JP2017111214A - Method for manufacturing wavelength conversion member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a wavelength conversion member capable of suppressing a decrease in light-emitting intensity caused by a residual organic component, the wavelength conversion member including a base material layer and a phosphor layer formed on the surface of the base material layer.SOLUTION: A method for manufacturing a wavelength conversion member including a base material layer and a phosphor layer formed on the surface of the base material layer includes the steps of: preparing a phosphor layer forming material containing a glass powder, a phosphor powder, and an organic component; manufacturing a laminate by laminating a phosphor layer forming material layer on the surface of the base material layer formed with a through hole; and forming a phosphor layer by removing the organic component by burning the laminate and sintering the glass powder and the phosphor powder.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method of manufacturing a light emitting color conversion member that converts the wavelength of light emitted from a light emitting diode (LED) or a laser diode (LD) to another wavelength.

  In recent years, as a next-generation light-emitting device that replaces fluorescent lamps and incandescent lamps, attention has been focused on light-emitting devices using LEDs and LDs from the viewpoints of low power consumption, small size and light weight, and easy light quantity adjustment. As an example of such a next-generation light-emitting device, for example, in Patent Document 1, a wavelength conversion member that absorbs part of light from the LED and converts it into yellow light is disposed on the LED that emits blue light. A light emitting device is disclosed. This light emitting device emits white light that is a combined light of blue light emitted from the LED and yellow light emitted from the wavelength conversion member.

  As the wavelength conversion member, a material in which an inorganic phosphor powder is dispersed in a resin matrix has been conventionally used. However, when the wavelength conversion member is used, there is a problem that the resin is deteriorated by the light from the LED and the luminance of the light emitting device tends to be lowered. In particular, there is a problem that the mold resin deteriorates due to heat generated by the LED or high energy short wavelength (blue to ultraviolet) light, causing discoloration or deformation.

  Accordingly, a wavelength conversion member made of a completely inorganic solid in which a phosphor is dispersed and fixed in a glass matrix instead of a resin has been proposed (see, for example, Patent Documents 2 and 3). The wavelength conversion member has a feature that glass as a base material is not easily deteriorated by the heat of LED or irradiation light, and problems such as discoloration and deformation hardly occur. However, the wavelength converting member has a problem that it is inferior in mechanical strength, particularly when the thickness is reduced. Therefore, in order to ensure the mechanical strength of the wavelength conversion member, a phosphor composite material in which a phosphor layer is formed on an inorganic material substrate has been proposed (see, for example, Patent Document 4).

JP 2000-208815 A JP 2003-258308 A Japanese Patent No. 4895541 JP 2007-48864 A

  The phosphor composite material described in Patent Document 4 is prepared by preparing a green sheet for a phosphor layer, and thermocompression-bonding the green sheet on an inorganic material substrate and baking it. However, even after firing, organic components such as a binder contained in the green sheet are likely to remain in the phosphor layer, and the organic component may become a coloring component, which may reduce the emission intensity of the wavelength conversion member.

  In view of the above, the present invention is a method for producing a wavelength conversion member comprising a base material layer and a phosphor layer formed on the surface thereof, and a residual organic component that causes a decrease in emission intensity. An object is to provide a method that can be reduced.

  The method for producing a wavelength conversion member of the present invention is a method for producing a wavelength conversion member comprising a base material layer and a phosphor layer formed on the surface thereof, and comprises a glass powder, a phosphor powder and an organic material. A step of preparing a phosphor layer forming material containing a component, a step of laminating a phosphor layer forming material layer on the surface of a base material layer on which a through hole is formed, and a laminate, The step of removing the organic component by firing and sintering the glass powder and the phosphor powder to form a phosphor layer is characterized.

  When firing with the phosphor layer forming material layer laminated on the base material layer, the surface opposite to the base material layer of the phosphor layer forming material layer is open to the outside, so that the organic component is Easy to be removed. On the other hand, the surface of the phosphor layer forming material layer on the base material layer side is basically not open to the outside, and the organic component is difficult to remove. In the manufacturing method of the present invention, the through hole is formed in the base material layer, and the organic component is easily discharged to the outside through the through hole. Therefore, the residual organic component in the phosphor layer after firing can be reduced, and a decrease in emission intensity can be suppressed.

  In the manufacturing method of the wavelength conversion member of this invention, it is preferable that the through-hole is formed in the base material layer. In this way, the number of sites where organic components are discharged to the outside through the through-holes increases, and it becomes easier to further reduce the remaining organic components in the phosphor layer after firing.

  In the method for producing a wavelength conversion member of the present invention, the laminate may include two base material layers and a phosphor layer forming material layer sandwiched therebetween. In this way, a wavelength conversion member in which the phosphor layer is sandwiched between the two base material layers can be obtained, the mechanical strength of the wavelength conversion member can be improved, and the phosphor layer can be made thinner. It becomes easy. Moreover, when the base material layer is made of a heat dissipation material as will be described later, the heat generated in the phosphor layer can be released to the outside more efficiently. In addition, when firing in a state where the phosphor layer forming material layer is sandwiched between two base material layers, both surfaces of the phosphor layer forming material layer are not open to the outside. Becomes extremely difficult to be discharged to the outside. However, even in this case, the organic component is discharged to the outside from the through hole formed in the base material layer, so that the remaining organic component after firing can be reduced.

  In the method for producing a wavelength conversion member of the present invention, the phosphor layer forming material is preferably a green sheet. Green sheets generally contain a binder. The binder has a relatively high decomposition temperature among organic components and is difficult to be removed by baking. Therefore, in this case, it becomes easier to enjoy the effects of the present invention.

  In the manufacturing method of the wavelength conversion member of this invention, a base material layer may consist of a thermal radiation material which has higher thermal conductivity than a fluorescent substance layer. In particular, when the power of the light source is large, there is a problem that the temperature of the phosphor layer rises due to the heat of the light source or the heat emitted from the phosphor, and the emission intensity decreases with time (temperature quenching). In some cases, the temperature rise of the phosphor layer becomes significant, and the constituent materials (glass matrix and the like) may be dissolved. Therefore, by adopting a configuration in which the phosphor layer is formed on the surface of the heat dissipation material having a higher thermal conductivity than the phosphor layer, the heat generated in the phosphor layer can be efficiently released to the outside, as described above. Occurrence of various problems can be suppressed.

  In the manufacturing method of the wavelength conversion member of this invention, what consists of translucent ceramics can be used as a heat dissipation material. In this way, a transmission type wavelength conversion member can be produced.

  In the method for producing a wavelength conversion member of the present invention, as the translucent ceramic, aluminum oxide ceramics, zirconia ceramics, aluminum nitride ceramics, silicon carbide ceramics, boron nitride ceramics, magnesium oxide ceramics, titanium oxide ceramics At least one selected from ceramics, niobium oxide ceramics, zinc oxide ceramics, and yttrium oxide ceramics can be used.

  In the method for producing a wavelength conversion member of the present invention, after firing the laminate and forming the phosphor layer on the surface of the base material layer, the step of cutting the wavelength conversion member on the surface passing through the through hole in the base material layer, May be included. If it does in this way, mass production of a wavelength conversion member will be attained by producing a wavelength conversion member of a large area, and then making it small.

  The wavelength conversion member of the present invention is characterized by comprising a substrate layer having a through hole and a phosphor layer formed on the surface thereof.

  According to the present invention, it is possible to manufacture a wavelength conversion member including a base material layer and a phosphor layer formed on the surface thereof, and having a small amount of residual organic components in the phosphor layer. As a result, it is possible to suppress a decrease in emission intensity caused by the remaining organic component.

(A) is a typical side view of the laminated body which concerns on 1st Embodiment, (b) shows the typical top view which looked at the laminated body of (a) from the base material layer side. It is a typical side view of the laminated body which concerns on 2nd Embodiment. It is a typical side view of the laminated body which concerns on 3rd Embodiment. It is a typical side view of the layered product concerning a 4th embodiment. It is a typical side view of the layered product concerning a 5th embodiment. It is a typical side view which shows the cutting process of the wavelength conversion member of this invention.

  Below, an example of embodiment of the manufacturing method of the wavelength conversion member of this invention is demonstrated. However, the present invention is not limited to the following embodiments.

  The method for producing a wavelength conversion member is a method for producing a wavelength conversion member comprising a base material layer and a phosphor layer formed on the surface thereof, and contains a glass powder, a phosphor powder and an organic component. A step of preparing a phosphor layer forming material, a step of laminating a phosphor layer forming material layer on the surface of the base material layer on which the through-holes are formed, and a step of fabricating the laminate. The step of removing the organic component and sintering the glass powder and the phosphor powder to form a phosphor layer is included. Below, it demonstrates in detail for every process.

(Preparation process of phosphor layer forming material)
Examples of the glass powder include silicate glass, borosilicate glass, tin phosphate glass, bismuth glass, zinc borosilicate glass, and lead borosilicate glass. These may be used alone or in combination of two or more. Among these, silicate glass and borosilicate glass are preferable because they are excellent in weather resistance and heat resistance and can suppress deterioration with time of the wavelength conversion member.

While particle size of the glass powder is not particularly limited, for example, the maximum particle diameter _{D max} is 200μm or less (especially 150μm or less, more 105μm or less), and an average particle diameter _{D 50} of more than 0.1 [mu] m (in particular 1μm or more, further 2 μm or more). When the maximum particle diameter _Dmax of the glass powder is too large, the excitation light is hardly scattered in the obtained wavelength conversion member, and the light emission efficiency tends to be lowered. When the average particle diameter D ₅₀ is too small, in the wavelength conversion member obtained, luminous efficiency tends to decrease with the excitation light is excessively scattered.

In the present invention, the maximum particle diameter D _max and the average particle size D ₅₀ refers to the value measured by a laser diffraction method.

  The inorganic phosphor powder is not particularly limited as long as it is generally available on the market. For example, nitride phosphors, oxynitride phosphors, oxide phosphors (including garnet phosphors such as YAG phosphors), oxysulfide phosphors, halide phosphors (halophosphate chlorides, etc.), and alumines Examples thereof include powders made of acid salt phosphors and the like. These may be used alone or in combination of two or more. Of these inorganic phosphors, nitride phosphors, oxynitride phosphors and oxide phosphors are preferable because they have high heat resistance and are relatively difficult to deteriorate during firing. Nitride phosphors and oxynitride phosphors are characterized by converting near-ultraviolet to blue excitation light into a wide wavelength range from green to red and having a relatively high emission intensity. Therefore, nitride phosphors and oxynitride phosphors are particularly effective as inorganic phosphor powders used for wavelength conversion members for white LED elements.

  Examples of the inorganic phosphor include those having an excitation band at a wavelength of 300 to 500 nm and an emission peak at a wavelength of 380 to 780 nm, particularly blue (wavelength 440 to 480 nm), green (wavelength 500 to 540 nm), yellow (wavelength 540 to 540). 595 nm) and red light (wavelength 600 to 700 nm).

Examples of inorganic phosphors that emit blue light when irradiated with ultraviolet to near-ultraviolet excitation light having a wavelength of 300 to 440 nm include (Sr, Ba) MgAl ₁₀ O ₁₇ : Eu ²⁺ , (Sr, Ba) ₃ MgSi ₂ O ₈ : Eu ^{2+ and the} like can be mentioned.

As inorganic phosphors that emit green fluorescence when irradiated with ultraviolet to near-ultraviolet excitation light having a wavelength of 300 to 440 nm, SrAl ₂ O ₄ : Eu ²⁺ , SrBaSiO ₄ : Eu ²⁺ , Y ₃ (Al, Gd) ₅ O ₁₂ : Ce ³⁺ , SrSiON: Eu ²⁺ , BaMgAl ₁₀ O ₁₇ : Eu ²⁺ , Mn ²⁺ , Ba ₂ MgSi ₂ O ₇ : Eu ²⁺ , Ba ₂ SiO ₄ : Eu ²⁺ , Ba ₂ Li ₂ Si ₂ O ₇ : Eu ²⁺ , BaAl ₂ O _4: ^{Eu 2+} and the like.

As an inorganic phosphor that emits green fluorescence when irradiated with blue excitation light having a wavelength of 440 to 480 nm, SrAl ₂ O ₄ : Eu ²⁺ , SrBaSiO ₄ : Eu ²⁺ , Y ₃ (Al, Gd) ₅ O ₁₂ : Ce ³⁺ , SrSiON: Eu ²⁺ , β-SiAlON: Eu ^{2+ and the} like.

Examples of the inorganic phosphor that emits yellow fluorescence when irradiated with ultraviolet to near-ultraviolet excitation light having a wavelength of 300 to 440 nm include La ₃ Si ₆ N ₁₁ : Ce ³⁺ .

Examples of the inorganic phosphor that emits yellow fluorescence when irradiated with blue excitation light having a wavelength of 440 to 480 nm include Y ₃ (Al, Gd) ₅ O ₁₂ : Ce ³⁺ and Sr ₂ SiO ₄ : Eu ²⁺ .

Examples of the inorganic phosphor that emits red fluorescence when irradiated with excitation light having a wavelength of 300 to 440 nm include MgSr ₃ Si ₂ O ₈ : Eu ²⁺ , Mn ²⁺ , Ca ₂ MgSi ₂ O ₇ : Eu ²⁺ , Mn ^{2+ and the} like.

As inorganic phosphors that emit red fluorescence when irradiated with blue excitation light having a wavelength of 440 to 480 nm, CaAlSiN ₃ : Eu ²⁺ , CaSiN ₃ : Eu ²⁺ , (Ca, Sr) ₂ Si ₅ N ₈ : Eu ²⁺ , α -SiAlON: Eu < ²⁺ > etc. are mentioned.

  A plurality of inorganic phosphor powders may be mixed and used in accordance with the wavelength range of excitation light or light emission. For example, when white light is obtained by irradiation with ultraviolet excitation light, inorganic phosphor powders emitting blue, green, yellow, and red fluorescence may be mixed and used.

  The luminous efficiency (lm / W) of the wavelength conversion member varies depending on the content of the inorganic phosphor powder dispersed in the glass matrix. What is necessary is just to adjust suitably content of inorganic fluorescent substance powder so that luminous efficiency may become optimal. If the content of the inorganic phosphor powder is too large, it becomes difficult to sinter, the porosity becomes large, the excitation light is not easily irradiated to the inorganic phosphor powder, and the mechanical strength of the wavelength conversion member is lowered. There is a risk of problems such as being easy to do. On the other hand, when there is too little content of inorganic fluorescent substance powder, it will become difficult to obtain desired luminescence intensity. From such a viewpoint, the mass ratio of the glass powder to the inorganic phosphor powder is preferably 20 to 99.99: 0.01 to 80, more preferably 50 to 99: 1 to 50, and still more preferably 70 to 98: It is preferable to adjust to 2 to 30, particularly preferably 75 to 97: 3 to 25%, and most preferably 80 to 95: 5 to 20.

  Note that the wavelength conversion member for the purpose of reflecting the fluorescence generated in the wavelength conversion member to the excitation light incident side and mainly taking out only the fluorescence to the outside is not limited to the above, and the emission intensity is maximized. Thus, content of inorganic fluorescent substance powder can be increased (for example, mass ratio of glass powder and inorganic fluorescent substance powder is 20-70: 30-80, Furthermore, 25-60: 40-75).

  In addition to the glass powder and the inorganic phosphor powder, for example, a light diffusing material such as alumina, silica, magnesia and the like may be contained up to 30% by mass (ratio to the total amount of the raw material powder).

  Organic components include binders, plasticizers, solvents and the like.

  The binder is a component that increases film strength after drying and imparts flexibility. The content of the binder in the slurry is preferably 0.1 to 30% by mass, more preferably 1 to 20% by mass, and further preferably 3 to 15% by mass. When the amount of the binder is too small, the bonding property between the powders becomes unstable, and the moldability and workability are likely to deteriorate. On the other hand, if the amount of the binder is too large, the powder filling rate tends to decrease after slurry molding. As binders, vinyl polymers such as polyvinyl butyral and polyvinyl alcohol; acrylic polymers such as polybutyl methacrylate, polymethyl methacrylate and polyethyl methacrylate; cellulose polymers such as ethyl cellulose and nitrocellulose; amides An organic polymer such as a polymer can be used, and these can be used alone or in combination.

  The plasticizer is a component that controls the drying speed and imparts flexibility to the dry film, and the content in the slurry is generally about 0 to 10% by mass, and more preferably about 2 to 7% by mass. As the plasticizer, dioctyl adipate, dibutyl phthalate, butyl benzyl phthalate, dioctyl phthalate, diisooctyl phthalate, dicapryl phthalate, dibutyl phthalate, and the like can be used alone or in combination.

  The solvent is a component for pasting the raw material, and the content in the slurry is generally about 1 to 50% by mass, and more preferably about 1 to 40% by mass. As the solvent, terpineol, isoamyl acetate, toluene, methyl ethyl ketone, diethylene glycol monobutyl ether acetate, 2,2,4-trimethyl-1,3-pentadiol monoisobutyrate and the like can be used alone or in combination.

  In addition to the above components, a dispersant may be added to the slurry in an amount of about 0 to 5% by mass. As the dispersant, a polymer type dispersant, a surfactant type dispersant, an inorganic type dispersant and the like can be used alone or in combination.

The glass powder, phosphor powder and organic component are kneaded with a ball mill or the like to obtain a slurry-like phosphor layer forming material.
(Laminate manufacturing process)
Next, a phosphor layer forming material layer is laminated on the surface of the base material layer to produce a laminate. FIG. 1A is a schematic side view of the laminate according to the first embodiment, and FIG. 1B is a schematic plan view of the laminate of FIG. The laminate 11 according to the first embodiment is formed by forming the phosphor layer forming material layer 1 on the surface of the base material layer 2 on which the through holes 2a are formed. By forming the through-hole 2a in the base material layer 2, the decomposition gas and the volatile gas of the organic component O are easily discharged to the outside at the time of firing as shown by the arrow in FIG.

  For example, after the phosphor layer forming material is applied to a resin film surface such as PET (polyethylene terephthalate) by a doctor blade method or the like and dried, the phosphor layer forming material layer 1 made of a green sheet is obtained. By laminating the phosphor layer forming material layer 1 on the base material layer 2, a laminate 11 is obtained. Alternatively, the phosphor layer forming material layer 1 is formed by applying a phosphor layer forming material on the surface of the base material layer 2 by a screen printing method, a spray method, or the like, and the laminate 3 is obtained.

  Examples of the base material layer 2 include glass and ceramics. Here, if the base material layer 2 is made of a heat dissipation material having a higher thermal conductivity than the phosphor layer, the heat generated in the phosphor layer 2 can be efficiently released to the outside. Specifically, the heat conductivity of the heat dissipation material is preferably 5 W / m · K or more, 10 W / m · K or more, and particularly preferably 20 W / m · K or more.

  If what consists of translucent ceramics is used as a thermal radiation material, a transmissive | pervious wavelength conversion member can be obtained. The total light transmittance at a wavelength of 400 nm to 800 nm of the translucent ceramic is preferably 10% or more, 20% or more, 30% or more, 40% or more, and particularly preferably 50% or more.

  Translucent ceramics include aluminum oxide ceramics, zirconia oxide ceramics, aluminum nitride ceramics, silicon carbide ceramics, boron nitride ceramics, magnesium oxide ceramics, titanium oxide ceramics, niobium oxide ceramics, and zinc oxide ceramics Examples thereof include ceramics and yttrium oxide ceramics.

  The thickness of the base material layer 2 is preferably 0.05 to 1 mm, 0.07 to 0.8 mm, particularly 0.1 to 0.5 mm. When the thickness of the base material layer is too small, the mechanical strength tends to decrease. On the other hand, when the thickness of the base material layer is too large, the wavelength conversion member tends to increase in size.

  The diameter of the through hole 2a is preferably 0.05 to 2 mm, particularly preferably 0.5 to 1 mm. If the diameter of the through hole 2a is too small, the organic component O is difficult to be discharged to the outside during firing. On the other hand, if the diameter of the through hole 2a is too large, the effective use area as the wavelength conversion member tends to be small. Moreover, the mechanical strength of the base material layer 2 is likely to decrease.

There may be one through hole 2a or a plurality of through holes 2a. In particular, when a wavelength conversion member having a large area is manufactured, the decomposition gas and the volatile gas of the organic component O contained in the phosphor layer forming material layer 1 can be efficiently externalized by forming a plurality of through holes 2a. Can be discharged. Specifically, the number of through holes 2a is preferably 1 piece / cm ² or more, and more preferably 2 pieces / cm ² or more. In addition, when there are too many through-holes 2a, there exists a tendency for the effective utilization area as a wavelength conversion member to become small. Moreover, the mechanical strength of the base material layer 2 is likely to decrease.

  In the main surface of the base material layer 2, the area ratio occupied by the through holes 2a is preferably 0.001 to 30%, particularly preferably 0.5 to 10%. When the area ratio which the through-hole 2a occupies is too small, it will become difficult to discharge | emit the organic component O outside at the time of baking. On the other hand, when the area ratio which the through-hole 2a accounts is too large, there exists a tendency for the effective utilization area as a wavelength conversion member to become small. Moreover, the mechanical strength of the base material layer 2 is likely to decrease.

  FIG. 2 shows a schematic side view of the laminate according to the second embodiment. The laminate 12 according to the second embodiment includes two base material layers 2 and a phosphor layer forming material layer 1 sandwiched therebetween. Here, a through hole 2 a is formed in one of the two base material layers 2. If it does in this way, the wavelength conversion member excellent in mechanical strength can be obtained. Moreover, when the base material layer 2 consists of a thermal radiation material, it becomes possible to discharge | release the heat | fever which generate | occur | produced in the fluorescent substance layer to the exterior more efficiently. In the present embodiment, since both surfaces of the phosphor layer forming material layer 1 are not open to the outside, the organic component O is extremely difficult to be discharged to the outside. However, even in this case, since the organic component O is discharged to the outside from the through hole 2a formed in the base material layer 2, the residual organic component O after firing can be reduced.

  FIG. 3 shows a schematic side view of the laminate according to the third embodiment. Similar to the laminate 12 according to the second embodiment, the laminate 13 according to the third embodiment includes two base material layers 2 and a phosphor layer forming material layer 1 sandwiched therebetween. It becomes. Here, the through holes 2 a are formed in both of the two base material layers 2. In this way, the organic component O is more easily discharged outside during firing.

  FIG. 4 shows a schematic side view of the laminate according to the fourth embodiment. The laminate 14 according to the fourth embodiment is formed by alternately laminating three base material layers 2 and two phosphor layer forming material layers 1. In this way, it is possible to obtain a wavelength conversion member that is further excellent in mechanical strength. Moreover, when the base material layer 2 consists of a thermal radiation material, it becomes possible to discharge | release the heat | fever which generate | occur | produced in the fluorescent substance layer to the exterior more efficiently. Here, the through-hole 2a is formed in one of the two base material layers 2 located on the outer surface and the base material layer 2 located inside. Also in this embodiment, since the organic component O is discharged | emitted from the through-hole 2a formed in the base material layer 2, the residual organic component O after baking can be reduced.

  FIG. 5 shows a schematic side view of the laminate according to the fifth embodiment. Similar to the laminate 14 according to the fourth embodiment, the laminate 15 according to the fifth embodiment is formed by alternately laminating three base material layers 2 and two phosphor layer forming material layers 1. . Here, the through-hole 2a is formed in both the two base material layers 2 located in an outer surface. In this way, since the organic component O is more efficiently discharged to the outside from the through hole 2a formed in the base material layer 2, the remaining organic component O after firing can be further reduced.

(Baking process)
By firing the laminate obtained above, the organic component is removed and the glass powder and the phosphor powder are sintered to form a phosphor layer. Thereby, a wavelength conversion member is obtained. It is preferable to perform the main baking for sintering the glass powder and the phosphor powder after the degreasing step for removing the organic component. The degreasing step is preferably in the range of the softening point of glass powder to 150 ° C to the softening point of glass powder to -5 ° C, and more preferably in the range of softening point of glass powder to 120 ° C to softening point of glass powder to -10 ° C. By setting it as such a temperature range, an organic component can be removed. Moreover, the range of the softening point of glass powder-softening point of glass powder +150 degreeC is preferable for this baking, and the range of softening point of glass powder +5 degreeC-softening point of glass powder +130 degreeC is more preferable. By setting it as such a temperature range, it becomes possible to obtain a dense sintered body.

  The thickness of the phosphor layer in the obtained wavelength conversion member is preferably as thin as possible in such a range that the excitation light is surely absorbed by the phosphor. The reason for this is that if the phosphor layer is too thick, light scattering and absorption becomes too large, and the emission efficiency of the fluorescence tends to decrease. For example, the strength is easily reduced and the constituent materials are easily dissolved. Therefore, the thickness of the phosphor layer is preferably 2 mm or less, 1 mm or less, particularly 0.8 mm or less. The lower limit of the thickness of the phosphor layer is usually about 0.03 mm. For the purpose of obtaining white as the emitted light, the thickness of the phosphor layer may be controlled so that the excitation light and the fluorescence are in an appropriate ratio.

  As shown in FIG. 6, the obtained wavelength conversion member 20 may be cut at a surface C passing through the through hole 2 a in the base material layer 2 to produce a plurality of wavelength conversion member pieces 20 ′. Here, the surface C is a surface substantially perpendicular to the main surface of the phosphor layer 1 ′ or the base material layer 2. In this way, after the wavelength conversion member 20 having a large area is manufactured, the wavelength conversion member piece 20 ′ can be easily mass-produced by making it into small pieces. The through-hole 2a may hinder the transmission of excitation light or fluorescence. By cutting the wavelength conversion member 20 at the surface C as described above, the through-hole 2a is an end portion in each wavelength conversion member piece 20 ′. Therefore, such a problem is unlikely to occur.

DESCRIPTION OF SYMBOLS 1 Phosphor layer formation material layer 1 'Phosphor layer 2 Base material layer 2a Through-hole 11, 12, 13, 14, 15 Laminated body 20 Wavelength conversion member 20' Wavelength conversion member piece

Claims (9)

A method for producing a wavelength conversion member comprising a base material layer and a phosphor layer formed on a surface thereof,
Preparing a phosphor layer forming material containing glass powder, phosphor powder and an organic component;
A step of producing a laminate by laminating a phosphor layer-forming material layer on the surface of the base material layer in which the through holes are formed; and
A step of firing the laminate to remove organic components and sintering the glass powder and phosphor powder to form a phosphor layer;
The manufacturing method of the wavelength conversion member characterized by including.   The method for producing a wavelength conversion member according to claim 1, wherein a plurality of through holes are formed in the base material layer.   The method for producing a wavelength conversion member according to claim 1 or 2, wherein the laminate comprises two base material layers and a phosphor layer forming material layer sandwiched therebetween.   The method for producing a wavelength conversion member according to any one of claims 1 to 3, wherein the phosphor layer forming material is a green sheet.   The method for manufacturing a wavelength conversion member according to any one of claims 1 to 4, wherein the base material layer is made of a heat dissipating material having a higher thermal conductivity than the phosphor layer.   The method for producing a luminescent color conversion member according to claim 5, wherein the heat dissipating material is made of translucent ceramics.   Translucent ceramics are aluminum oxide ceramics, zirconia ceramics, aluminum nitride ceramics, silicon carbide ceramics, boron nitride ceramics, magnesium oxide ceramics, titanium oxide ceramics, niobium oxide ceramics, zinc oxide ceramics The method for producing a luminescent color conversion member according to claim 6, wherein the luminescent color conversion member is at least one selected from yttrium oxide ceramics.   The step of cutting the wavelength conversion member on the surface passing through the through hole in the base material layer after firing the laminate and forming the phosphor layer on the surface of the base material layer is included. The method for producing a wavelength conversion member according to claim 7.   A wavelength conversion member comprising a base material layer having a through hole and a phosphor layer formed on the surface thereof.