CN110119797A - Mold monitoring system and method based on RFID - Google Patents
Mold monitoring system and method based on RFID Download PDFInfo
- Publication number
- CN110119797A CN110119797A CN201910395926.8A CN201910395926A CN110119797A CN 110119797 A CN110119797 A CN 110119797A CN 201910395926 A CN201910395926 A CN 201910395926A CN 110119797 A CN110119797 A CN 110119797A
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- mold
- rfid
- label tag
- rfid label
- binding face
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- 238000012544 monitoring process Methods 0.000 title claims abstract description 52
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000000465 moulding Methods 0.000 claims abstract description 24
- 238000012545 processing Methods 0.000 claims abstract description 9
- 230000005540 biological transmission Effects 0.000 claims description 5
- 238000005259 measurement Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 8
- 239000000243 solution Substances 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K17/00—Methods or arrangements for effecting co-operative working between equipments covered by two or more of main groups G06K1/00 - G06K15/00, e.g. automatic card files incorporating conveying and reading operations
- G06K17/0022—Methods or arrangements for effecting co-operative working between equipments covered by two or more of main groups G06K1/00 - G06K15/00, e.g. automatic card files incorporating conveying and reading operations arrangements or provisions for transferring data to distant stations, e.g. from a sensing device
- G06K17/0029—Methods or arrangements for effecting co-operative working between equipments covered by two or more of main groups G06K1/00 - G06K15/00, e.g. automatic card files incorporating conveying and reading operations arrangements or provisions for transferring data to distant stations, e.g. from a sensing device the arrangement being specially adapted for wireless interrogation of grouped or bundled articles tagged with wireless record carriers
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The mold monitoring system and method based on RFID that the invention discloses a kind of, mold includes the first mold and the second mold being oppositely arranged, and mold monitoring system includes: the first RFID label tag on the first binding face of the first mold and/or the second binding face of the second mold；RFID reader, for receiving the radiofrequency signal of the first RFID label tag；Processing unit, the molding and die opening state of the first mold and the second mold are judged for the signal reception condition according to the first RFID label tag, when RFID reader receives the radiofrequency signal of the first RFID label tag, determine the first mold and the second mold is die opening state, when RFID reader does not receive the radiofrequency signal of the first RFID label tag, the first mold and the second mold are determined to mold state.Distance the present invention is based on the mold monitoring system and method for RFID without two RFID label tags on precise measurement mold, it can be realized by the radiofrequency signal of RFID label tag on supervision molding binding face to mold die sinking-molding monitoring, universality is preferable, and monitoring cost is low.
Description
Technical field
The present invention relates to mold monitoring technology fields, more particularly to a kind of mold monitoring system based on RFID and side
Method.
Background technique
Mold is generally divided into male model, master mold, and because mold can generate abrasion or deviation after prolonged use, it is artificial right to need
Mold is adjusted.But traditional mold is due to lacking monitoring to frequency of use, it is difficult to determine mold need when into
Row maintenance, can only probably estimate by rule of thumb, affect the quality of product, it is therefore desirable to monitor in real time to mold.
Existing monitoring method are as follows: respectively male model, master mold binding face on RFID is set, cooperation is with complicated monitoring
The distance between two RFID of systematic survey regard as once being opened when the distance is 0.But two RFID of precise measurement
The distance between use environment is required high, universality is poor, and with high costs.
Therefore, in view of the above technical problems, it is necessary to which a kind of mold monitoring system and method based on RFID is provided.
Summary of the invention
In view of this, the purpose of the present invention is to provide a kind of mold monitoring system and method based on RFID, to realize
Accurate monitoring to mold.
To achieve the goals above, the technical solution that one embodiment of the invention provides is as follows:
A kind of mold monitoring system based on RFID, the mold include the first mold and the second mold being oppositely arranged,
When the first mold and the second mold clamping, the binding face on the first binding face and the second mold on the first mold fits, institute
Stating mold monitoring system includes:
The first RFID label tag on the first binding face of the first mold and/or the second binding face of the second mold；
RFID reader, for receiving the radiofrequency signal of the first RFID label tag；
Processing unit judges the conjunction of the first mold and the second mold for the signal reception condition according to the first RFID label tag
Mould and die opening state determine the first mold and the second mould when RFID reader receives the radiofrequency signal of the first RFID label tag
Tool is die opening state, when RFID reader does not receive the radiofrequency signal of the first RFID label tag, determines the first mold and second
Mold is molding state.
As a further improvement of the present invention, first RFID label tag be embedded at the first mold the first binding face and/
Or second mold the second binding face on.
As a further improvement of the present invention, on first mold relative to the first lateral surface of the first binding face and/
Or second be equipped with the second RFID label tag relative to the second lateral surface of the second binding face on mold, the RFID reader is also used
In the radiofrequency signal for receiving the second RFID label tag, processing unit is also used to the signal reception condition according to the second RFID label tag to mould
Tool is monitored.
As a further improvement of the present invention, first RFID label tag and the second RFID label tag are respectively arranged on the first mold
On the second mold.
As a further improvement of the present invention, the reader is connected with antenna, and the antenna is used for transmission radiofrequency signal.
Another embodiment of the present invention provides technical solution it is as follows:
A kind of mold monitoring method based on RFID, the mold monitoring method include:
The first RFID label tag is set on the first binding face of the first mold and/or the second binding face of the second mold；
The radiofrequency signal of the first RFID label tag is received by RFID reader；
The molding and die opening state of the first mold and the second mold are judged according to the signal reception condition of the first RFID label tag,
When RFID reader receives the radiofrequency signal of the first RFID label tag, determines the first mold and the second mold is die opening state,
When RFID reader does not receive the radiofrequency signal of the first RFID label tag, the first mold and the second mold are determined to mold shape
State.
As a further improvement of the present invention, first RFID label tag be embedded at the first mold the first binding face and/
Or second mold the second binding face on, when the first mold and the second mold are in molding state, the first RFID label tag is penetrated
Frequency signal is shielded.
As a further improvement of the present invention, the mold monitoring method further include:
It is bonded relative on the first lateral surface of the first binding face and/or the second mold relative to second on the first mold
The second RFID label tag is set on second lateral surface in face；
The radiofrequency signal of the second RFID label tag is received by RFID reader；
Mold is monitored according to the signal reception condition of the second RFID label tag.
As a further improvement of the present invention, first RFID label tag and the second RFID label tag are respectively arranged on the first mold
On the second mold.
As a further improvement of the present invention, the reader is connected with antenna, and the antenna is used for transmission radiofrequency signal.
The beneficial effects of the present invention are:
The present invention is based on the mold monitoring system and method for RFID without on precise measurement mold two RFID label tags away from
From can be realized by the radiofrequency signal of RFID label tag on supervision molding binding face to mold die sinking-molding monitoring, can keep away
Exempt from the influence of site environment, universality is preferable, and monitoring cost is low.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The some embodiments recorded in invention, for those of ordinary skill in the art, without creative efforts,
It is also possible to obtain other drawings based on these drawings.
Fig. 1 is structural schematic diagram of the mold under die opening state in the embodiment of the present invention 1；
Fig. 2 is structural schematic diagram of the mold under molding state in the embodiment of the present invention 1；
Fig. 3 is the module diagram of the mold monitoring system based on RFID in the embodiment of the present invention 1；
Fig. 4 is the flow diagram of the mold monitoring method based on RFID in the embodiment of the present invention 1；
Fig. 5 is structural schematic diagram of the mold under die opening state in the embodiment of the present invention 2；
Fig. 6 is structural schematic diagram of the mold under molding state in the embodiment of the present invention 2；
Fig. 7 is the module diagram of the mold monitoring system based on RFID in the embodiment of the present invention 2；
Fig. 8 is the flow diagram of the mold monitoring method based on RFID in the embodiment of the present invention 2.
Specific embodiment
Technical solution in order to enable those skilled in the art to better understand the present invention, below in conjunction with of the invention real
The attached drawing in example is applied, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described implementation
Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
Technical staff's every other embodiment obtained without making creative work, all should belong to protection of the present invention
Range.
The mold monitoring system based on RFID that the invention discloses a kind of, mold include the first mold being oppositely arranged and
Two molds, the binding face phase on the first binding face and the second mold when the first mold and the second mold clamping, on the first mold
Fitting, mold monitoring system include:
The first RFID label tag on the first binding face of the first mold and/or the second binding face of the second mold；
RFID reader, for receiving the radiofrequency signal of the first RFID label tag；
Processing unit judges the conjunction of the first mold and the second mold for the signal reception condition according to the first RFID label tag
Mould and die opening state determine the first mold and the second mould when RFID reader receives the radiofrequency signal of the first RFID label tag
Tool is die opening state, when RFID reader does not receive the radiofrequency signal of the first RFID label tag, determines the first mold and second
Mold is molding state.
The mold monitoring method based on RFID that the invention also discloses a kind of, comprising:
The first RFID label tag is set on the first binding face of the first mold and/or the second binding face of the second mold；
The radiofrequency signal of the first RFID label tag is received by RFID reader；
The molding and die opening state of the first mold and the second mold are judged according to the signal reception condition of the first RFID label tag,
When RFID reader receives the radiofrequency signal of the first RFID label tag, determines the first mold and the second mold is die opening state,
When RFID reader does not receive the radiofrequency signal of the first RFID label tag, the first mold and the second mold are determined to mold shape
State.
It elaborates below in conjunction with specific embodiment to the present invention.
Embodiment 1:
To join shown in Fig. 1, Fig. 2, the mold of the present embodiment includes the first mold 11 and the second mold 12 being oppositely arranged, and first
Mold 11 and the opposite two sides of the second mold 12 are the first binding face 111 and the second binding face 121, when the first mold 11 and second
When mold 12 molds, the binding face 121 on the first binding face 111 and the second mold fits.Relative on first mold 11
The side of one binding face 111 is the first lateral surface 112, relative to the side of the second binding face 121 is second on the second mold 12
Lateral surface 122.
Join Fig. 1, Fig. 2 and as shown in connection with fig. 3, the mold monitoring system in the present embodiment based on RFID includes:
The first RFID label tag 21 on the first binding face 111 of the first mold 11；
RFID reader 30, for receiving the radiofrequency signal of the first RFID label tag 21；
Processing unit 40 is connected with RFID reader 30, for being judged according to the signal reception condition of the first RFID label tag
The molding and die opening state of first mold and the second mold.
Accordingly, join shown in Fig. 4, the mold monitoring method in the present embodiment includes:
First RFID label tag 21 is set on the first binding face 111 of the first mold 11；
The radiofrequency signal of the first RFID label tag 21 is received by RFID reader 30；
The molding of the first mold 11 and the second mold 12 is judged according to the signal reception condition of the first RFID label tag 21 and is opened
Mould state.
In the present embodiment, when RFID reader 30 receives the radiofrequency signal of the first RFID label tag 21, the first mould is determined
Tool 11 and the second mold 12 are die opening state, when RFID reader 30 does not receive the radiofrequency signal of the first RFID label tag 21,
Determine the first mold 11 and the second mold 12 is molding state.
Preferably, the first RFID label tag 21 in the present embodiment is embedded on the first binding face 111 of the first mold 11.
In addition, reader 30 is connected with antenna (not shown), antenna is used for transmission the radiofrequency signal of the first RFID label tag 21.
Embodiment 2:
To join shown in Fig. 5, Fig. 6, the mold of the present embodiment includes the first mold 11 and the second mold 12 being oppositely arranged, and first
Mold 11 and the opposite two sides of the second mold 12 are the first binding face 111 and the second binding face 121, when the first mold 11 and second
When mold 12 molds, the binding face 121 on the first binding face 111 and the second mold fits.Relative on first mold 11
The side of one binding face 111 is the first lateral surface 112, relative to the side of the second binding face 121 is second on the second mold 12
Lateral surface 122.
Join Fig. 5, Fig. 6 and as shown in connection with fig. 7, the mold monitoring system in the present embodiment based on RFID includes:
The first RFID label tag 21 on the first binding face 111 of the first mold 11；
The second RFID label tag 22 on the second lateral surface 122 of the second mold 12；
RFID reader 30, for receiving the radiofrequency signal of the first RFID label tag 21 and the second RFID label tag 22；
Processing unit 40 is connected with RFID reader 30, for being sentenced according to the signal reception condition of the first RFID label tag 21
The molding and die opening state of disconnected first mold and the second mold, and according to the signal reception condition of the second RFID label tag 22 to mold
It is monitored.
Accordingly, join shown in Fig. 8, the mold monitoring method in the present embodiment includes:
First RFID label tag 21 is set on the first binding face 111 of the first mold 11；
Second RFID label tag 22 is set on the second lateral surface 122 of the second mold 12；
The radiofrequency signal of the first RFID label tag 21 and the second RFID label tag 22 is received by RFID reader 30；
The molding of the first mold 11 and the second mold 12 is judged according to the signal reception condition of the first RFID label tag 21 and is opened
Mould state, and mold is monitored according to the signal reception condition of the second RFID label tag 22.
In the present embodiment, when RFID reader 30 receives the radiofrequency signal of the first RFID label tag 21, the first mould is determined
Tool 11 and the second mold 12 are die opening state, when RFID reader 30 does not receive the radiofrequency signal of the first RFID label tag 21,
Determine the first mold 11 and the second mold 12 is molding state.
Unlike the first embodiment, stock control can be carried out to mold by the second RFID label tag 22 in the present embodiment
Monitoring, the first mold 11 and the second mold 12 be in molding state when inbound/outbound process, are needed at this time through the progress of the second RFID label tag 22
The management of mold.
In addition, passing through the setting of the second RFID label tag, it is able to solve the influence of site environment, such as because of the shadow of site environment
It ringing, leads to not the radiofrequency signal for receiving the first RFID label tag, processing unit, which judges on injection molding machine at this time, does not have mold, thus
It causes to judge by accident.And pass through the setting of the second RFID label tag, whether have mold, substantially increase prison if can accurately identify on injection molding machine
Control precision.
It should be understood that in the second outside of the first binding face of the first mold and the second mold in above-described embodiment
The first RFID label tag and the second RFID label tag are respectively set on face, in other embodiments, the first RFID label tag also can be set
In on the second binding face of the second mold, the second RFID label tag also be can be set on the first lateral surface of the first mold, meanwhile,
The quantity of first RFID label tag and the second RFID label tag, which can according to need, to be configured, and the setting energy of multiple RFID label tags is passed through
Enough further increase mold monitoring accuracy rate.
As can be seen from the above technical solutions, the invention has the following beneficial effects:
The present invention is based on the mold monitoring system and method for RFID without on precise measurement mold two RFID label tags away from
From can be realized by the radiofrequency signal of RFID label tag on supervision molding binding face to mold die sinking-molding monitoring, can keep away
Exempt from the influence of site environment, universality is preferable, and monitoring cost is low.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (10)
1. a kind of mold monitoring system based on RFID, the mold includes the first mold and the second mold being oppositely arranged, the
When one mold and the second mold clamping, the binding face on the first binding face and the second mold on the first mold fits, special
Sign is that the mold monitoring system includes:
The first RFID label tag on the first binding face of the first mold and/or the second binding face of the second mold；
RFID reader, for receiving the radiofrequency signal of the first RFID label tag；
Processing unit, for the signal reception condition according to the first RFID label tag judge the first mold and the second mold molding and
Die opening state determines the first mold and the second mold is when RFID reader receives the radiofrequency signal of the first RFID label tag
Die opening state determines the first mold and the second mold when RFID reader does not receive the radiofrequency signal of the first RFID label tag
To mold state.
2. the mold monitoring system according to claim 1 based on RFID, which is characterized in that first RFID label tag is embedding
On the first binding face of the first mold and/or the second binding face of the second mold.
3. the mold monitoring system according to claim 1 based on RFID, which is characterized in that opposite on first mold
In on the first lateral surface and/or the second mold of the first binding face relative to the second lateral surface of the second binding face be equipped with second
RFID label tag, the RFID reader are also used to receive the radiofrequency signal of the second RFID label tag, and processing unit is also used to according to
The signal reception condition of two RFID label tags is monitored mold.
4. the mold monitoring system according to claim 3 based on RFID, which is characterized in that first RFID label tag and
Second RFID label tag is respectively arranged on the first mold and the second mold.
5. the mold monitoring system according to any one of claims 1 to 4 based on RFID, which is characterized in that described to read
It reads device to be connected with antenna, the antenna is used for transmission radiofrequency signal.
6. a kind of mold monitoring method based on RFID, which is characterized in that the mold monitoring method includes:
The first RFID label tag is set on the first binding face of the first mold and/or the second binding face of the second mold；
The radiofrequency signal of the first RFID label tag is received by RFID reader；
The molding and die opening state that the first mold and the second mold are judged according to the signal reception condition of the first RFID label tag, when
When RFID reader receives the radiofrequency signal of the first RFID label tag, determines the first mold and the second mold is die opening state, when
When RFID reader does not receive the radiofrequency signal of the first RFID label tag, the first mold and the second mold are determined to mold state.
7. the mold monitoring method according to claim 6 based on RFID, which is characterized in that first RFID label tag is embedding
On the first binding face of the first mold and/or the second binding face of the second mold, when the first mold and the second mold are in
When molding state, the radiofrequency signal of the first RFID label tag is shielded.
8. the mold monitoring method according to claim 6 based on RFID, which is characterized in that the mold monitoring method is also
Include:
On the first mold relative on the first lateral surface of the first binding face and/or the second mold relative to the second binding face
Second RFID label tag is set on the second lateral surface；
The radiofrequency signal of the second RFID label tag is received by RFID reader；
Mold is monitored according to the signal reception condition of the second RFID label tag.
9. the mold monitoring method according to claim 8 based on RFID, which is characterized in that first RFID label tag and
Second RFID label tag is respectively arranged on the first mold and the second mold.
10. the mold monitoring method according to any one of claim 6~9 based on RFID, which is characterized in that described to read
It reads device to be connected with antenna, the antenna is used for transmission radiofrequency signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910395926.8A CN110119797A (en) | 2019-05-13 | 2019-05-13 | Mold monitoring system and method based on RFID |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910395926.8A CN110119797A (en) | 2019-05-13 | 2019-05-13 | Mold monitoring system and method based on RFID |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110119797A true CN110119797A (en) | 2019-08-13 |
Family
ID=67522322
Family Applications (1)
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|---|---|---|---|
| CN201910395926.8A Pending CN110119797A (en) | 2019-05-13 | 2019-05-13 | Mold monitoring system and method based on RFID |
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| JP2009037416A (en) * | 2007-08-01 | 2009-02-19 | Kajima Corp | Structure for mounting antenna, joint member, and transmitting/receiving system |
| US20160375701A1 (en) * | 2015-06-29 | 2016-12-29 | Inteva Products, Llc | Product molding system and method of labeling molded products |
| JP2017087648A (en) * | 2015-11-13 | 2017-05-25 | アピックヤマダ株式会社 | Mold die, mold device, and production support system |
| CN108177316A (en) * | 2018-02-02 | 2018-06-19 | 东莞市新峰软件技术有限公司 | A kind of mold management through figures system |
| CN109605699A (en) * | 2019-01-28 | 2019-04-12 | 苏州协同创新智能制造装备有限公司 | Mold monitoring device |
| CN109657776A (en) * | 2019-01-28 | 2019-04-19 | 苏州协同创新智能制造装备有限公司 | Counting device for supervision molding |
-
2019
- 2019-05-13 CN CN201910395926.8A patent/CN110119797A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009037416A (en) * | 2007-08-01 | 2009-02-19 | Kajima Corp | Structure for mounting antenna, joint member, and transmitting/receiving system |
| US20160375701A1 (en) * | 2015-06-29 | 2016-12-29 | Inteva Products, Llc | Product molding system and method of labeling molded products |
| JP2017087648A (en) * | 2015-11-13 | 2017-05-25 | アピックヤマダ株式会社 | Mold die, mold device, and production support system |
| CN108177316A (en) * | 2018-02-02 | 2018-06-19 | 东莞市新峰软件技术有限公司 | A kind of mold management through figures system |
| CN109605699A (en) * | 2019-01-28 | 2019-04-12 | 苏州协同创新智能制造装备有限公司 | Mold monitoring device |
| CN109657776A (en) * | 2019-01-28 | 2019-04-19 | 苏州协同创新智能制造装备有限公司 | Counting device for supervision molding |
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