JP6500744B2 - Method of manufacturing wavelength conversion element - Google Patents

Description

  The present invention relates to a method of manufacturing a wavelength conversion element for converting a wavelength of light emitted from a light emitting diode (LED: Light Emitting Diode), a laser diode (LD: Laser Diode) or the like into another wavelength.

  In recent years, as a next-generation light emitting device replacing fluorescent lamps and incandescent lamps, attention has been focused on light emitting devices using LEDs or LDs from the viewpoint of low power consumption, small size, light weight, and easy light amount adjustment. As an example of such a next-generation light emitting device, for example, in Patent Document 1, a wavelength conversion member that absorbs a part of light from the LED and converts it into yellow light is disposed on the LED that emits blue light. A light emitting device is disclosed. The light emitting device emits white light which is a composite light of blue light emitted from the LED and yellow light emitted from the wavelength conversion member.

  As a wavelength conversion member, what disperse | distributed inorganic fluorescent substance powder in the resin matrix conventionally is used. However, when the wavelength conversion member is used, there is a problem that the resin is deteriorated by the light from the LED and the luminance of the light emitting device tends to be low. In particular, there is a problem that the mold resin is deteriorated by the heat emitted by the LED or the high energy short wavelength (blue to ultraviolet) light to cause discoloration or deformation.

  Then, the wavelength conversion member which consists of a perfect inorganic solid which disperse | distributed and fixed fluorescent substance in glass matrix instead of resin is proposed (for example, refer patent document 2 and 3). The said wavelength conversion member has the characteristics that the glass used as a base material does not deteriorate easily with the heat | fever of LED, or irradiation light, and problems, such as discoloration and a deformation | transformation, do not produce easily.

  In recent years, the output of LEDs and LDs used as light sources is increasing for the purpose of high power. Along with that, the temperature of the wavelength conversion member rises due to the heat of the light source and the heat emitted from the phosphor irradiated with the excitation light, and as a result, there is a problem that the light emission intensity decreases with time (temperature quenching). Further, depending on the case, the temperature rise of the wavelength conversion member becomes remarkable, and there is a possibility that the constituent material (glass matrix or the like) may be dissolved.

  Therefore, in order to dissipate heat from the wavelength conversion member, a wavelength conversion element is proposed in which a heat dissipation member having a thermal conductivity higher than that of the wavelength conversion member is provided in the peripheral portion of the wavelength conversion member (for example, patent See reference 4). In Patent Document 4, as a method of attaching a wavelength conversion member to a stainless steel heat dissipating member, a cut or hole is formed in a fitting portion of a heat dissipating member having a through hole, and low melting glass is filled in the cut or hole. The method of attaching is mentioned by.

JP, 2000-208815, A Unexamined-Japanese-Patent No. 2003-258308 Japanese Patent Application Publication No. 2007-016171 Unexamined-Japanese-Patent No. 2007-323861

  However, in the method described in Patent Document 4, a gap is formed between the wavelength conversion member and the heat dissipation member, and heat from the wavelength conversion member is not easily transmitted to the heat dissipation member.

  An object of the present invention is to provide a method of manufacturing a wavelength conversion element capable of efficiently transferring the heat from the wavelength conversion member to the heat dissipation member.

  The present invention comprises a heat dissipation member having a through hole, a wavelength conversion member disposed in the through hole, and a glass layer provided between the wavelength conversion member and the through hole, and the surface of the through hole and the wavelength A method of manufacturing a wavelength conversion element in which a side surface of a conversion member is adhered, which is a step of preparing a glass paste containing glass powder, a binder, and a solvent, a glass paste, a side surface of the wavelength conversion member, Applying to at least one of the surfaces of the through holes to form a paste application layer, heating the paste application layer to remove the binder, and sintering the glass powder to form a glass layer; After the glass layer is formed, the wavelength conversion member is disposed in the through hole, and the glass layer located between the side surface of the wavelength conversion member and the surface of the through hole is heated to soften and flow the wavelength. It is characterized by comprising the step of adhering the side surface of the through hole of the wood.

  The through hole is preferably formed in a tapered shape expanding from one end to the other end. In that case, it is preferable to arrange the wavelength conversion member having a shape corresponding to the through hole in the through hole from the other end side.

  The wavelength conversion member may be formed by dispersing phosphor powder in an inorganic binder. The wavelength conversion member may be made of polycrystalline ceramic phosphor or single crystal ceramic phosphor.

  The wavelength conversion member may be a laminate in which a phosphor layer and a translucent heat dissipation layer having a thermal conductivity higher than that of the phosphor layer are alternately stacked. In this case, the translucent heat-radiating layer is made of, for example, a translucent ceramic.

  In the present invention, the heat dissipation member is formed of, for example, metal or ceramic.

  In the present invention, the glass powder is at least one selected from, for example, silicate glass, borosilicate glass, tin phosphate glass, bismuth acid salt glass and lead borosilicate glass.

  According to the present invention, it is possible to manufacture a wavelength conversion element capable of efficiently transferring the heat from the wavelength conversion member to the heat dissipation member.

It is a typical sectional view showing a wavelength conversion element manufactured with a manufacturing method of a 1st embodiment of the present invention. It is a typical sectional view for explaining the manufacturing method of a 1st embodiment of the present invention. It is typical sectional drawing for demonstrating the manufacturing method of the 2nd Embodiment of this invention. It is a typical sectional view showing a wavelength conversion element manufactured with a manufacturing method of a 3rd embodiment of the present invention. It is a typical sectional view showing the wavelength conversion member in a 4th embodiment of the present invention.

  Hereinafter, preferred embodiments will be described. However, the following embodiments are merely illustrative, and the present invention is not limited to the following embodiments. In each drawing, members having substantially the same functions may be referred to by the same reference numerals.

  FIG. 1 is a schematic cross-sectional view showing a wavelength conversion element manufactured by the manufacturing method of the first embodiment of the present invention. As shown in FIG. 1, the wavelength conversion element 10 according to this embodiment includes a heat dissipation member 2 having a through hole 3, a wavelength conversion member 1 disposed in the through hole 3, a wavelength conversion member 1 and a through hole 3. And a glass layer 4 provided therebetween. The surface 3 a of the through hole 3 and the side surface 1 a of the wavelength conversion member 1 are bonded by the glass layer 4. When the wavelength conversion member 1 is irradiated with excitation light, heat is generated from the wavelength conversion member 1 together with the fluorescence. The heat generated from the wavelength conversion member 1 is transmitted to the heat dissipation member 2 through the glass layer 4.

  Examples of the wavelength conversion member 1 include those containing a phosphor that emits fluorescence by excitation light emitted from a light source. As such a wavelength conversion member 1, one formed by dispersing a powder of a phosphor in an inorganic binder can be mentioned. By dispersing in an inorganic binder, the phosphor can be dispersed uniformly. Examples of the inorganic binder include glass and polysilazane. As the glass, in consideration of the heat resistance of the phosphor, it is preferable to use one having a softening point of 250 ° C. to 1000 ° C., and more preferably 300 ° C. to 850 ° C. Examples of the glass include borosilicate glass, phosphate glass and the like.

  The phosphor is not particularly limited as long as it emits fluorescence upon incidence of excitation light. Specific examples of the phosphor include, for example, oxide phosphors, nitride phosphors, oxynitride phosphors, chloride phosphors, acid chloride phosphors, sulfide phosphors, acid sulfide phosphors, and halides. At least one selected from a phosphor, a chalcogenide phosphor, an aluminate phosphor, a halophosphate chloride phosphor, and a garnet-based compound phosphor. When blue light is used as excitation light, for example, a phosphor that emits green light, yellow light or red light as fluorescence can be used.

The average particle size of the phosphor _{(D 50)} is preferably 1 to 50 [mu] m, and more preferably 5 to 25 [mu] m. When the average particle size of the phosphor is too small, the emission intensity tends to be reduced. On the other hand, when the average particle diameter of the phosphor is too large, the luminescent color tends to be nonuniform.

  The content of the phosphor in the wavelength conversion member 1 is preferably 5 to 80% by volume, more preferably 10 to 75% by volume, and still more preferably 20 to 70% by volume. When the content of the phosphor is too small, it is difficult to obtain a desired emission intensity. On the other hand, when the content of the phosphor is too large, the mechanical strength of the wavelength conversion member 1 tends to decrease.

  The wavelength conversion member 1 may be configured substantially only of a fluorescent material without containing an inorganic binder or the like. Specific examples of such materials include polycrystalline ceramic phosphors and single crystal ceramic phosphors. Since these ceramic phosphors are very excellent in heat resistance, problems such as melting hardly occur even when the output of excitation light becomes large and the temperature becomes high. Examples of polycrystalline ceramic phosphors and single crystal ceramic phosphors include garnet-based ceramic phosphors such as YAG ceramic phosphors.

  The thickness of the wavelength conversion member 1 is preferably as thin as possible within a range where the excitation light is reliably absorbed by the phosphor. The reason is that if the wavelength conversion member 1 is too thick, scattering and absorption of light in the wavelength conversion member 1 become too large, and the emission efficiency of fluorescence tends to decrease, and the temperature of the wavelength conversion member 1 It becomes high and it is easy to generate | occur | produce the fall of the luminescence intensity over time, and melt | dissolution of a constituent material. Therefore, the thickness of the wavelength conversion member 1 is preferably 2 mm or less, more preferably 1 mm or less, and still more preferably 0.8 mm or less. The lower limit of the thickness of the wavelength conversion member 1 is usually about 0.03 mm. Further, in the case of the purpose of obtaining a white color as the outgoing light, the thickness of the wavelength conversion member 1 may be controlled so that the excitation light and the fluorescence become an appropriate ratio.

  The heat dissipation member 2 is provided to dissipate the heat generated by the wavelength conversion member 1. Therefore, the heat dissipating member 2 is preferably formed of a material having high thermal conductivity. From such a point of view, the heat dissipation member 2 is preferably formed of metal, ceramic or the like. As a metal, aluminum, stainless steel, etc. are mentioned, for example. As the ceramic, a high thermal conductivity ceramic can be used. As high thermal conductivity ceramics, aluminum oxide based ceramics, aluminum nitride based ceramics, silicon carbide based ceramics, boron nitride based ceramics, magnesium oxide based ceramics, titanium oxide based ceramics, niobium oxide based ceramics, zinc oxide based ceramics, yttrium oxide based ceramics Ceramic etc. are mentioned.

  The through hole 3 of the heat dissipation member 2 in the present embodiment is formed in a tapered shape expanding from one end 3 b to the other end 3 c. In addition, the wavelength conversion member 1 has a shape corresponding to the through hole 3. Specifically, the side surface 1 a of the wavelength conversion member 1 has a shape corresponding to the tapered surface 3 a of the through hole 3. Since the side surface 1a of the wavelength conversion member 1 and the surface 3a of the through hole 3 have the above-mentioned shape, the side surface 1a of the wavelength conversion member 1 in the manufacturing process of the wavelength conversion element 10 described later with reference to FIG. It becomes easy to press-fit uniformly on the surface 3a of 3. In the present embodiment, the side surface 1a of the wavelength conversion member 1 and the surface 3a of the through hole 3 are formed in a conical tapered shape, but the present invention is not limited thereto. It may be done.

  In the wavelength conversion element 10 of the present embodiment, for example, the wavelength conversion member 1 in the through hole 3 is irradiated with excitation light from the one end 3b side, wavelength conversion is performed by the wavelength conversion member 1, and fluorescence is converted to the other end 3c. It can be emitted from the side.

  In order to prevent excitation light and fluorescence from leaking from the wavelength conversion member 1 to the outside, a reflection layer may be provided on the side surface 1 a of the wavelength conversion member 1 and / or the surface 3 a of the through hole 3. Examples of the reflective layer include metal layers made of Ag, Al, Pt, Cu or the like, and ceramic layers containing alumina, titania or the like. When the heat dissipation member 2 is formed of metal, the surface 3a of the through hole 3 can also function as a reflective layer.

  A band pass filter may be provided on the excitation light incident side surface of the wavelength conversion member 1 for the purpose of improving the forward extraction of the fluorescence. Moreover, you may provide an anti-reflective film in the excitation light of the wavelength conversion member 1, and the radiation | emission side surface of fluorescence for the purpose of reflection loss reduction of excitation light and fluorescence.

  FIG. 2 is a schematic cross-sectional view for explaining the manufacturing method of the first embodiment of the present invention. As shown in FIG. 2, a glass layer 4 is formed on the side surface 1 a of the wavelength conversion member 1. The glass layer 4 can be formed as follows.

  A glass paste containing glass powder, a binder, and a solvent is prepared. The glass powder preferably has a softening point of 250 ° C. to 1000 ° C., and more preferably 300 ° C. to 850 ° C. The softening point of the glass powder refers to the value obtained by the fiber elongation method. Specific examples of the glass include at least one selected from silicate glass, borosilicate glass, tin phosphate glass, bismuthate glass and lead borosilicate glass. Among these, borosilicate glass and tin phosphate glass are particularly preferable because they have a relatively low softening point and can be sintered at low temperatures, and can suppress deterioration of the phosphor during firing.

  As the binder, polypropylene carbonate, polybutyl methacrylate, polyvinyl butyral, polymethyl methacrylate, polyethyl methacrylate, ethyl cellulose, nitrocellulose, polyester carbonate and the like can be used, and these can be used alone or in combination.

  As a solvent, terpineol, isoamyl acetate, toluene, methyl ethyl ketone, diethylene glycol monobutyl ether acetate, 2,2,4-trimethyl-1,3-pentadiol monoisobutyrate etc. can be used alone or in combination.

  The glass paste can be prepared, for example, by adding and mixing glass powder in a solution in which a binder is dissolved in a solvent. The glass paste may contain a filler such as ceramic or metal, if necessary. In this way, the viscosity of the glass paste is increased, and it is possible to suppress the sagging of the paste application layer described later. Further, since the thermal conductivity of the glass layer 4 is improved, the heat generated by the wavelength conversion member 1 can be efficiently transmitted to the heat dissipation member 2. When the filler is contained, it is preferably 1 to 100 parts by mass, and more preferably 10 to 50 parts by mass with respect to 100 parts by mass of the glass powder.

  In the present embodiment, the glass paste thus prepared is applied onto the side surface 1 a of the wavelength conversion member 1 to form a paste application layer. Next, the paste application layer is heated to remove the binder, and the glass powder is sintered to form the glass layer 4. The removal of the binder is preferably performed in the range of softening point of glass powder -150 ° C to softening point of glass powder -5 ° C, and in the range of softening point of glass powder -120 ° C to softening point of glass powder -10 ° C It is further preferred to do. Sintering of the glass powder is preferably carried out in the range of the softening point of the glass powder to the softening point of the glass powder + 150 ° C., and further the softening point of the glass powder + 5 ° C. to the softening point of the glass powder + 130 ° C. preferable. By heating in such a temperature range, the binder can be completely removed and a dense glass layer 4 can be formed. When the temperature for sintering the glass powder is too low, pores tend to remain in the glass layer 4. When the wavelength conversion member 1 and the heat radiation member 2 are brought into contact and heated in such a state, bubbles tend to be formed in the glass or large gaps are formed in the process in which the glass powders are sintered and shrunk. Since the heat conductivity of these air bubbles and gaps is extremely low, the heat from the wavelength conversion member 1 can not be effectively transmitted to the heat dissipation member 2, and the heat dissipation property is likely to be reduced.

  Next, the wavelength conversion member 1 in which the glass layer 4 is formed on the side surface 1a is disposed on the other end 3c side of the through hole 3 as shown in FIG. The wavelength conversion member 1 is moved in the arrow A direction, and the glass layer 4 is heated in a state in which the glass layer 4 formed on the side surface 1 a is pressure bonded to the surface 3 a of the through hole 3. The heating temperature is, for example, preferably in the range of the softening point of the glass powder to the softening point of the glass powder + 150 ° C, and more preferably the softening point of the glass powder + 5 ° C to the softening point of the glass powder + 130 ° C. By setting it in such a temperature range, the glass layer 4 softens and flows, and the side surface a of the wavelength conversion member 1 and the surface 3 a of the through hole 3 can be bonded.

  According to the present invention, the surface 3a of the through hole 3 and the side surface 1a of the wavelength conversion member 1 are reheated in advance by causing the glass layer 4 formed on the side surface 1a of the wavelength conversion member 1 to soften and flow. It is possible to suppress the generation of air bubbles in the glass layer 4 and the formation of a large gap due to contraction.

  FIG. 3 is a schematic cross-sectional view for explaining the manufacturing method of the second embodiment of the present invention. In the present embodiment, a glass paste is applied on the surface 3 a of the through hole 3 in the heat dissipation member 2, and a paste application layer is formed on the surface 3 a of the through hole 3. As in the first embodiment, the paste applied layer is heated to remove the binder, and the glass powder is sintered to form the glass layer 4 on the surface 3 a of the through hole 3.

  Thereafter, the wavelength conversion member 1 is moved in the arrow A direction, and the glass layer 4 is heated in a state in which the glass layer 4 on the surface 3 a of the through hole 3 is crimped to the side surface 1 a of the wavelength conversion member 1. Thereby, the glass layer 4 softens and flows, and the surface 3 a of the through hole 3 and the side surface 1 a of the wavelength conversion member 1 can be bonded.

  Also in the present embodiment, the members are adhered by reheating the glass layer 4 to cause it to soften and flow, so it is possible to suppress the generation of air bubbles in the glass layer and the formation of large gaps due to contraction. Can. For this reason, the heat from the wavelength conversion member 1 can be effectively transmitted to the heat dissipation member 2, and the heat dissipation can be enhanced.

  In the present embodiment, the glass layer 4 is formed on the entire surface 3 a of the through hole 3. However, the present invention is not limited to this. When the wavelength conversion member 1 is crimped to the surface 3 a of the through hole 3 The glass layer 4 may be formed only in the contact area. The glass layer 4 may be formed on both the side surface 1 a of the wavelength conversion member 1 and the surface 3 a of the through hole 3.

  FIG. 4 is a schematic cross-sectional view showing a wavelength conversion element manufactured by the manufacturing method of the third embodiment of the present invention. In the present embodiment, the through holes 3 are formed in a cylindrical shape. Therefore, the wavelength conversion member 1 is also formed in a cylindrical shape. The through holes 3 in the present invention do not necessarily have to be tapered as in the first and second embodiments, and may have a columnar shape as in the present embodiment. The through holes 3 and the wavelength conversion member 1 may have a prismatic shape.

  Also in the present embodiment, the members are adhered by reheating the glass layer 4 to cause it to soften and flow, so it is possible to suppress the generation of air bubbles in the glass layer and the formation of large gaps due to contraction. Can. For this reason, the heat from the wavelength conversion member 1 can be effectively transmitted to the heat dissipation member 2, and the heat dissipation can be enhanced.

  Similar to the wavelength conversion element 10 manufactured in the first embodiment, a band pass filter may be provided on the excitation light incident side surface of the wavelength conversion member 1 for the purpose of improving forward extraction of fluorescence. Moreover, you may provide an anti-reflective film in the excitation light of the wavelength conversion member 1, and the radiation | emission side surface of fluorescence for the purpose of reflection loss reduction of excitation light and fluorescence.

  FIG. 5 is a schematic cross-sectional view showing a wavelength conversion member in a fourth embodiment of the present invention. In the wavelength conversion member in the present invention, as in the wavelength conversion member 20 shown in FIG. 5, the phosphor layers 21 and the translucent heat dissipation layers 22 having a thermal conductivity higher than that of the phosphor layers 21 are alternately stacked. You may be comprised from the laminated body. Specifically, the wavelength conversion member 20 of the present embodiment is formed of a laminate including the phosphor layer 21 and the translucent heat dissipation layer 22 formed on both sides thereof. In the present embodiment, the heat generated by irradiating the phosphor layer 21 with the excitation light is efficiently released to the outside through the light transmissive heat dissipation layers 22. Therefore, it can suppress that the temperature of the fluorescent substance layer 21 rises excessively.

  As the fluorescent substance layer 21, the thing similar to the wavelength conversion member 1 of 1st Embodiment can be used. Specifically, one formed by dispersing a phosphor in an inorganic binder, a polycrystalline ceramic phosphor, a single crystal ceramic phosphor, or the like can be used.

  The translucent heat-radiating layer 22 has a thermal conductivity higher than that of the phosphor layer 21. Specifically, it is preferably 5 W / m · K or more, more preferably 10 W / m · K or more, and still more preferably 20 W / m · K or more. Further, the excitation light and the fluorescence emitted from the phosphor layer 21 are transmitted. Specifically, the total light transmittance at a wavelength of 400 to 800 nm of the translucent heat-radiating layer 22 is preferably 10% or more, more preferably 20% or more, and still more preferably 30% or more. And 40% or more is particularly preferable, and 50% or more is most preferable.

  As the light transmitting heat dissipation layer 22, aluminum oxide ceramics, zirconia oxide ceramics, aluminum nitride ceramics, silicon carbide ceramics, boron nitride ceramics, magnesium oxide ceramics, titanium oxide ceramics, niobium oxide ceramics, oxide Examples thereof include translucent ceramic substrates such as zinc-based ceramics and yttrium oxide-based ceramics.

  The thickness of the light transmitting heat dissipation layer 22 is preferably 0.05 to 1 mm, more preferably 0.07 to 0.8 mm, and still more preferably 0.1 to 0.5 mm. If the thickness of the light transmitting heat sink layer 22 is too small, the mechanical strength tends to decrease. On the other hand, when the thickness of the light transmitting heat dissipation layer 22 is too large, the wavelength conversion element tends to be large.

  In addition, the thickness of the two translucent heat-dissipation layers 22 provided in the both surfaces of the fluorescent substance layer 21 may be the same, and may differ. For example, in the case where the mechanical strength as the wavelength conversion member 20 is secured by making the thickness of one translucent heat-radiating layer 22 relatively large (for example, 0.2 mm or more, further 0.5 mm or more), The thickness of the other translucent heat-radiating layer 22 may be relatively small (for example, less than 0.2 mm, and further 0.1 mm or less).

  Similar to the wavelength conversion element 10 manufactured in the first embodiment, an antireflection film for reducing reflection loss of excitation light and improving forward extraction of fluorescence on the excitation light incident side surface of the light transmitting heat dissipation layer 22. Alternatively, a band pass filter may be provided. In addition, an antireflective film may be provided on the surface of the light emitting layer 22 on the emission side of the excitation light and the fluorescence for the purpose of reducing the reflection loss of the excitation light and the fluorescence. Furthermore, in order to prevent the excitation light and the fluorescence from leaking from the phosphor layer 21 and the light transmitting heat dissipation layer 22 to the outside, a reflection layer may be provided on the side surface of each layer.

  The wavelength conversion member 20 of the present embodiment can be manufactured, for example, as follows.

  A slurry containing a glass powder, a fluorescent substance, and an organic component such as a binder resin or a solvent is applied on a resin film such as polyethylene terephthalate by a doctor blade method or the like, and dried by heating. Make a green sheet. The phosphor layer 21 is obtained by firing the green sheet.

  The wavelength conversion member 20 is obtained by laminating the translucent heat-dissipation layer 22 on both surfaces of the phosphor layer 21 and heating and pressing. Alternatively, the phosphor layer 21 and the translucent heat-radiating layer 22 may be joined via an inorganic adhesive such as polysilazane. Further, in the case where the phosphor layer 21 is made of ceramic phosphor and the light transmitting heat dissipation layer 22 is made of light transmitting ceramic, the phosphor layer 21 and the light transmitting heat dissipation layer 22 are joined by the discharge plasma sintering method. You may In this way, the adhesion between the phosphor layer 21 and the light transmitting heat dissipation layer 22 is improved, and the heat generated in the phosphor layer 21 is easily transmitted to the light transmitting heat dissipation layer 22.

  The wavelength conversion member 20 of the present embodiment is a laminate of three layers, but is not limited to this. For example, four layers in which the phosphor layers 21 and the translucent heat dissipation layers 22 are alternately laminated The above laminate may be used.

  The wavelength conversion member 20 of this embodiment can be applied to any of the manufacturing methods of the first and second embodiments. Moreover, like the wavelength conversion member 1 of 3rd Embodiment, a column shape or prismatic shape may be sufficient.

  Even in the case of using the wavelength conversion member 20 of the present embodiment, the members are adhered by reheating the glass layer 4 to soften and flow them, so that air bubbles may be generated in the glass layer or a large gap due to contraction. Can be suppressed. For this reason, the heat from the wavelength conversion member 20 can be effectively transmitted to the heat dissipation member 2, and the heat dissipation can be enhanced.

DESCRIPTION OF SYMBOLS 1 ... Wavelength conversion member 1a ... Side surface 2 ... Heat dissipation member 3 ... Through-hole 3a ... Surface 3b ... One end 3c ... Other end 4 ... Glass layer 10 ... Wavelength conversion element 20 ... Wavelength conversion member 21 ... Phosphor layer 22 ... Transmittance Heat dissipation layer

Claims (9)

A heat dissipation member having a through hole, a wavelength conversion member disposed in the through hole, and a glass layer provided between the wavelength conversion member and the through hole, and the surface of the through hole by the glass layer A method of manufacturing a wavelength conversion element in which the side surface of the wavelength conversion member is bonded,
Preparing a glass paste comprising glass powder, a binder and a solvent,
Applying the glass paste to at least one of the side surface of the wavelength conversion member and the surface of the through hole to form a paste application layer;
Heating the paste applied layer to remove the binder and sintering the glass powder to form a glass layer;
After the glass layer is formed, the wavelength conversion member is disposed in the through hole, and the glass layer located between the side surface of the wavelength conversion member and the surface of the through hole is heated to soften and flow. And thereby bonding the side surface of the wavelength conversion member and the surface of the through hole.   The method of manufacturing a wavelength conversion element according to claim 1, wherein the through hole is formed in a tapered shape expanding from one end to the other end.   The method for manufacturing a wavelength conversion element according to claim 2, wherein the wavelength conversion member having a shape corresponding to the through hole is disposed in the through hole from the other end side.   The manufacturing method of the wavelength conversion element as described in any one of Claims 1-3 which the said wavelength conversion member disperse | distributes the powder of fluorescent substance in the inorganic binder, and is formed.   The manufacturing method of the wavelength conversion element as described in any one of Claims 1-3 which the said wavelength conversion member becomes from a polycrystalline ceramic fluorescent substance or a single crystal ceramic fluorescent substance.   The said wavelength conversion member is a laminated body which laminated | stacked alternately the fluorescent substance layer and the translucent heat-dissipation layer which has thermal conductivity higher than the said fluorescent substance layer to any one of Claims 1-3. The manufacturing method of the wavelength conversion element as described.   The manufacturing method of the wavelength conversion element of Claim 6 in which the said translucent heat-dissipating layer consists of translucent ceramic.   The method of manufacturing a wavelength conversion element according to any one of claims 1 to 7, wherein the heat dissipation member is formed of metal or ceramic.   The glass powder according to any one of claims 1 to 8, wherein the glass powder is at least one selected from silicate glass, borosilicate glass, tin phosphate glass, bismuthate glass and lead borosilicate glass. Method of manufacturing a wavelength converter

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