JP2017130585A - 受光モジュール及び光学モジュールの製造方法 - Google Patents
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Abstract
【解決手段】受光モジュール100は、半導体受光素子10と、半導体受光素子10が搭載され、半導体受光素子10と電気的に接続される端子部21を主面20M上に有する基板20と、所定波長の光に対して光学的に透明であり、半導体受光素子10及び基板20の主面20Mを封止する樹脂部30と、を備える。樹脂部30は、主面20Mに交差する方向に延びる第1端面31と、第1端面31に対向し、主面20Mに交差する方向に延びる第2端面32と、第1端面31と第2端面32とを接続し、基板20の主面20Mに平行な第3端面33と、を有している。第1端面31は、露出した粗面であり、第2端面32は、主面20Mに対して傾斜しており、第2端面32及び第3端面33は、所定波長の光を遮光する遮光膜40で被覆されている。
【選択図】図1
Description
Claims (10)
- 半導体受光素子と、
前記半導体受光素子が搭載され、前記半導体受光素子と電気的に接続される端子部を主面上に有する基板と、
所定波長の光に対して光学的に透明であり、前記半導体受光素子及び前記基板の前記主面を封止する樹脂部と、を備え、
前記樹脂部は、
前記主面に交差する方向に延びる第1端面と、
前記第1端面に対向し、前記主面に交差する方向に延びる第2端面と、
前記第1端面と前記第2端面とを接続し、前記基板の前記主面に平行な第3端面と、を有し、
前記第1端面は、粗面であり、且つ、露出しており、
前記第2端面は、前記主面に対して傾斜しており、
前記第2端面及び前記第3端面は、前記所定波長の光を遮光する遮光膜で被覆されている、受光モジュール。 - 前記基板はガラスエポキシ基板であり、
前記基板は前記第2端面に連続する切欠き部を有し、
前記切欠き部は、前記所定波長の光を遮光する遮光膜で被覆されている、請求項1に記載の受光モジュール。 - 前記第2端面は粗面である、請求項1又は2に記載の受光モジュール。
- 前記樹脂部は、前記第1端面と前記第2端面とを接続し、前記基板の前記主面に交差する方向に延びる第4端面及び第5端面を更に有し、
前記第4端面及び前記第5端面は、前記所定波長の光を遮光する遮光膜で被覆されている、請求項1〜3の何れか一項に記載の受光モジュール。 - 前記第4端面及び前記第5端面は粗面であり、且つ、前記基板の前記主面に対して傾斜している、請求項4に記載の受光モジュール。
- 基板の主面上に半導体光学素子を固定する工程と、
前記半導体光学素子と、前記基板の前記主面上に形成された端子部とを電気的に接続する工程と、
所定波長の光に対して光学的に透明である樹脂を用いて、前記半導体光学素子及び前記基板の前記主面を封止し、封止樹脂部を形成する工程と、
前記基板の前記主面に沿う第1方向においてベベルカットを行うことにより、前記封止樹脂部に、前記主面に対して傾斜している傾斜面を形成する工程と、
前記主面に平行な前記封止樹脂部の平行面及び前記傾斜面を、前記所定波長の光を遮光する遮光膜で被覆する工程と、
少なくとも、前記第1方向に直交する第2方向においてダイシングを行い、前記基板を個片化する工程と、を含む光学モジュールの製造方法。 - 前記遮光膜で被覆する工程に先立って、前記第2方向においてハーフカットを行う工程を更に含む、請求項6に記載の光学モジュールの製造方法。
- 前記封止樹脂部に前記傾斜面を形成する前記工程において、前記第1方向においてベベルカットを行うことにより、前記傾斜面に連続する切欠き部を前記基板に形成する、請求項6又は7に記載の光学モジュールの製造方法。
- 前記半導体光学素子は、半導体受光素子である、請求項6〜8の何れか一項に記載の光学モジュールの製造方法。
- 前記半導体光学素子は、半導体発光素子である、請求項6〜8の何れか一項に記載の光学モジュールの製造方法。
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JP2016010078A JP6734654B2 (ja) | 2016-01-21 | 2016-01-21 | 受光モジュール及び受光モジュールの製造方法 |
KR1020187021679A KR102606362B1 (ko) | 2016-01-21 | 2016-11-21 | 수광 모듈 및 수광 모듈의 제조 방법 |
PCT/JP2016/084496 WO2017126214A1 (ja) | 2016-01-21 | 2016-11-21 | 受光モジュール及び光学モジュールの製造方法 |
CN201680079415.XA CN108541344B (zh) | 2016-01-21 | 2016-11-21 | 受光模块及光学模块的制造方法 |
TW105139630A TWI714677B (zh) | 2016-01-21 | 2016-12-01 | 受光模組及光學模組之製造方法 |
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JP7365124B2 (ja) * | 2019-02-12 | 2023-10-19 | ローム株式会社 | 近接センサおよびこれを用いた電子機器 |
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JP3762545B2 (ja) | 1998-06-08 | 2006-04-05 | 三洋電機株式会社 | 光半導体装置 |
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- 2016-11-21 CN CN201680079415.XA patent/CN108541344B/zh active Active
- 2016-11-21 KR KR1020187021679A patent/KR102606362B1/ko active IP Right Grant
- 2016-11-21 WO PCT/JP2016/084496 patent/WO2017126214A1/ja active Application Filing
- 2016-12-01 TW TW105139630A patent/TWI714677B/zh active
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JPH0243746A (ja) * | 1988-08-04 | 1990-02-14 | Fuji Electric Co Ltd | 透明樹脂でモールドした光電変換素子の製造方法 |
JPH04196363A (ja) * | 1990-11-28 | 1992-07-16 | Oki Electric Ind Co Ltd | 受発光装置 |
JPH08107224A (ja) * | 1994-10-04 | 1996-04-23 | Sharp Corp | プラグ・ジャック式光電共用伝送装置 |
JP2000031544A (ja) * | 1998-07-13 | 2000-01-28 | Rohm Co Ltd | 半導体発光素子 |
JP2001118865A (ja) * | 1999-10-19 | 2001-04-27 | Japan Rec Co Ltd | 光電子部品の製造方法 |
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US20130256711A1 (en) * | 2012-03-30 | 2013-10-03 | Cree, Inc. | Substrate based light emitter devices, components, and related methods |
JP2013247269A (ja) * | 2012-05-28 | 2013-12-09 | Toshiba Corp | 半導体発光装置及び発光モジュール |
JP2014067781A (ja) * | 2012-09-25 | 2014-04-17 | Minebea Co Ltd | 光源装置の製造方法 |
JP2014099468A (ja) * | 2012-11-13 | 2014-05-29 | Pioneer Electronic Corp | 半導体デバイスの製造方法および半導体デバイス |
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TW201733149A (zh) | 2017-09-16 |
CN108541344A (zh) | 2018-09-14 |
TWI714677B (zh) | 2021-01-01 |
JP6734654B2 (ja) | 2020-08-05 |
CN108541344B (zh) | 2022-04-05 |
KR102606362B1 (ko) | 2023-11-27 |
WO2017126214A1 (ja) | 2017-07-27 |
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