JP2017061080A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2017061080A5 JP2017061080A5 JP2015187537A JP2015187537A JP2017061080A5 JP 2017061080 A5 JP2017061080 A5 JP 2017061080A5 JP 2015187537 A JP2015187537 A JP 2015187537A JP 2015187537 A JP2015187537 A JP 2015187537A JP 2017061080 A5 JP2017061080 A5 JP 2017061080A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- metal foil
- group
- resin
- treated metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims 81
- 239000011888 foil Substances 0.000 claims 41
- 229910052751 metal Inorganic materials 0.000 claims 40
- 239000002184 metal Substances 0.000 claims 40
- 229920005989 resin Polymers 0.000 claims 31
- 239000011347 resin Substances 0.000 claims 31
- 125000005843 halogen group Chemical group 0.000 claims 18
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 18
- 125000003545 alkoxy group Chemical group 0.000 claims 12
- 239000002335 surface treatment layer Substances 0.000 claims 11
- 239000000758 substrate Substances 0.000 claims 10
- 125000000217 alkyl group Chemical group 0.000 claims 9
- 125000003118 aryl group Chemical group 0.000 claims 9
- 125000000753 cycloalkyl group Chemical group 0.000 claims 9
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 9
- -1 aluminate compound Chemical class 0.000 claims 8
- 230000007062 hydrolysis Effects 0.000 claims 8
- 238000006460 hydrolysis reaction Methods 0.000 claims 8
- 239000000463 material Substances 0.000 claims 7
- 229910000077 silane Inorganic materials 0.000 claims 7
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 6
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims 6
- 150000001875 compounds Chemical class 0.000 claims 6
- 230000008878 coupling Effects 0.000 claims 6
- 238000010168 coupling process Methods 0.000 claims 6
- 238000005859 coupling reaction Methods 0.000 claims 6
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 6
- 238000004519 manufacturing process Methods 0.000 claims 6
- 230000002265 prevention Effects 0.000 claims 6
- 238000007788 roughening Methods 0.000 claims 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 5
- 239000011889 copper foil Substances 0.000 claims 5
- 238000000034 method Methods 0.000 claims 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 4
- 239000004840 adhesive resin Substances 0.000 claims 3
- 229920006223 adhesive resin Polymers 0.000 claims 3
- 229910052782 aluminium Inorganic materials 0.000 claims 3
- 125000003396 thiol group Chemical group [H]S* 0.000 claims 3
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 claims 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 2
- 229910052731 fluorine Inorganic materials 0.000 claims 2
- 239000011737 fluorine Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000004381 surface treatment Methods 0.000 claims 2
- KKYDYRWEUFJLER-UHFFFAOYSA-N 1,1,2,2,3,3,4,4,5,5,6,6,7,7,10,10,10-heptadecafluorodecyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)CCC(F)(F)F KKYDYRWEUFJLER-UHFFFAOYSA-N 0.000 claims 1
- 229920000106 Liquid crystal polymer Polymers 0.000 claims 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- CZWLNMOIEMTDJY-UHFFFAOYSA-N hexyl(trimethoxy)silane Chemical compound CCCCCC[Si](OC)(OC)OC CZWLNMOIEMTDJY-UHFFFAOYSA-N 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims 1
- 239000004810 polytetrafluoroethylene Substances 0.000 claims 1
- 239000005871 repellent Substances 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015187537A JP6498091B2 (ja) | 2015-09-25 | 2015-09-25 | 表面処理金属箔、積層体、プリント配線板、半導体パッケージ、電子機器 |
| TW105130807A TWI618814B (zh) | 2015-09-25 | 2016-09-23 | Surface treatment metal foil, laminate, printed wiring board, semiconductor package, electronic device, and printed wiring board manufacturing method |
| PCT/JP2016/078117 WO2017051905A1 (ja) | 2015-09-25 | 2016-09-23 | 表面処理金属箔、積層体、プリント配線板、半導体パッケージ、電子機器及びプリント配線板の製造方法 |
| CN201680049528.5A CN107921749A (zh) | 2015-09-25 | 2016-09-23 | 表面处理金属箔、积层体、印刷配线板、半导体封装、电子机器及印刷配线板的制造方法 |
| KR1020187009978A KR20180051600A (ko) | 2015-09-25 | 2016-09-23 | 표면 처리 금속박, 적층체, 프린트 배선판, 반도체 패키지, 전자기기 및 프린트 배선판의 제조 방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015187537A JP6498091B2 (ja) | 2015-09-25 | 2015-09-25 | 表面処理金属箔、積層体、プリント配線板、半導体パッケージ、電子機器 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018090929A Division JP2018121085A (ja) | 2018-05-09 | 2018-05-09 | プリント配線板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017061080A JP2017061080A (ja) | 2017-03-30 |
| JP2017061080A5 true JP2017061080A5 (https=) | 2018-01-11 |
| JP6498091B2 JP6498091B2 (ja) | 2019-04-10 |
Family
ID=58386090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015187537A Expired - Fee Related JP6498091B2 (ja) | 2015-09-25 | 2015-09-25 | 表面処理金属箔、積層体、プリント配線板、半導体パッケージ、電子機器 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6498091B2 (https=) |
| KR (1) | KR20180051600A (https=) |
| CN (1) | CN107921749A (https=) |
| TW (1) | TWI618814B (https=) |
| WO (1) | WO2017051905A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10581081B1 (en) * | 2019-02-01 | 2020-03-03 | Chang Chun Petrochemical Co., Ltd. | Copper foil for negative electrode current collector of lithium ion secondary battery |
| JP7607343B2 (ja) | 2022-03-24 | 2024-12-27 | 株式会社サーフテクノロジー | 固着物剥離性改善表面処理方法及び固着物剥離性改善部材 |
| CN115867626A (zh) * | 2022-03-30 | 2023-03-28 | 东洋油墨Sc控股株式会社 | 金属板用接合剂、印刷配线板用增强构件及其制造方法、以及配线板及其制造方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02144177A (ja) * | 1988-11-26 | 1990-06-01 | Nisshin Steel Co Ltd | 金属板への有機薄膜形成方法 |
| JPH08246163A (ja) * | 1995-01-11 | 1996-09-24 | Kao Corp | 金属表面への撥液性付与方法 |
| JP2008104936A (ja) * | 2006-10-25 | 2008-05-08 | National Institute Of Advanced Industrial & Technology | 超撥水性アルミ箔及びその製造方法 |
| JP5114355B2 (ja) * | 2008-10-08 | 2013-01-09 | 株式会社Ｓｎｔ | 撥水・撥油性コーティング物品およびその製造 |
| JP4790003B2 (ja) * | 2008-12-26 | 2011-10-12 | 株式会社カーメイト | コーティング膜形成方法およびコーティング液 |
| WO2012101985A1 (ja) * | 2011-01-26 | 2012-08-02 | 住友ベークライト株式会社 | プリント配線板およびプリント配線板の製造方法 |
| US20140110153A1 (en) * | 2012-01-17 | 2014-04-24 | Panasonic Corporation | Wiring board and method for manufacturing the same |
| WO2013125658A1 (ja) * | 2012-02-24 | 2013-08-29 | Ｊｆｅスチール株式会社 | 金属材料、表面処理方法及び装置 |
| WO2013183606A1 (ja) * | 2012-06-04 | 2013-12-12 | Jx日鉱日石金属株式会社 | キャリア付金属箔 |
| CN104335688B (zh) * | 2012-06-04 | 2018-02-09 | Jx日矿日石金属株式会社 | 多层印刷配线板的制造方法 |
| JP2014014752A (ja) * | 2012-07-06 | 2014-01-30 | Toyota Motor Corp | 撥水撥油性被膜の形成方法、及び当該方法によって形成される撥水撥油性被膜 |
| TWI551436B (zh) * | 2012-09-24 | 2016-10-01 | Ｊｘ日鑛日石金屬股份有限公司 | A carrier metal foil, a laminate made of a resin-made plate-like carrier and a metal foil, and the like |
| US9528020B2 (en) * | 2013-01-07 | 2016-12-27 | Mitsubishi Electric Corporation | Coating composition, method for producing same, and coated article |
| JP6593979B2 (ja) * | 2013-07-24 | 2019-10-23 | Ｊｘ金属株式会社 | 表面処理銅箔、キャリア付銅箔、基材、銅張積層板の製造方法、電子機器の製造方法及びプリント配線板の製造方法 |
| JP6266965B2 (ja) * | 2013-12-04 | 2018-01-24 | Ｊｘ金属株式会社 | 多層プリント配線基板の製造方法及びベース基材 |
| JP6327840B2 (ja) * | 2013-12-04 | 2018-05-23 | Ｊｘ金属株式会社 | 熱硬化性樹脂と離型剤とを含む樹脂組成物 |
| JP6306865B2 (ja) * | 2013-12-05 | 2018-04-04 | Ｊｘ金属株式会社 | 樹脂基板を互いに剥離可能に密着させた積層体 |
| CN106102935A (zh) * | 2014-03-18 | 2016-11-09 | 3M创新有限公司 | 经处理的制品及其制备方法 |
-
2015
- 2015-09-25 JP JP2015187537A patent/JP6498091B2/ja not_active Expired - Fee Related
-
2016
- 2016-09-23 TW TW105130807A patent/TWI618814B/zh not_active IP Right Cessation
- 2016-09-23 KR KR1020187009978A patent/KR20180051600A/ko not_active Ceased
- 2016-09-23 WO PCT/JP2016/078117 patent/WO2017051905A1/ja not_active Ceased
- 2016-09-23 CN CN201680049528.5A patent/CN107921749A/zh active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104685980B (zh) | 多层印刷配线基板的制造方法及基底基材 | |
| JP5168141B2 (ja) | メタライジング用ポリイミドフィルムおよび金属積層ポリイミドフィルム | |
| CN103430642B (zh) | 多层印刷线路板的制造方法 | |
| JP2017034216A5 (https=) | ||
| KR102344267B1 (ko) | 이형 폴리이미드 필름, 접착층 부착 이형 폴리이미드 필름이 부착된 적층판, 적층판, 접착층 부착 이형 폴리이미드 필름이 부착된 단층 또는 다층 배선판, 및 다층 배선판의 제조 방법 | |
| CN106232350B (zh) | 带剥离树脂层的金属箔和印刷电路板 | |
| TW201811557A (zh) | 附脫模層的銅箔、積層體、印刷配線板的製造方法及電子機器的製造方法 | |
| JP2017061080A5 (https=) | ||
| TWI455969B (zh) | 樹脂組成物薄片、附金屬箔之樹脂組成物薄片、金屬基底配線板材料、金屬基底配線板、及ｌｅｄ光源構件 | |
| JPWO2020262450A5 (https=) | ||
| US8591750B2 (en) | Multilayer wiring board and manufacturing method thereof | |
| CN104650539A (zh) | 树脂组合物 | |
| KR102826349B1 (ko) | 조화 경화체 | |
| JP2015130478A (ja) | プリント回路基板およびその製造方法 | |
| JP2018125378A5 (https=) | ||
| KR102126611B1 (ko) | 박리성 동박, 코어리스 기판의 제조방법 및 이 방법으로 얻어진 코어리스 기판 | |
| CN105542127A (zh) | 树脂组合物 | |
| ATE356676T1 (de) | Nanostrukturbeschichtungen | |
| US20180242450A1 (en) | Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board | |
| JP2017193730A (ja) | スパッタリング式無機コンポジット膜を具備するキャリア付き銅箔及びその作成方法 | |
| JP6705094B2 (ja) | 離型フィルム付銅箔および離型フィルム付銅箔の製造方法 | |
| JP6266965B2 (ja) | 多層プリント配線基板の製造方法及びベース基材 | |
| JP2016153173A (ja) | ガスバリア性フィルム及びその製造方法、ならびにそれを用いた画像表示素子 | |
| TW201410107A (zh) | 印刷電路板及其製造方法 | |
| WO2017051908A1 (ja) | 金属箔、離型層付き金属箔、積層体、プリント配線板、半導体パッケージ、電子機器及びプリント配線板の製造方法 |