode contacts welded and connected to the annular conducting ring; the annular working electrode can also be formed by combining a plurality of electrode plates, n electrode contacts are uniformly distributed on the annular working electrode, each electrode contact corresponds to one electrode plate, and adjacent electrode contacts are connected through conductive wires to form a continuous closed circuit.

The C-shaped working electrode can be composed of a C-shaped conductive structure and m male electric connectors 103 welded and connected to the C-shaped conductive structure; the C-shaped working electrode can be formed by combining a plurality of electrode plates, and m public electric connectors 103 are uniformly distributed on the C-shaped working electrode. Each male electric connector 103 corresponds to one electrode plate, and adjacent male electric connectors 103 are connected through conducting wires to form a non-closed continuous circuit.

In the embodiment of the utility model, the first O-shaped sealing ring, the second O-shaped sealing ring, the third O-shaped sealing ring and the fourth O-shaped sealing ring are commonly used O-shaped sealing rings of an electroplating clamp. The O-ring is typically made of elastomeric material.

The working process of the double-sided electroplating clamp for the glass wafer in the embodiment of the utility model is as follows:

the clamp is prepared by selecting and using: the double-sided electroplating clamp provided by the utility model is suitable in specification and model according to the size of the glass wafer to be electroplated, wherein the size of the glass wafer to be electroplated is smaller than the size of an assembly shell of the double-sided electroplating clamp and is larger than the peripheral size of the second O-shaped sealing ring additionally arranged on the C-shaped boss 102; and the bolts used by the threaded fit of the fastening pressing plate 3 are unscrewed, the distance between the clamp body 1 and the attaching clamping plate 2 is adjusted, and the glass wafer to be electroplated can be clamped stably and reliably.

Clamping a glass wafer to be electroplated: placing a glass wafer to be electroplated on a working surface substrate of the fixture body 1, wherein the glass wafer to be electroplated tightly abuts against the first O-shaped sealing ring and the second O-shaped sealing ring, at the moment, the first O-shaped sealing ring and the second O-shaped sealing ring separate an inner ring from an outer ring of a contact surface of the glass wafer to be electroplated, the inner ring is a part of the glass wafer to be electroplated which can realize electroplating, the outer ring is a part of the glass wafer to be electroplated which can possibly enter electroplating liquid but cannot realize electroplating, and an arrangement area of electroplating working electrodes (such as an annular working electrode, C-shaped working electrodes and m female electric connectors) is arranged between the inner ring and the outer ring and is an area which does not allow the electroplating liquid to enter; the attaching clamp plate 2 is arranged on the clamp body 1 in an aligned manner, the first O-shaped sealing ring and the third O-shaped sealing ring are overlapped to form an inner ring seal, the second O-shaped sealing ring and the fourth O-shaped sealing ring are overlapped to form an outer ring seal, and m male electric connectors 103 are correspondingly inserted into m female electric connectors 202 to form a circuit path. And the annular working electrode on the clamp body 1, the n electrode contacts on the annular working electrode, the n electrode contacts on the C-shaped working electrode and the m male electric connectors 103 on the C-shaped working electrode are arranged in a sealing space formed by inner ring sealing and outer ring sealing. During the electroplating process, the electroplating solution cannot enter the sealed space, and the electroplating working electrode cannot be plated with metal during the electroplating process, so that the electroplating performance is reduced or fails. The clamp body 1 and the attaching clamp plate 2 are pressed together through threaded bolt matching, so that stable clamping of the glass wafer to be electroplated is realized.

The power supply circuit is connected with: the first electrode lead and/or the second electrode lead are electrically connected to a direct current power supply. The annular working electrode of the fixture body 1 is electrically connected with the first electrode lead 104, and can supply power through the first electrode lead 104, so that the glass wafer to be electroplated and the contact surface thereof can be subjected to power supply electroplating through n electrode contacts; the second electrode lead 105, the C-shaped working electrode of the fixture body 1, the m male electrical connectors 103, the m female electrical connectors 202, the annular working electrode and the n electrode contacts on the attachment clamping plate 2 are electrically connected in sequence, and the annular working electrode on the attachment clamping plate 2 can be powered by the first electrode lead 104, so that power supply electroplating can be performed on the contact surface between the glass wafer to be electroplated and the annular working electrode on the attachment clamping plate 2; when one of the first electrode lead 104 and the second electrode lead 105 is electrically connected to a direct current power supply, single-sided plating of the glass wafer can be realized, and when both the first electrode lead 104 and the second electrode lead 105 are electrically connected to a direct current power supply, double-sided plating of the glass wafer can be realized.

Electroplating the glass wafer to be electroplated: the double-sided electroplating clamp provided by the utility model, which clamps the glass wafer to be electroplated, is immersed in an electroplating tank containing electrolyte, electrified for electroplating, and under the action of current on the electrolyte, an electroplated layer is deposited on the electroplating surface of the glass wafer to be electroplated, which is positioned at the inner ring. If double-sided electroplating is carried out, an electroplated layer is deposited on both surfaces of the glass wafer to be electroplated which is positioned at the inner ring; if single-sided plating is performed, a plating layer is deposited on one surface of the glass wafer to be plated, which is positioned at the inner ring. In the electroplating process, the annular working electrode on the clamp body 1, the n electrode contacts on the annular working electrode, the C-shaped working electrode and the m male electric connectors 103 on the C-shaped working electrode, the annular working electrode on the attaching clamp plate 2, the n electrode contacts on the annular working electrode and the m female electric connectors 202 are sealed spaces in which the electroplating liquid cannot invade, so that the technical problem that the electroplating working electrode is plated is solved. Therefore, the double-sided electroplating clamp for the glass wafer can keep a high-quality working state for a long time, on one hand, the service life of the double-sided electroplating clamp is prolonged, and the use cost is reduced; on the other hand, the quality of single-sided or double-sided electroplating of the glass wafer is improved.

It can be seen that, in the double-sided electroplating clamp for glass wafers according to the embodiment of the present utility model, the first O-ring and the third O-ring, which are disposed opposite to each other and in use are overlapped to form an inner ring seal, and the second O-ring and the fourth O-ring, which are disposed opposite to each other and in use are overlapped to form an outer ring seal, so that the annular working electrode on the clamp body 1, the n electrode contacts thereon, the C-shaped working electrode, and the m male connectors 103 thereon, the annular working electrode on the attachment clamping plate 2, the n electrode contacts thereon, and the m female connectors 202 are located in a sealed space formed by the inner ring seal and the outer ring seal. In the electroplating process, the electroplating liquid cannot enter the sealed space, and the technical problem that the electroplating working electrode is plated in the electroplating process is solved. According to the technical scheme, the double-sided electroplating clamp for the glass wafer can keep a high-quality working state for a long time, so that the service life of the double-sided electroplating clamp is prolonged, and the use cost is reduced; on the other hand, the quality of single-sided or double-sided electroplating of the glass wafer is improved. In the embodiment of the utility model, the first electrode lead 104 is used for supplying power to the annular working electrode on the attaching clamping plate 2, and the second electrode lead 105, the C-shaped working electrode, the m male electric connectors 103, the m female electric connectors 202 and the annular working electrode on the attaching clamping plate 2 are sequentially and electrically connected to form a circuit channel for supplying power to the annular working electrode on the attaching clamping plate 2, and the annular working electrode on the attaching clamping plate 2 are respectively arranged on and contacted with two electroplating surfaces of a glass wafer to be electroplated. According to the technical scheme, the double-sided electroplating clamp for the glass wafer can realize double-sided electroplating under the condition of realizing single-sided electroplating, and the electroplating efficiency of the wafer to be electroplated is improved. Furthermore, one electroplating clamp can be adopted to meet different electroplating requirements, so that the flexibility of electroplating task selection is realized, the applicability of the utility model is improved, and the operation difficulty of electroplating the glass wafer is also reduced. Thereby accelerating the large-scale commercial application of the double-sided electroplating clamp for the glass wafer.

In order to improve the sealing performance of the outer ring seal and the inner ring seal, in this embodiment of the present utility model, optionally, a vacuum channel 106 for vacuumizing is provided on the fixture body 1, and an open end of the vacuum channel 106 on the fixture body 1 is located in the second O-ring seal. According to the technical scheme, the annular working electrode, n electrode contacts on the annular working electrode, the C-shaped working electrode, m male electric connectors 103 on the C-shaped working electrode and m female electric connectors 202 are in a sealing space which is pumped to be low in air pressure, so that the external atmospheric pressure is changed into a driving force for sealing the sealing space. In this embodiment, the open end of the vacuum channel 106 is surrounded by the second O-ring, so as to ensure that the sealed space is continuously kept at a low air pressure for a long time, thereby improving the reliability and effectiveness of the sealing of the sealed space. The vacuum channel 106 is connected to a vacuum pump through a vacuum tube, so that full-automatic control can be realized. In addition, the tightness of the sealed space can be checked by combining the vacuum channel 106 with a vacuum pumping system.

In order to facilitate connection and management of external devices, in the embodiment of the present utility model, optionally, the device further includes an interface board 4; the interface board 4 is fixedly disposed at one end of the fixture body 1, and the interface board 4 is integrated with a first electrode lead interface 401 electrically connected with the first electrode lead 104, a second electrode lead interface 402 electrically connected with the second electrode lead 105, and a vacuum interface 403 in pipeline connection with the vacuum channel 106. According to the technical scheme, the quick connection with an external power supply and the connection with a vacuum pump can be realized. In this embodiment, the first electrode lead interface 401 and the second electrode lead interface 402 are detachably connected to the first electrode lead 104 and the second electrode lead 105 through metal terminals or pins. The vacuum interface 403 may be detachably connected to the vacuum channel 106 by using an international KF series vacuum sealing connector.

In order to facilitate the realization of the accurate alignment of the first O-ring and the third O-ring, the accurate alignment of the second O-ring and the fourth O-ring, and the accurate alignment of the m male connectors 103 and the m female connectors 202. In this embodiment of the present utility model, optionally, the alignment structure includes an alignment groove 107 formed on the fixture body 1, and an alignment handle 203 disposed on the attaching clamping plate 2, where the attaching clamping plate 2 is aligned on the fixture body 1 by matching the alignment handle 203 with the alignment groove 107. By adopting the alignment structure of the technical scheme, m male electric connectors 103 can be precisely inserted into m female electric connectors 202 to form a high-quality current path, and the double-sided electroplating power supply quality and the power supply stability are improved. By adopting the alignment structure of the technical scheme, the high superposition of the first O-shaped sealing ring and the third O-shaped sealing ring can be realized to form high-quality inner ring sealing, the high superposition of the second O-shaped sealing ring and the fourth O-shaped sealing ring can form high-quality outer ring sealing, and then the annular working electrode, n electrode contacts thereon, the C-shaped working electrode, m male electric connectors 103 thereon and m female electric connectors 202 are all in a sealing space, so that the working electrode, the electrode contacts and the electric connectors are plated with metal due to overflow of electroplating solution is effectively prevented. In this embodiment, the dimensions of the alignment handle 203 and the alignment groove 107 are designed in a non-interference fit manner, so that the alignment handle 203 can be smoothly inserted into the alignment groove 107 during assembly, but a large extraction force needs to be applied during disassembly, so as to ensure the firm positioning of the attachment clamping plate 2 and the clamp body 1.

In order to facilitate the assembly and disassembly of the glass wafer to be electroplated and the electroplated glass wafer and improve the usability of the double-sided electroplating clamp for the glass wafer, in the embodiment of the utility model, optionally, bolt holes are formed in the fastening pressing plate 3 and the clamp body 1, and the fastening pressing plate 3 is used for pressing the attaching clamping plate 2 and the clamp body 1 through the bolt and the bolt holes in a threaded fit manner. The number and location of the bolt holes should be designed to ensure a firm press fit, and the embodiment of the present utility model is not particularly limited. The press fit between the attaching clamp plate 2 and the clamp body 1 is realized through the bolts, the operation is simple, and the rapid disassembly and assembly of the glass wafer is realized while the disassembly and assembly safety of the glass wafer is ensured.

Claims (7)

1. The double-sided electroplating clamp for the glass wafer is characterized by comprising:

the fixture body (1) is used for supporting and positioning a glass wafer to be electroplated;

a first annular boss (101) and a concentric C-shaped boss (102) are arranged on a working surface substrate of the clamp body (1), the C-shaped boss (102) is arranged on the outer ring of the first annular boss (101), and the protruding height of the C-shaped boss (102) is larger than that of the first annular boss (101); an annular working electrode is arranged on the first annular boss (101), and n electrode contacts are uniformly distributed on the annular working electrode; c-shaped working electrodes are arranged on the C-shaped bosses, and m male electric connectors (103) are uniformly distributed on the C-shaped working electrodes;

an annular groove for embedding a first O-shaped sealing ring is formed in the inner ring wall body of the first annular boss (101); when the first O-shaped sealing ring is embedded on the first annular boss (101) through the annular groove, the protruding height of the first O-shaped sealing ring is larger than that of the annular working electrode; the outer ring wall body of the C-shaped boss (102) is provided with a C-shaped groove for embedding a second O-shaped sealing ring; when the second O-shaped sealing ring is embedded on the C-shaped boss (102) through the C-shaped groove, the protruding height of the second O-shaped sealing ring is larger than that of the C-shaped working electrode;

a first electrode lead (104) and a second electrode lead (105) are arranged on a substrate of the clamp body (1), the first electrode lead (104) is electrically connected with an annular working electrode, and the second electrode lead (105) is electrically connected with a C-shaped working electrode;

an attaching clamping plate (2) for clamping a glass wafer to be electroplated in cooperation with the clamp body (1);

a third annular boss (201) is arranged on the working surface substrate of the attaching clamp plate (2), an annular working electrode is arranged on the third annular boss (201), and n electrode contacts are uniformly distributed on the annular working electrode;

an annular groove for embedding a third O-shaped sealing ring is formed in the inner ring wall body of the third annular boss (201); when the third O-shaped sealing ring is embedded on the third annular boss (201) through an annular groove, the protruding height of the third O-shaped sealing ring is larger than that of the annular working electrode; an annular groove for embedding a fourth O-shaped sealing ring is formed in the substrate of the attaching clamp plate (2) of the outer ring of the third annular boss (201); when the fourth O-shaped sealing ring is embedded on the substrate of the attaching clamp plate (2) through the annular groove, the protruding height of the fourth O-shaped sealing ring is larger than that of the annular working electrode; m female electric connectors (202) are annularly and uniformly distributed on the substrate of the attaching clamp plate (2) between the third annular boss (201) and the fourth O-shaped sealing ring, and each female electric connector (202) is electrically connected with an annular working electrode arranged on the third annular boss (201);

the attaching clamp plate (2) is arranged on the clamp body (1) in an alignment manner through an alignment structure;

when the attaching clamp plate (2) is arranged on the clamp body (1) in an aligned manner, m male electric connectors (103) are inserted into m female electric connectors (202) to form a current path, the first O-shaped sealing ring and the third O-shaped sealing ring are overlapped to form an inner ring seal, the second O-shaped sealing ring and the fourth O-shaped sealing ring are overlapped to form an outer ring seal, and therefore the annular working electrode, n electrode contacts on the annular working electrode, m male electric connectors (103) on the C-shaped working electrode and m female electric connectors (202) are all located in a sealing space;

the fastening pressing plate (3) is used for pressing the clamp body (1) and the attaching clamping plate (2) through threaded fit to fix the glass wafer to be electroplated;

wherein n is greater than or equal to 3 and m is greater than or equal to 2.

2. The double-sided electroplating clamp for glass wafers according to claim 1, wherein the clamp body (1) is provided with a vacuum channel (106) for vacuumizing, and the open end of the vacuum channel (106) on the clamp body (1) is positioned in the second O-shaped sealing ring.

3. The double-sided plating jig for glass wafers according to claim 2, further comprising an interface board (4); the interface board (4) is fixedly arranged at one end part of the fixture body (1), a first electrode lead interface (401) electrically connected with the first electrode lead (104) is integrated with the interface board (4), a second electrode lead interface (402) electrically connected with the second electrode lead (105) is integrated with a vacuum interface (403) connected with the vacuum channel (106) in a pipeline mode.

4. A double-sided electroplating clamp for glass wafers according to any one of claims 1-3, wherein the alignment structure comprises an alignment groove (107) formed on the clamp body (1), an alignment handle (203) arranged on the attaching clamp plate (2), and the attaching clamp plate (2) is aligned on the clamp body (1) by matching the alignment handle (203) with the alignment groove (107).

5. A double-sided electroplating clamp for glass wafers according to any one of claims 1-3, wherein bolt holes are formed in the fastening pressing plate (3) and the clamp body (1), and the fastening pressing plate (3) is used for pressing the attaching clamping plate (2) and the clamp body (1) through the bolts and the bolt holes in a threaded fit manner.

6. A double-sided electroplating clamp for glass wafers according to any one of claims 1-3, wherein the materials of the clamp body (1), the attaching clamp plate (2) and the fastening clamp plate (3) are acid and alkali resistant insulating engineering materials.

7. The double-sided plating jig for glass wafers according to claim 6, wherein the acid and alkali resistant insulating engineering material is an insulating engineering plastic plate.