CN219747287U - Conductive polishing head fixing device and conductive polishing head system - Google Patents

Abstract

The utility model discloses a conductive polishing head fixing device, which comprises: a loading member having a first adsorption end surface that is fittingly connectable to the polishing head; and at least a first channel is formed, and one end of the first channel extends to the first adsorption end surface; the power mechanism is used for driving the loading part to rotate; one end of the first conductive piece is connected with a power supply; the conductive interface assembly at least comprises a first acting end, wherein at least part of the first acting end is arranged in the first channel and is electrically connected with the first conductive piece. The utility model also discloses a conductive polishing head system. The utility model provides a simple and reliable solution for the electrification of the polishing head; the loading part and the polishing head are newly provided with a first channel and a second channel, so that the conductivity of the polishing head can be realized on the basis of not affecting the existing structure; the conductive interface component is arranged, so that the requirements of conveniently and rapidly detaching and installing the electrified polishing head can be met.

Description

Conductive polishing head fixing device and conductive polishing head system

Technical Field

The utility model belongs to the technical field of semiconductor integrated circuit chip manufacturing, and particularly relates to a conductive polishing head fixing device and a conductive polishing head system.

Background

The wafer substrate and semiconductor device manufacturing process comprises polishing, surface planarization and other processes, and usually adopts mechanical polishing, chemical mechanical polishing or planarization and other technologies, and the wafer substrate carrier (polishing head) is used for pressurizing the wafer back, controlling parameters such as pressure, polishing head rotating speed, polishing disk rotating speed, polishing liquid flow and the like, and polishing or planarization treatment is carried out on the front surface of the wafer substrate or the surface of the film on the polishing pad. Compared with mechanical polishing, chemical mechanical polishing and chemical mechanical polishing planarization can realize higher polishing or planarization efficiency, including higher flatness, lower defectivity and the like, by adjusting the formulation of the polishing liquid to generate chemical reaction on the surface of the wafer substrate.

Based on chemical mechanical polishing and planarization, the electrochemical mechanical polishing and planarization can further utilize the conductive property of the wafer substrate or the film on the surface of the wafer substrate to form a current path, and perform electrochemical reaction on the surface of the wafer substrate or the film, so that the chemical reaction speed of the surface is improved through precise control of a circuit system, and further the mechanical polishing and planarization efficiency is improved.

Because of various difficulties, no electrochemical mechanical polishing and planarization equipment suitable for large-scale mass production exists in the market at present.

The polishing head of the chemical mechanical polishing and planarization apparatus has a feature that frequent disassembly and maintenance are required, consumable replacement is required, crystallization is cleaned, and the like. Therefore, the polishing head has the requirements of convenient disassembly and assembly, stability and reliability. Similarly, the polishing head suitable for electrochemical mechanical polishing and planarization equipment has the same requirement, but for the charged polishing head which needs to be connected with an external lead, the lead on-off during disassembly and assembly is a difficult problem.

Disclosure of Invention

In order to overcome the defects in the prior art, the utility model provides the conductive polishing head fixing device and the conductive polishing head system, which can realize the conductivity of the polishing head, are convenient to replace and have high use flexibility.

The technical scheme adopted for solving the technical problems is as follows: an electroconductive polishing head fixing device, comprising:

a loading member having a first adsorption end surface that is fittingly connectable to the polishing head; and at least a first channel is formed, and one end of the first channel extends to the first adsorption end surface;

the power mechanism is used for driving the loading part to rotate;

one end of the first conductive piece is connected with a power supply;

the conductive interface assembly at least comprises a first acting end, wherein at least part of the first acting end is arranged in the first channel and is electrically connected with the first conductive piece.

Further, the first acting end is made of conductive materials.

Further, the conductive interface assembly further includes a fixing member made of an insulating material, the fixing member is connected to the loading member, and the first acting end is connected to the fixing member.

Further, the loading element is connected to the swivel.

Further, the first passage extends in an axial direction of the loading member.

Further, the first conductive piece is arranged in the first channel in a penetrating way.

Further, the first channel comprises a first air passage channel and a first installation channel, and the first conductive piece is arranged in the first installation channel in a penetrating mode.

Further, the first channel is arranged in the loading part, or the first channel is arranged in the outer side area of the loading part; alternatively, the first channel is provided on the outer side wall of the loading member.

The utility model also discloses a conductive polishing head system, which comprises:

a loading member having a first adsorption end surface; and at least a first channel is formed, and one end of the first channel extends to the first adsorption end surface;

a polishing head having a second adsorption end surface; and at least a second channel is formed, and one end of the second channel extends to the second adsorption end surface;

the power mechanism is used for driving the loading part to rotate;

the conductive piece at least comprises a first conductive piece, one end of which is connected with a power supply;

the conductive interface assembly at least comprises a first acting end and a second acting end which are connected with the first conductive piece, and at least part of the first acting end and the second acting end are arranged in the first channel and/or the second channel;

when the first adsorption end face and the second adsorption end face are attached, the first acting end and the second acting end are in contact conduction so as to realize electric connection of the polishing head.

Further, the first acting end is made of a conductive material, and the second acting end is made of a conductive material.

Further, the conductive member further includes a second conductive member connected to the second active end.

Further, the conductive interface assembly further comprises a fixing member made of an insulating material, the fixing member is connected with the loading part or the polishing head, and the first acting end or the second acting end is connected with the fixing member.

Further, the conductive interface assembly further includes a mounting frame made of an insulating material, the mounting frame is connected to the polishing head or the loading unit, and the second acting end or the first acting end is connected to the mounting frame.

Further, an elastic piece is arranged in the mounting frame, a flange which can be propped against the elastic piece is formed on the outer wall of the second acting end or the first acting end, the flange is propped against the inner wall of the mounting frame in the stretching state of the elastic piece, and two ends of the second acting end or the first acting end extend out from openings on two sides of the mounting frame respectively.

Further, the first acting end and the second acting end can be magnetically attracted.

Further, the mounting frame is formed by splicing an upper body and a lower body.

Further, the loading part is connected with the rotary joint, and the polishing head can synchronously rotate with the loading part.

Further, the first passage extends in an axial direction of the loading member.

Further, the first channel comprises a first air path channel and a first installation channel, and the first conductive piece is arranged in the first installation channel in a penetrating manner; the second channel comprises a second air channel and a second installation channel, and the second conductive piece is arranged in the second installation channel in a penetrating mode.

Further, the first air passage and the second air passage are communicated up and down.

Further, the first acting end or/and the second acting end form a mounting hole, and the first conductive piece or/and the second conductive piece are connected with a conductive adapter, and the conductive adapter can be in threaded connection with the mounting hole.

Further, the end face of the first acting end is provided with a limiting clamping groove for inserting part of the second acting end; or, the surface of the second acting end is provided with a limit clamping groove for the partial insertion of the first acting end.

Further, a sealing element is arranged on the outer side of the conductive interface assembly, and the first adsorption end face and the second adsorption end face are attached to form extrusion sealing on the sealing element.

Further, the polishing head includes an adsorption film for adsorbing the wafer, which is at least partially made of a conductive material and is electrically connected to the second active end or the second conductive member.

Further, the adsorption film is a flexible film, or a metal film, or a combination film of metal and nonmetal.

Further, the polishing head includes a retaining ring for holding a wafer within the polishing head, at least partially made of an electrically conductive material, and electrically connected to the second active end or the second conductive member.

Further, the first channel is arranged in the loading part, or the first channel is arranged in the outer side area of the loading part; alternatively, the first channel is provided on the outer side wall of the loading member.

The utility model is a brand new mechanical structure suitable for large-scale mass production of electrochemical mechanical polishing and flattening equipment, and has the advantages that the electrochemical mechanical polishing and flattening equipment can be easily transformed into the electrochemical mechanical polishing and flattening equipment under the condition of not affecting the basic mechanism of the original chemical mechanical polishing and flattening equipment, and the original functions are compatible, namely the electro-polishing head and the common polishing head are simultaneously adapted.

The utility model has the advantages that 1) a simple and reliable solution is provided for the electrification of the polishing head; 2) The loading part and the polishing head are newly provided with a first channel and a second channel, so that the conductivity of the polishing head can be realized on the basis of not affecting the existing structure; 3) The conductive interface component is arranged, so that the requirements of conveniently and rapidly detaching and installing the electrified polishing head can be met; 4) The number of the loading parts and the channels on the polishing head can be set according to the requirements, and a plurality of wires can be arranged in one channel or communicated with the plurality of wires, so that the requirements of the communication of the plurality of wires can be met; 5) The conductive interface component can be divided into a loading component and a polishing head, so that the daily disassembly and maintenance are convenient; 6) The two parts of the conductive interface assembly may each have different functions and cooperate to form different functions.

Drawings

Fig. 1 is a cross-sectional view showing a fitting structure of a conductive polishing head fixing device and a polishing head according to a first embodiment of the present utility model.

Fig. 2 is a cross-sectional view showing the mating structure of the conductive polishing head fixing device and the polishing head, and the rotary joint in accordance with the first embodiment of the present utility model.

Fig. 3 is a top view of a third embodiment of an electrically conductive polishing head system.

Fig. 4 is a C-C cross-sectional view of fig. 3.

Fig. 5 is an enlarged view of the structure at a in fig. 4.

Fig. 6 is a B-B cross-sectional view in fig. 3.

Fig. 7 is a top view of a conductive interface assembly according to a third embodiment of the utility model.

Fig. 8 is a cross-sectional view taken along D-D in fig. 7, with the first and second active ends disengaged for conduction.

Fig. 9 is a sectional view D-D of fig. 7 with the first and second active ends engaged in conduction.

Fig. 10 is a top view of a third embodiment of an electrically conductive polishing head system with a first active end extending the entire first channel.

Fig. 11 is an enlarged view of a portion of a conductive interface assembly according to a third embodiment of the present utility model, where a sealing member is disposed between a first suction end surface and a second suction end surface.

Fig. 12 is a cross-sectional view of a conductive interface assembly in accordance with a fifth embodiment of the utility model.

Fig. 13 is a cross-sectional view of a conductive polishing head system in accordance with a sixth embodiment of the utility model.

Fig. 14 is an enlarged view of the structure at E in fig. 13.

Fig. 15 is a cross-sectional view of a conductive interface assembly in accordance with a seventh embodiment of the utility model.

Fig. 16 is a cross-sectional view of a conductive polishing head system according to an eighth embodiment of the utility model.

Fig. 17 is a cross-sectional view of a conductive polishing head system according to a ninth embodiment of the utility model.

Fig. 18 is a front view of a conductive polishing head system in accordance with a tenth embodiment of the present utility model.

Fig. 19 is a cross-sectional view of F-F in fig. 18.

Detailed Description

In order to make the present utility model better understood by those skilled in the art, the following description will make clear and complete descriptions of the technical solutions of the embodiments of the present utility model with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.

Example 1

As shown in fig. 1, a conductive polishing head fixture includes a loading member 1, a first conductive member 31, and a conductive interface assembly 4.

The loading member 1 has a first suction end face 11 that can be cooperatively connected with the polishing head 2, and at least a first passage 12 is formed in the loading member 1, and one end of the first passage 12 extends to the first suction end face 11. Taking the direction shown in fig. 1 as an example, the first suction end surface 11 is a horizontal plane, the lower end of the first passage 12 extends to the first suction end surface 11, and the first passage 12 extends along the axial direction of the loading member 1, penetrating the loading member 1.

As shown in fig. 2, the upper part of the loading component 1 can be connected with the rotary joint 5, and the loading component 1 can rotate under the drive of a power mechanism, wherein the power mechanism can be realized in the prior art, and the power mechanism and the loading component 1 can be integrally arranged or can be separately arranged.

The number of the first channels 12 may be one, or two or more, as shown in fig. 2, the first channels 12 include a first air path channel 121 and a first mounting channel 122, and the first conductive member 31 is disposed in the first mounting channel 122 in a penetrating manner. The number of the first air passage 121 and the first installation passage 122 is not limited, and the functions thereof are not limited, for example, an ultrasonic device, a microwave device, an electromagnetic device, a magnetic attraction device, a light guide device, a liquid, etc. may be provided in the first air passage 121.

One end of the first conductive member 31 is connected to a power source (not shown), and the first conductive member 31 is disposed through the first channel 12. Here, a major part of the axial length of the first channel 12 is occupied by the first conductive element 31, or a minor part of the axial length is occupied by the first conductive element 31. Of course, it is also possible that the entire axial length of the first channel 12 is occupied by the first active end 41 of the conductive interface assembly 4, while the first conductive member 31 is connected to the first active end 41 and is located outside the first channel 12. In the present embodiment, the first conductive member 31 is an electric wire.

The conductive interface assembly 4 includes at least a first active end 41, at least a portion of the first active end 41 being disposed within the first channel 12, and the first active end 41 being electrically connected to the first conductive member 31. In this embodiment, the first acting end 41 is made of a conductive material, however, in other embodiments, the first acting end 41 may be made of a conductive material partially and made of a non-conductive material partially, which is not limited in particular, so long as the conductive function can be achieved.

In order to facilitate the assembly connection between the first active end 41 and the loading element 1, the conductive interface assembly 4 further comprises a fixing element 43 made of insulating material, the fixing element 43 being connected to the loading element 1, the first active end 41 being connected to the fixing element 43. The connection between the fixing member 43 and the loading member 1 may be a bolt connection or the like, and the connection between the first acting end 41 and the fixing member 43 may be an interference fit connection, particularly without limitation.

Of course, as shown in fig. 2, the first active end 41 may be a cylindrical conductor embedded in the loading member 1, and the fixing member 43 is not required.

Example two

A polishing head system includes a conductive polishing head fixture and a polishing head 2. The structure of the loading part 1, the first conductive member 31 and the conductive interface assembly 4 in the conductive polishing head fixing device is the same as that of the first embodiment, and will not be described again.

The polishing head 2 is a polishing head in the prior art, the polishing head 2 is not conductive, and the top surface of the polishing head is a second adsorption end surface 21 which can be attached to the first adsorption end surface 11. The polishing head 2 is internally provided with a plurality of air bags, and the pressure of each area of the back of the wafer is generated by controlling the air pressure in the air bags, so as to control the polishing effect.

When the first adsorption end face 11 and the second adsorption end face 21 are attached, negative pressure is formed in the first air passage 121, so that the loading part 1 adsorbs the polishing head 2 and can rotate, and the loading part 1 and the polishing head 2 can rotate together under the drive of the power mechanism, thereby realizing the polishing process of the wafer.

Example III

As shown in fig. 3 to 10, a conductive polishing head system includes a loading member 1, a polishing head 2, a conductive member, and a conductive interface assembly 4.

The loading member 1 has a first suction end face 11, and at least a first passage 12 is formed in the loading member 1, and one end of the first passage 12 extends to the first suction end face 11. Taking the direction shown in fig. 4 as an example, the first suction end surface 11 is a horizontal plane, the lower end of the first passage 12 extends to the first suction end surface 11, and the first passage 12 extends along the axial direction of the loading member 1, penetrating the loading member 1.

The upper part of the loading element 1 may be connected to a swivel joint 5 and the loading element 1 may be rotated about its own centre line under the drive of the power mechanism.

The number of the first channels 12 may be one, or may be two or more, the first channels 12 include a first air passage 121 and a first mounting channel 122, and the first conductive member 31 is disposed in the first mounting channel 122 in a penetrating manner. The number of the first air passage 121 and the first mounting passage 122 is not limited, and the function thereof is not limited.

The polishing head 2 has a second suction end surface 21, and at least a second passage 22 is formed in the polishing head 2, and one end of the second passage 22 extends to the second suction end surface 21. Taking the direction shown in fig. 4 as an example, the second suction end surface 21 is a horizontal surface, the upper end of the second passage 22 extends to the second suction end surface 21, and the second passage 22 extends along the axial direction of the polishing head 2.

The conductive member comprises at least a first conductive member 31 with one end connected to a power source, and the first conductive member 31 is disposed in the first channel 12 in a penetrating manner. Here, a major part of the axial length of the first channel 12 is occupied by the first conductive element 31, or a minor part of the axial length is occupied by the first conductive element 31. Of course, it is also possible that the entire axial length of the first channel 12 is occupied by the first active end 41 of the conductive interface assembly 4, and that the first conductive member 31 is connected to the first active end 41 and is located outside the first channel 12, as shown in fig. 10. In the present embodiment, the first conductive member 31 is an electric wire.

The conductive interface assembly 4 includes at least a first active end 41 and a second active end 42, at least a portion of the first active end 41 is disposed in the first channel 12, and the first active end 41 is electrically connected to the first conductive member 31. At least a portion of the second active end 42 is disposed within the second channel 22. In the present embodiment, the first acting end 41 and the second acting end 42 are made of conductive materials, however, in other embodiments, the first acting end 41 and the second acting end 42 may be made of conductive materials, and the second acting end 42 may be made of non-conductive materials, which is not limited in particular, so long as the conductive function can be achieved.

In order to facilitate the assembly connection between the second active end 42 and the polishing head 2, the conductive interface assembly 4 further includes a mounting frame 44 made of an insulating material, and the mounting frame 44 is connected to the polishing head 2, and the specific connection manner is not limited. The mounting frame 44 is non-conductive and isolates the second active end 42 from the polishing head 2 to prevent leakage. The second acting end 42 is connected with the mounting frame 44, specifically, the mounting frame 44 is formed by splicing an upper body 443 and a lower body 444, an elastic member 441 is arranged in the mounting frame 44, a flange 442 is formed on the outer wall of the second acting end 42, one end of the elastic member 441 abuts against the flange 442, the other end abuts against the lower body 444 of the mounting frame 44, in the extending state of the elastic member 441, the flange 442 abuts against the upper body 443 of the mounting frame 44, and two ends of the second acting end 42 extend out from openings on the upper side and the lower side of the mounting frame 44 respectively, so that the second acting end 42 can be in effective contact conduction with the first acting end 41.

When the first suction end face 11 and the second suction end face 21 are attached, the first action end 41 and the second action end 42 are in contact conduction, thereby achieving electrical connection of the polishing head 2. In other words, the power supply is conducted with the polishing head 2 through the first conductive member 31, the first active end 41, and the second active end 42, so as to realize electrification of the polishing head 2.

In order to ensure effective engagement between the first active end 41 and the second active end 42 and to ensure formation of a conductive path, a limit catch 411 is provided at an end face of the first active end 41, and a portion of the second active end 42 is inserted into the limit catch 411.

To further ensure an effective engagement between the first active end 41 and the second active end 42, the first active end 41 and the second active end 42 may be magnetically attracted, i.e. the first active end 41 and the second active end 42 are not only electrically conductive but also magnetically.

Since the working area of the polishing head 2 is wet, there are two risks that liquid may infiltrate between the polishing head 2 and the loading unit 1, namely, the second working end 42 and the first working end 41 may be conducted to the polishing head 2 or the loading unit 1 through the liquid, resulting in electric leakage; secondly, the liquid may corrode the second active end 42 and the first active end 41.

As shown in fig. 11, a sealing member 47 is provided on the outside of the conductive interface unit 4, and after the first suction end surface 11 and the second suction end surface 21 are bonded, a pressing seal action is formed on the sealing member 47. The seal member 47 may be fitted into the mounting groove of the second suction end surface 21 or the mounting groove of the first suction end surface 11, and is not particularly limited. As long as the sealing between the first adsorption end face 11 and the second adsorption end face 21 can be achieved, water is prevented from entering the conductive interface assembly 4, and risks of water leakage and corrosion are avoided.

Example IV

In this embodiment, the conductive member further includes a second conductive member 32 connected to the second active end 42.

In other words, in the third embodiment, the second active end 42 may be utilized to directly make electrical communication with the polishing head 2. In the present embodiment, the second conductive member 32 is electrically connected to the polishing head 2, and the power supply is electrically connected to the polishing head 2 through the first conductive member 31, the first acting end 41, the second acting end 42, and the second conductive member 32, so as to realize electrification of the polishing head 2.

The number of the second passages 22 may be one, or may be two or more. As shown in fig. 6, the second channel 22 includes a second air channel 221 and a second mounting channel 222, and the second conductive member 32 is disposed through the second mounting channel 222. The number of the second air path channels 221 and the second installation channels 222 is not limited, and the function thereof is not limited.

In order to ensure effective suction between the loading member 1 and the polishing head 2, the first air path passage 121 and the second air path passage 221 communicate up and down. The first air passage 121 and the second air passage 221 are connected to the fixed air port through the rotary joint 5 above after being vertically in one-to-one correspondence.

Example five

In the third embodiment, at least part of the first active end 41 is located in the first passage 12 and at least part of the second active end 42 is located in the second passage 22.

As shown in fig. 12, in the present embodiment, the same structure as the first acting end 41 described above may be located in the second passage 22, and the same structure as the second acting end 42 described above may be located in the first passage 12, in other words, the structure in the third embodiment is interchanged up and down.

At this time, the surface of the second acting end is provided with a limit clamping groove for the partial insertion of the first acting end.

Of course, in other embodiments, the first acting end 41 may protrude from the first adsorption end surface 11, and when the first adsorption end surface 11 and the second adsorption end surface 21 are attached, the first acting end 41 extends into the second channel 22 to be in contact with and in communication with the second acting end 42.

Alternatively, the second acting end 42 protrudes from the second adsorption end surface 21 to a greater extent, and the first acting end 41 is located deeper inside the first channel 12, and when the first adsorption end surface 11 and the second adsorption end surface 21 are attached, the second acting end 42 extends into the first channel 12 to be in contact with the first acting end 41 for conduction.

Example six

As shown in fig. 5, when the loading member 1 is completed to be mounted with the fixing piece 43, the end surface of the fixing piece 43 is flush with the first suction end surface 11; when the mounting frame 44 completes the mounting with the polishing head 2, the end surface of the mounting frame 44 is flush with the second suction end surface 21.

As shown in fig. 13 and 14, in the present embodiment, the recess 13 for mounting the fixing piece 43 and the first acting end 41 in the loading member 1 is large in depth, and can accommodate a large portion of the second acting end 42 and the mounting frame 44. When the polishing head 2 does not need to be charged, the mounting frame 44 can be detached.

Of course, in other embodiments, a groove with a larger depth may be formed on the polishing head 2 to accommodate the first active end 41.

Example seven

On the basis of the fourth embodiment, in order to realize the assembly connection between the first conductive member 31 and the first acting end 41, a mounting hole 45 is formed in the first acting end 41, an internal thread is formed in the mounting hole 45, the first conductive member 31 is connected to the conductive adaptor 46, specifically, may be wound around the outer periphery of the conductive adaptor 46, and the conductive adaptor 46 has an external thread which can be screwed with the mounting hole 45, thereby realizing the detachable connection between the first conductive member 31 and the first acting end 42.

Similarly, to achieve the assembly connection between the second conductive member 32 and the second active end 42, a second mounting hole 48 is formed in the second active end 42, an internal thread is formed in the second mounting hole 48, the second conductive member 32 is connected to a second conductive adaptor 49, specifically, may be wound around the outer periphery of the second conductive adaptor 49, and the second conductive adaptor 49 has an external thread which can be screwed with the second mounting hole 48, thereby achieving the detachable connection between the second conductive adaptor 49 and the second active end 42.

Of course, in other embodiments, the first conductive element 31 and the first active end 42 may be directly welded, or the first active end 42 may be a portion of the first conductive element 31 itself, without limitation.

Example eight

In the above embodiment, the first passage 12 extends along the axial direction of the loading member 1. As shown in fig. 16, the first passage 12 does not necessarily extend straight along the axial direction of the loading member 1, but may extend in a curved manner, the lower end of the first passage 12 being located at the first suction end surface 11, and the upper end of the first passage 12 may be located at the upper end surface opposite to the first suction end surface 11, or may be located at the side wall of the loading member 1, specifically without limitation.

Likewise, the second channel 12 need not extend straight, but may extend in a curved manner.

Example nine

In the above embodiment, the first passage 12 is located inside the loading member 1. As shown in fig. 17, the first channel 12 may also be provided in an outer region of the loading element 1, which outer region comprises an outer side wall, as well as a region of the outer periphery of the loading element 1.

Examples ten

As shown in fig. 18 and 19, the conductive interface member 4 does not have to have a complicated structure as in the third embodiment described above, and may have a simple structure in which the first active end 41 extends directly over the first passage 12, the second active end 42 extends directly over the second passage 22, and the upper end of the second active end 42 is flush with the second suction end surface 21.

Example eleven

On the basis of the above embodiment, the polishing head 1 includes the adsorbing film 23 for adsorbing the wafer, and at least part of the adsorbing film 23 is made of a conductive material and is electrically connected to the second active end 42 or the second conductive member 32. Specifically, in the tenth embodiment, the lower end of the second acting end 42 extends to the adsorption film 23.

The adsorption film 23 is a flexible film, a metal film, or a combination of metal and nonmetal.

Example twelve

On the basis of the above embodiment, the polishing head 1 comprises a retaining ring 24 for holding the wafer in the polishing head, which is at least partially made of an electrically conductive material and is electrically connected to the second active end 42 or to the second electrically conductive member 32.

The holding ring 24 may be present together with the adsorption film 23 in the eleventh embodiment, or may be present alone, and is not particularly limited.

The structures between the above-described embodiments may be present in various combinations, and are not particularly limited.

The foregoing detailed description is provided to illustrate the present utility model and not to limit the utility model, and any modifications and changes made to the present utility model within the spirit of the present utility model and the scope of the appended claims fall within the scope of the present utility model.

Claims (27)

1. An electroconductive polishing head fixing device, characterized by comprising:

a loading member (1) having a first suction end surface (11) which is fittingly connectable to the polishing head (2); and at least a first channel (12) is formed, one end of the first channel (12) extends to a first adsorption end face (11);

the power mechanism is used for driving the loading part (1) to rotate;

a first conductive member (31) having one end connected to a power source;

the conductive interface assembly (4) at least comprises a first acting end (41), and at least part of the first acting end (41) is arranged in the first channel (12) and is electrically connected with the first conductive piece (31).

2. The conductive polishing head fixing apparatus as claimed in claim 1, wherein: the first active end (41) is made of an electrically conductive material.

3. The conductive polishing head fixing apparatus as claimed in claim 1, wherein: the conductive interface assembly (4) further comprises a fixing piece (43) made of an insulating material, the fixing piece (43) is connected with the loading part (1), and the first acting end (41) is connected with the fixing piece (43).

4. The conductive polishing head fixing apparatus as claimed in claim 1, wherein: the loading part (1) is connected with the rotary joint (5).

5. The conductive polishing head fixing apparatus as claimed in claim 1, wherein: the first channel (12) extends in the axial direction of the loading member (1).

6. The conductive polishing head fixing apparatus as claimed in claim 1, wherein: the first conductive piece (31) is arranged in the first channel (12) in a penetrating way.

7. The conductive polishing head fixing apparatus as claimed in claim 1, wherein: the first channel (12) comprises a first air passage channel (121) and a first installation channel (122), and the first conductive piece (31) is arranged in the first installation channel (122) in a penetrating mode.

8. The conductive polishing head fixing apparatus as claimed in claim 1, wherein: the first channel (12) is arranged in the loading part (1), or the first channel (12) is arranged in the outer side area of the loading part (1); alternatively, the first channel (12) is arranged on the outer side wall of the loading part (1).

9. An electrically conductive polishing head system, comprising:

a loading member (1) having a first adsorption end surface (11); and at least a first channel (12) is formed, one end of the first channel (12) extends to a first adsorption end face (11);

a polishing head (2) having a second suction end surface (21); and at least a second channel (22) is formed, one end of the second channel (22) extends to a second adsorption end surface (21);

the power mechanism is used for driving the loading part (1) to rotate;

the conductive member at least comprises a first conductive member (31) with one end connected with a power supply;

-an electrically conductive interface assembly (4) comprising at least a first active end (41) connected to said first electrically conductive member (31), and a second active end (42), at least part of the first active end (41) and the second active end (42) being arranged in the first channel (12) and/or in the second channel (22);

when the first adsorption end face (11) and the second adsorption end face (21) are attached, the first acting end (41) and the second acting end (42) are in contact conduction so as to realize electric connection of the polishing head (2).

10. The conductive polishing head system as set forth in claim 9, wherein: the first active end (41) is made of an electrically conductive material, and the second active end (42) is made of an electrically conductive material.

11. The conductive polishing head system as set forth in claim 9, wherein: the conductive member further includes a second conductive member (32) coupled to the second active end (42).

12. The conductive polishing head system as set forth in claim 9, wherein: the conductive interface assembly (4) further comprises a fixing piece (43) made of an insulating material, the fixing piece (43) is connected with the loading part (1) or the polishing head (2), and the first acting end (41) or the second acting end (42) is connected with the fixing piece (43).

13. The conductive polishing head system as set forth in claim 9, wherein: the conductive interface assembly (4) further comprises a mounting frame (44) made of an insulating material, the mounting frame (44) is connected with the polishing head (2) or the loading part (1), and the second acting end (42) or the first acting end (41) is connected with the mounting frame (44).

14. The conductive polishing head system as set forth in claim 13, wherein: an elastic piece (441) is arranged in the mounting frame (44), a flange (442) which can be propped against the elastic piece (441) is formed on the outer wall of the second acting end (42) or the first acting end (41), the flange (442) is propped against the inner wall of the mounting frame (44) in the stretching state of the elastic piece (441), and two ends of the second acting end (42) or the first acting end (41) respectively extend out from openings at two sides of the mounting frame (44).

15. The conductive polishing head system as set forth in claim 9, wherein: the first acting end (41) and the second acting end (42) can be magnetically attracted.

16. The conductive polishing head system as set forth in claim 13, wherein: the mounting frame (44) is formed by splicing an upper body (443) and a lower body (444).

17. The conductive polishing head system as set forth in claim 9, wherein: the loading part (1) is connected with the rotary joint (5), and the polishing head (2) can synchronously rotate with the loading part (1).

18. The conductive polishing head system as set forth in claim 9, wherein: the first channel (12) extends in the axial direction of the loading member (1).

19. The conductive polishing head system as set forth in claim 11, wherein: the first channel (12) comprises a first air passage channel (121) and a first installation channel (122), and the first conductive piece (31) is arranged in the first installation channel (122) in a penetrating manner; the second channel (22) comprises a second air channel (221) and a second installation channel (222), and the second conductive piece (32) is arranged in the second installation channel (222) in a penetrating mode.

20. The conductive polishing head system as set forth in claim 19, wherein: the first air passage (121) and the second air passage (221) are communicated up and down.

21. The conductive polishing head system as set forth in claim 9, wherein: the first acting end (41) or/and the second acting end (42) form a mounting hole (45), the first conductive piece (31) or/and the second conductive piece (32) is/are connected with a conductive adapter piece (46), and the conductive adapter piece (46) can be connected with the mounting hole (45) in a threaded mode.

22. The conductive polishing head system as set forth in claim 9, wherein: the end face of the first acting end (41) is provided with a limit clamping groove (411) for inserting part of the second acting end (42); or, the surface of the second acting end is provided with a limit clamping groove for the partial insertion of the first acting end.

23. The conductive polishing head system as set forth in claim 9, wherein: and a sealing piece (47) is arranged on the outer side of the conductive interface assembly (4), and the first adsorption end face (11) and the second adsorption end face (21) are attached to form extrusion sealing on the sealing piece (47).

24. The conductive polishing head system as set forth in claim 11, wherein: the polishing head (2) comprises an adsorption film (23) for adsorbing the wafer, which is at least partially made of an electrically conductive material and is electrically connected to the second active end (42) or the second electrically conductive member (32).

25. The conductive polishing head system as set forth in claim 24, wherein: the adsorption film (23) is a flexible film, or a metal film, or a combination film of metal and nonmetal.

26. The conductive polishing head system as set forth in claim 11, wherein: the polishing head (2) comprises a retaining ring (24) for holding a wafer within the polishing head, which is at least partially made of an electrically conductive material and is electrically connected to the second active end (42) or the second electrically conductive member (32).

27. The conductive polishing head system as set forth in claim 9, wherein: the first channel (12) is arranged in the loading part (1), or the first channel (12) is arranged in the outer side area of the loading part (1); alternatively, the first channel (12) is arranged on the outer side wall of the loading part (1).