JP2017063180A5 - - Google Patents

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Publication number
JP2017063180A5
JP2017063180A5 JP2016139119A JP2016139119A JP2017063180A5 JP 2017063180 A5 JP2017063180 A5 JP 2017063180A5 JP 2016139119 A JP2016139119 A JP 2016139119A JP 2016139119 A JP2016139119 A JP 2016139119A JP 2017063180 A5 JP2017063180 A5 JP 2017063180A5
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JP
Japan
Prior art keywords
die
board
reflow
bond pad
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016139119A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017063180A (ja
Filing date
Publication date
Priority claimed from US14/812,861 external-priority patent/US9847310B2/en
Application filed filed Critical
Publication of JP2017063180A publication Critical patent/JP2017063180A/ja
Publication of JP2017063180A5 publication Critical patent/JP2017063180A5/ja
Pending legal-status Critical Current

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JP2016139119A 2015-07-18 2016-07-14 合金のフリップチップ接合 Pending JP2017063180A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201562194205P 2015-07-18 2015-07-18
US62/194,205 2015-07-18
US14/812,861 2015-07-29
US14/812,861 US9847310B2 (en) 2015-07-18 2015-07-29 Flip chip bonding alloys

Publications (2)

Publication Number Publication Date
JP2017063180A JP2017063180A (ja) 2017-03-30
JP2017063180A5 true JP2017063180A5 (cg-RX-API-DMAC10.html) 2019-08-29

Family

ID=56418458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016139119A Pending JP2017063180A (ja) 2015-07-18 2016-07-14 合金のフリップチップ接合

Country Status (4)

Country Link
US (1) US9847310B2 (cg-RX-API-DMAC10.html)
EP (1) EP3121843A3 (cg-RX-API-DMAC10.html)
JP (1) JP2017063180A (cg-RX-API-DMAC10.html)
CN (1) CN106356366B (cg-RX-API-DMAC10.html)

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US10439587B2 (en) 2016-12-02 2019-10-08 Skyworks Solutions, Inc. Methods of manufacturing electronic devices formed in a cavity
DE102017108422A1 (de) * 2017-04-20 2018-10-25 Osram Opto Semiconductors Gmbh Verfahren zum Befestigen eines Halbleiterchips auf einem Leiterrahmen und elektronisches Bauelement
US10600755B2 (en) * 2017-08-10 2020-03-24 Amkor Technology, Inc. Method of manufacturing an electronic device and electronic device manufactured thereby
KR102637666B1 (ko) 2018-05-14 2024-02-16 엑소 이미징, 인크. 열압착 본딩, 공융 본딩, 및 솔더 본딩을 사용하는 마이크로머신 pMUT 어레이들 및 전자기기들을 위한 통합 기법들
WO2019222116A1 (en) * 2018-05-14 2019-11-21 Exo Imaging, Inc. INTEGRATION TECHNIQUES FOR MICROMACHINED pMUT ARRAYS AND ELECTRONICS USING SOLID LIQUID INTERDIFFUSION (SLID)
US10388627B1 (en) * 2018-07-23 2019-08-20 Mikro Mesa Technology Co., Ltd. Micro-bonding structure and method of forming the same
US10347602B1 (en) * 2018-07-23 2019-07-09 Mikro Mesa Technology Co., Ltd. Micro-bonding structure
CN111373553B (zh) * 2019-12-30 2022-01-07 重庆康佳光电技术研究院有限公司 一种发光器件及其制备方法、显示装置

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