JP2014057060A5 - - Google Patents
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- Publication number
- JP2014057060A5 JP2014057060A5 JP2013183676A JP2013183676A JP2014057060A5 JP 2014057060 A5 JP2014057060 A5 JP 2014057060A5 JP 2013183676 A JP2013183676 A JP 2013183676A JP 2013183676 A JP2013183676 A JP 2013183676A JP 2014057060 A5 JP2014057060 A5 JP 2014057060A5
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting device
- lead frame
- cavity
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001681 protective effect Effects 0.000 claims 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120101821A KR102033928B1 (ko) | 2012-09-13 | 2012-09-13 | 발광 소자 및 조명 시스템 |
| KR10-2012-0101821 | 2012-09-13 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014057060A JP2014057060A (ja) | 2014-03-27 |
| JP2014057060A5 true JP2014057060A5 (enExample) | 2016-10-20 |
| JP6312999B2 JP6312999B2 (ja) | 2018-04-18 |
Family
ID=48874933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013183676A Expired - Fee Related JP6312999B2 (ja) | 2012-09-13 | 2013-09-05 | 発光素子及びこれを備えた照明システム |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US9318675B2 (enExample) |
| EP (1) | EP2709174B1 (enExample) |
| JP (1) | JP6312999B2 (enExample) |
| KR (1) | KR102033928B1 (enExample) |
| CN (1) | CN103682068B (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102013104840A1 (de) * | 2013-05-10 | 2014-11-13 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement und Verfahren zur Herstellung von strahlungsemittierenden Halbleiterbauelementen |
| DE102014101557A1 (de) * | 2014-02-07 | 2015-08-13 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu seiner Herstellung |
| WO2016035508A1 (ja) * | 2014-09-01 | 2016-03-10 | シャープ株式会社 | 発光装置 |
| JP6532200B2 (ja) | 2014-09-04 | 2019-06-19 | 日亜化学工業株式会社 | パッケージ及びそれを用いた発光装置 |
| JP6862141B2 (ja) * | 2015-10-14 | 2021-04-21 | エルジー イノテック カンパニー リミテッド | 発光素子パッケージ及び照明装置 |
| KR20170064673A (ko) * | 2015-12-02 | 2017-06-12 | (주)포인트엔지니어링 | 칩기판 |
| JP2017135148A (ja) * | 2016-01-25 | 2017-08-03 | スタンレー電気株式会社 | 半導体装置 |
| JP6387973B2 (ja) | 2016-01-27 | 2018-09-12 | 日亜化学工業株式会社 | 発光装置 |
| USD831593S1 (en) * | 2016-03-24 | 2018-10-23 | Hamamatsu Photonics K.K | Optical semiconductor element |
| USD826184S1 (en) * | 2016-03-24 | 2018-08-21 | Hamamatsu Photonics K.K. | Optical semiconductor element |
| JP1563909S (enExample) * | 2016-03-24 | 2016-11-21 | ||
| JP1563908S (enExample) * | 2016-03-24 | 2016-11-21 | ||
| US10411169B2 (en) * | 2017-02-03 | 2019-09-10 | Nichia Corporation | Light emitting device having leads in resin package |
| US10374002B2 (en) * | 2017-02-13 | 2019-08-06 | Fuji Xerox Co., Ltd. | Layered structure including thyristor and light-emitting element, light-emitting component, light-emitting device, and image forming apparatus |
| JP6669208B2 (ja) * | 2018-08-02 | 2020-03-18 | 日亜化学工業株式会社 | 発光装置 |
| JP6669217B2 (ja) * | 2018-08-30 | 2020-03-18 | 日亜化学工業株式会社 | パッケージ及びそれを用いた発光装置 |
| KR101970938B1 (ko) * | 2019-02-11 | 2019-04-19 | 진재언 | 지향각이 조절된 발광소자 패키지 및 이를 이용한 발광장치 |
| US11417808B2 (en) | 2019-09-12 | 2022-08-16 | Nichia Corporation | Light emitting device |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0832118A (ja) * | 1994-07-19 | 1996-02-02 | Rohm Co Ltd | 発光ダイオード |
| US7193299B2 (en) | 2001-08-21 | 2007-03-20 | Osram Opto Semiconductors Gmbh | Conductor frame and housing for a radiation-emitting component, radiation-emitting component and display and/or illumination system using radiation-emitting components |
| JP2005026401A (ja) * | 2003-07-01 | 2005-01-27 | Matsushita Electric Ind Co Ltd | 発光ダイオード |
| KR100587020B1 (ko) * | 2004-09-01 | 2006-06-08 | 삼성전기주식회사 | 고출력 발광 다이오드용 패키지 |
| JP2007142290A (ja) | 2005-11-21 | 2007-06-07 | Sharp Corp | 発光装置 |
| TWI284433B (en) * | 2006-02-23 | 2007-07-21 | Novalite Optronics Corp | Light emitting diode package and fabricating method thereof |
| JP5368982B2 (ja) * | 2007-06-14 | 2013-12-18 | ローム株式会社 | 半導体発光装置 |
| KR20110018777A (ko) * | 2009-08-18 | 2011-02-24 | 삼성엘이디 주식회사 | 발광 다이오드 패키지 |
| TWD139299S1 (zh) * | 2009-11-11 | 2011-03-01 | 億光電子工業股份有限公司 | 發光二極體 |
| KR101028195B1 (ko) * | 2010-01-18 | 2011-04-11 | 엘지이노텍 주식회사 | 발광 소자 패키지 및 이를 구비한 라이트 유닛 |
| JP5922326B2 (ja) * | 2010-07-26 | 2016-05-24 | 大日本印刷株式会社 | Ｌｅｄ用リードフレームまたは基板およびその製造方法、ならびに半導体装置およびその製造方法 |
| KR101186000B1 (ko) * | 2010-06-28 | 2012-09-25 | 엘지디스플레이 주식회사 | 발광 다이오드, 백라이트 유닛 및 이를 구비한 액정표시장치 |
| DE102010026343A1 (de) * | 2010-07-07 | 2012-03-29 | Osram Opto Semiconductors Gmbh | Bauelement und Verfahren zur Herstellung eines Bauelements |
| DE102010027253B4 (de) * | 2010-07-15 | 2022-05-12 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Halbleiterbauteil |
| US20120098006A1 (en) * | 2010-10-22 | 2012-04-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Light emitting diode package with photoresist reflector and method of manufacturing |
| JP2012142426A (ja) | 2010-12-28 | 2012-07-26 | Toshiba Corp | Ｌｅｄパッケージ及びその製造方法 |
| KR20120118686A (ko) * | 2011-04-19 | 2012-10-29 | 엘지이노텍 주식회사 | 발광소자 모듈 |
| JP2012234955A (ja) * | 2011-04-28 | 2012-11-29 | Toshiba Corp | Ｌｅｄパッケージ及びその製造方法 |
| US8692282B2 (en) * | 2011-10-27 | 2014-04-08 | Seoul Semiconductor Co., Ltd. | Light emitting diode package and light emitting module comprising the same |
-
2012
- 2012-09-13 KR KR1020120101821A patent/KR102033928B1/ko not_active Expired - Fee Related
-
2013
- 2013-03-15 US US13/836,574 patent/US9318675B2/en not_active Expired - Fee Related
- 2013-07-29 EP EP13178406.8A patent/EP2709174B1/en not_active Not-in-force
- 2013-07-31 CN CN201310328799.2A patent/CN103682068B/zh active Active
- 2013-09-05 JP JP2013183676A patent/JP6312999B2/ja not_active Expired - Fee Related
-
2016
- 2016-03-11 US US15/067,995 patent/US9620693B2/en active Active
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