JP2017092477A5 - - Google Patents

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Publication number
JP2017092477A5
JP2017092477A5 JP2016220737A JP2016220737A JP2017092477A5 JP 2017092477 A5 JP2017092477 A5 JP 2017092477A5 JP 2016220737 A JP2016220737 A JP 2016220737A JP 2016220737 A JP2016220737 A JP 2016220737A JP 2017092477 A5 JP2017092477 A5 JP 2017092477A5
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JP
Japan
Prior art keywords
layer
light emitting
emitting device
solder pad
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2016220737A
Other languages
English (en)
Japanese (ja)
Other versions
JP6890952B2 (ja
JP2017092477A (ja
Filing date
Publication date
Priority claimed from TW104137443A external-priority patent/TWI772253B/zh
Priority claimed from TW105120263A external-priority patent/TWI692115B/zh
Application filed filed Critical
Publication of JP2017092477A publication Critical patent/JP2017092477A/ja
Publication of JP2017092477A5 publication Critical patent/JP2017092477A5/ja
Priority to JP2021088068A priority Critical patent/JP7482081B2/ja
Application granted granted Critical
Publication of JP6890952B2 publication Critical patent/JP6890952B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2016220737A 2015-11-13 2016-11-11 発光デバイス Active JP6890952B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021088068A JP7482081B2 (ja) 2015-11-13 2021-05-26 発光デバイス

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
TW104137443A TWI772253B (zh) 2015-11-13 2015-11-13 發光元件
TW104137443 2015-11-13
TW105120263 2016-06-28
TW105120263A TWI692115B (zh) 2016-06-28 2016-06-28 發光元件

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021088068A Division JP7482081B2 (ja) 2015-11-13 2021-05-26 発光デバイス

Publications (3)

Publication Number Publication Date
JP2017092477A JP2017092477A (ja) 2017-05-25
JP2017092477A5 true JP2017092477A5 (fi) 2019-12-19
JP6890952B2 JP6890952B2 (ja) 2021-06-18

Family

ID=58768402

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2016220737A Active JP6890952B2 (ja) 2015-11-13 2016-11-11 発光デバイス
JP2021088068A Active JP7482081B2 (ja) 2015-11-13 2021-05-26 発光デバイス
JP2023077053A Pending JP2023099191A (ja) 2015-11-13 2023-05-09 発光デバイス

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2021088068A Active JP7482081B2 (ja) 2015-11-13 2021-05-26 発光デバイス
JP2023077053A Pending JP2023099191A (ja) 2015-11-13 2023-05-09 発光デバイス

Country Status (2)

Country Link
JP (3) JP6890952B2 (fi)
KR (5) KR102295014B1 (fi)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11024770B2 (en) * 2017-09-25 2021-06-01 Nichia Corporation Light emitting element and light emitting device
JP6638748B2 (ja) * 2017-09-25 2020-01-29 日亜化学工業株式会社 発光素子及び発光装置
EP3528296B1 (en) 2018-02-16 2020-06-03 Nichia Corporation Light emitting element and light emitting device
JP6635206B1 (ja) * 2018-02-16 2020-01-22 日亜化学工業株式会社 発光素子および発光装置
JP6773104B2 (ja) * 2018-02-28 2020-10-21 日亜化学工業株式会社 発光素子及び発光装置
JP7054430B2 (ja) * 2018-04-26 2022-04-14 日亜化学工業株式会社 発光素子
JP6844606B2 (ja) * 2018-12-28 2021-03-17 日亜化学工業株式会社 発光素子及びその製造方法ならびに発光装置
JP7312056B2 (ja) * 2019-01-07 2023-07-20 日機装株式会社 半導体発光素子および半導体発光素子の製造方法
CN113363366B (zh) * 2020-03-06 2024-04-19 隆达电子股份有限公司 发光元件
JP2023130977A (ja) 2022-03-08 2023-09-21 スタンレー電気株式会社 半導体発光素子、半導体発光装置及び半導体発光装置モジュール
JP7513924B2 (ja) 2022-04-28 2024-07-10 日亜化学工業株式会社 半導体発光素子
CN115000270B (zh) * 2022-06-16 2023-12-01 惠州华星光电显示有限公司 光源模组及显示装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007173465A (ja) 2005-12-21 2007-07-05 Rohm Co Ltd 窒化物半導体発光素子の製造方法
JP2009238931A (ja) * 2008-03-26 2009-10-15 Panasonic Electric Works Co Ltd 半導体発光素子およびそれを用いる照明装置ならびに半導体発光素子の製造方法
JP2009259904A (ja) 2008-04-14 2009-11-05 Sharp Corp 窒化物系化合物半導体発光素子
JP2011119491A (ja) * 2009-12-04 2011-06-16 Showa Denko Kk 半導体発光素子、電子機器および発光装置
JP5869961B2 (ja) * 2012-05-28 2016-02-24 株式会社東芝 半導体発光装置
JP6041341B2 (ja) * 2012-07-19 2016-12-07 ローム株式会社 発光素子、発光素子ユニットおよび発光素子パッケージ
JP5915504B2 (ja) * 2012-11-06 2016-05-11 日亜化学工業株式会社 半導体発光素子
KR101967837B1 (ko) 2013-03-11 2019-04-10 삼성전자주식회사 반도체 발광 소자
JP6094345B2 (ja) * 2013-04-11 2017-03-15 日亜化学工業株式会社 発光素子及びそれを用いた発光装置
KR102086365B1 (ko) * 2013-04-19 2020-03-09 삼성전자주식회사 반도체 발광소자
JP6221926B2 (ja) 2013-05-17 2017-11-01 日亜化学工業株式会社 半導体発光素子およびその製造方法
KR102100936B1 (ko) * 2013-07-10 2020-04-16 서울바이오시스 주식회사 정전방전 보호 기능을 갖는 발광 다이오드 칩
KR102223038B1 (ko) * 2013-12-17 2021-03-08 삼성전자주식회사 반도체 발광소자 및 이를 구비한 반도체 발광장치
US9196812B2 (en) * 2013-12-17 2015-11-24 Samsung Electronics Co., Ltd. Semiconductor light emitting device and semiconductor light emitting apparatus having the same
KR20150014353A (ko) * 2014-03-31 2015-02-06 서울바이오시스 주식회사 발광 다이오드
CN204315621U (zh) * 2014-12-30 2015-05-06 广州市鸿利光电股份有限公司 一种led倒装晶片

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