JP2017135380A5 - - Google Patents

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Publication number
JP2017135380A5
JP2017135380A5 JP2017010079A JP2017010079A JP2017135380A5 JP 2017135380 A5 JP2017135380 A5 JP 2017135380A5 JP 2017010079 A JP2017010079 A JP 2017010079A JP 2017010079 A JP2017010079 A JP 2017010079A JP 2017135380 A5 JP2017135380 A5 JP 2017135380A5
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Japan
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JP2017010079A
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English (en)
Japanese (ja)
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JP6901269B2 (ja
JP2017135380A (ja
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Priority claimed from KR1020160010530A external-priority patent/KR102486035B1/ko
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Publication of JP2017135380A5 publication Critical patent/JP2017135380A5/ja
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JP2017010079A 2016-01-28 2017-01-24 発光素子パッケージ及びこれを備えた発光装置 Active JP6901269B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2016-0010530 2016-01-28
KR1020160010530A KR102486035B1 (ko) 2016-01-28 2016-01-28 발광 소자 패키지 및 이를 구비한 발광 장치

Publications (3)

Publication Number Publication Date
JP2017135380A JP2017135380A (ja) 2017-08-03
JP2017135380A5 true JP2017135380A5 (enExample) 2020-02-20
JP6901269B2 JP6901269B2 (ja) 2021-07-14

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ID=57890727

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017010079A Active JP6901269B2 (ja) 2016-01-28 2017-01-24 発光素子パッケージ及びこれを備えた発光装置

Country Status (5)

Country Link
US (1) US10608153B2 (enExample)
EP (1) EP3200249B1 (enExample)
JP (1) JP6901269B2 (enExample)
KR (1) KR102486035B1 (enExample)
CN (1) CN107017324B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109494260B (zh) * 2018-12-28 2024-04-05 山东省半导体研究所 一种oj芯片大功率瞬态抑制保护二极管及其制作方法
KR20210117726A (ko) * 2020-03-20 2021-09-29 엘지이노텍 주식회사 조명모듈 및 조명장치

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4066608B2 (ja) 2001-03-16 2008-03-26 日亜化学工業株式会社 パッケージ成形体及びその製造方法
JP4269709B2 (ja) * 2002-02-19 2009-05-27 日亜化学工業株式会社 発光装置およびその製造方法
JP4211359B2 (ja) * 2002-03-06 2009-01-21 日亜化学工業株式会社 半導体装置の製造方法
JP2006108333A (ja) 2004-10-04 2006-04-20 Toyoda Gosei Co Ltd ランプ
WO2008038997A1 (en) * 2006-09-27 2008-04-03 Seoul Semiconductor Co., Ltd. Light emitting diode package employing leadframe with plated layer of high brightness
KR101455431B1 (ko) 2007-03-26 2014-10-27 니치아 카가쿠 고교 가부시키가이샤 발광 장치
US7566159B2 (en) 2007-05-31 2009-07-28 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Side-emitting LED package with improved heat dissipation
KR100969142B1 (ko) * 2008-01-25 2010-07-08 알티전자 주식회사 측면 발광 다이오드 패키지
KR100969144B1 (ko) 2008-01-28 2010-07-08 알티전자 주식회사 발광 다이오드 패키지
KR100981214B1 (ko) 2008-01-28 2010-09-10 알티전자 주식회사 발광다이오드 패키지
JP4683053B2 (ja) 2008-01-28 2011-05-11 日亜化学工業株式会社 射出成形用金型及びこれによって成形される半導体パッケージ並びに半導体パッケージの製造方法
CN101939858B (zh) 2008-02-08 2013-02-13 日亚化学工业株式会社 发光装置
JP5832713B2 (ja) * 2008-04-14 2015-12-16 日亜化学工業株式会社 蛍光体及びこれを用いた発光装置並びに蛍光体の製造方法
KR100986202B1 (ko) 2008-07-01 2010-10-07 알티전자 주식회사 사이드 뷰 발광 다이오드 패키지
TWI456784B (zh) 2008-07-29 2014-10-11 日亞化學工業股份有限公司 發光裝置
JP2010141058A (ja) 2008-12-10 2010-06-24 Toyoda Gosei Co Ltd 発光装置
KR101064090B1 (ko) * 2009-11-17 2011-09-08 엘지이노텍 주식회사 발광소자 패키지
KR101705700B1 (ko) * 2010-07-01 2017-02-10 엘지이노텍 주식회사 발광 소자
KR101186649B1 (ko) * 2010-11-29 2012-09-28 서울반도체 주식회사 사이드뷰 발광다이오드 패키지

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