JP2017098998A - 電子機器 - Google Patents
電子機器 Download PDFInfo
- Publication number
- JP2017098998A JP2017098998A JP2017004783A JP2017004783A JP2017098998A JP 2017098998 A JP2017098998 A JP 2017098998A JP 2017004783 A JP2017004783 A JP 2017004783A JP 2017004783 A JP2017004783 A JP 2017004783A JP 2017098998 A JP2017098998 A JP 2017098998A
- Authority
- JP
- Japan
- Prior art keywords
- transmission line
- conductor
- line member
- signal
- ground conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/203—Strip line filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/203—Strip line filters
- H01P1/2039—Galvanic coupling between Input/Output
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/026—Coplanar striplines [CPS]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0086—Casings, cabinets or drawers for electric apparatus portable, e.g. battery operated apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0225—Single or multiple openings in a shielding, ground or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/053—Tails
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/056—Folded around rigid support or component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09254—Branched layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Waveguides (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
21:第1伝送線路
22:第2伝送線路
31:基準グランド導体
32,321,322:補助グランド導体
80:携帯電子機器
81:機器筐体
82A,82B:実装回路基板
84,84’:ICチップ
85:実装部品
90,90K:誘電体素体
91,92,93,94:誘電体層
110,110J,110K:主体部
111,112,1111,1112,1121,1121H,1122:引き出し部
211:第1信号導体
2111,2112:線状導体パターン
212,222,2161,2162,2161E,2162E,2163E,2164E,2161F,2162F:コイル導体
214,224:スタブ導体
213,2151,2152,2151E,2152E,2153E,2154E,2155E,2156E,2151F,2152F:キャパシタ形成用平板導体
221:第2信号導体
310D,320D,310E,320E,310F,320F:開口
411,412,421,422、431,432,441,411E,412E,413E,421E,422E,423E,424E,411F,421F:層間接続導体
511,512,521,522,P11,P12,P21,P22:外部接続端子
800,800’:バッテリーパック
820,830:実装回路基板
821,821’:接続部材
822,823:接続端子
CL110,CL1121:中心軸
TW:捻れ
Bd:曲げ
Claims (3)
- 伝送線路部材と、実装回路基板とを備えた電子機器であって、
前記伝送線路部材は、
平板状の誘電体素体と、
前記誘電体素体の内部に配置され、高周波信号の伝送方向に沿って延びる形状からなる第1信号導体と、
前記誘電体素体の厚み方向において前記第1信号導体の一方側に配置された第1グランド導体と、
前記誘電体素体の厚み方向において前記第1信号導体の他方側に配置された第2グランド導体と、
を備え、
前記伝送線路部材は、前記第1信号導体を前記第1グランド導体と前記第2グランド導体で挟み込むことにより前記高周波信号を伝送する第1伝送線路が形成されており、
前記伝送線路部材が、前記実装回路基板の表面から一側面を介して裏面に至るように、前記実装回路基板に巻き付けられている、
電子機器。 - 前記実装回路基板にはICチップ、実装部品、またはバッテリーパックのいずれかが実装されており、
前記ICチップ、前記実装部品、または前記バッテリーパックのいずれかが前記伝送線路部材の巻き付けの内周側に位置するように前記伝送線路部材が巻き付けられている、
請求項1に記載の電子機器。 - 前記伝送線路部材は、前記第1グランド導体と前記第2グランド導体を接続する前記厚み方向に延びる複数の層間接続導体を備える、
請求項1または請求項2に記載の電子機器。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014064985 | 2014-03-27 | ||
JP2014064985 | 2014-03-27 | ||
JP2014087890 | 2014-04-22 | ||
JP2014087890 | 2014-04-22 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016510152A Division JP6079929B2 (ja) | 2014-03-27 | 2015-02-26 | 伝送線路部材および電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017098998A true JP2017098998A (ja) | 2017-06-01 |
JP6330926B2 JP6330926B2 (ja) | 2018-05-30 |
Family
ID=54194979
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016510152A Active JP6079929B2 (ja) | 2014-03-27 | 2015-02-26 | 伝送線路部材および電子機器 |
JP2017004783A Active JP6330926B2 (ja) | 2014-03-27 | 2017-01-16 | 電子機器 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016510152A Active JP6079929B2 (ja) | 2014-03-27 | 2015-02-26 | 伝送線路部材および電子機器 |
Country Status (3)
Country | Link |
---|---|
US (2) | US9899715B2 (ja) |
JP (2) | JP6079929B2 (ja) |
WO (1) | WO2015146448A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11271757B2 (en) | 2017-12-28 | 2022-03-08 | Mitsubishi Heavy Industries, Ltd. | Monitoring device, monitoring system, information processing device, monitoring method, and program |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN209250938U (zh) * | 2016-02-24 | 2019-08-13 | 株式会社村田制作所 | 复合基板 |
US11021892B2 (en) * | 2016-08-17 | 2021-06-01 | Amesbury Group, Inc. | Locking system having an electronic keeper |
WO2018056362A1 (ja) * | 2016-09-23 | 2018-03-29 | 株式会社村田製作所 | フラット状アンテナ |
WO2018128157A1 (ja) * | 2017-01-05 | 2018-07-12 | 株式会社村田製作所 | 電子機器 |
JP6558514B2 (ja) * | 2017-03-31 | 2019-08-14 | 株式会社村田製作所 | 電子機器 |
WO2018213494A1 (en) * | 2017-05-16 | 2018-11-22 | Rigetti & Co, Inc. | Connecting electrical circuitry in a quantum computing system |
US11248396B2 (en) | 2017-07-24 | 2022-02-15 | Amesbury Group, Inc. | Sealed keeper sensors |
WO2019058832A1 (ja) | 2017-09-21 | 2019-03-28 | 株式会社村田製作所 | ケーブル型アンテナ |
CN214960295U (zh) | 2018-08-22 | 2021-11-30 | 株式会社村田制作所 | 传输线路基板以及传输线路基板的接合构造 |
KR102152101B1 (ko) * | 2018-11-02 | 2020-09-07 | 진영글로벌 주식회사 | 차량 전장용 디바이스 |
CN110534853B (zh) * | 2019-09-07 | 2020-09-04 | 西南交通大学 | 一种基于对称分裂结构多模谐振器的多频带阻滤波器 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0792480A (ja) * | 1993-09-22 | 1995-04-07 | Sharp Corp | 表示装置 |
JP2007220746A (ja) * | 2006-02-14 | 2007-08-30 | Fujikura Ltd | プリント配線板 |
WO2011007660A1 (ja) * | 2009-07-13 | 2011-01-20 | 株式会社村田製作所 | 信号線路及び回路基板 |
WO2013190859A1 (ja) * | 2012-06-19 | 2013-12-27 | 株式会社村田製作所 | 積層型多芯ケーブル |
JP2014042225A (ja) * | 2012-02-14 | 2014-03-06 | Murata Mfg Co Ltd | 高周波信号線路及びこれを備えた電子機器 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5854534A (en) * | 1992-08-05 | 1998-12-29 | Fujitsu Limited | Controlled impedence interposer substrate |
US6937480B2 (en) * | 2001-05-14 | 2005-08-30 | Fuji Xerox Co., Ltd. | Printed wiring board |
US7656678B2 (en) * | 2001-10-26 | 2010-02-02 | Entorian Technologies, Lp | Stacked module systems |
US6819202B2 (en) * | 2002-02-13 | 2004-11-16 | Scientific Components | Power splitter having counter rotating circuit lines |
US7405698B2 (en) * | 2004-10-01 | 2008-07-29 | De Rochemont L Pierre | Ceramic antenna module and methods of manufacture thereof |
JP4685614B2 (ja) * | 2005-12-06 | 2011-05-18 | 富士通オプティカルコンポーネンツ株式会社 | 基板及び基板モジュール |
US7787254B2 (en) * | 2006-03-08 | 2010-08-31 | Microelectronics Assembly Technologies, Inc. | Thin multichip flex-module |
JP5654303B2 (ja) * | 2010-09-21 | 2015-01-14 | 太陽誘電株式会社 | 電子部品およびその製造方法、並びに電子部品を備えた電子デバイス |
JP5618034B2 (ja) * | 2012-08-10 | 2014-11-05 | 株式会社村田製作所 | 分岐ケーブル |
CN104737448B (zh) * | 2012-10-19 | 2017-11-14 | 株式会社村田制作所 | 共模滤波器 |
-
2015
- 2015-02-26 JP JP2016510152A patent/JP6079929B2/ja active Active
- 2015-02-26 WO PCT/JP2015/055512 patent/WO2015146448A1/ja active Application Filing
-
2016
- 2016-09-06 US US15/256,818 patent/US9899715B2/en active Active
-
2017
- 2017-01-16 JP JP2017004783A patent/JP6330926B2/ja active Active
-
2018
- 2018-01-02 US US15/859,815 patent/US10116025B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0792480A (ja) * | 1993-09-22 | 1995-04-07 | Sharp Corp | 表示装置 |
JP2007220746A (ja) * | 2006-02-14 | 2007-08-30 | Fujikura Ltd | プリント配線板 |
WO2011007660A1 (ja) * | 2009-07-13 | 2011-01-20 | 株式会社村田製作所 | 信号線路及び回路基板 |
JP2014042225A (ja) * | 2012-02-14 | 2014-03-06 | Murata Mfg Co Ltd | 高周波信号線路及びこれを備えた電子機器 |
WO2013190859A1 (ja) * | 2012-06-19 | 2013-12-27 | 株式会社村田製作所 | 積層型多芯ケーブル |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11271757B2 (en) | 2017-12-28 | 2022-03-08 | Mitsubishi Heavy Industries, Ltd. | Monitoring device, monitoring system, information processing device, monitoring method, and program |
Also Published As
Publication number | Publication date |
---|---|
WO2015146448A1 (ja) | 2015-10-01 |
JP6330926B2 (ja) | 2018-05-30 |
JPWO2015146448A1 (ja) | 2017-04-13 |
US10116025B2 (en) | 2018-10-30 |
JP6079929B2 (ja) | 2017-02-15 |
US20180145384A1 (en) | 2018-05-24 |
US20160372811A1 (en) | 2016-12-22 |
US9899715B2 (en) | 2018-02-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6330926B2 (ja) | 電子機器 | |
JP5794218B2 (ja) | 高周波信号線路及びこれを備えた電子機器 | |
JP6137246B2 (ja) | 高周波フィルタ、高周波ダイプレクサ、および電子機器 | |
JP5817795B2 (ja) | 高周波モジュール | |
JP6249020B2 (ja) | 高周波モジュール | |
JP5652542B2 (ja) | 方向性結合器 | |
US10110196B2 (en) | Electronic component | |
JP6183461B2 (ja) | 高周波モジュール | |
TW201929428A (zh) | 積層帶通濾波器 | |
US8253510B2 (en) | Non-reciprocal circuit element | |
JP6183462B2 (ja) | 高周波モジュール | |
WO2015022839A1 (ja) | 電力分配器 | |
US9331658B2 (en) | Filter circuit | |
JP5804076B2 (ja) | Lcフィルタ回路及び高周波モジュール | |
US8400236B2 (en) | Electronic component | |
CN206441849U (zh) | 传输线路构件及电子设备 | |
WO2021187083A1 (ja) | コイルデバイス、回路素子モジュール及び電子機器 | |
WO2023276879A1 (ja) | フィルタ装置、アンテナ装置、およびアンテナモジュール | |
JP2013219409A (ja) | 高周波モジュール | |
JP5673891B1 (ja) | アンテナ装置、無線通信端末 | |
JPWO2023276879A5 (ja) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20171214 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20171219 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180207 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180327 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180409 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6330926 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |