JP2017111426A - 光学素子を取り付けるためのキャリア及び関連する製造工程 - Google Patents
光学素子を取り付けるためのキャリア及び関連する製造工程 Download PDFInfo
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Abstract
Description
図1Aは、一実施形態における光学的取り付け構造を生成するためのアブレーションの影響を受けやすい層とアブレーションの影響を受けにくい層を交互にしたスタックを示している。スタック106は、アブレーションの影響を受けにくい層104(1)〜104(M)とアブレーションの影響を受けやすい層102(1)〜102(N)とを含む。アブレーションの影響を受けにくい層104(1)〜104(M)の各々は、それぞれ幾何学模様を表してもよく(図1Aでは図示せず)、アブレーション工程による浸食の影響を受けにくい。一実施形態によれば、アブレーションの影響を受けにくい層104(1)〜104(M)は銅で構成されてもよい。しかし、アブレーションの影響を受けにくい層は、例えば、金、ニッケル、及び他の金属を含む別の原料で構成されてもよい。
図2は、光リンクを生成するための少なくとも1つの光学部品を取り付けるための光学的取り付け装置を生成するための工程を示すフローチャートである。工程は、202から開始される。204において、アブレーションの影響を受けにくい層104(1)〜104(M)のセットと、アブレーションの影響を受けやすい層102(1)〜102(N)のセットが規定される。206において、アブレーションの影響を受けにくい層がエッチングされて、各層内に幾何学模様が画定される。PCB製造業において、さまざまなエッチング工程が周知であることが知られている。208において、アブレーション工程が、アブレーションの影響を受けにくい層104(1)〜104(M)のセットと、アブレーションの影響を受けやすい層102(1)〜102(N)のセットに適用されて、キャリアパーツが生成される。工程は、210で終了する。
図3は、一実施形態におけるアブレーション工程によって生成される光ファイバケーブルと光学的ダイを正確に取り付けるためのキャリアパーツを示している。キャリアパーツ302は、アブレーションの影響を受けにくい層104(1)〜104(M)とアブレーションの影響を受けやすい層102(1)〜102(N)からなるスタック106を含む。キャリアパーツ302は、アブレーション工程によって生成された複数の幾何学的特徴、例えば、110(1)〜110(2)を含む。幾何学的特徴110(1)は、光ファイバを取り付けるためのトレンチ又はファイバ配置溝である。幾何学的特徴110(2)は、光学的ダイの取り付けを提供するものである。
Claims (16)
- 少なくとも2つの光学素子を正確に取り付けるためのキャリアであって、
複数の交互の層を含み、
各層は、ある群から採取される第1の原料及び第2の原料のうちのいずれか一方からなり、
前記第1の原料はアブレーション工程による浸食の影響を受けやすく、前記第2の原料は、アブレーション工程による浸食の影響を受けにくく、
前記第2の原料からなる各層には幾何学模様があって、前記複数の交互の層に対するアブレーション工程の適用時に複数の特徴が生成され、
生成された前記特徴の各々は、前記少なくとも2つの光学素子の各々のための取り付け部を提供する、キャリア。 - 前記第1の原料はポリイミドである、請求項1に記載のキャリア。
- 前記第2の原料は銅である、請求項1に記載のキャリア。
- 前記少なくとも2つの光学素子のうちの一つは、光ファイバケーブルである、請求項1に記載のキャリア。
- 前記少なくとも2つの光学素子のうちの一つは、光学的ダイである、請求項1に記載のキャリア。
- 前記光学的ダイはレーザを含む、請求項5に記載のキャリア。
- 前記光学的ダイはフォトダイオードを含む、請求項5に記載のキャリア。
- キャリアパーツは、
ファイバ配置溝、
光学的ダイ取り付け部、
ドライバと増幅器のうちの一方を取り付けるためのパッド、及び
PCBデバイスに接続するためのパッド、
の特徴を含む、請求項1に記載のキャリア。 - 光電子取り付け部品を製造する方法であって、
複数の交互の層を規定し、
各層は、ある群から採取される第1の原料及び第2の原料のうちのいずれか一方からなり、
前記第1の原料はアブレーション工程による浸食の影響を受けやすく、前記第2の原料は、アブレーション工程による浸食の影響を受けにくく、
前記第2の原料からなる各層をエッチングして幾何学模様を生成し、
前記幾何学模様の組み合わせは、少なくとも1つの光学素子を取り付けるための複数の特徴に対応し、
レーザアブレーション工程を前記複数の交互の層に適用して、前記特徴を生成する、
方法。 - 前記第1の原料はポリイミドである、請求項9に記載の方法。
- 前記第2の原料は銅である、請求項9に記載の方法。
- 前記少なくとも2つの光学素子のうちの一つは、光ファイバケーブルである、請求項9に記載の方法。
- 前記少なくとも2つの光学素子のうちの一つは、光学的ダイである、請求項9に記載の方法。
- 前記光学的ダイはレーザを含む、請求項13に記載の方法。
- 前記光学的ダイはフォトダイオードを含む、請求項13に記載の方法。
- 前記光学的ダイは回路基板に対して垂直に置かれる、請求項13に記載の方法。
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Citations (7)
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JPH11337776A (ja) * | 1998-05-28 | 1999-12-10 | Oki Electric Ind Co Ltd | 光モジュールおよびその製造方法 |
JPH11337773A (ja) * | 1998-05-26 | 1999-12-10 | Oki Electric Ind Co Ltd | 光モジュール |
JP2000114581A (ja) * | 1998-10-09 | 2000-04-21 | Fujitsu Ltd | 電気的相互連結及び光学的相互連結を具備した多層光電子基板並びにその製造方法 |
JP2007264517A (ja) * | 2006-03-30 | 2007-10-11 | Fujikura Ltd | 光配線モジュールとその製造方法 |
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JPH08166523A (ja) * | 1994-12-13 | 1996-06-25 | Hitachi Ltd | 光アセンブリ |
US5631571A (en) * | 1996-04-03 | 1997-05-20 | The United States Of America As Represented By The Secretary Of The Air Force | Infrared receiver wafer level probe testing |
KR100289040B1 (ko) * | 1997-12-22 | 2001-05-02 | 이계철 | 단일광섬유를이용한양방향광통신모듈 |
GB2340998B (en) * | 1998-08-26 | 2003-07-16 | Lsi Logic Corp | Optical/electrical inputs for an integrated circuit die |
US6690845B1 (en) * | 1998-10-09 | 2004-02-10 | Fujitsu Limited | Three-dimensional opto-electronic modules with electrical and optical interconnections and methods for making |
US7101091B2 (en) * | 2001-02-21 | 2006-09-05 | Zarlink Semiconductor, Inc. | Apparatus for coupling a fiber optic cable to an optoelectronic device, a system including the apparatus, and a method of forming the same |
AU2003222822A1 (en) * | 2002-05-14 | 2003-11-11 | Leonhard Kurz Gmbh And Co. Kg | Optically variable element comprising a sequence of thin-film layers |
US7251389B2 (en) * | 2005-09-26 | 2007-07-31 | Intel Corporation | Embedded on-die laser source and optical interconnect |
US9360644B2 (en) * | 2014-09-08 | 2016-06-07 | International Business Machines Corporation | Laser die and photonics die package |
-
2015
- 2015-10-09 US US14/879,382 patent/US9857544B2/en active Active
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2016
- 2016-10-06 EP EP16192688.6A patent/EP3153901A1/en not_active Withdrawn
- 2016-10-07 KR KR1020160129866A patent/KR20170044033A/ko not_active Application Discontinuation
- 2016-10-07 JP JP2016198837A patent/JP2017111426A/ja active Pending
- 2016-10-10 CN CN201610885369.4A patent/CN106802453B/zh active Active
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JPH11337773A (ja) * | 1998-05-26 | 1999-12-10 | Oki Electric Ind Co Ltd | 光モジュール |
JPH11337776A (ja) * | 1998-05-28 | 1999-12-10 | Oki Electric Ind Co Ltd | 光モジュールおよびその製造方法 |
JP2000114581A (ja) * | 1998-10-09 | 2000-04-21 | Fujitsu Ltd | 電気的相互連結及び光学的相互連結を具備した多層光電子基板並びにその製造方法 |
US20100035052A1 (en) * | 2005-11-02 | 2010-02-11 | John Farah | Polyimide substrate bonded to other substrate |
JP2007264517A (ja) * | 2006-03-30 | 2007-10-11 | Fujikura Ltd | 光配線モジュールとその製造方法 |
JP2013539082A (ja) * | 2010-10-06 | 2013-10-17 | エルジー イノテック カンパニー リミテッド | 光印刷回路基板及びその製造方法 |
US20150050028A1 (en) * | 2013-08-19 | 2015-02-19 | International Business Machines Corporation | Structured substrate for optical fiber alignment |
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US20170102509A1 (en) | 2017-04-13 |
US9857544B2 (en) | 2018-01-02 |
KR20170044033A (ko) | 2017-04-24 |
JP2022163007A (ja) | 2022-10-25 |
CN106802453B (zh) | 2020-06-02 |
CN106802453A (zh) | 2017-06-06 |
EP3153901A1 (en) | 2017-04-12 |
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