TWI618814B - Surface treatment metal foil, laminate, printed wiring board, semiconductor package, electronic device, and printed wiring board manufacturing method - Google Patents

Surface treatment metal foil, laminate, printed wiring board, semiconductor package, electronic device, and printed wiring board manufacturing method Download PDF

Info

Publication number
TWI618814B
TWI618814B TW105130807A TW105130807A TWI618814B TW I618814 B TWI618814 B TW I618814B TW 105130807 A TW105130807 A TW 105130807A TW 105130807 A TW105130807 A TW 105130807A TW I618814 B TWI618814 B TW I618814B
Authority
TW
Taiwan
Prior art keywords
metal foil
layer
group
resin
treated metal
Prior art date
Application number
TW105130807A
Other languages
English (en)
Chinese (zh)
Other versions
TW201718937A (zh
Inventor
森山晃正
石井雅史
Original Assignee
Ｊｘ金屬股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｊｘ金屬股份有限公司 filed Critical Ｊｘ金屬股份有限公司
Publication of TW201718937A publication Critical patent/TW201718937A/zh
Application granted granted Critical
Publication of TWI618814B publication Critical patent/TWI618814B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electroplating Methods And Accessories (AREA)
TW105130807A 2015-09-25 2016-09-23 Surface treatment metal foil, laminate, printed wiring board, semiconductor package, electronic device, and printed wiring board manufacturing method TWI618814B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2015-187537 2015-09-25
JP2015187537A JP6498091B2 (ja) 2015-09-25 2015-09-25 表面処理金属箔、積層体、プリント配線板、半導体パッケージ、電子機器

Publications (2)

Publication Number Publication Date
TW201718937A TW201718937A (zh) 2017-06-01
TWI618814B true TWI618814B (zh) 2018-03-21

Family

ID=58386090

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105130807A TWI618814B (zh) 2015-09-25 2016-09-23 Surface treatment metal foil, laminate, printed wiring board, semiconductor package, electronic device, and printed wiring board manufacturing method

Country Status (5)

Country Link
JP (1) JP6498091B2 (https=)
KR (1) KR20180051600A (https=)
CN (1) CN107921749A (https=)
TW (1) TWI618814B (https=)
WO (1) WO2017051905A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10581081B1 (en) * 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
JP7607343B2 (ja) 2022-03-24 2024-12-27 株式会社サーフテクノロジー 固着物剥離性改善表面処理方法及び固着物剥離性改善部材
CN115867626A (zh) * 2022-03-30 2023-03-28 东洋油墨Sc控股株式会社 金属板用接合剂、印刷配线板用增强构件及其制造方法、以及配线板及其制造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02144177A (ja) * 1988-11-26 1990-06-01 Nisshin Steel Co Ltd 金属板への有機薄膜形成方法
JPH08246163A (ja) * 1995-01-11 1996-09-24 Kao Corp 金属表面への撥液性付与方法
JP2008104936A (ja) * 2006-10-25 2008-05-08 National Institute Of Advanced Industrial & Technology 超撥水性アルミ箔及びその製造方法
JP2012169598A (ja) * 2011-01-26 2012-09-06 Sumitomo Bakelite Co Ltd プリント配線板およびプリント配線板の製造方法
JP2014060407A (ja) * 2012-01-17 2014-04-03 Panasonic Corp 配線基板とその製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5114355B2 (ja) * 2008-10-08 2013-01-09 株式会社Ｓｎｔ 撥水・撥油性コーティング物品およびその製造
JP4790003B2 (ja) * 2008-12-26 2011-10-12 株式会社カーメイト コーティング膜形成方法およびコーティング液
WO2013125658A1 (ja) * 2012-02-24 2013-08-29 Ｊｆｅスチール株式会社 金属材料、表面処理方法及び装置
WO2013183606A1 (ja) * 2012-06-04 2013-12-12 Jx日鉱日石金属株式会社 キャリア付金属箔
CN104335688B (zh) * 2012-06-04 2018-02-09 Jx日矿日石金属株式会社 多层印刷配线板的制造方法
JP2014014752A (ja) * 2012-07-06 2014-01-30 Toyota Motor Corp 撥水撥油性被膜の形成方法、及び当該方法によって形成される撥水撥油性被膜
TWI551436B (zh) * 2012-09-24 2016-10-01 Ｊｘ日鑛日石金屬股份有限公司 A carrier metal foil, a laminate made of a resin-made plate-like carrier and a metal foil, and the like
US9528020B2 (en) * 2013-01-07 2016-12-27 Mitsubishi Electric Corporation Coating composition, method for producing same, and coated article
JP6593979B2 (ja) * 2013-07-24 2019-10-23 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、基材、銅張積層板の製造方法、電子機器の製造方法及びプリント配線板の製造方法
JP6266965B2 (ja) * 2013-12-04 2018-01-24 Ｊｘ金属株式会社 多層プリント配線基板の製造方法及びベース基材
JP6327840B2 (ja) * 2013-12-04 2018-05-23 Ｊｘ金属株式会社 熱硬化性樹脂と離型剤とを含む樹脂組成物
JP6306865B2 (ja) * 2013-12-05 2018-04-04 Ｊｘ金属株式会社 樹脂基板を互いに剥離可能に密着させた積層体
CN106102935A (zh) * 2014-03-18 2016-11-09 3M创新有限公司 经处理的制品及其制备方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02144177A (ja) * 1988-11-26 1990-06-01 Nisshin Steel Co Ltd 金属板への有機薄膜形成方法
JPH08246163A (ja) * 1995-01-11 1996-09-24 Kao Corp 金属表面への撥液性付与方法
JP2008104936A (ja) * 2006-10-25 2008-05-08 National Institute Of Advanced Industrial & Technology 超撥水性アルミ箔及びその製造方法
JP2012169598A (ja) * 2011-01-26 2012-09-06 Sumitomo Bakelite Co Ltd プリント配線板およびプリント配線板の製造方法
JP2014060407A (ja) * 2012-01-17 2014-04-03 Panasonic Corp 配線基板とその製造方法

Also Published As

Publication number Publication date
JP2017061080A (ja) 2017-03-30
KR20180051600A (ko) 2018-05-16
CN107921749A (zh) 2018-04-17
WO2017051905A1 (ja) 2017-03-30
JP6498091B2 (ja) 2019-04-10
TW201718937A (zh) 2017-06-01

Similar Documents

Publication Publication Date Title
TWI660651B (zh) 金屬箔、附脫模層之金屬箔、積層體、印刷配線板、半導體封裝、電子機器及印刷配線板之製造方法
TWI610599B (zh) 表面處理銅箔、覆銅積層板、印刷配線板、電子機器、半導體封裝用電路形成基板、半導體封裝及印刷配線板之製造方法
TWI631228B (zh) Metal foil, release layer metal foil, laminate, printed circuit board, semiconductor package, electronic device, and printed circuit board manufacturing method
TW201811557A (zh) 附脫模層的銅箔、積層體、印刷配線板的製造方法及電子機器的製造方法
TWI619413B (zh) 印刷配線板之製造方法、表面處理銅箔、積層體、印刷配線板、半導體封裝及電子機器
TWI660658B (zh) 附脫模層金屬箔、金屬箔、積層體、印刷配線板、半導體封裝、電子機器及印刷配線板的製造方法
TWI618814B (zh) Surface treatment metal foil, laminate, printed wiring board, semiconductor package, electronic device, and printed wiring board manufacturing method
TWI625229B (zh) Metal foil, metal foil with release layer, laminate, printed wiring board, semiconductor package, electronic device, and printed wiring board manufacturing method
TWI645959B (zh) 金屬箔、附脫模層之金屬箔、積層體、印刷配線板、半導體封裝、電子機器及印刷配線板之製造方法
JP2018121085A (ja) プリント配線板の製造方法
CN108696988A (zh) 附脱模层铜箔、积层体、印刷配线板的制造方法及电子机器的制造方法
WO2017022807A1 (ja) プリント配線板の製造方法、表面処理銅箔、積層体、プリント配線板、半導体パッケージ及び電子機器
JP2015212426A (ja) 表面処理銅箔、銅張積層板、プリント配線板、電子機器、半導体パッケージ、プリント配線板の製造方法、樹脂基材の製造方法、銅箔の表面プロファイルを樹脂基材に転写する方法及び樹脂基材
JP2016135924A (ja) 表面処理銅箔、銅張積層板、プリント配線板の製造方法、半導体パッケージの製造方法及び電子機器の製造方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees