JP2017095033A - 車両用パネル及び車両用配線構造 - Google Patents
車両用パネル及び車両用配線構造 Download PDFInfo
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- JP2017095033A JP2017095033A JP2015231572A JP2015231572A JP2017095033A JP 2017095033 A JP2017095033 A JP 2017095033A JP 2015231572 A JP2015231572 A JP 2015231572A JP 2015231572 A JP2015231572 A JP 2015231572A JP 2017095033 A JP2017095033 A JP 2017095033A
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- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 238000009413 insulation Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 10
- 238000002360 preparation method Methods 0.000 description 7
- 238000012986 modification Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
- B60R16/0207—Wire harnesses
- B60R16/0215—Protecting, fastening and routing means therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
- H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0352—Differences between the conductors of different layers of a multilayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0391—Using different types of conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10053—Switch
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0353—Making conductive layer thin, e.g. by etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/043—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a moving tool for milling or cutting the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/045—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by making a conductive layer having a relief pattern, followed by abrading of the raised portions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Instrument Panels (AREA)
Abstract
Description
車両用パネルであるインストルメントパネル1及びこれに適用された車両用配線構造について説明する。
図2(a)、(b)に示すように、パネル本体2の表面側には、印刷配線部3の配線パターンに沿って配策溝10が形成されている。この各配策溝10に印刷配線部3がそれぞれ配置されている。 印刷配線部3の作製は、次の通りである。先ず、図3(a)、(b)に示すように、パネル本体2に配策溝10を形成する。次に、図4(a)、(b)に示すように、パネル本体2の全域にインクジェットノズル20で導電性部材(例えば導電性インク)30を吹き付ける。次に、図5に示すように、例えばサンドペーパ21でパネル本体2の表面全域を拭き、パネル本体2の表面の導電性部材30(配策溝10内の導電性部材以外)を取り除く。これで、図2(a)、(b)に示す印刷配線部3が形成される。
図6(a)、(b)に示す比較例1では、パネル本体2にインクジェットノズル20で配線パターンに沿って導電性部材(例えば導電性インク)を吹き付ける。つまり、インクジェットノズル20で描画することで印刷配線部3を形成している。インクジェットノズル20で全ての印刷配線部3を描画する必要があるため、印刷配線部3を形成する作製(加工)時間が長いという問題がある。本実施形態は、このような課題を解決し、印刷配線部3を形成する作製(加工)時間を短くできるものである。
図7〜図9は、前記実施形態の第1変形例を示す。図7(a)、(b)に示すように、パネル本体2の表面には、電子部品7を配置する箇所に凸部11が設けられている。凸部11の両側には、印刷配線部3が配置されている。
図10は、前記実施形態の第2変形例を示す。図10(a)、(b)に示すように、印刷配線部3A,3Bは、小電流用と大電流用に分かれている。大電流用の配策経路となる配策溝10の底には、配策溝10に沿ってバスバー12が埋設されている。
図11(a)に示す比較例2では、印刷配線部3A,3Bとして大電流用と小電流用のものを形成する場合、大電流用の印刷配線部3Aの厚みを厚く、小電流用の印刷配線部3Bの厚みを薄く形成している。
2 パネル本体
3,3A,3B 印刷配線部
3a 導電性部材
4 絶縁性表皮
6 キートップ(電装用部品)
10 配策溝
11 凸部
12 バスバー
Claims (4)
- 表面側に電装用部品が設置されるパネル本体と、前記パネル本体の表面に配置される印刷配線部と、前記印刷配線部を被うように前記パネル本体の表面側に配置される絶縁性表皮とを備えたことを特徴とする車両用パネル。
- 請求項1記載の車両用パネルであって、
前記印刷配線部は、前記パネル本体に形成された配策溝に配置されていることを特徴とする車両用パネル。 - 請求項2記載の車両用パネルであって、
前記印刷配線部は、小電流用と大電流用に分かれ、
大電流用の配策経路となる前記配策溝の底にはバスバーが埋設され、大電流用の前記印刷配線部は、前記バスバーと前記配策溝に配置された導電性部材からなることを特徴とする車両用パネル。 - 表面側に電装用部品が設置されるパネル本体と、前記パネル本体の表面側に配置される絶縁性表皮とを備え、前記パネル本体と前記絶縁性表皮の間に印刷配線部が配置されたことを特徴とする車両用配線構造。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015231572A JP6530699B2 (ja) | 2015-11-27 | 2015-11-27 | 車両用パネル及び車両用配線構造 |
US15/355,149 US10017133B2 (en) | 2015-11-27 | 2016-11-18 | Vehicular panel and wiring structure for vehicle |
DE102016223284.3A DE102016223284A1 (de) | 2015-11-27 | 2016-11-24 | Fahrzeug-panel und verdrahtungsstruktur für fahrzeug |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015231572A JP6530699B2 (ja) | 2015-11-27 | 2015-11-27 | 車両用パネル及び車両用配線構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017095033A true JP2017095033A (ja) | 2017-06-01 |
JP6530699B2 JP6530699B2 (ja) | 2019-06-12 |
Family
ID=58693366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015231572A Expired - Fee Related JP6530699B2 (ja) | 2015-11-27 | 2015-11-27 | 車両用パネル及び車両用配線構造 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10017133B2 (ja) |
JP (1) | JP6530699B2 (ja) |
DE (1) | DE102016223284A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019018689A (ja) * | 2017-07-14 | 2019-02-07 | 株式会社イノアックコーポレーション | 車両用パネルの製造方法および車両用パネル |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9783130B2 (en) | 2015-12-01 | 2017-10-10 | Delphi Technologies, Inc. | Interior trim components with integrated electrical wiring |
WO2020123308A1 (en) | 2018-12-14 | 2020-06-18 | Yazaki Corporation | Additive manufacturing techniques for producing a network of conductive pathways on a substrate |
DE102020109335A1 (de) | 2020-04-03 | 2021-10-07 | Bayerische Motoren Werke Aktiengesellschaft | Formteil mit elektrischer Kontaktierung |
DE102020114548A1 (de) | 2020-05-29 | 2021-12-02 | Yazaki Systems Technologies Gmbh | Verfahren zur Herstellung eines elektrischen Verteilersystems und elektrisches Verteilersystem |
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JPS56154316A (en) * | 1980-05-01 | 1981-11-28 | Nissan Motor Co Ltd | Car door |
JPH02158191A (ja) * | 1988-12-12 | 1990-06-18 | Furukawa Electric Co Ltd:The | 部品実装回路基板の製造方法 |
JPH07221411A (ja) * | 1994-02-08 | 1995-08-18 | Toyota Autom Loom Works Ltd | プリント配線基板及びその製造方法 |
JP2002019544A (ja) * | 2000-07-10 | 2002-01-23 | Sumitomo Wiring Syst Ltd | 回路を備えた車体内板 |
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JPS6346945A (ja) * | 1986-08-14 | 1988-02-27 | Yazaki Corp | 自動車用ワイヤ−ハ−ネス装置 |
US4707394A (en) * | 1986-09-19 | 1987-11-17 | Firan Corporation | Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby |
JPH0654607B2 (ja) | 1987-09-08 | 1994-07-20 | 矢崎総業株式会社 | インストルメントパネル用ワイヤーハーネス装置 |
US5805402A (en) * | 1993-06-09 | 1998-09-08 | Ut Automotive Dearborn, Inc. | Integrated interior trim and electrical assembly for an automotive vehicle |
FR2708170B1 (fr) * | 1993-07-19 | 1995-09-08 | Innovation Dev Cie Gle | Circuits électroniques à très haute conductibilité et de grande finesse, leurs procédés de fabrication, et dispositifs les comprenant. |
US5936818A (en) * | 1995-12-08 | 1999-08-10 | Ut Automotive Dearborn, Inc. | Interior trim panel and electrical harness apparatus for an automotive vehicle |
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US6106303A (en) * | 1998-05-27 | 2000-08-22 | Lear Automotive Dearborn, Inc. | Trim panel having grooves with integrally formed electrical circuits |
US6640434B1 (en) * | 2000-04-11 | 2003-11-04 | Lear Corporation | Method of forming an electrical circuit on a substrate |
DE10238020A1 (de) * | 2001-08-23 | 2004-03-04 | Brose Fahrzeugteile Gmbh & Co. Kommanditgesellschaft, Coburg | Kraftfahrzeug-Baugruppe |
US20080265613A1 (en) * | 2007-04-26 | 2008-10-30 | Excello Engineered Systems, Llc | Circuit-carrying water deflector and method for making the same |
US9241415B2 (en) * | 2013-05-10 | 2016-01-19 | GM Global Technology Operations LLC | Flexible electrical circuit assembly for a motor vehicle |
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2015
- 2015-11-27 JP JP2015231572A patent/JP6530699B2/ja not_active Expired - Fee Related
-
2016
- 2016-11-18 US US15/355,149 patent/US10017133B2/en not_active Expired - Fee Related
- 2016-11-24 DE DE102016223284.3A patent/DE102016223284A1/de not_active Withdrawn
Patent Citations (5)
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JP2002019544A (ja) * | 2000-07-10 | 2002-01-23 | Sumitomo Wiring Syst Ltd | 回路を備えた車体内板 |
JP2003204140A (ja) * | 2002-01-10 | 2003-07-18 | Sony Corp | 配線基板の製造方法、多層配線基板の製造方法および多層配線基板 |
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JP2019018689A (ja) * | 2017-07-14 | 2019-02-07 | 株式会社イノアックコーポレーション | 車両用パネルの製造方法および車両用パネル |
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US10017133B2 (en) | 2018-07-10 |
US20170151916A1 (en) | 2017-06-01 |
DE102016223284A1 (de) | 2017-06-01 |
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