JP2017028019A5 - - Google Patents

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Publication number
JP2017028019A5
JP2017028019A5 JP2015143169A JP2015143169A JP2017028019A5 JP 2017028019 A5 JP2017028019 A5 JP 2017028019A5 JP 2015143169 A JP2015143169 A JP 2015143169A JP 2015143169 A JP2015143169 A JP 2015143169A JP 2017028019 A5 JP2017028019 A5 JP 2017028019A5
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JP
Japan
Prior art keywords
mainly composed
layer
heat dissipation
inorganic layer
coating
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JP2015143169A
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English (en)
Japanese (ja)
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JP6517103B2 (ja
JP2017028019A (ja
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Priority to JP2015143169A priority Critical patent/JP6517103B2/ja
Priority claimed from JP2015143169A external-priority patent/JP6517103B2/ja
Priority to CN201811414148.4A priority patent/CN109560051A/zh
Priority to CN201610518471.0A priority patent/CN106356343A/zh
Priority to TW105121693A priority patent/TWI613843B/zh
Publication of JP2017028019A publication Critical patent/JP2017028019A/ja
Publication of JP2017028019A5 publication Critical patent/JP2017028019A5/ja
Application granted granted Critical
Publication of JP6517103B2 publication Critical patent/JP6517103B2/ja
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JP2015143169A 2015-07-17 2015-07-17 放熱基板、デバイス及び放熱基板の製造方法 Active JP6517103B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015143169A JP6517103B2 (ja) 2015-07-17 2015-07-17 放熱基板、デバイス及び放熱基板の製造方法
CN201811414148.4A CN109560051A (zh) 2015-07-17 2016-07-04 散热基板、装置及散热基板的制造方法
CN201610518471.0A CN106356343A (zh) 2015-07-17 2016-07-04 散热基板、装置及散热基板的制造方法
TW105121693A TWI613843B (zh) 2015-07-17 2016-07-11 散熱基板、具有散熱基板的裝置及散熱基板的製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015143169A JP6517103B2 (ja) 2015-07-17 2015-07-17 放熱基板、デバイス及び放熱基板の製造方法

Publications (3)

Publication Number Publication Date
JP2017028019A JP2017028019A (ja) 2017-02-02
JP2017028019A5 true JP2017028019A5 (enExample) 2019-01-31
JP6517103B2 JP6517103B2 (ja) 2019-05-22

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Family Applications (1)

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JP2015143169A Active JP6517103B2 (ja) 2015-07-17 2015-07-17 放熱基板、デバイス及び放熱基板の製造方法

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JP (1) JP6517103B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102191613B1 (ko) * 2017-09-15 2020-12-15 주식회사 엘지화학 복합재
KR102191614B1 (ko) 2017-09-15 2020-12-15 주식회사 엘지화학 복합재
KR102191615B1 (ko) 2017-09-22 2020-12-15 주식회사 엘지화학 복합재
JP2025078903A (ja) * 2022-04-01 2025-05-21 日東電工株式会社 積層体、放熱基板および積層体の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3704518A1 (de) * 1987-02-13 1988-08-25 Hoechst Ag Beschichtungsloesung und verfahren zur erzeugung glasartiger schichten
JP2005314136A (ja) * 2004-04-27 2005-11-10 Matsushita Electric Ind Co Ltd 気密封止用封着材料およびガラスペースト組成物
JP2007134221A (ja) * 2005-11-11 2007-05-31 Matsushita Electric Ind Co Ltd リン酸系ガラス封着リング、その製造方法、およびディスプレイデバイス
JP2007297249A (ja) * 2006-05-01 2007-11-15 Taiyo Nippon Sanso Corp ガラスフリット
US20100009203A1 (en) * 2008-07-09 2010-01-14 Yoshikazu Nageno Insulation layer and method for producing thereof
JP2012222106A (ja) * 2011-04-07 2012-11-12 Jsr Corp 伝熱性部材、積層体および電子部品
DE102011115379B4 (de) * 2011-10-10 2018-09-27 Schott Ag Beschichtetes Glas- oder Glaskeramik-Substrat mit haptischen Eigenschaften und Glaskeramik-Kochfeld
JP2015117170A (ja) * 2013-12-19 2015-06-25 旭硝子株式会社 金属被覆用ガラスおよびガラス層付き金属部材

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