JP2017107622A - 回路付サスペンション基板、および、回路付サスペンション基板の製造方法 - Google Patents
回路付サスペンション基板、および、回路付サスペンション基板の製造方法 Download PDFInfo
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- JP2017107622A JP2017107622A JP2015238853A JP2015238853A JP2017107622A JP 2017107622 A JP2017107622 A JP 2017107622A JP 2015238853 A JP2015238853 A JP 2015238853A JP 2015238853 A JP2015238853 A JP 2015238853A JP 2017107622 A JP2017107622 A JP 2017107622A
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- suspension board
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- 239000000725 suspension Substances 0.000 title claims abstract description 61
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000004020 conductor Substances 0.000 claims abstract description 64
- 229910052751 metal Inorganic materials 0.000 claims abstract description 52
- 239000002184 metal Substances 0.000 claims abstract description 52
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- 239000002966 varnish Substances 0.000 claims description 8
- 238000009413 insulation Methods 0.000 abstract 4
- 230000005540 biological transmission Effects 0.000 description 12
- 239000007767 bonding agent Substances 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4826—Mounting, aligning or attachment of the transducer head relative to the arm assembly, e.g. slider holding members, gimbals, adhesive
- G11B5/483—Piezoelectric devices between head and arm, e.g. for fine adjustment
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4833—Structure of the arm assembly, e.g. load beams, flexures, parts of the arm adapted for controlling vertical force on the head
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4853—Constructional details of the electrical connection between head and arm
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Moving Of The Head To Find And Align With The Track (AREA)
- Structure Of Printed Boards (AREA)
Abstract
【解決手段】
金属支持基板2と、ベース絶縁層3と、圧電素子接続端子16を有する導体パターン4と、カバー絶縁層5とを備える回路付サスペンション基板1において、ベース絶縁層3を形成するときに、階調露光によって、ベース絶縁層3に、金属支持基板2の厚み方向に見て圧電素子接続端子16を含む第1部分3Aと、厚み方向に見て第1部分3Aと異なる位置に配置される第2部分3Bとを形成する。第1部分3Aの厚みは、第2部分3Bの厚みよりも薄い。
【選択図】図2
Description
図1〜図3Eを参照して、第1実施形態の回路付サスペンション基板1について説明する。
(第2実施形態)
次いで、図4〜図7Gを参照して、第2実施形態の回路付サスペンション基板40について説明する。なお、第2実施形態において、上記した第1実施形態と同様の部材には同様の符号を付し、その説明を省略する。
(その他の実施形態)
なお、上記した第2実施形態では、圧電素子接続端子16と重なる部分において、中間絶縁層41と金属支持基板2との間に、ベース絶縁層3を設けることもできる。
2 金属支持基板
3 ベース絶縁層
3A 第1部分
3B 第2部分
4 導体パターン
4B 第2導体パターン
5 カバー絶縁層
5A 第3部分
5B 第4部分
16 圧電素子接続端子
31 圧電素子
40 回路付サスペンション基板
41 中間絶縁層
41A 第1部分
41B 第2部分
Claims (4)
- 圧電素子を搭載可能な回路付サスペンション基板であって、
金属支持基板と、
前記圧電素子に電気的に接続可能な端子を有し、前記金属支持基板の上に間隔を隔てて配置される導体層と、
前記導体層を支持するように前記金属支持基板と前記導体層との間に配置される第1絶縁層と、
前記端子を露出するように前記第1絶縁層および前記導体層の上に配置される第2絶縁層と
を備え、
前記第1絶縁層は、
前記金属支持基板の厚み方向に見て前記端子を含む第1部分と、
前記厚み方向に見て前記第1部分と異なる位置に配置される第2部分と
を備え、
前記第1部分の厚みは、前記第2部分の厚みよりも薄いことを特徴とする、回路付サスペンション基板。 - 前記第1部分の面積は、前記厚み方向に見て、前記端子の面積よりも大きいことを特徴とする、請求項1に記載の回路付サスペンション基板。
- 前記第2絶縁層は、
前記第1部分の上に配置される第3部分と、
前記第2部分の上に配置される第4部分と
を備え、
前記第3部分の厚みは、前記第4部分の厚みと同じであることを特徴とする、請求項2に記載の回路付サスペンション基板。 - 請求項1〜3のいずれか一項に記載の回路付サスペンション基板の製造方法であって、
前記金属支持基板の上に、前記第1絶縁層を形成する工程と、
前記第1絶縁層の上に前記導体層を形成する工程と、
前記端子を露出するように前記第1絶縁層および前記導体層の上に前記第2絶縁層を形成する工程と
を含み、
均一な厚みで塗布された感光性樹脂のワニスを階調露光することにより、前記第1絶縁層に、前記第1部分と前記2部分とを形成することを特徴とする、回路付サスペンション基板の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015238853A JP6533153B2 (ja) | 2015-12-07 | 2015-12-07 | 回路付サスペンション基板、および、回路付サスペンション基板の製造方法 |
US15/368,862 US9913373B2 (en) | 2015-12-07 | 2016-12-05 | Suspension board with circuit and producing method thereof |
CN201611116117.1A CN106852009B (zh) | 2015-12-07 | 2016-12-07 | 带电路的悬挂基板和带电路的悬挂基板的制造方法 |
Applications Claiming Priority (1)
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JP2015238853A JP6533153B2 (ja) | 2015-12-07 | 2015-12-07 | 回路付サスペンション基板、および、回路付サスペンション基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017107622A true JP2017107622A (ja) | 2017-06-15 |
JP6533153B2 JP6533153B2 (ja) | 2019-06-19 |
Family
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JP2015238853A Active JP6533153B2 (ja) | 2015-12-07 | 2015-12-07 | 回路付サスペンション基板、および、回路付サスペンション基板の製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9913373B2 (ja) |
JP (1) | JP6533153B2 (ja) |
CN (1) | CN106852009B (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012160235A (ja) * | 2011-02-01 | 2012-08-23 | Nitto Denko Corp | 回路付サスペンション基板 |
JP2013012725A (ja) * | 2011-05-31 | 2013-01-17 | Nitto Denko Corp | 配線回路基板およびその製造方法 |
JP2015125793A (ja) * | 2013-12-27 | 2015-07-06 | 日東電工株式会社 | 回路付サスペンション基板およびヘッドジンバルアッセンブリ |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9241410B2 (en) * | 2011-05-31 | 2016-01-19 | Nitto Denko Corporation | Wired circuit board and producing method thereof |
JP6029835B2 (ja) * | 2012-03-02 | 2016-11-24 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
-
2015
- 2015-12-07 JP JP2015238853A patent/JP6533153B2/ja active Active
-
2016
- 2016-12-05 US US15/368,862 patent/US9913373B2/en not_active Expired - Fee Related
- 2016-12-07 CN CN201611116117.1A patent/CN106852009B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012160235A (ja) * | 2011-02-01 | 2012-08-23 | Nitto Denko Corp | 回路付サスペンション基板 |
JP2013012725A (ja) * | 2011-05-31 | 2013-01-17 | Nitto Denko Corp | 配線回路基板およびその製造方法 |
JP2015125793A (ja) * | 2013-12-27 | 2015-07-06 | 日東電工株式会社 | 回路付サスペンション基板およびヘッドジンバルアッセンブリ |
Also Published As
Publication number | Publication date |
---|---|
US9913373B2 (en) | 2018-03-06 |
CN106852009A (zh) | 2017-06-13 |
CN106852009B (zh) | 2021-06-11 |
US20170164470A1 (en) | 2017-06-08 |
JP6533153B2 (ja) | 2019-06-19 |
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