JP2017087648A - Mold die, mold device, and production support system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique where information regarding a mold die is made incidental so as to be recorded.SOLUTION: Provided is a mold die (50) where a workpiece (W) is held and is molded. This mold die (50) includes chases (64U,64L) having mold faces (52a, 54a), and has a pair of opened/closed dies (52, 54). Further, the mold die (50) has RFID tags (66U, 66L) recorded with information corresponding to the chases (64U, 64L).SELECTED DRAWING: Figure 6

Description

  The present invention relates to a technique effectively applied to a mold, a molding apparatus, and a production support system.

  Japanese Laid-Open Patent Publication No. 6-169042 (referred to as Patent Document 1) has a description of application to a transfer mold apparatus as an assembling apparatus (particularly, refer to claim 9, paragraphs [0009] and [0016]). This assembling apparatus includes an assembling part (die) having data storage means, and an apparatus main body (base) having data reading means and data control means. In this built-in device, an ID (Identifier) tag as data storage means is embedded in a built-in component, and an ID antenna as data reading means is embedded in the device main body.

JP-A-6-169042

  Usually, in a molding apparatus such as a transfer mold, the mold is heated. In such a case, the embedded device described in Patent Document 1 may not be able to read data due to heat. Note that Patent Document 1 neither describes nor suggests countermeasures against heat to the data reading means or the like.

  In addition, when the ID code which is ID information is attached to the mold as a seal, the mold mold becomes hot, and the ID code may be peeled off or discolored. Further, even if the ID code is provided by engraving the mold, the ID code may be difficult to read due to discoloration of the surface of the mold due to heating or adhesion of the mold resin.

  An object of the present invention is to provide a technique for recording information about a mold by attaching it to the mold. The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  A mold according to one solution of the present invention is a mold that sandwiches and molds a workpiece, includes a first mold block having a mold surface, and a pair of molds that are opened and closed, An RFID (radio frequency identifier) tag in which information corresponding to one mold block is recorded is provided. According to this, the information regarding the first mold block of the mold can be attached to the mold and recorded.

  Further, in the mold according to the one solution, the pair of molds further includes a second mold block, and the second mold block is configured to be able to store the first mold block. In addition, it is more preferable to provide a built-in heater. According to this, the first mold block is also heated through the second mold block.

  Further, in the mold according to the one solution, the first mold block has a pressure surface that is pressurized in a closed state, and the RFID tag is provided except for the pressure surface. Is more preferable. According to this, it is possible to prevent the RFID tag itself from being pressed in a state where the mold is closed.

  In the mold according to the one solution, it is more preferable that an information holding temperature of the RFID tag is equal to or higher than a temperature at which the RFID tag is heated by the heater. According to this, it is possible to keep the recorded information.

  In the mold according to the one solution, it is more preferable that a heat insulating material is further provided, and the RFID tag is provided on the pair of metal molds via the heat insulating material. According to this, the RFID tag can be protected against heat.

  According to another aspect of the present invention, there is provided a mold apparatus comprising: the mold according to the one means; and a communication device that is provided outside the mold and communicates with the RFID tag. To do. According to this, it is possible to prevent the communication device from being exposed to a high temperature like the inside of the mold, and read information recorded on the RFID tag or write information to the RFID tag. .

  The molding apparatus according to the one solution may further include a press unit that accommodates the mold, and the communication may be performed near a transfer path in which the first mold block to be attached and detached is moved in the press unit. More preferably, an apparatus is provided. According to this, information can be read from and written to the RFID tag when the first mold block is attached or detached.

  In the molding apparatus according to the one solving means, it is more preferable that the molding apparatus further includes a transport mechanism that transports the workpiece to the mold, and the communication device is provided in the transport mechanism. Accordingly, information can be read from and written to the RFID tag when the transport mechanism enters and exits the mold.

  The mold according to the one solution may further include a detection unit that detects a state of the mold as a detection value, and the detection value detected by the detection unit to the RFID tag via the communication device. It is more preferable that the detection unit and the communication device are connected so that is transmitted. According to this, the usage history information of the mold can be recorded / held on the RFID tag.

  A production support system according to one solution of the present invention is a production support system for providing the first mold block of the molding apparatus according to the one solution and supporting production on the workpiece, wherein the control A storage unit that stores life information of the first mold block, and a communication unit that communicates with a system of the workpiece producer, and the communication unit is assigned to the first mold block. ID information is received as operation information from the system of the producer of the workpiece, the control unit diagnoses the life of the first mold block based on the received operation information and the life information, and the control unit When there is the first mold block that is approaching the end of its life, a process for recommending replacement of the first mold block to the work producer system using the communication unit is performed, or And executes the preparation process of the first mold block changeover. According to this, the 1st metal mold block required for production can be provided in a timely manner, and the operating rate of the apparatus in production can be improved.

  A molding apparatus according to another solution of the present invention is a molding apparatus including a unit to be heated, and is heated and cooled repeatedly by being conveyed so as to be in contact with and separated from the unit, and the mold apparatus can be replaced. And a communication device that communicates with an RFID tag attached to the device component. According to this, replacement of apparatus parts can be performed appropriately.

  A production support system according to another solution of the present invention is a production support system for providing a mold part or an apparatus part for use in semiconductor production to support semiconductor production, the control unit, A storage unit that stores life information of the mold part or the device part, and a communication unit that communicates with a system of a semiconductor producer; the communication unit is an ID assigned to the mold part or the device part Information is received as operation information from the system of the semiconductor producer, and the control unit diagnoses the life of the mold part or the device part based on the received operation information and the life information, and the control unit When there is the mold part or the apparatus part that is approaching the end of its life, a process for recommending replacement of the apparatus part to the system of the mold part or the semiconductor producer using the communication unit is executed. Or, and executes the preparation process of the mold part or the parts of the device replacement. According to this, it is possible to provide mold parts or apparatus parts necessary for production in a semiconductor factory in a timely manner, and improve the operation rate of the apparatus in production.

  Of the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows. According to one solution of the present invention, information about a mold can be recorded by being attached to the mold.

It is a schematic block diagram of the molding apparatus which concerns on Embodiment 1 of this invention. It is a schematic system block diagram of the molding apparatus shown in FIG. It is typical sectional drawing of the principal part of the molding apparatus shown in FIG. FIG. 4 is a schematic cross-sectional view of the main part of the molding apparatus in the process following FIG. 3. It is a typical sectional view of the important section of a mold device in the process following FIG. FIG. 6 is a schematic cross-sectional view of the main part of the molding apparatus in the process following FIG. 5. It is typical sectional drawing of the principal part of the molding apparatus which concerns on Embodiment 2 of this invention. It is typical sectional drawing of the principal part of the molding apparatus which concerns on Embodiment 3 of this invention. It is typical sectional drawing of the principal part of the molding apparatus in the process following FIG. It is typical sectional drawing of the principal part of the molding apparatus which concerns on Embodiment 4 of this invention. It is a system block diagram of the control part and memory | storage part of this invention. It is a block diagram of a production system or the like including the molding apparatus of the present invention.

  In the following embodiments of the present invention, the description will be divided into a plurality of sections when necessary. However, in principle, they are not irrelevant to each other, and one of them is related to some or all of the other modifications, details, etc. It is in. For this reason, the same code | symbol is attached | subjected to the member which has the same function in all the figures, and the repeated description is abbreviate | omitted. In addition, the number of components (including the number, numerical value, quantity, range, etc.) is limited to that specific number unless otherwise specified or in principle limited to a specific number in principle. It may be more than a specific number or less. In addition, when referring to the shape of a component, etc., it shall include substantially the same or similar to the shape, etc., unless explicitly stated or in principle otherwise considered otherwise .

(Embodiment 1)
A molding apparatus 10 (also referred to as a resin molding apparatus) according to Embodiment 1 of the present invention will be described with reference to FIGS. FIG. 1 is a schematic configuration diagram of a molding apparatus 10 and shows an arrangement of each mechanism unit in a top view. FIG. 2 is a schematic system block diagram of the molding apparatus 10. 3-6 is typical sectional drawing of the principal part of the molding apparatus 10 in an assembly | attachment process, and respond | corresponds to the AA line of FIG.

  As shown in FIG. 1, the molding apparatus 10 is mainly disposed on the apparatus back side, the supply section 12 disposed on the apparatus front side, the plurality of (two places) press sections 14, and the storage section 16. A transport unit 20. The supply unit 12 accommodates a workpiece W (molded product) and resin supplied to the press unit 14. The press unit 14 includes a mold die 50 (also referred to as a resin mold), and performs resin molding (also referred to as resin molding) on the workpiece W sandwiched between the mold dies 50. In the molding apparatus 10 shown in FIG. 1, a plurality of (two) press portions 14 are provided, but only one press portion 14 may be provided. The storage unit 16 stores the workpiece W (molded product P) after molding. And the conveyance part 20 is equipped with the loader hand 22 (conveyance mechanism) and the rail 24 straddling each mechanism part, moves the loader hand 22 on the rail 24, and supplies the supply part 12, the press part 14, and the accommodating part 16 in order. The work W is conveyed. In the present embodiment, the molding apparatus 10 is applied to transfer molding in which a resin is extruded from a pot by a plunger and injected into and filled in a cavity in the molding die 50 of the press unit 14. Not limited to this, the molding apparatus 10 may be applied to compression molding in which the resin in the cavity is compressed by opening and closing the mold 50.

  The mold die 50 (see FIG. 6) of the press unit 14 includes a pair of molds (for example, one in which a plurality of mold blocks made of alloy tool steel are assembled) having a cavity. In the present embodiment, of the pair of molds, one mold on the upper side in the vertical direction is the upper mold 52, and the other mold on the lower side is the lower mold 54. The mold 50 is opened and closed when the upper mold 52 and the lower mold 54 are separated or approached. For this reason, the vertical direction is also the mold opening / closing direction. In the following description, the entire mold die 50, either the upper die 52 or the lower die 54, or individual die blocks (chase, base, plunger, etc.) constituting them are exchanged. The target is called “mold part”.

  In the present embodiment, the press unit 14 accommodates the mold 50, and includes a known mold opening / closing mechanism 56 (press mechanism) that opens and closes the mold 50. For example, the mold opening / closing mechanism 56 includes a pair of platens 58 and 60, a plurality of tie bars 62, a drive source (for example, an electric motor), and a drive transmission mechanism (for example, a toggle link). The pair of platens includes a fixed platen 58 and a movable platen 60. The plurality of tie bars 62 are provided through the fixed platen 58 and the movable platen 60. Here, the fixed platen 58 is fixed to the plurality of tie bars 62. The movable platen 60 is movably provided on the plurality of tie bars 62 and is moved (lifted / lowered) by a drive source and a drive transmission mechanism.

  In the mold opening / closing mechanism 56, the mold die 50 is provided between the pair of platens 58 and 60. In the present embodiment, the upper mold 52 that is a fixed mold is assembled to the fixed platen 58, and the lower mold 54 that is a movable mold is assembled to the movable platen 60. In the mold opening and closing of the mold 50, the upper mold 52 may be a movable mold, the lower mold 54 may be a fixed mold, or both the upper mold 52 and the lower mold 54 may be movable.

  Incidentally, the upper mold 52 includes a chase 64U (mold block) having a mold surface 52a (for example, a surface on which a cavity is provided and is also referred to as a parting surface). The upper mold 52 includes an RFID tag 66U on which information corresponding to the chase 64U is recorded. The RFID tag 66U includes a chip 100 in which a function such as a controller IC (integrated circuit) or a memory IC is incorporated, and an antenna 102 electrically connected to the chip 100, and is sealed with a resin. (See FIG. 2). By providing the RFID tag 66U, information regarding the chase 64U of the mold 50 can be attached to the mold 50 and recorded / held. Further, the chase 64U can be identified from the ID information recorded / held in the memory IC of the RFID tag 66U regardless of the surface of the chase 64U. The RFID tag 66U is preferably attached to the mold block via a non-metallic heat insulating material. This is because the RFID tag 66U is held away from the metal mold block, thereby suppressing radio wave absorption by the metal surface and improving the communication distance. In addition, since the RFID tag 66U is attached to a mold block that is heated via a heat insulating material, it is possible to prevent the RFID tag 66U from being degraded by delaying heating.

  The RFID tag 66U is provided except for the pressing surface of the chase 64U. In FIG. 6, the pressing surface of the chase 64U is the upper and lower surfaces that are pressed in a state where the mold is closed, and therefore the RFID tag 66U is provided on the other side surface (the side surface on the front side of the apparatus in FIG. 6). According to this, it is possible to prevent the RFID tag 66 </ b> U itself from being pressurized and damaged in the closed state.

  The RFID tag 66U is preferably detachably attached to the chase 64U using a fastener (not shown) such as a bolt. According to this, the RFID tag 66U can be attached before the chase 64U is assembled as the mold 50, and the RFID tag 66U can be removed after assembly (in use). Moreover, it can replace with the volt | bolt as a fastener and can also be set as the structure which can provide a magnet in RFID tag 66U and can be easily attached and detached to metal metal mold parts (chase 64U). For the above-described reason, it is preferable to interpose another member between the RFID tag 66U and the magnet. In this case, a resin material such as engineering plastic that is a non-metallic member and can withstand high temperatures, fiber reinforced plastic, and the like are preferable. Further, it is preferable that the RFID tag 66U is detachably provided using a fastener in that the RFID tag 66U can be arbitrarily replaced.

  The upper mold 52 includes a chase 64U and a base 68U (mold block). The base 68U has, for example, a rectangular bowl shape (box shape) that opens on the lower surface side, and is configured to accommodate the chase 64U. Here, the base 68U is configured such that the outer periphery thereof is thermally insulated, and includes a plurality of end blocks surrounding the chase 64U. If the chase 64U is rectangular in plan view (mold surface view), the plurality of end blocks are composed of four mold blocks that surround the four sides. Of these, the front end block 70U is the front side of the apparatus. For example, in the state where the other three end blocks except the front of the apparatus are assembled, the chase 64U is inserted and assembled from the front side of the apparatus, and then the front end block 70U is assembled, whereby the chase 64U is stored in the base 68U. be able to. When the RFID tag 66U protrudes from the side surface of the chase 64U, a relief portion (concave portion) is provided in the front end block 70U.

  The base 68U includes a built-in heater 72U. The upper mold 52 such as the chase 64U is adjusted to a predetermined temperature (for example, 180 ° C.) and heated by the heater 72U. As described above, since the base 68U accommodates the chase 64U, the chase 64U is sufficiently heated even if it is configured to be detachable (replaceable) with respect to the base 68U. Further, by providing the RFID tag 66U in the chase 64U, for example, even if the chase 64U is removed and stored, the ID information of the chase 64U can always be attached and recorded.

  Here, as the RFID tag 66U, a temperature that can hold information at a temperature equal to or higher than the temperature at which the RFID tag 66U is heated by the heater 72U (information holding temperature) can be used. Thereby, even if the mold 50 is heated by performing the molding operation with the RFID tag 66U attached to the chase 64U, the information recorded in the RFID tag 66U can be kept. Further, the mold die 50 includes a heat insulating material (not shown), and the RFID tag 66U is provided on the mold die 50 through the heat insulating material, whereby the RFID tag 66U can be protected from heat.

  In addition, the RFID tag 66U can be removed before the chase 64U is stored in the base 68U by attaching the RFID tag 66U to the chase 64U with a fastener. In this case, the RFID tag 66U may be temporarily attached to the thermally insulated surface of the outer periphery of the mold die 50. Thereby, it is possible to prevent the RFID tag 66U from being heated in the mold 50. When the chase 64U is removed from the base 68U, the RFID tag 66U that has been attached to the outer peripheral surface of the mold 50 can be reattached to the chase 64U. According to this, even if the heat-resistant temperature of the RFID tag 66U is lower than the temperature in the mold, the information associated with the chase 64U can be retained. In this case, since the information is not accommodated in the mold, information on the RFID tag 66U can be read and written.

  By the way, the molding apparatus 10 includes an antenna 74U and a reader / writer 76U (see FIG. 2) as a communication device that communicates with the RFID tag 66U. The reader / writer 76U reads / writes from / to the RFID tag 66U via the antenna 74U. This communication device is provided outside the mold 50. For this reason, it is possible to prevent the communication device from being exposed to a high temperature such as the inside of the mold 50. Note that these may be used as a communication device integrally including the antenna 74U and the reader / writer 76U.

  In the present embodiment, the antenna 74U of the communication device is provided in the vicinity of the transfer path along which the detachable chase 64U is moved within the press unit 14. Specifically, the antenna 74U can be appropriately provided on the side or above the transfer path of the chase 64U. For example, it is provided near the tie bar 62 on the front side of the apparatus in the transfer path of the chase 64U. For this reason, when the chase 64U is attached / detached, information recorded on the RFID tag 66U can be read, or information on the mold die 50, for example, can be written on the RFID tag 66U. Therefore, a separate operation for reading / writing information from / to the RFID tag 66U is not required, and reading / writing of information from / to the RFID tag 66U is performed efficiently and reliably.

  Here, the transfer route of the chase 64U in the process of assembling the chase 64U will be described. The chase 64U is moved along a transfer path (transfer direction) where the front side of the apparatus is one side and the back side of the apparatus is the other side (see FIGS. 3 to 6). To attach (accommodate) the chase 64U to the base 68U, first, as shown in FIG. 3, the chase 64U is arranged on the front side (left side in the drawing) of the molding apparatus 10. The chase 64U is preferably on the same horizontal plane as the base 68U, and may be in the vicinity of the transfer path.

  Subsequently, as shown in FIG. 4, the chase 64 </ b> U is inserted (entered) into the mold 50. Specifically, the chase 64U is moved while the chase 64U is in contact with the inner surface of the base 68U. At this time, since the antenna 74U is provided in the vicinity of the tie bar 62 on the front side of the apparatus near the transfer path, when the chase 64U is inserted, the RFID tag 66U is read / written by the reader / writer 76U when passing in front of the antenna 74U. The For this reason, the RFID tag 66U is provided on the side surface of the chase 64U on the front side of the apparatus. Here, as the installation location of the RFID tag 66U, the back side of the apparatus is preferable in addition to the front side of the apparatus of the chase 64U where the mold surfaces are not rubbed together. Furthermore, the installation location of the RFID tag 66U may be on the device side of the chase 64U.

  Subsequently, as shown in FIG. 5, the chase 64U is assembled to the base 68U. Subsequently, as shown in FIG. 6, the mold setting is completed by closing the chase 64U with the front end block 70U. In this way, the chase 64U is moved along the transfer path (transfer direction) with the front side of the apparatus as one side and the back side of the apparatus as the other side. The chase 64U can be removed from the base 68U by reversing the order of these steps. Further, in the process of attaching and removing the chase 64U, the RFID tag 66U can be removed and temporarily attached outside the mold.

  The RFID tag 66U provided on the chase 64U of the upper die 52 has been described so far, but the same applies to the RFID tag 66L provided on the chase 64L of the lower die 54. Specifically, the lower mold 54 includes a chase 64L (mold block) having a mold surface 54a, an RFID tag 66L in which information corresponding to the chase 64L is recorded, and further includes a front end block 70L. A base 68L (mold block) is provided. The RFID tag 66L is provided except for the pressing surface of the chase 64L. The base 68L is configured to accommodate the chase 64L and includes a built-in heater 72L. The molding apparatus 10 includes a communication device having an antenna 74L and a reader / writer 76L provided on the tie bar 62 on the front side of the device in the transfer path of the chase 64L. As a result, information regarding the mold 50 can be attached to the chase 64L of the lower mold 54 and recorded.

  By the way, the molding apparatus 10 includes a control system as shown in FIG. Specifically, the molding apparatus 10 includes a control unit 80, a storage unit 82, a display unit 84, and an input unit 87. The control unit 80 is communicably connected to the reader / writers 76U and 76L, the storage unit 82, and the display unit 84. Hereinafter, the control system of the molding apparatus 10 will be described in association with the RFID tag 66U provided in the upper mold 52. Since the RFID tag 66L provided in the lower mold 54 is the same as the RFID tag 66U, description thereof is omitted. In the following description, when the RFID tag 66U provided in the upper mold 52 and the RFID tag 66L provided in the lower mold 54 are not distinguished, they are simply referred to as “RFID tag 66”.

  For example, when the control unit 80 inserts the chase 64U into the mold 50, ID information and other information related to the chase 64U of the mold 50 recorded in the RFID tag 66U approaching the antenna 74U. The reader / writer 76U is controlled so that the reader / writer 76U reads (the number of moldings and the like) via the antenna 74U. Then, the control unit 80 can read the corresponding information from the storage unit 82 based on the information, and store the information recorded in the RFID tag 66U in the storage unit 82. In addition, the control unit 80 notifies the operator of the molding apparatus 10 by displaying the information on the display unit 84. Thereby, for example, it is possible to display on the display unit 84 whether the combination of the mold blocks constituting the mold 50 (for example, the combination of the chase 64U and the base 68U) is appropriate, and the operator can display this. By checking, it is possible to prevent mold setting errors without depending on visual inspection of the mold label. Therefore, it is possible to prevent the production of a defective product (molded product P) due to a set mistake.

  In addition, whether or not the combination of the members constituting the mold 50 is appropriate can be confirmed regardless of the above-described combination, such as whether the combination of the chase 64U and the chase 64L is appropriate. The above-described effects (for example, prevention of set mistakes) can be more reliably achieved by providing the RFID tag 66U provided on the chase 64U of the upper die 52 and the RFID tag 66L provided on the chase 64L of the lower die 54. Can be played. However, since the upper mold 52 and the lower mold 54 are basically handled integrally, the RFID tag 66 may be provided in only one of the molds.

  On the other hand, for example, when the chase 64U is removed from the inside of the mold 50 (base 68U), the control unit 80 reads ID information related to the chase 64U of the mold 50 recorded in the RFID tag 66U, The reader / writer 76U is controlled so as to write the information. That is, the control unit 80 can read the corresponding information from the storage unit 82 and store it in the RFID tag 66U. According to this, the information can be updated by causing the RFID tag 66U to record the latest information when the mold 50 is removed. For example, the number of moldings recorded in the RFID tag 66U when the chase 64U is removed may be updated. Specifically, the latest molding frequency is read from the storage unit 82 and stored in the RFID tag 66U, whereby the RFID tag 66U of the chase 64U can hold the latest molding frequency. As a result, the number of moldings performed using the mold part that is the chase 64U can be accurately recorded and used for prediction or the like as described later.

  Examples of the storage unit 82 include a memory device and a disk device, in which a control program for controlling the device and various types of information are recorded. The storage unit 82 records various types of information described later in association with various types of recording methods such as various database formats such as a relational database format and file format. For example, as illustrated in FIG. 11, in the storage unit 82, ID information or the like is recorded as individual information 822 in an arbitrary number of drives 821 in a plurality of data file formats or table formats. Therefore, the storage unit 82 records ID information attached to the RFID tag 66 and mold related information related to a molding process using a mold part corresponding to the ID information. These pieces of information are stored so as to be able to be referred to in cooperation with a file name, a label, an index, or the like. For this reason, when referring to the mold related information from the storage unit 82 based on each ID information, information related to mold parts, which will be described later, is read from the storage unit 82 as the corresponding one or more mold related information.

  As ID information, a character string of a plurality of lines uniquely set corresponding to each RFID tag 66 can be used. However, it is also possible to hold the mold related information itself as shown below or ID information including them.

  On the other hand, as mold-related information, for example, information related to mold parts corresponding to ID information attached to the RFID tag 66 is recorded. Examples of the information on the mold part include manufacturing information of the mold part, recipe information indicating a recipe of a molding process performed using the mold part, usage history information of the mold part, and the like. Further, as the mold related information, not only information unique to each individual mold part but also information related to other mold forming processes is recorded. Specifically, as information regarding the molding apparatus, apparatus information regarding the operation status of the molding apparatus 10, material used for molding in the molding apparatus 10 and material information regarding the workpiece W, and a molded product P molded by the molding apparatus 10 Information on the molded product, information based on the output from each unit constituting the apparatus (such as input from the input unit 87), and information on an operator who operates the molding apparatus 10 are included. Further, in the storage unit 82, various types of information associated with the molded product P other than these are appropriately recorded.

  As a configuration example shown in the present embodiment, for example, information on the chase 64U that is linked to the ID information of the RFID tag 66U and recorded / held in the storage unit 82 includes corresponding recipe information used in the molding apparatus 10, use History information (usage time, replacement / repair history), manufacturing information (company name, manufacturing date, manufacturing number information, drawing information, mold dimensions, mold material, plating conditions), and the like. In this case, the control unit 80 reads (receives) the ID information recorded / held on the RFID tag 66U to the reader / writer 76U via the antenna 74U, and records the above-described information associated with the ID information. By reading from the storage unit 82, it can be used for control in the molding apparatus 10 and other analysis processes. Note that, as described above, such information may be recorded in the memory IC of the RFID tag 66 and directly read out.

  On the other hand, the RFID tag 66 may be configured to hold not only ID information but also various information recorded in the storage unit 82. In this way, by recording various types of information on the mold parts in both the storage unit 82 on the mold apparatus 10 side and the memory IC of the RFID tag 66 attached to the mold parts, the mold parts can be exchanged more. The information associated with the mold parts can be reliably left and used while being efficiently performed. As an example, it is preferable to record the above-described mold manufacturing information in the memory IC of the RFID tag 66. According to this, the manufacturing company name, date of manufacture, manufacturing number information, drawing information, mold dimensions, mold material, plating conditions, etc. can be read out as manufacturing information of the mold, allowing easy maintenance. It becomes.

  The molding apparatus 10 further includes a detection unit 86 that detects a state relating to the mold 50 and other states (for example, operation information) in the molding apparatus 10 as detection values. The molding apparatus 10 further includes an input unit 87 that receives an operation from an operator or inputs a predetermined numerical value or character string. The control unit 80 is a detection value of analog data or digital data output as it is detected and input by the detection unit 86, the input unit 87, or the like, a predetermined physical quantity calculated by calculation based on the detection value, or the like. Is calculated in the storage unit 82. Further, the control unit 80 communicates with and records in the memory IC of the RFID tag 66 via a communication device (reader / writers 76U and 76L) as necessary.

  Examples of the detection unit 86 include a timer for measuring an arbitrary time and time in the apparatus, a thermometer for measuring the temperature of the mold 50 and the temperature in the molding apparatus 10, a press as the number of moldings, and a known transfer unit ( A shot counter that counts the number of times of opening / closing (elevating) (not shown) as the number of shots, or a pressure that measures the pressure at any position (in the cavity, press tie bar, plunger surface) inside the molding apparatus 10 or the mold 50 Totals are listed. In addition, since it can be used as drive information (operation information) of the apparatus by detecting the moving speed of the transport system of the apparatus and the like, the detection state of the power source such as a motor from which these are calculated in the detection unit 86 It is preferable to detect also.

  Specifically, the time required for each molding process (molding process, conveyance, preheating, etc.), the time when the process was performed, and the like are recorded based on the time and time output from the detection unit as a timer. be able to. Further, based on the detection value of the detection unit 86 as a shot counter, it is possible to record the number of times molding has been performed in each press unit, the number of moldings performed using each mold part, and the like. In addition, molding conditions at each molding can be recorded by associating temperature information and pressure information output by a pressure gauge or thermometer with time and the number of moldings.

  Thus, by using information based on the detection value of the detection unit 86, it can be used for management of mold parts including the mold 50 depending on the number of times of molding, the heating state, and the like. Further, by associating the molding conditions with the molded product P and outputting them as product information, traceability is ensured and the molding conditions can be easily corrected.

  Here, when providing the operation information to the production support system 400 (see FIG. 12), which will be described later, even a production supporter who provides the mold 50 or the like from the semiconductor producer who uses the molding apparatus 10. Not all information can be provided. For this reason, it is preferable to determine and store ID information, mold-related information, detection values, and the like as to whether or not the information can be provided to the production supporter. For example, the operating state of the apparatus such as the detection value of the detection unit 86 and the driving state of the power source is diagnosed by excluding those that should be kept secret and should not be provided to the production supporter, such as recipe information and material information. In addition, it is possible to provide only the highly effective information to the production supporter as operation information to the production supporter.

  Furthermore, maintenance of the RFID tag 66 itself can be performed based on information based on the detection value of the detection unit 86. In other words, when the RFID tag 66 itself deteriorates due to heating and reaches the end of its life, the RFID tag 66 can be surely held with ID information or the like by replacing the RFID tag 66 before reaching the end of its life. Can do. That is, for example, when a holding condition that makes it difficult to hold information when the memory of the RFID tag 66 continues to be heated at a predetermined temperature for a predetermined time is known, the RFID tag 66 itself before the holding condition is exceeded. It can also be set as the structure which replaces.

  In this case, information that is to be held in the RFID tag 66 stored in the storage unit 82 and information that is actually held and read by the RFID tag 66 are collated at appropriate timing to verify information loss or the like. It can also be determined whether or not the lifetime has been reached. Thereby, when it is determined that the information to be held in the RFID tag 66 is not held under a predetermined reading condition, the information to be held in the RFID tag 66 stored in the storage unit 82 is read, and a new RFID tag By writing information in 66 and attaching it to the corresponding mold part, the information to be held in the mold part can be reliably held. Further, the ID information recorded in the new RFID tag 66 can be recorded in the storage unit 82 as ID information associated with the mold.

  Further, as another specific utilization form based on the present embodiment, various types of information can be read from the storage unit 82 on the mold apparatus 10 side by recording and holding a history of usage time in the RFID tags 66U and 66L. This information can be used without it. For this reason, for example, maintenance is possible even when information from the molding apparatus 10 cannot be taken out (for example, when it is in the storage position 301 shown in FIG. 12). For this reason, when it is used again, it can be used after estimating and diagnosing the degree of wear of the chase 64U in advance. In addition, if the RFID tag 66U, 66L records and maintains a history of usage time, even if these are not recorded in the storage unit 82, or deleted or lost, they are used after the end of their lifetime. It is also possible to predict the occurrence of a problem and avoid it, or to notify the replacement time. In this case, it is also possible to notify the recommendation of stop of use through the display unit 84 or the like, or to propose repairs such as member replacement, re-plating, and dimension correction. Further, the ID information of the mold part which has reached the time of replacement or the replacement period is transferred via the network to the production supporter 500 (see FIG. 12) which is the mold part manufacturer. Ordering replacement parts can be done easily. Of course, according to the present invention, the same effect can be obtained even when recording in the storage unit 82, except for the case where these uses are particularly limited.

  Furthermore, by recording and holding appropriate ID information in the RFID tag 66, it becomes easy to distinguish between the genuine product of the mold part and the imitation product, and it is possible to prevent the occurrence of troubles due to the use of the imitation product. . In addition, by recording not only ID information but also mold related information in the RFID tag 66, when the mold 50 to which this ID information is linked is distributed to the market as a used product, the degree of previous use can be reduced. Since it can be verified, it can be used appropriately.

(Embodiment 2)
A molding apparatus 10 according to Embodiment 2 of the present invention will be described with reference to FIG. FIG. 7 is a schematic cross-sectional view of the main part of the molding apparatus 10. The present embodiment differs from the first embodiment described above in the installation locations of the RFID tags 66U and 66L. In this way, the RFID tag 66U can be installed at an arbitrary position while considering damage due to pressurization or overheating.

  As shown in FIG. 7, in the upper mold 52, the chase 64U includes a plurality of pillars 88U provided at predetermined positions on the upper surface (a surface facing the inner surface of the base 68U and the inner surface of the mold). The chase 64U is assembled to the base 68U via a plurality of pillars 88U. For this reason, on the upper surface of the chase 64U, a portion in contact with the pillar 88U becomes a pressing surface that is pressed in a state where the mold is closed. On the other hand, the portion not in contact with the pillar 88U is not a pressing surface. Therefore, in this embodiment, the installation location of the RFID tag 66U is the upper surface of the chase 64U between the plurality of pillars 88U. The same applies to the RFID tag 66L provided on the chase 64L of the lower die 54. The installation location of the RFID tag 66L is the lower surface of the chase 64L between the plurality of pillars 88L (the surface facing the inner surface of the base 68L). The inner surface of the mold). According to this, it is possible to prevent the RFID tags 66U and 66L themselves from being pressed in a state in which the mold is closed, and to record information on the chase 64U and 64L, respectively. In this case, communication is facilitated when the antennas 74U and 74L are installed on the surfaces facing the respective surfaces on which the RFID tags 66U and 66L are installed.

(Embodiment 3)
A molding apparatus 10 according to Embodiment 3 of the present invention will be described with reference to FIGS. 8 and 9 are schematic cross-sectional views of the main part of the molding apparatus 10 during the workpiece transfer process. Note that the present embodiment differs from the first embodiment described above in the installation locations of the RFID tags 66U and 66L and the installation location of the antenna 74 of the communication device.

  As shown in FIG. 8, in the upper mold 52, the base 68 </ b> U is recessed deeper than the RFID tag 66 </ b> U from the side surface (the right side surface in the drawing) of the apparatus 68 and the mold surface 52 a of the side end block 90 </ b> U. An RFID tag 66U is provided in each of the recesses. The installation location of these RFID tags 66U does not become a pressurizing surface that is pressed in a closed state depending on the depth of the recess. The same applies to the lower mold 54, and a recess that is deeper than the thickness of the RFID tag 66L from the side surface (the right side surface in the drawing) of the base 68L and the mold surface 54a of the side end block 90L. Each of these is provided with an RFID tag 66L.

  According to this, even if it is a case where it installs in the position corresponding to mold surface 52a, 54a, it can prevent that RFID tags 66U and 66L itself are pressurized in the state where a mold was closed. In addition, information regarding the bases 68U and 68L can be attached and recorded respectively. By recording information unique to the bases 68U and 68L, it can be used in the same manner as the chase 64U and 64L described above. The mold 50 is not configured to arbitrarily exchange the combination of the base and the chase, but when handled integrally, the upper mold 52 and the RFID tags 66U and 66L attached to the outer periphery of the bases 68U and 68L. Information on the lower mold 54 can be recorded respectively.

  Here, in this embodiment, as shown in FIG. 9, the antenna 74 of the communication apparatus corresponding to the RFID tag 66 is provided in the loader hand 22 (conveyance mechanism). According to this, when the loader hand 22 moves in and out of the mold 50, information can be read from and written to the RFID tags 66U and 66L provided on the mold surfaces 52a and 54a and the bases 68U and 68L. it can.

(Embodiment 4)
A molding apparatus 10 according to Embodiment 4 of the present invention will be described with reference to FIG. FIG. 10 is a schematic cross-sectional view of the main part of the molding apparatus 10. Note that the present embodiment is different from the first embodiment described above in the installation location of the RFID tag 66L.

  As shown in FIG. 10, the molding apparatus 10 includes a plurality of pots 92, a plurality of plungers 94, and a plunger base 96. The plurality of pots 92 are provided in the chase 64L (center insert), and communicate with the cavity when the mold is closed. The plurality of plungers 94 are inserted into each of the plurality of pots 92, and the resin set in each pot 92 is pushed out to be injected and filled into the cavities. The plunger base 96 fixes a plurality of plungers 94 and reciprocates (up and down) by a plunger drive mechanism, thereby reciprocating the plurality of plungers 94 all at once.

  In the present embodiment, an RFID tag 66L is provided for each plunger 94 / pot 92 pair. Specifically, the RFID tag 66L is provided at the end of the plunger 94 on the plunger base 96 side (which is cooler than the tip). Further, the antenna 74 of the communication device that communicates with the RFID tag 66L is provided in the vicinity of the position where the plunger 94 is installed. According to this, not only the chase and the base but also the usage history etc. of the die part to be exchanged such as the plunger 94 is recorded, and an efficient operation such as appropriately performing the exchange by using the information as described above is possible. Become. Similarly to the above-described embodiment, the antenna 74 may be provided in the vicinity of the transfer path when the plunger 94 is installed. A plurality of RFID tags 66L may be provided for each of the plurality of plungers 94. Further, an RFID tag can be provided in the pot.

  Although the present invention has been specifically described above based on the embodiments, it is needless to say that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.

  For example, the case where the RFID tag is installed on the side surface of the chase in the first embodiment, between the pillars of the chase in the second embodiment, the end block exposed surface of the chase and the side surface of the base in the third embodiment, and the plunger in the fourth embodiment will be described. did. However, the present invention is not limited to this, and the installation location of the RFID tag may be a mold block that is assembled to form a mold.

  For example, the case where the installation location of the antenna connected to the reader / writer is a tie bar in the first and second embodiments and a loader hand in the third embodiment has been described. Not limited to this, the antenna is installed at a location near the mold block where the RFID tag 66 is installed (preferably a low temperature position avoiding heat from a heater such as a mold as much as possible), and when data is read and written. It is only necessary to be able to communicate with the RFID tag 66 by using a mold block passing position or a handy type outside the molding apparatus.

  For example, as in the third embodiment, an RFID tag can be provided in each mold block (constituent member) constituting the mold. Specifically, not only the confirmation of the mold block to be combined in one mold, such as the chase and the insert assembled to it, the chase (insert) and the pot plunger, the base and the chase, It can be confirmed whether the correspondence between the upper die and the lower die arranged in one press section is appropriate. Further, in the molding apparatus, it is possible to confirm what kind of mold block the mold mold installed for each press unit is configured. In addition, it is possible to prevent an assembly error (set error) of the mold.

  Moreover, although the structure using the RFID tag 66 in which the information about the member of the mold 50 to be heated described above is recorded has been described, the present invention is not limited to this. For example, in the case where heating and cooling are repeated by being transported so as to be in contact with and separated from a heated unit such as a mold die 50 as in the loader hand 22 shown in FIG. It becomes easy to deteriorate by heating by approaching the mold 50 made. In addition, production is performed while switching parts having different shapes depending on the shape of the workpiece W or the like. For these reasons, device parts such as a hand portion that grips the workpiece W with the loader hand 22, for example, are assembled in the device in a replaceable manner. Therefore, an RFID tag may be provided in the replacement part (device part) of the loader hand 22 for the purpose of appropriately replacing the device part. The device parts are not limited to those described later as long as they are intended to be replaced or can be replaced and constitute parts of the device.

  For example, the hand portion 22a (device part) as an exchange part in the loader hand 22 shown in FIG. 9 operates to open and close the claw portion and the like in order to supply the work W to the mold surface 52a and to hold and transport the work W. repeat. For this reason, although the sliding part and the rotation part are required in the hand part 22a, such an apparatus member is easily deteriorated by sliding and rotating in an environment where heating and cooling are repeated. For this reason, by providing an RFID tag in the hand portion 22a as a device part to be replaced, for example, by recording the number of times the workpiece W is put into the mold 50, etc., the replacement can be performed at an appropriate time. You can also. In this case, for example, the antenna 74U can be disposed at an appropriate position through which the hand portion 22a passes.

  In addition, a server installed outside the molding apparatus 10 can be used as a substitute for the storage unit 82 in the above-described embodiment. FIG. 12 shows a system block including a molding apparatus 10 using a storage unit 82 as a modification and a production system block of a semiconductor factory including the molding apparatus 10. The semiconductor factory 300 includes a plurality of molding apparatuses 10 as described above, and the mold 50 is appropriately transferred between the accommodation position 301 (such as a shelf) and the molding apparatus 10. In addition, each molding apparatus 10 is connected to a network IN such as the Internet via a gateway, a switch, or a router for each semiconductor factory 300 (not shown). Thereby, each mold apparatus 10 is connected to the management system 200 and managed. The management system 200 includes a data processing unit 201 that performs data processing such as data communication and calculation, and a storage 202 that records information instead of the storage unit 82 described above.

  In such a production system, ID information and mold-related information from the molding apparatus 10 can be recorded in, for example, the storage 202 of the management system 200 instead of the storage unit 82 of the molding apparatus 10. According to this, when the mold 50 is moved to another semiconductor factory 300 for production adjustment or the like and production is performed there, the mold is referred to the past history even if the molding apparatus 10 is changed. 50 can be used. In addition, the data processing unit 201 of the management system 200 can perform overall management including adjustment of the production amount of each semiconductor factory 300. Therefore, based on the prediction of the production amount, an appropriate maintenance period can be set. Since it is possible to calculate and arrange replacement parts systematically based on the life of the mold managed by the RFID 66, efficient production and management are possible.

  If not only ID information but also mold related information is recorded in the RFID tag 66 of the mold 50, even if there is no system for collectively managing information such as the management system 200 described above, the mold Production can be performed based on mold-related information recorded on the RFID tag 66 of the mold 50.

  In addition, by managing the mold parts in the mold 50 using the RFID tag 66, production support is performed in units of the molding apparatus 10, the unit of the semiconductor factory 300, or the management system 200 (production system) for managing them. be able to.

  As described above, as a production support system 400 for providing mold parts or apparatus parts for semiconductor production and supporting semiconductor production, a production support management system 501 (control unit), mold parts or It has a data server 502 (storage unit) that stores the lifetime information of the device parts, and a communication system 503 (communication unit) that communicates with a system of a semiconductor producer. Here, the communication system 503 obtains ID information (for example, ID information held in the RFID tag 66 described above) assigned to the mold part or the device part from the management system 200 on the semiconductor producer side regarding the operating state ( Operation information). At this time, the production support management system 501 diagnoses the life of the mold part or the device part based on the operation information received by the communication system 503 and the life information in the data server 502. In this case, the production support management system 501 can use the communication system 503 to perform processing for recommending replacement of the device parts to the management system 200 when there is a mold part or a device part that is near the end of its life. Alternatively, the production support management system 501 can execute a manufacturing process of a replacement mold part or apparatus part. According to this, it is possible to provide mold parts or apparatus parts necessary for production in the semiconductor factory 300 in a timely manner, and improve the operation rate of the apparatus in production.

  In addition, the production support system 400 that supports such production collects and analyzes the ID information as described above and information (data) such as mold-related information associated with the ID information, and then sends the information to the production supporter 500. It is also possible to provide it as operation information. According to this, for example, the production supporter 500 that supplies the molding apparatus 10 and the mold die 50 performs an analysis and diagnoses the mold apparatus 10 based on the mold-related information or generates a problem in the molding apparatus 10 or the mold die 50. It is possible to predict and take preventive maintenance. Furthermore, when a problem (trouble) occurs, it is possible to take measures such as prompt instruction and recovery advice.

  Specifically, operation information that can be provided to the production supporter 500 in the mold related information from the management system 200 in the production system is transmitted to the production support management system 501 (specifically, the communication system 503) of the production supporter 500. At this time, the production support management system 501 calculates, for example, information such as the usage time of the mold part and the device part based on the ID information and the mold related information associated therewith, and correlates the usage time and the failure rate. By making a diagnosis based on mathematical formulas or the like, a proposal notification is sent to the management system 200 in the production system so as to replace mold parts and apparatus parts that are approaching the end of their lives. In addition, when information on pressure and temperature in the detection unit 86 is provided as operation information, it can be replaced by associating appropriate measures (exchange, repair, notification, etc.) when it exceeds a predetermined value. It is also possible to make time judgments. Here, when the management system 200 in the production system notifies the user of replacement of the mold part or apparatus part as necessary, the replacement mold part (for example, the mold part) is received from the stock 504 of the production supporter 500. The mold block of the mold 50, etc.) and device parts are provided to the semiconductor factory 300. As a result, it is possible to prevent occurrence of problems in production by appropriately exchanging mold parts and apparatus parts, and to improve the factory operation rate in the semiconductor factory 300. Further, the production support system 400 can predict the time of replacement based on the provided information, and can execute a manufacturing process such as the start of manufacture of mold parts or apparatus parts or preparation for production.

  As described above, according to the production support system 400 of the present invention, by performing management using at least ID information for the mold part and the apparatus part to be exchanged, exchange according to deterioration or consumption due to heating or the like. Can contribute to the improvement of the factory operation rate in the production system for producing semiconductors.

  Further, according to the production support system 400, for example, based on ID information and mold-related information, maintenance and repair of computer hardware used in the management system 200, a computer for an electronic data processing system realized as the data processing unit 201 Hardware installation work / maintenance / repair, and semiconductor manufacturing equipment including the mold apparatus 10, telecommunications machinery / equipment, measurement machinery / equipment, and plastic processing machinery / equipment are also used to support efficiency. be able to. In addition, ID information and mold related information can be supported by creation, design, maintenance, advice, backup, recovery, etc. of computer programs and database structures in the data network of the control unit 80 and the data processing unit 201 of the management system 200. It can also be used.

50 Mold mold 52 Upper mold 52a Mold surface 54 Lower mold 54a Mold surface 64U, 64L Chase 66U, 66L RFID tag W Workpiece

Claims (12)

A mold that sandwiches and molds a workpiece,
A first mold block having a mold surface, and a pair of molds to be opened and closed;
An RFID tag on which information corresponding to the first mold block is recorded;
A mold die comprising: The mold according to claim 1, wherein
The pair of molds further includes a second mold block;
The second mold block is configured to be capable of storing the first mold block, and includes a built-in heater. The mold according to claim 2, wherein
The first mold block has a pressing surface to be pressed in a closed state;
A mold die, wherein the RFID tag is provided excluding the pressing surface. In the mold according to claim 2 or 3,
A mold mold characterized in that an information holding temperature of the RFID tag is equal to or higher than a temperature at which the RFID tag is heated by the heater. In the mold according to any one of claims 1 to 4,
Further comprising a thermal insulator,
The mold mold, wherein the RFID tag is provided on the pair of molds via the heat insulating material. Mold metal mold according to any one of claims 1 to 5,
A communication device provided outside the mold and communicated with the RFID tag;
A molding apparatus comprising: The molding apparatus according to claim 6, wherein
It further comprises a press part for accommodating the mold.
The molding apparatus, wherein the communication device is provided in the vicinity of a transfer path in which the first mold block to be attached and detached is moved in the press section. The molding apparatus according to claim 6, wherein
A transport mechanism that transports the workpiece to the mold;
The molding apparatus according to claim 1, wherein the communication device is provided in the transport mechanism. In the molding apparatus according to any one of claims 6 to 8,
A detection unit for detecting a state of the mold as a detection value;
The mold device, wherein the detection unit and the communication device are connected so that a detection value detected by the detection unit is transmitted to the RFID tag via the communication device. A production support system for providing the first mold block of the molding apparatus according to any one of claims 6 to 9, and supporting production on the workpiece,
A control unit, a storage unit that stores life information of the first mold block, and a communication unit that communicates with a system of a producer of the workpiece,
The communication unit receives ID information assigned to the first mold block as operation information from a system of a producer of the workpiece,
The control unit diagnoses the life of the first mold block based on the received operation information and the life information,
When there is the first mold block approaching the life, the control unit performs a process of recommending replacement of the first mold block to the work producer system using the communication unit. Alternatively, a production support system for executing a manufacturing process of the first mold block for replacement. A molding apparatus comprising a unit to be heated,
Device parts that are heated and cooled repeatedly by being transported so as to be in contact with and separated from the unit, and that are exchangeably assembled in the molding apparatus,
A communication device that communicates with an RFID tag attached to the device component;
A molding apparatus comprising: A production support system for supporting the production of semiconductors by providing mold parts or device parts for semiconductor production,
A control unit, a storage unit that stores life information of the mold part or the device part, and a communication unit that communicates with a system of a semiconductor producer,
The communication unit receives ID information assigned to the mold part or the apparatus part as operating information from a system of a semiconductor producer,
The control unit diagnoses the life of the mold part or the device part based on the received operation information and the life information,
When there is the mold part or the apparatus part that has approached the lifetime, the control unit recommends replacement of the apparatus part to the system of the mold part or the semiconductor producer using the communication unit. Or a manufacturing support system for performing the manufacturing process of the mold part or the apparatus part for replacement.

Images