JP2017027047A - フォトリソグラフィー用洗浄液組成物及びこれを用いたフォトレジストパターンの形成方法 - Google Patents
フォトリソグラフィー用洗浄液組成物及びこれを用いたフォトレジストパターンの形成方法 Download PDFInfo
- Publication number
- JP2017027047A JP2017027047A JP2016138208A JP2016138208A JP2017027047A JP 2017027047 A JP2017027047 A JP 2017027047A JP 2016138208 A JP2016138208 A JP 2016138208A JP 2016138208 A JP2016138208 A JP 2016138208A JP 2017027047 A JP2017027047 A JP 2017027047A
- Authority
- JP
- Japan
- Prior art keywords
- cleaning liquid
- liquid composition
- photoresist
- photoresist pattern
- hydroxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 58
- 239000007788 liquid Substances 0.000 title claims abstract description 53
- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 44
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000000206 photolithography Methods 0.000 title claims abstract description 20
- 150000001875 compounds Chemical class 0.000 claims abstract description 22
- 239000000126 substance Substances 0.000 claims abstract description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 14
- -1 alcohol compound Chemical class 0.000 claims abstract description 9
- 125000001453 quaternary ammonium group Chemical group 0.000 claims abstract description 9
- 239000000908 ammonium hydroxide Substances 0.000 claims abstract description 8
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 30
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 claims description 12
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 9
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 claims description 9
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 claims description 6
- PHTQWCKDNZKARW-UHFFFAOYSA-N isoamylol Chemical compound CC(C)CCO PHTQWCKDNZKARW-UHFFFAOYSA-N 0.000 claims description 6
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 6
- NDKBVBUGCNGSJJ-UHFFFAOYSA-M benzyltrimethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)CC1=CC=CC=C1 NDKBVBUGCNGSJJ-UHFFFAOYSA-M 0.000 claims description 3
- 229940035429 isobutyl alcohol Drugs 0.000 claims description 3
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- VHLDQAOFSQCOFS-UHFFFAOYSA-M tetrakis(2-hydroxyethyl)azanium;hydroxide Chemical compound [OH-].OCC[N+](CCO)(CCO)CCO VHLDQAOFSQCOFS-UHFFFAOYSA-M 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- NIPLIJLVGZCKMP-UHFFFAOYSA-M Neurine Chemical compound [OH-].C[N+](C)(C)C=C NIPLIJLVGZCKMP-UHFFFAOYSA-M 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 2
- 238000001459 lithography Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000007261 regionalization Effects 0.000 abstract description 3
- 230000007547 defect Effects 0.000 description 25
- 235000011114 ammonium hydroxide Nutrition 0.000 description 7
- 239000004094 surface-active agent Substances 0.000 description 7
- 239000008367 deionised water Substances 0.000 description 6
- 229910021641 deionized water Inorganic materials 0.000 description 6
- 230000018109 developmental process Effects 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- WLKQPMRATNOBFE-UHFFFAOYSA-N ethenamine;hydrate Chemical compound [OH-].[NH3+]C=C WLKQPMRATNOBFE-UHFFFAOYSA-N 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- DZLFLBLQUQXARW-UHFFFAOYSA-N tetrabutylammonium Chemical compound CCCC[N+](CCCC)(CCCC)CCCC DZLFLBLQUQXARW-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
- G03F7/405—Treatment with inorganic or organometallic reagents after imagewise removal
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/72—Ethers of polyoxyalkylene glycols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/722—Ethers of polyoxyalkylene glycols having mixed oxyalkylene groups; Polyalkoxylated fatty alcohols or polyalkoxylated alkylaryl alcohols with mixed oxyalkylele groups
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/43—Solvents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Inorganic Chemistry (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Detergent Compositions (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
Abstract
【解決手段】化学式1で表される化合物0.001〜0.1重量%、四級アンモニウムヒドロキシド0.001〜0.1重量%、水溶性アルコール化合物0.1〜5重量%及び水(残量)を含むことを特徴とする、フォトリソグラフィー用洗浄液組成物。[化学式1]
式中、RはHまたはOHであり、xは5〜15の中から選ばれる整数であり、yは5〜10の中から選ばれる整数であり、zは0または1である。
【選択図】図1
Description
RはHまたはOHであり、
xは1〜100の中から選ばれる整数であり、
yは0〜100の中から選ばれる整数であり、
zは0〜100の中から選ばれる整数である。
RはHまたはOHであり、
xは5〜20の中から、好ましくは5〜15の中から、より好ましくは10〜15の中から選ばれる整数であり、
yは520の中から、好ましくは5〜15の中から、より好ましくは5〜10の中から選ばれる整数であり、
zは0〜3の中から、好ましくは0及び1から選ばれる整数である
前記化学式1で表される化合物は、界面活性剤であって、親油性基たるアルカン(Alkane)と、親水性基たるオキシエチレン(oxyethylene)基、エトキシ(ethoxy)基及び/またはプロポキシ(propoxy)基から構成されているから、脱イオン水の表面張力を著しく減少させることができ、一定の分子量以下の液体状態では水によく溶けるため、他の化合物との混合が容易である。
[実施例1]
前記化学式1で表される(式中、R=H、x=12、y=7、z=0)化合物0.01g、テトラブチルアンモニウムヒドロキシド0.01g及びイソプロピルアルコール1gに脱イオン水98.98gを追加混合して洗浄液組成物を製造した。
前記化学式1で表される(式中、R=H、x=12、y=9、z=0)化合物0.01g、テトラブチルアンモニウムヒドロキシド0.01g及びイソプロピルアルコール1gに脱イオン水98.98gを追加混合して洗浄液組成物を製造した。
前記化学式1で表される(式中、R=H、x=12、y=9、z=1)化合物0.01g、テトラブチルアンモニウムヒドロキシド0.01g及びイソプロピルアルコール1gに脱イオン水98.98gを追加混合して洗浄液組成物を製造した。
前記化学式1で表される(式中、R=OH、x=12、y=9、z=0)化合物0.01g、テトラブチルアンモニウムヒドロキシド0.01g及びイソプロピルアルコール1gに脱イオン水98.98gを追加混合して洗浄液組成物を製造した。
実施例1〜3で製造された洗浄液組成物を現像済みのフォトレジスト微細パターンに十分に塗布し、回転させた後、CD−SEM(HITACH社「高分解能FEB測長装置 CG6300」)を用いてパターン崩壊現象を観察し、その結果を表1及び図1に示した。パターン崩壊基準は、CD−SEM観察によって確認することができるが、パターンが崩れると、CD−SEMイメージから不良として観察される。
実施例2及び4で製造された洗浄液組成物を現像済みのフォトレジスト微細パターンに十分に塗布し、回転させた後、KLA装備(KLA-Tencor Corporation社2830シリーズ)を用いて欠陥数減少現象を観察し、その結果を表2及び図2に示した。
実施例2で製造された洗浄液組成物を現像済みのフォトレジストホールパターンに十分に塗布し、回転させた後、KLA装備(KLA-Tencor Corporation社2830シリーズ)を用いて欠陥数減少現象を観察し、その結果を表3及び図3に示した。
Claims (5)
- 前記アルコール化合物は、エタノール、ベンジルアルコール、イソプロピルアルコール、イソアミルアルコール、2−プロパノール、1−ペンタノール、イソブチルアルコール、ブチルアルコール、よりなる群から選ばれることを特徴とする、請求項1に記載のフォトリソグラフィー用洗浄液組成物。
- 前記四級アンモニウムヒドロキシドは、テトラキスデシルアンモニウムヒドロキシド、テトラキス(2−ヒドロキシエチル)アンモニウムヒドロキシド、テトラメチルアンモニウムヒドロキシド、テトラブチルアンモニウムヒドロキシド、ベンジルトリメチルアンモニウムヒドロキシド、及びトリメチルビニルアンモニウムヒドロキシドよりなる群から選ばれることを特徴とする、請求項1または2に記載のフォトリソグラフィー用洗浄液組成物。
- (a)半導体基板にフォトレジストを塗布し、膜を形成する段階と、
(b)前記フォトレジスト膜を露光させた後、現像してパターンを形成する段階と、
(c)形成されたフォトレジストパターンの崩壊防止のために、請求項1〜3のいずれか一項に記載のフォトリソグラフィー用洗浄液組成物でフォトレジストパターンを洗浄する段階とを含むことを特徴とする、フォトレジストパターン形成方法。 - 前記フォトレジストの露光は、KrF、ArF、及びEUVよりなる群から選ばれたいずれかを露光源として使用することを特徴とする、請求項4に記載のフォトレジストパターン形成方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150101689A KR101617169B1 (ko) | 2015-07-17 | 2015-07-17 | 포토리소그래피용 세정액 조성물 및 이를 이용한 포토레지스트 패턴의 형성방법 |
KR10-2015-0101689 | 2015-07-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017027047A true JP2017027047A (ja) | 2017-02-02 |
JP6175547B2 JP6175547B2 (ja) | 2017-08-02 |
Family
ID=56022680
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016138208A Active JP6175547B2 (ja) | 2015-07-17 | 2016-07-13 | フォトリソグラフィー用洗浄液組成物及びこれを用いたフォトレジストパターンの形成方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9829797B2 (ja) |
JP (1) | JP6175547B2 (ja) |
KR (1) | KR101617169B1 (ja) |
CN (2) | CN111505913A (ja) |
SG (1) | SG10201604551XA (ja) |
TW (1) | TWI605117B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107357142A (zh) * | 2017-07-03 | 2017-11-17 | 杭州格林达化学有限公司 | 一种水系光致抗蚀剂剥离液及其制备方法 |
JP2021521493A (ja) * | 2018-06-14 | 2021-08-26 | ヨンチャン ケミカル カンパニー リミテッドYoung Chang Chemical Co.,Ltd | 極紫外線リソグラフィー用工程液組成物、及びこれを用いるパターン形成方法 |
JP2021523417A (ja) * | 2018-06-14 | 2021-09-02 | ヨンチャン ケミカル カンパニー リミテッドYoung Chang Chemical Co.,Ltd | 極紫外線リソグラフィー用工程液組成物、及びこれを用いるパターン形成方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101759571B1 (ko) * | 2017-04-10 | 2017-07-19 | 영창케미칼 주식회사 | Euv용 감광성 포토레지스트 미세패턴 형성용 현상액 조성물 |
KR101947517B1 (ko) * | 2018-01-23 | 2019-02-13 | 영창케미칼 주식회사 | Euv 광원용 감광성 포토레지스트 미세패턴 형성용 현상액 조성물 |
EP3743772A1 (en) * | 2018-01-25 | 2020-12-02 | Merck Patent GmbH | Photoresist remover compositions |
EP3802768A1 (en) * | 2018-05-25 | 2021-04-14 | Basf Se | Use of compositions comprising a solvent mixture for avoiding pattern collapse when treating patterned materials with line-space dimensions of 50 nm or below |
CN111474833A (zh) * | 2020-05-29 | 2020-07-31 | 常州时创新材料有限公司 | 光刻润湿液及其应用 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000250229A (ja) * | 1999-02-24 | 2000-09-14 | Nec Corp | フォトレジスト膜の現像方法 |
WO2002073677A1 (en) * | 2001-03-14 | 2002-09-19 | Advanced Micro Devices, Inc. | Method and evaporating solution for rinsing a developed photoresist layer |
JP2005292827A (ja) * | 2004-03-19 | 2005-10-20 | Air Products & Chemicals Inc | 界面活性剤を含有する処理溶液 |
WO2005103832A1 (ja) * | 2004-04-23 | 2005-11-03 | Tokyo Ohka Kogyo Co., Ltd. | レジストパターン形成方法及び複合リンス液 |
JP2008182221A (ja) * | 2006-12-28 | 2008-08-07 | Sanyo Chem Ind Ltd | 半導体基板用洗浄剤 |
JP2009229572A (ja) * | 2008-03-19 | 2009-10-08 | Tokyo Ohka Kogyo Co Ltd | リソグラフィー用洗浄剤及びレジストパターン形成方法 |
JP2010256849A (ja) * | 2009-03-31 | 2010-11-11 | Tokyo Ohka Kogyo Co Ltd | リソグラフィー用洗浄液及びこれを用いたレジストパターンの形成方法 |
JP2011152719A (ja) * | 2010-01-27 | 2011-08-11 | Fujifilm Corp | レリーフ印刷版の製版方法 |
JP2014071287A (ja) * | 2012-09-28 | 2014-04-21 | Tokyo Ohka Kogyo Co Ltd | レジストパターン形成方法及びレジスト組成物 |
US20140256155A1 (en) * | 2013-03-11 | 2014-09-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cleaning Solution for Preventing Pattern Collapse |
JP2014219577A (ja) * | 2013-05-09 | 2014-11-20 | Azエレクトロニックマテリアルズマニュファクチャリング株式会社 | リソグラフィー用リンス液およびそれを用いたパターン形成方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7238653B2 (en) * | 2003-03-10 | 2007-07-03 | Hynix Semiconductor Inc. | Cleaning solution for photoresist and method for forming pattern using the same |
JP2004348103A (ja) * | 2003-03-27 | 2004-12-09 | Sumitomo Chem Co Ltd | フォトレジスト剥離剤 |
KR100682184B1 (ko) * | 2004-12-28 | 2007-02-12 | 주식회사 하이닉스반도체 | 감광막 패턴 수축용 조성물 |
KR101385946B1 (ko) * | 2007-04-02 | 2014-04-16 | 주식회사 동진쎄미켐 | 포토레지스트 조성물 및 이를 이용한 포토레지스트 패턴의형성 방법 |
MX340821B (es) * | 2011-11-18 | 2016-07-26 | Colgate Palmolive Co | Composicion de limpieza. |
-
2015
- 2015-07-17 KR KR1020150101689A patent/KR101617169B1/ko active IP Right Grant
-
2016
- 2016-06-02 TW TW105117408A patent/TWI605117B/zh active
- 2016-06-03 SG SG10201604551XA patent/SG10201604551XA/en unknown
- 2016-06-14 US US15/181,521 patent/US9829797B2/en active Active
- 2016-06-20 CN CN202010200244.XA patent/CN111505913A/zh active Pending
- 2016-06-20 CN CN201610446648.0A patent/CN106353976A/zh active Pending
- 2016-07-13 JP JP2016138208A patent/JP6175547B2/ja active Active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000250229A (ja) * | 1999-02-24 | 2000-09-14 | Nec Corp | フォトレジスト膜の現像方法 |
WO2002073677A1 (en) * | 2001-03-14 | 2002-09-19 | Advanced Micro Devices, Inc. | Method and evaporating solution for rinsing a developed photoresist layer |
JP2004527113A (ja) * | 2001-03-14 | 2004-09-02 | アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド | 現像済みフォトレジスト層をすすぐための方法および蒸発性の溶液 |
JP2005292827A (ja) * | 2004-03-19 | 2005-10-20 | Air Products & Chemicals Inc | 界面活性剤を含有する処理溶液 |
WO2005103832A1 (ja) * | 2004-04-23 | 2005-11-03 | Tokyo Ohka Kogyo Co., Ltd. | レジストパターン形成方法及び複合リンス液 |
JP2008182221A (ja) * | 2006-12-28 | 2008-08-07 | Sanyo Chem Ind Ltd | 半導体基板用洗浄剤 |
JP2009229572A (ja) * | 2008-03-19 | 2009-10-08 | Tokyo Ohka Kogyo Co Ltd | リソグラフィー用洗浄剤及びレジストパターン形成方法 |
JP2010256849A (ja) * | 2009-03-31 | 2010-11-11 | Tokyo Ohka Kogyo Co Ltd | リソグラフィー用洗浄液及びこれを用いたレジストパターンの形成方法 |
JP2011152719A (ja) * | 2010-01-27 | 2011-08-11 | Fujifilm Corp | レリーフ印刷版の製版方法 |
JP2014071287A (ja) * | 2012-09-28 | 2014-04-21 | Tokyo Ohka Kogyo Co Ltd | レジストパターン形成方法及びレジスト組成物 |
US20140256155A1 (en) * | 2013-03-11 | 2014-09-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cleaning Solution for Preventing Pattern Collapse |
JP2014219577A (ja) * | 2013-05-09 | 2014-11-20 | Azエレクトロニックマテリアルズマニュファクチャリング株式会社 | リソグラフィー用リンス液およびそれを用いたパターン形成方法 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107357142A (zh) * | 2017-07-03 | 2017-11-17 | 杭州格林达化学有限公司 | 一种水系光致抗蚀剂剥离液及其制备方法 |
CN107357142B (zh) * | 2017-07-03 | 2021-01-26 | 杭州格林达电子材料股份有限公司 | 一种水系光致抗蚀剂剥离液及其制备方法 |
JP2021521493A (ja) * | 2018-06-14 | 2021-08-26 | ヨンチャン ケミカル カンパニー リミテッドYoung Chang Chemical Co.,Ltd | 極紫外線リソグラフィー用工程液組成物、及びこれを用いるパターン形成方法 |
JP2021523417A (ja) * | 2018-06-14 | 2021-09-02 | ヨンチャン ケミカル カンパニー リミテッドYoung Chang Chemical Co.,Ltd | 極紫外線リソグラフィー用工程液組成物、及びこれを用いるパターン形成方法 |
US11473035B2 (en) | 2018-06-14 | 2022-10-18 | Young Chang Chemical Co., Ltd. | Process solution composition for extreme ultraviolet lithography, and method for forming pattern by using same |
JP7270647B2 (ja) | 2018-06-14 | 2023-05-10 | ヨンチャン ケミカル カンパニー リミテッド | 極紫外線リソグラフィー用工程液組成物、及びこれを用いるパターン形成方法 |
Also Published As
Publication number | Publication date |
---|---|
US20170017161A1 (en) | 2017-01-19 |
TWI605117B (zh) | 2017-11-11 |
US9829797B2 (en) | 2017-11-28 |
CN106353976A (zh) | 2017-01-25 |
JP6175547B2 (ja) | 2017-08-02 |
SG10201604551XA (en) | 2017-02-27 |
CN111505913A (zh) | 2020-08-07 |
KR101617169B1 (ko) | 2016-05-03 |
TW201704461A (zh) | 2017-02-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6175547B2 (ja) | フォトリソグラフィー用洗浄液組成物及びこれを用いたフォトレジストパターンの形成方法 | |
TWI717526B (zh) | 清洗組成物、形成光阻圖案之方法及製造半導體裝置之方法 | |
CN103443710B (zh) | 光刻用清洗液以及使用了其的图案形成方法 | |
CN110023841B (zh) | 光刻组合物、形成抗蚀图案的方法和制造半导体器件的方法 | |
JP2005220350A (ja) | 洗浄液組成物及びこれを用いた半導体装置の洗浄方法 | |
US20050250054A1 (en) | Development of photolithographic masks for semiconductors | |
TW201807513A (zh) | 間隙塡充組成物及使用低分子化合物之圖案形成方法 | |
KR20190013969A (ko) | 갭 충전 조성물 및 중합체를 함유하는 조성물을 이용한 패턴의 형성 방법 | |
KR101820310B1 (ko) | 포토레지스트 도포장비 세정용 씬너 조성물 | |
JP2009229572A (ja) | リソグラフィー用洗浄剤及びレジストパターン形成方法 | |
US11624984B2 (en) | Process liquid composition for extreme ultraviolet lithography and pattern forming method using same | |
KR20080009970A (ko) | 포토레지스트 현상액 및 이를 이용한 포토레지스트 패턴형성 방법 | |
KR20090017129A (ko) | 포토레지스트 린스용 조성물 및 이를 이용한 포토레지스트패턴 형성방법 | |
CN113196178B (zh) | 极紫外光刻用工艺液体及使用其的图案形成方法 | |
JP2001159824A (ja) | ディフェクトの発生を抑えたホトレジストパターンの形成方法およびディフェクト低減用現像液 | |
KR102107370B1 (ko) | 집적 회로 기기, 광학 기기, 초소형 기계 장비 및 정밀 기계 장비 제조용 조성물 | |
US20230028942A1 (en) | Rinsing Composition and Method for Treating Surface of Photoresist Material Using Same | |
KR20040079759A (ko) | 포토레지스트 세정액 조성물 및 이를 이용한 패턴 형성방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20170531 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170704 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170710 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6175547 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |