JP2017045875A - 半導体モジュールおよびその製造方法 - Google Patents

半導体モジュールおよびその製造方法 Download PDF

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Publication number
JP2017045875A
JP2017045875A JP2015167644A JP2015167644A JP2017045875A JP 2017045875 A JP2017045875 A JP 2017045875A JP 2015167644 A JP2015167644 A JP 2015167644A JP 2015167644 A JP2015167644 A JP 2015167644A JP 2017045875 A JP2017045875 A JP 2017045875A
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JP
Japan
Prior art keywords
semiconductor module
bus bar
shunt resistor
lead frame
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015167644A
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English (en)
Japanese (ja)
Other versions
JP2017045875A5 (enExample
Inventor
康寛 川井
Yasuhiro Kawai
康寛 川井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NSK Ltd
Original Assignee
NSK Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NSK Ltd filed Critical NSK Ltd
Priority to JP2015167644A priority Critical patent/JP2017045875A/ja
Publication of JP2017045875A publication Critical patent/JP2017045875A/ja
Publication of JP2017045875A5 publication Critical patent/JP2017045875A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/848—Bonding techniques
    • H01L2224/84801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/848—Bonding techniques
    • H01L2224/8485—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Inverter Devices (AREA)
JP2015167644A 2015-08-27 2015-08-27 半導体モジュールおよびその製造方法 Pending JP2017045875A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015167644A JP2017045875A (ja) 2015-08-27 2015-08-27 半導体モジュールおよびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015167644A JP2017045875A (ja) 2015-08-27 2015-08-27 半導体モジュールおよびその製造方法

Publications (2)

Publication Number Publication Date
JP2017045875A true JP2017045875A (ja) 2017-03-02
JP2017045875A5 JP2017045875A5 (enExample) 2018-09-27

Family

ID=58211943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015167644A Pending JP2017045875A (ja) 2015-08-27 2015-08-27 半導体モジュールおよびその製造方法

Country Status (1)

Country Link
JP (1) JP2017045875A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018157023A (ja) * 2017-03-16 2018-10-04 株式会社デンソー 半導体装置およびその製造方法
WO2025243765A1 (ja) * 2024-05-21 2025-11-27 株式会社デンソー 電力変換モジュール及び電力変換装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015083944A (ja) * 2013-10-25 2015-04-30 コーア株式会社 電流検出装置
WO2015068196A1 (ja) * 2013-11-05 2015-05-14 三菱電機株式会社 半導体モジュール

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015083944A (ja) * 2013-10-25 2015-04-30 コーア株式会社 電流検出装置
WO2015068196A1 (ja) * 2013-11-05 2015-05-14 三菱電機株式会社 半導体モジュール

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018157023A (ja) * 2017-03-16 2018-10-04 株式会社デンソー 半導体装置およびその製造方法
WO2025243765A1 (ja) * 2024-05-21 2025-11-27 株式会社デンソー 電力変換モジュール及び電力変換装置

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