CN115034274A - Mold history management method, system, device, equipment and readable storage medium - Google Patents
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Abstract
The application discloses a mould resume management method, a system, a device, equipment and a readable storage medium, wherein the method comprises the following steps: acquiring stamping information of a stamping machine; receiving vibration data of a mold collected by an ultrasonic sensor, and determining defect information of the mold based on the vibration data; and controlling a first RFID reader-writer to write the stamping information and the defect information into a label of the die so as to enable an operator to perform subsequent management on the die. According to the method and the device, the defect information in the die machining process is recorded and called through the label, the defect information does not need to be recorded or called manually, and the die record management efficiency is improved.
Description
Technical Field
The present disclosure relates to mold inspection technologies, and in particular, to a mold history management method, system, apparatus, device, and readable storage medium.
Background
The mould is the master of industry and is the basis for the standardization and rapidity of the manufacture of industrial products, so the mould is used
The requirements of the manufacturing production and injection molding process are higher and higher.
With the development of the mold manufacturing process, some processing enterprises use the concept of separating the mold frame from the mold, namely, the standard characteristics in the mold are designed in the master mold, the customized mode of partially using the module is designed in the slave mold, the master mold is used for driving the punching machine, the slave mold is rapidly replaced, the mold replacing speed is greatly accelerated, and the production efficiency is directly improved.
However, in the conventional mold production tracking means, production information of the mold is manually recorded and tracked, and after the production efficiency is improved, the number of the mold is greatly increased, and the subsequent tracking efficiency of the mold is low by adopting a manual tracking method.
Disclosure of Invention
The present application mainly aims to provide a mold history management method, system, device, equipment and readable storage medium, and aims to solve the technical problem of how to improve the efficiency of mold history management in the prior art.
In order to achieve the above object, the present application provides a mold history management method, including:
acquiring stamping information of a stamping machine;
receiving vibration data of a mold collected by an ultrasonic sensor, and determining defect information of the mold based on the vibration data;
and controlling a first RFID reader-writer to write the stamping information and the defect information into a label of the die so as to enable an operator to perform subsequent management on the die.
For example, the receiving vibration data of the mold collected by the ultrasonic sensor and determining the defect information of the mold based on the vibration data includes:
receiving a current signal output by an ultrasonic sensor;
determining vibration information of the mold based on the current signal;
if the vibration information is abnormal vibration, determining that the defect information of the mold is a defect;
and if the vibration information is normal vibration, determining that the defect information of the mold is defect-free.
Illustratively, the determining vibration information of the mold based on the current signal includes:
calculating the intensity difference value of the current signal and a preset current signal;
if the intensity difference is larger than a preset intensity difference, determining that the vibration information is abnormal vibration;
if not, determining that the vibration information is normal vibration.
For example, after determining that the defect information of the mold is a defect if the vibration information is abnormal vibration, the method includes:
generating a first control instruction;
and controlling the punching machine to stop working based on the first control command.
Illustratively, the die includes a mother die and a daughter die, and before acquiring the punching information of the punching machine, the method includes:
receiving first characteristic information of the master mould and second characteristic information of the slave mould, which are acquired by a first RFID reader-writer;
determining whether the sub-mold is matched with the mother mold based on the first characteristic information and the second characteristic information;
and if so, generating a second control command, wherein the second control command is used for controlling the punching machine to start working.
In order to achieve the above object, the present application further provides a mold history management system, including: the system comprises an ultrasonic sensor, control equipment and a first RFID reader-writer;
the ultrasonic sensor is used for acquiring vibration data of the die and sending the vibration data to the control equipment;
the control equipment is used for acquiring the stamping information of the stamping machine; receiving the vibration data acquired by the ultrasonic sensor, and determining defect information of the die based on the vibration data; controlling the first RFID reader-writer to write the stamping information and the defect information into a label of the die so as to enable an operator to perform subsequent management on the die;
the first RFID reader-writer is used for writing the stamping information and the defect information into a label of the die.
Illustratively, the system further comprises: a second RFID reader;
the second RFID reader-writer is also used for identifying the stamping information and the defect information in the label so as to be maintained by an operator; and after the operator finishes the maintenance of the die, writing maintenance information into the label.
In order to achieve the above object, the present invention further provides a mold history management apparatus, comprising:
the acquisition module is used for acquiring the stamping information of the stamping machine;
the first determining module is used for receiving vibration data of the die collected by the ultrasonic sensor and determining defect information of the die based on the vibration data;
and the control module is used for controlling the first RFID reader-writer to write the stamping information and the defect information into the label of the die so as to allow an operator to perform subsequent management on the die.
Illustratively, the first determining module includes:
the receiving submodule is used for receiving a current signal output by the ultrasonic sensor;
a first determining submodule for determining vibration information of the mold based on the current signal;
the second determining submodule is used for determining that the defect information of the die is defective if the vibration information is abnormal vibration;
and the third determining submodule is used for determining that the defect information of the mold is defect-free if the vibration information is normal vibration.
Illustratively, the first determining sub-module includes:
the calculating unit is used for calculating the intensity difference value of the current signal and a preset current signal;
the determining unit is used for determining the vibration information as abnormal vibration if the intensity difference value is larger than a preset intensity difference value;
and the determining unit is used for determining that the vibration information is normal vibration if the vibration information is not normal vibration.
Illustratively, the first determining module further includes:
the generation submodule is used for generating a first control instruction;
and the control sub-module is used for controlling the punching machine to stop working based on the first control instruction.
In an exemplary embodiment, the mold history management apparatus further includes:
the receiving module is used for receiving first characteristic information of the master mould and second characteristic information of the slave mould, which are acquired by a first RFID reader-writer;
a second determining module, configured to determine whether the sub mold and the mother mold are adapted based on the first characteristic information and the second characteristic information;
and the generating module is used for generating a second control command if the first control command is positive, wherein the second control command is used for controlling the punching machine to start working.
In order to achieve the above object, the present application further provides a mold record management apparatus, which includes a memory, a processor, and a mold record management program stored in the memory and operable on the processor, wherein the mold record management program, when executed by the processor, implements the steps of the mold record management method as described above.
In an exemplary manner, to achieve the above object, the present application further provides a computer-readable storage medium having a mold history management program stored thereon, wherein the mold history management program, when executed by a processor, implements the steps of the mold history management method as described above.
Compared with the prior art, the production information of the mold is manually recorded and tracked. The method comprises the steps of acquiring stamping information of a stamping machine when the stamping machine starts to work; obtaining vibration information of a mold, and determining defect information of the mold; and writing the stamping information and the defect information into a label of the die so as to be used for subsequent management of the die by an operator. According to the method and the device, the production and processing states of the die are monitored in real time through the ultrasonic sensor, the defect information of the die is written into the tag through the RFID reader-writer, and a follow-up operator only needs to identify the defect information in the tag when detecting and maintaining the die and does not need to acquire the defect information of the die by calling a paper material. Therefore, the defect information in the die machining process is recorded and called through the label, manual recording or calling of the defect information is not needed, and the die record management efficiency is improved.
Drawings
FIG. 1 is a schematic flow chart of a first embodiment of a mold history management method according to the present application;
FIG. 2 is a drawing illustrating a press according to a first embodiment of the method for managing die history according to the present application;
fig. 3 is a schematic structural diagram of a hardware operating environment according to an embodiment of the present application.
The implementation, functional features and advantages of the objectives of the present application will be further explained with reference to the accompanying drawings.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
Referring to fig. 1, fig. 1 is a schematic flow chart of a first embodiment of the mold history management method.
While the present embodiments provide an embodiment of a mold history management method, it should be noted that although a logical order is shown in the flow chart, in some cases, the steps shown or described may be performed in an order different from that shown or described herein. For convenience of description, the following description of the respective steps of the mold history management method, which is performed by the main body, is omitted, and the mold history management method includes:
in step S10, the press information of the press machine is acquired.
And step S20, receiving vibration data of the die collected by the ultrasonic sensor, and determining defect information of the die based on the vibration data.
And step S30, controlling a first RFID reader-writer to write the stamping information and the defect information into a label of the die, so that an operator can perform subsequent management on the die.
The method comprises the following specific steps:
in step S10, the press information of the press machine is acquired.
In the present embodiment, as shown in fig. 2, 201 is a control device, 202 is an ultrasonic sensor, 203 is a first RFID (Radio Frequency Identification) reader/writer, and 204 is a punch. The die has a certain service life, namely, if the service life exceeds the threshold value of the stamping times of the die in the stamping process, the die is easy to crack, unfilled corners and the like when the die is stamped by a stamping machine, and the quality of subsequent products is influenced. And the damage appears in the mould course of working, need let punching machine stop work, the supplementary uninstallation mould of operation personnel, and this process can reduce the efficiency of mould production.
Illustratively, the punching information includes the number of punching times of the punching machine, punching parameters, and the like. For example, the punching frequency of the punching machine is acquired and accumulated in real time, and if the punching machine performs 1000 times of accumulated punching when the die finishes the punching process, the punching information includes 1000 times of punching frequency.
Illustratively, before the obtaining the stamping information of the stamping machine, the method includes:
and a, receiving first characteristic information of the master mould and second characteristic information of the slave mould, which are acquired by a first RFID reader-writer.
In the present embodiment, the mold includes a mother mold and a daughter mold. The female die is a universal standard in the die, and the sub-die is a customized partial use module. The female die is fixed on the punching machine and moves along with the punching machine, and the sub-die is rapidly replaced, so that the production and processing efficiency is improved. Because the female die is a general template, the condition that the child die is not matched with the female die but can be physically connected exists, if the female die and the child die are combined in error, the child die still needs to be disassembled, and the production and processing efficiency is influenced. For example, the daughter molds 1, 2, 3, 4 may be connected to the mother mold a, and the existing daughter molds 5, 6, 7, 8 may be physically connected to the mother mold a, but the connected product is not the target product.
Illustratively, the characteristic information includes first characteristic information of the mother mold and second characteristic information of the child mold.
Illustratively, the characteristic information includes parameter information, number information, and the like of the mold. For example, the master mold is numbered a, the child molds are numbered 1, 2, 3, 4, and if the master mold is numbered a and the child mold is numbered 2, it is determined that the child mold matches the master mold.
The characteristic information of the sub-mold and the mold is stored in the RFID label and is identified by a first RFID reader-writer on the stamping machine. The RFID tag contains information such as the number of the mold, the production date, the maintenance date, and the like.
And b, determining whether the sub-mold is matched with the mother mold or not based on the first characteristic information and the second characteristic information.
In this embodiment, the second characteristic information of the sub-mold is compared with the first characteristic information of the mother mold, and it is determined whether the sub-mold is matched with the mother mold.
And c, if so, generating a second control command, wherein the second control command is used for controlling the punching machine to start working.
In this embodiment, after identifying the feature information, determining that the sub-mold is matched with the mother mold, and generating a second control instruction by the control device, where the second control instruction is used to control the stamping machine to perform the mold stamping operation; if after the characteristic information is identified, the fact that the sub-mold is not matched with the female mold is determined, and the control equipment generates a reminding instruction for reminding an operator to replace the sub-mold.
And step S20, receiving vibration data of the die collected by the ultrasonic sensor, and determining defect information of the die based on the vibration data.
In this embodiment, vibration information in the die machining process is obtained in real time through an ultrasonic sensor mounted on the die, and if the vibration information is abnormal, it is determined that the die has a defect in the stamping process.
For example, the receiving vibration data of the mold collected by the ultrasonic sensor and determining the defect information of the mold based on the vibration data includes:
and d, receiving the current signal output by the ultrasonic sensor.
In the embodiment, the ultrasonic sensor sends the acquired vibration information to the control device in real time in the form of current signals during the detection process. The control device determines whether the die has a defect in the punching process based on the current information.
And e, determining the vibration information of the die based on the current signal.
In the embodiment, the current information acquired in real time is compared with the current signal in the normal stamping process of the die to obtain a comparison result, and the vibration information of the die is determined based on the comparison result.
Illustratively, the vibration information of the mold includes abnormal vibration and normal vibration.
Illustratively, the determining the vibration information based on the current signal includes:
and e1, calculating the intensity difference value of the current signal and a preset current signal.
In this embodiment, the preset current signal is a current signal output by the ultrasonic sensor during a normal stamping process of the die. The current signal intensity is compared with the preset current signal intensity, and the following three conditions exist: the current signal intensity is greater than the preset current signal intensity, the current signal intensity is equal to the preset current signal intensity, and the current signal intensity is less than the preset current signal intensity. If the intensity of the current signal is greater than the preset intensity of the current signal, the intensity difference value is a positive value; if the intensity of the current signal is smaller than the preset intensity of the current signal, the intensity difference value is a negative value. For example, if the acquired current signal intensity is 2V and the preset current signal intensity is 1.5V, determining that the intensity difference is 0.5V; and if the acquired current signal intensity is 1V and the preset current signal intensity is 1.2V, determining that the intensity difference is-0.2V.
For example, the value of the preset current signal is set according to needs, and the embodiment is not limited in particular. For example, the preset current signal may have a value of 1V, 1.5V, etc.
Step e2, if the intensity difference is greater than a preset intensity difference, determining that the vibration information is abnormal vibration.
In this embodiment, due to the difference between the environmental conditions detected by the ultrasonic sensor and the mold, the output current intensity is not a fixed value, and a certain offset exists, and if the offset value is within the range of the preset intensity difference, it is determined that the vibration information is normal vibration; and if the deviation value exceeds the range of the preset intensity difference value, determining the vibration information as abnormal vibration.
Illustratively, the preset intensity difference value includes a first preset intensity difference value and a second preset intensity difference value.
For example, the first preset intensity difference value and the second preset intensity difference value are set as needed, and the embodiment is not particularly limited. For example, the first preset intensity difference is 0.2V, 0.4V, etc.; the second preset intensity difference is 0.2V, 0.3V, etc.
If the current signal intensity is greater than the preset current signal intensity, determining that the vibration information is abnormal vibration if the calculated intensity difference is greater than a first preset intensity difference; and if the current signal intensity is smaller than the preset current signal intensity, and the absolute value of the calculated intensity difference is larger than a second preset intensity difference, determining that the vibration information is abnormal vibration. For example, if the first preset intensity difference is 0.2V, the acquired current signal intensity is 2V, the preset current signal intensity is 1.5V, and the intensity difference is determined to be 0.5V, it is determined that the vibration information of the mold is abnormal vibration; and the second preset intensity difference is 0.3V, and if the acquired current signal intensity is 1V and the preset current signal intensity is 1.5V, determining that the intensity difference is-0.5V, and determining that the vibration information of the mold is abnormal vibration.
And e3, if not, determining that the vibration information is normal vibration.
In this embodiment, if the intensity difference is smaller than or equal to the preset intensity difference, it is determined that the vibration information is abnormal vibration. For example, if the first preset intensity difference is 0.2V, the intensity of the acquired current signal is 1.7V, the preset current signal intensity is 1.5V, and the intensity difference is determined to be 0.2V, it is determined that the vibration information of the mold is normal vibration; and the second preset intensity difference value is 0.3V, if the acquired current signal intensity is 1V and the preset current signal intensity is 1.2V, and the intensity difference value is determined to be-0.2V, the vibration information of the die is determined to be normal vibration.
And f, if the vibration information is abnormal vibration, determining that the defect information of the mold is defective.
In this embodiment, if the mold vibration information is abnormal vibration, determining that the defect information of the mold is defective; and if the vibration information of the mold is normal vibration, determining that the defect information of the mold is defect-free.
Exemplary defect types for the mold include: foreign matters exist in the die, the sub-die and the mother die are not completely connected, the die is cracked, and the like. Wherein, the defect type of the die can be judged through the current signal output by the ultrasonic wave. For example, if the current signal intensity is greater than the preset current signal intensity and the intensity difference is greater than the first preset intensity difference, it is determined that the defect type of the mold may be that a foreign object exists in the mold, the sub-mold and the main mold are not completely connected, and the like; and if the current signal intensity is smaller than the preset current signal intensity and the absolute value of the intensity difference is larger than the second preset intensity difference, determining that the defect type of the mold may be mold cracking, mold corner collapse and the like.
For example, after determining that the defect information of the mold is a defect if the vibration information is abnormal vibration, the method includes:
in this embodiment, after detecting that the die has abnormal vibration in the stamping process, if the die is continuously stamped, the die may be irreversibly damaged or even damaged by the stamping machine, so that the stamping of the die needs to be stopped at the first time, and the worker assists in disassembling the die and transporting the die to a warehouse, so as to repair the damaged die later.
And g, generating a first control instruction.
In the present embodiment, when the presence of the die defect is detected, the control device outputs a first control command for controlling the press machine to stop operating.
And h, controlling the punching machine to stop working based on the first control command.
In this embodiment, the press machine stops the press work after receiving the first control command output from the device to be controlled.
In this application, detect the processing state of mould in real time through ultrasonic sensing to the very first time stop punching press work when appearing unusually, reduce the harm to the minimum, improved the reliability of punching press.
And i, if the vibration information is normal vibration, determining that the defect information of the mold is defect-free.
In this embodiment, if the vibration information is normal vibration, it is determined that the mold is in a normal processing state, and the defect information indicates that no defect exists.
And step S30, controlling a first RFID reader-writer to write the stamping information and the defect information into a label of the die, so that an operator can perform subsequent management on the die.
In this embodiment, after the production is completed, the control device controls the first RFID reader to write information into the tag. And writing the stamping information of the stamping machine and the defect information of the die into a label through a first RFID reader-writer, wherein the label is an RFID label. Wherein, the stamping times are updated for the last stamping times. For example, the die has been punched for 4 times, 5000 times of punching are accumulated, and before the 5 th punching, the first RFID reader on the punching machine identifies the tag and obtains the first punching number, where the first punching number is 5000 times. And if the second stamping times accumulated in the 5 th stamping process are 1000 times, accumulating the first stamping times and the second stamping times to obtain a third stamping times of 6000 times. After the punching is finished, writing a third punching number into the RFID label.
The RFID label comprises a master mould RFID label and a sub mould RFID label, and the first RFID reader-writer writes the stamping information and the defect information into the master mould RFID label and the sub mould RFID label.
For example, the subsequent management includes that the worker can obtain the stamping information and the defect information in the mold through the handheld RFID reader, that is, the second RFID reader, and maintain the mold based on the stamping information and the defect information. And if the stamping times of the die are more than or equal to the preset stamping times, determining that the die is an invalid die, and in order to ensure the quality of the product, not carrying out stamping production on the die.
For example, the preset number of punching times is set as needed, and the embodiment is not particularly limited.
And after the operator finishes the maintenance of the die, writing maintenance information into the label.
In this embodiment, when the worker maintains the mold and determines that the mold can be put into the press again, the information of "maintenance completed" can be written by the second RFID reader. And in the next stamping production process, when the first RFID reader-writer on the stamping machine recognizes the information, determining that the die can be put into production.
According to the method and the device, the information of the die can be acquired and modified through the second RFID reader-writer, and all production detail information of the die can be read and updated only through the second RFID reader-writer even if an MES system or a complex die management system is not available, so that offline die record management is realized.
Compared with the prior art, the production information of the mold is manually recorded and tracked. The method comprises the steps of acquiring stamping information of a stamping machine when the stamping machine starts to work; obtaining vibration information of a mold, and determining defect information of the mold; and writing the stamping information and the defect information into a label of the die so as to be used for subsequent management of the die by an operator. According to the method and the device, the production and processing states of the die are monitored in real time through the ultrasonic sensor, the defect information of the die is written into the tag through the RFID reader-writer, and a follow-up operator only needs to identify the defect information in the tag when detecting and maintaining the die and does not need to acquire the defect information of the die by calling a paper material. Therefore, the defect information in the die machining process is recorded and called through the label, manual recording or calling of the defect information is not needed, and the die record management efficiency is improved.
In an exemplary aspect, the present application further provides a mold history management system, including: the system comprises an ultrasonic sensor, control equipment and a first RFID reader-writer;
the ultrasonic sensor is used for acquiring vibration data of the die and sending the vibration data to the control equipment;
the control equipment is used for acquiring the stamping information of the stamping machine; receiving the vibration data acquired by the ultrasonic sensor, and determining defect information of the die based on the vibration data; controlling the first RFID reader-writer to write the stamping information and the defect information into a label of the die so as to enable an operator to perform subsequent management on the die;
the first RFID reader-writer is used for writing the stamping information and the defect information into a label of the die.
Illustratively, the system further comprises: a second RFID reader;
the second RFID reader-writer is also used for identifying the stamping information and the defect information in the label so as to be maintained by an operator; and after the operator finishes the maintenance of the die, writing maintenance information into the label.
The specific implementation of the mold history management system of the present application is substantially the same as that of the above embodiments of the mold history management method, and will not be described herein again.
In an exemplary aspect, the present application further provides a mold history management apparatus including:
the acquisition module is used for acquiring the stamping information of the stamping machine;
the first determining module is used for receiving vibration data of the die collected by the ultrasonic sensor and determining defect information of the die based on the vibration data;
and the control module is used for controlling the first RFID reader-writer to write the stamping information and the defect information into the label of the die so as to provide the subsequent management of the die for an operator.
Illustratively, the first determining module includes:
the receiving submodule is used for receiving a current signal output by the ultrasonic sensor;
a first determining submodule for determining vibration information of the mold based on the current signal;
the second determining submodule is used for determining that the defect information of the die is defective if the vibration information is abnormal vibration;
and the third determining submodule is used for determining that the defect information of the mold is defect-free if the vibration information is normal vibration.
Illustratively, the first determining sub-module includes:
the calculating unit is used for calculating the intensity difference value of the current signal and a preset current signal;
the determining unit is used for determining the vibration information as abnormal vibration if the intensity difference value is larger than a preset intensity difference value;
and the determining unit is used for determining that the vibration information is normal vibration if the vibration information is not normal vibration.
Illustratively, the first determining module further includes:
the generation submodule is used for generating a first control instruction;
and the control sub-module is used for controlling the punching machine to stop working based on the first control instruction.
In an exemplary embodiment, the mold history management apparatus further includes:
the receiving module is used for receiving first characteristic information of the master mould and second characteristic information of the slave mould, which are acquired by a first RFID reader-writer;
a second determining module, configured to determine whether the sub mold and the mother mold are matched based on the first characteristic information and the second characteristic information;
and the generating module is used for generating a second control instruction if the first control instruction is positive, wherein the second control instruction is used for controlling the punching machine to start working.
The specific implementation of the mold history management apparatus of the present application is substantially the same as that of the above embodiments of the mold history management method, and will not be described herein again.
In addition, this application still provides a mould record management equipment. As shown in fig. 3, fig. 3 is a schematic structural diagram of a hardware operating environment according to an embodiment of the present application.
For example, fig. 3 may be a schematic structural diagram of a hardware operating environment of the mold history management apparatus.
As shown in fig. 3, the mold history management apparatus may include a processor 301, a communication interface 302, a memory 303, and a communication bus 304, wherein the processor 301, the communication interface 302, and the memory 303 communicate with each other through the communication bus 304, and the memory 303 stores a computer program; the processor 301 is configured to implement the steps of the mold history management method when executing the program stored in the memory 303.
The communication bus 304 mentioned in the above mold history management device may be a Peripheral Component Interconnect (PCI) bus, an Extended Industry Standard Architecture (EISA) bus, or the like. The communication bus 304 may be divided into an address bus, a data bus, a control bus, and the like. For ease of illustration, only one thick line is shown, but this does not mean that there is only one bus or one type of bus.
The communication interface 302 is used for communication between the mold history management apparatus and another apparatus.
The Memory 303 may include a Random Access Memory (RMD) or a Non-Volatile Memory (NM), such as at least one disk Memory. Optionally, the memory 303 may also be at least one storage device located remotely from the processor 301.
The Processor 301 may be a general-purpose Processor, including a Central Processing Unit (CPU), a Network Processor (NP), and the like; but also Digital Signal Processors (DSPs), Application Specific Integrated Circuits (ASICs), Field Programmable Gate Arrays (FPGAs) or other Programmable logic devices, discrete Gate or transistor logic devices, discrete hardware components.
The specific implementation of the mold history management apparatus of the present application is substantially the same as that of the above embodiments of the mold history management method, and will not be described herein again.
In addition, an embodiment of the present application further provides a computer-readable storage medium, in which a mold history management program is stored, and the mold history management program implements the steps of the mold history management method when executed by a processor.
The specific implementation of the computer-readable storage medium of the present application is substantially the same as the embodiments of the mold history management method, and is not further described herein.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The above-mentioned serial numbers of the embodiments of the present application are merely for description, and do not represent the advantages and disadvantages of the embodiments.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present application or portions thereof that contribute to the prior art may be embodied in the form of a software product, where the computer software product is stored in a storage medium (such as a ROM/RAM, a magnetic disk, and an optical disk), and includes several instructions for enabling a terminal device (which may be a mobile phone, a computer, a server, a device, or a network device) to execute the method described in the embodiments of the present application.
The above description is only a preferred embodiment of the present application, and not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application, or which are directly or indirectly applied to other related technical fields, are included in the scope of the present application.
Claims (10)
1. A method for managing mold history, the method comprising:
acquiring stamping information of a stamping machine;
receiving vibration data of a mold collected by an ultrasonic sensor, and determining defect information of the mold based on the vibration data;
and controlling a first RFID reader-writer to write the stamping information and the defect information into a label of the die so as to enable an operator to perform subsequent management on the die.
2. The method of claim 1, wherein said receiving vibration data of the mold collected by an ultrasonic sensor and determining defect information of the mold based on the vibration data comprises:
receiving a current signal output by an ultrasonic sensor;
determining vibration information of the mold based on the current signal;
if the vibration information is abnormal vibration, determining that the defect information of the mold is defective;
and if the vibration information is normal vibration, determining that the defect information of the mold is defect-free.
3. The method of claim 2, wherein determining vibration information for the mold based on the current signal comprises:
calculating the intensity difference value of the current signal and a preset current signal;
if the intensity difference is larger than a preset intensity difference, determining that the vibration information is abnormal vibration;
if not, determining that the vibration information is normal vibration.
4. The method according to claim 2, wherein the determining that the defect information of the mold is a defect if the vibration information is abnormal vibration comprises:
generating a first control instruction;
and controlling the punching machine to stop working based on the first control command.
5. The method of claim 1, wherein the dies include a master die and a slave die, and the obtaining the punching information of the punching machine comprises:
receiving first characteristic information of the master mould and second characteristic information of the slave mould, which are acquired by a first RFID reader-writer;
determining whether the sub-mold is matched with the mother mold based on the first characteristic information and the second characteristic information;
and if so, generating a second control command, wherein the second control command is used for controlling the punching machine to start working.
6. A mold history management system, the system comprising: the system comprises an ultrasonic sensor, control equipment and a first RFID reader-writer;
the ultrasonic sensor is used for acquiring vibration data of the die and sending the vibration data to the control equipment;
the control equipment is used for acquiring the stamping information of the stamping machine; receiving the vibration data acquired by the ultrasonic sensor, and determining defect information of the die based on the vibration data; controlling the first RFID reader-writer to write the stamping information and the defect information into a label of the die so as to enable an operator to perform subsequent management on the die;
the first RFID reader-writer is used for writing the stamping information and the defect information into a label of the die.
7. The system of claim 6, wherein the system further comprises: a second RFID reader;
the second RFID reader-writer is also used for identifying the stamping information and the defect information in the label so as to be maintained by an operator; and after the operator finishes the maintenance of the die, writing maintenance information into the label.
8. A mold history management apparatus, comprising:
the acquisition module is used for acquiring the stamping information of the stamping machine;
the first determining module is used for receiving vibration data of the die collected by the ultrasonic sensor and determining defect information of the die based on the vibration data;
and the control module is used for controlling the first RFID reader-writer to write the stamping information and the defect information into the label of the die so as to allow an operator to perform subsequent management on the die.
9. A mold record management apparatus comprising a memory, a processor, and a mold record management program stored on the memory and executable on the processor, the mold record management program when executed by the processor implementing the steps of the mold record management method of any one of claims 1 to 5.
10. A computer-readable storage medium, having a mold history management program stored thereon, the mold history management program, when executed by a processor, implementing the steps of the mold history management method of any of claims 1 to 5.
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