JP2017025345A - Electroless plating method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electroless plating method capable of surely forming a wiring pattern with a simple process.SOLUTION: An electroless plating method includes: a pattern forming process P11 forming an ink pattern 11R on a substrate 11 with an ink containing a predetermined component; a catalyst adding process P12 adding a catalyst 52 in an area having the ink pattern 11R formed thereon; a catalyst deactivating process P13 in which the component contained in the ink deactivates the catalyst 52 added on the ink pattern 11R by heating the substrate 11; and a pattern forming process P15 forming an electroless plating film in a part other than the ink pattern 11R by immersing the substrate 11 in an electroless plating solution.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a method for manufacturing a wiring board used in various electronic devices, and more particularly, to an electroless plating method for a wiring board.

  Conventionally, various electronic devices have used many wiring boards such as a printed wiring board (PWB) in which a wiring pattern is formed on a base material such as a synthetic resin. As a manufacturing method of this printed wiring board (PWB), a photosensitive masking agent is applied to a substrate laminated with copper foil, this masking agent is exposed and developed, and copper foil other than the wiring pattern covered with the masking agent is applied. The so-called subtractive method in which a wiring pattern is formed by etching is most commonly performed. This manufacturing method has a problem of waste of resources for removing most of copper from the copper foil and treatment of waste liquid containing copper.

  Therefore, various so-called additive method manufacturing methods for producing a metal film only on necessary wiring pattern portions have been proposed, and in particular, electroless plating methods are positioned as an important technique as the manufacturing method. Yes. The main points of this electroless plating method include a pattern forming method for forming a wiring pattern and a catalyst application / activation method including a pretreatment for performing electroless plating. It is done.

  First, as a typical example of the electroless plating method, a pattern layer to be a wiring pattern is formed on a substrate on which a wiring pattern is formed, and an electroless plating film is formed using a catalyst provided in the pattern layer as a core. The method of forming is mentioned. Patent Document 1 (Conventional Example 1) proposes a method using an electroless plating paste. FIG. 8 is a diagram illustrating a process in a manufacturing method 700 for a metal structure according to Conventional Example 1. In the metal structure manufacturing method 700, as shown in FIG. 8A, an electroless plating paste containing a catalyst such as palladium (Pd) is printed on an insulating substrate 705 to form a base film 701. Then, the base film 701 is treated to activate the catalyst, and as shown in FIG. 8B, a metal film 702 is selectively grown on the surface of the patterned base film 701 by electroless plating. . Unlike Conventional Example 1, although not cited and not shown as prior art documents, a pattern layer is formed with an insulating paste that is not an electroless plating paste, and the surface of this pattern layer is treated to carry a catalyst. A method for forming an electroless plating film is also generally given as Conventional Example 2.

  In the manufacturing method of Conventional Example 1, pattern formation can be easily performed, but adjustment of the electroless plating paste for increasing the catalyst on the surface of the base film 701 is difficult, and treatment for activating the catalyst is also difficult. There was a problem. In the manufacturing method of Conventional Example 2 that solves the problem, when the surface of the pattern layer is processed, not only the surface of the pattern layer but also other portions are processed, and a catalyst is applied to the surface other than the surface of the pattern layer, In some cases, there has been a new problem that an electroless plating film is formed on an undesired portion. As described above, there are some problems in the wiring pattern method in which the electroless plating film is formed on the pattern layer as in Conventional Examples 1 and 2.

  Therefore, as a typical example of another electroless plating method, the entire surface of the substrate is treated, a catalyst is applied to the entire surface of the substrate, a pattern is formed, and the portion corresponding to this pattern is electroless plated. A method of forming a film has been proposed.

  Patent Document 2 (Conventional Example 3) proposes a plating circuit forming method 800 using light. FIG. 9 is a diagram illustrating steps in the plating circuit forming method 800 of Conventional Example 3. In the plating circuit forming method 800, first, as shown in FIG. 9A, a base material 801 of a glass epoxy substrate is immersed in a catalyst treatment liquid 802 containing a catalytic metal complex ion, and then the base material 801 is taken out. Then, the catalyst metal complex ions 821 of the catalyst treatment liquid 802 are attached to the surface of the catalyst treatment liquid 802. Then, as shown in FIG. 9B, light is emitted from a light source 830 using a mask pattern 803 having a light non-transmissive pattern 831 and a light transmissive portion 832 corresponding to the circuit pattern (wiring pattern). By doing so, a light non-irradiated portion 826 and a light irradiated portion 825 are generated on the surface of the substrate 801, and the catalytic activity of the catalytic metal complex ions 821 of the light irradiated portion 825 is deactivated. And as shown in FIG.9 (c), said base material 801 is immersed in the electroless-plating bath 805, and the electroless-plating film | membrane 856 is formed only in the light non-irradiation part 826. FIG.

  Further, unlike the prior art example 3, although not cited and not shown as prior art documents, the entire surface of the base material is treated, a catalyst is applied to the entire surface of the base material, and then a patterned insulating film is printed. A method of covering the catalyst with an insulating film and forming an electroless plating film other than that portion is also generally mentioned as Conventional Example 4.

  In contrast to Conventional Example 4, Patent Document 3 (Conventional Example 5) proposes a method of manufacturing wiring device 905 using a sputtering method. FIG. 10 is a perspective view showing a wiring device 905 of Conventional Example 5. The wiring device 905 shown in FIG. 10 first performs a first step of attaching the catalyst nucleus 902 to the substrate 901 by sputtering, and then a second step of forming an insulating film 903 on the entire surface of the substrate 901. It is carried out. Next, patterning is performed on the insulating film 903 by photolithography, and a third step of removing a part of the insulating film 903 to form a groove 903r and exposing the catalyst core 902 is performed. Finally, electroless plating is performed. Thus, the fourth step of forming a metal film in the groove 903r where the catalyst nucleus 902 is exposed is performed, and the wiring device 905 shown in FIG. 10 is manufactured.

JP 2004-162096 A JP-A-6-77626 JP 2001-335952 A

  However, in the manufacturing method of Conventional Example 3, the manufacturing process is difficult due to light irradiation conditions and time, and the catalyst treatment liquid 802 in which the catalytic activity due to light irradiation is deactivated is limited. It was not a way to do it. Further, in the manufacturing method of Conventional Example 4, since a process such as printing is performed after applying the catalyst, the adhesion force of the catalyst is weak, so that there is a problem that it falls off before the electroless plating film forming step. It was. Further, in the manufacturing method of Conventional Example 5, the sputtering method is used to improve the adhesion of the catalyst. Since such a vacuum process is used, an expensive facility and a time-consuming process must be performed. There was a new problem that we should not do. As described above, the method of forming a pattern after applying the catalyst to the entire surface of the base material as in Conventional Example 3, Conventional Example 4, and Conventional Example 5 also has some problems.

  The present invention solves the above-described problems, and an object thereof is to provide an electroless plating method capable of reliably forming a wiring pattern by a simple process.

  In order to solve this problem, the electroless plating method of the present invention includes a pattern forming step of forming an ink pattern on a substrate with ink containing a predetermined component, and a catalyst in the region where the ink pattern is formed. A catalyst applying step for applying, a catalyst inactivating step for inactivating a catalyst in which a component contained in the ink is applied on the ink pattern by heating the substrate, and electroless plating the substrate A wiring pattern forming step of forming an electroless plating film in a portion other than the ink pattern by dipping in a liquid.

  According to this, the electroless plating method of the present invention can easily form an ink pattern using a screen printing method or the like on the plane of the substrate, and can produce a finer ink pattern. . In addition, since the catalyst applied on the ink pattern can be deactivated by heating the substrate, the activated portion of the catalyst can be left on the substrate in a simple process, and the plating film is formed on the portion other than the ink pattern. Can be formed. As a result, the wiring pattern can be reliably formed by a simple process.

  The electroless plating method of the present invention is characterized in that the catalyst deactivation step is accompanied by deformation of the base material.

  According to this, the base material can be simultaneously deformed in the catalyst inactivation step of inactivating the catalyst by heating the base material. This makes it possible to easily produce a wiring board having a three-dimensional shape without increasing the number of steps.

  Moreover, the electroless plating method of the present invention is characterized in that the catalyst deactivation step is a step of insert-molding the base material.

  According to this, since the substrate is heated in the step of insert-molding the substrate, the catalyst applied on the ink is deactivated, and as a result, the catalyst deactivation step is performed. As a result, the wiring board integrated with the molded body can be easily produced without increasing the number of steps.

  The electroless plating method of the present invention is characterized in that the component is a carboxylic acid ester. In particular, the carboxylic acid ester is preferably a benzoic acid ester or an adipic acid ester.

  According to this, it is a plasticizer generally used widely and can be easily contained in ink. As a result, the wiring board can be easily manufactured. The reason why the catalyst is deactivated is not clear at present, but the carboxylic acid ester contained in the ink is hydrolyzed when heated, and the generated carboxylic acid acts on the catalyst particles to cause the ink surface. The catalyst is considered to be deactivated.

  In addition, the electroless plating method of the present invention is characterized by having an adhesive layer forming step of forming a film made of a triazine compound before the catalyst applying step.

  According to this, the adhesion between the base material and the catalyst can be strengthened by the film made of the triazine compound, and the catalyst can be prevented from falling off during the process after the catalyst application process. As a result, the electroless plating film is reliably formed in the wiring pattern forming step, and the wiring pattern can be more reliably formed.

  The electroless plating method of the present invention can easily form an ink pattern on a plane of a substrate using a screen printing method or the like, and can produce a finer ink pattern. In addition, since the catalyst applied on the ink pattern can be deactivated by heating the substrate, the activated portion of the catalyst can be left on the substrate in a simple process, and the plating film is formed on the portion other than the ink pattern. Can be formed. As a result, the wiring pattern can be reliably formed by a simple process.

It is a perspective view explaining the wiring board using the electroless-plating method of 1st Embodiment of this invention. It is a figure explaining the wiring board using the electroless-plating method of 1st Embodiment of this invention, Comprising: It is the side view seen from the X2 side shown in FIG. It is process drawing explaining the manufacturing method of the wiring board using the electroless-plating method of 1st Embodiment of this invention. It is a perspective view explaining the wiring board using the electroless-plating method of 2nd Embodiment of this invention. It is process drawing explaining the manufacturing method of the wiring board using the electroless-plating method of 2nd Embodiment of this invention. It is a perspective view explaining the wiring board using the electroless-plating method of 3rd Embodiment of this invention. It is process drawing explaining the manufacturing method of the wiring board using the electroless-plating method of 3rd Embodiment of this invention. It is a figure which shows the process in the manufacturing method of the metal structure of the prior art example 1, Comprising: Fig.8 (a) shows the state in which the base film was formed on the insulating substrate, FIG.8 (b) shows the state of base film. This shows a state in which a metal film is selectively grown on the surface. It is a figure which shows the process in the plating circuit formation method of the prior art example 3, Comprising: Fig.9 (a) shows the state which immersed the base material of the glass epoxy board | substrate in the catalyst processing liquid, FIG.9 (b) shows a light source and FIG. 9 (c) shows a state in which the base material is immersed in an electroless plating bath. FIG. 9 (c) shows a state in which a light non-irradiated part and a light irradiated part are generated on the surface of the base material. ing. It is the perspective view which showed the wiring apparatus produced using the manufacturing method of the prior art example 5.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[First Embodiment]
FIG. 1 is a perspective view illustrating a wiring board 101 using the electroless plating method according to the first embodiment of the present invention. FIG. 2 is a view for explaining the wiring board 101 using the electroless plating method according to the first embodiment of the present invention, and is a side view as seen from the X2 side shown in FIG. 1 and 2, a part of the wiring 14 is omitted.

  As shown in FIGS. 1 and 2, the wiring board 101 manufactured using the electroless plating method according to the first embodiment of the present invention includes a base material 11 having a dome-shaped three-dimensional shape, and front and back surfaces of the base material 11 ( Wiring 14 laid on the upper surface 11a and the lower surface 11u). In addition, the wiring board 101 having a three-dimensional shape includes a protruding extraction part 11t of the base material 11 and a terminal part 14t laid on the extraction part 11t for electrical connection with an external electric device. It is equipped with. The terminal portion 14t is connected to the wiring 14 although not shown. In addition, an overcoat layer is provided in a portion other than the terminal portion 14t in order to improve environmental resistance, but the overcoat layer is omitted for easy understanding.

  The substrate 11 of the wiring board 101 uses a sheet substrate such as a synthetic resin polyethylene terephthalate (PET), and has a rectangular outer shape as shown in FIG. 1 has a rectangular dome shape bulging in the Z1 direction shown in FIG. Further, the extraction portion 11t described above is provided on one side of the rectangular outer shape.

  The wiring 14 and the terminal portion 14t of the wiring board 101 are made of copper or a copper alloy material. And the wiring 14 laid by the upper surface 11a of the base material 11 becomes the wiring pattern 14P which has the wiring extended in one direction (Y direction shown in FIG. 1). Further, as shown in FIG. 1, the wiring pattern 14P is a wiring pattern 14P continuous over flat and three-dimensional portions.

  The wiring board 101 configured as described above is connected to an external device via the terminal portion 14t.

Next, a method for manufacturing the wiring board 101 according to the first embodiment of the present invention will be described with reference to FIG. FIG. 3 is a process diagram for explaining a method of manufacturing the wiring substrate 101 using the electroless plating method according to the first embodiment of the present invention, and FIG. 3A is a diagram showing a pattern forming process after P11. FIG. 3B is a view showing the adhesive layer forming process PA1 after, FIG. 3C is a view showing the catalyst applying process P12, and FIG. 3D is after the molding process PH4. FIG. 3E is a diagram showing the electroless plating process PM5 after the wiring pattern forming process P15, and FIG. 3F is a schematic diagram after the peeling process PR5 of the wiring pattern forming process P15. FIG. 3 (g) is a diagram illustrating a state after the outer shape forming step PF9 is performed after the overcoat forming step P16. In FIG. 3, the thickness of the coating 12, the catalyst 52, and the like are greatly different from actual ones for easy understanding. Moreover, the chemical structural formula (Formula 1) shown below is the chemical structural formula of the film 12 used in the electroless plating method of the first embodiment of the present invention.

  As shown in FIG. 3, the method of manufacturing the wiring substrate 101 was applied to the pattern formation step P11 for forming the ink pattern 11R on the substrate 11, the catalyst application step P12 for applying the catalyst 52, and the ink pattern 11R. An electroless plating method having a catalyst deactivation step P13 for deactivating the catalyst 52 and a wiring pattern formation step P15 for forming an electroless plating film is used. In addition, the manufacturing method of the wiring substrate 101 includes an adhesive layer forming step PA1 for forming the film 12 between the pattern forming step P11 and the catalyst applying step P12, a molding step PH4 for forming the base material 11 into a three-dimensional shape, The catalyst deactivation process P13 of the electroless plating method according to the first embodiment of the present invention is performed during the molding process PH4.

  First, the flat base material 11 is prepared, and the pattern formation process P11 which forms the ink pattern 11R on the upper surface 11a of the base material 11 is performed. In this pattern formation step P11, ink containing a predetermined component is used, and this ink is first patterned and printed on the upper surface 11a of the substrate 11 by a screen printing method. Thereafter, drying is performed to cure the ink, and a patterned ink pattern 11R is formed on the upper surface 11a of the substrate 11 as shown in FIG. Thereby, the pattern formation process P11 can be performed on the plane of the base material 11 using a screen printing method or the like, and a pattern can be easily formed and a finer pattern can be produced.

  In the electroless plating method of the first embodiment of the present invention, a carboxylic acid ester is used as the predetermined component, and in particular, a benzoic acid ester is used. The benzoic acid ester of this carboxylic acid ester is a plasticizer that is generally widely used and can be easily contained in the ink.

  Next, an adhesive layer forming step PA1 for forming a film 12 made of a triazine compound on the base material 11 on which the ink pattern 11R is formed is performed. This adhesion layer forming process PA1 uses a triazine compound having a chemical structure as shown in the example of (Chemical Formula 1). First, a certain amount of triazine compound is dissolved in an organic solvent such as ethyl alcohol, and this dissolution is performed. The liquid is applied to the upper surface 11a of the base material 11 in the region where the ink pattern 11R is formed. Thereafter, drying is performed to evaporate the organic solvent as a solvent, and as shown in FIG.

  Next, a catalyst application step P12 for applying the catalyst 52 to the region where the ink pattern 11R is formed is performed. This catalyst application process P12 uses palladium (Pd) as the catalyst 52, and is used for electroless plating such as a sensitizer-activator method or a characterizer-accelerator method on the upper surface 11a side of the base material 11 on which the film 12 is formed. By applying a general catalyst application method, the palladium of the catalyst 52 is supported on the film 12 as shown in FIG. For this reason, the adhesion between the substrate 11 and the catalyst 52 can be strengthened by the coating 12 made of the triazine compound. This can prevent the catalyst 52 from falling off during the process after the catalyst application process P12. In addition, a palladium fine particle such as so-called nanoparticles is dispersed in an organic solvent such as ethyl alcohol, and applied to the upper surface 11a side of the base material 11 on which the film 12 is formed and dried, whereby the palladium of the catalyst 52 is deposited on the film 12. It can also be supported.

  Next, a molding step PH4 for molding the base material 11 into a three-dimensional shape is performed. In the molding step PH4, first, the base material 11 provided with the ink pattern 11R and the catalyst 52 is set in a mold. Next, the substrate 11 is pressed with a mold while being heated to deform the substrate 11 into a three-dimensional shape. At that time, suction is performed so that the inside of the mold is evacuated. In this way, the base material 11 having a dome-shaped three-dimensional shape as shown in FIG. Since the base material 11 is heated in this process, the catalyst deactivation process P13 is performed simultaneously with the molding process PH4. Then, the catalyst 52 (shown in black in FIG. 3D) in which the component contained in the ink, that is, the benzoic acid ester of the carboxylic acid ester is applied on the ink pattern 11R is deactivated. As a result, the activated portion of the catalyst 52 (indicated by white in FIG. 3D) can be left on the substrate 11 by a simple process. The reason why the catalyst 52 is deactivated is not clear at present. However, the carboxylic acid ester contained in the ink is hydrolyzed when heated, and the generated carboxylic acid acts on the catalyst 52, so that the ink It is considered that the catalyst 52 on the surface is inactivated.

  Moreover, in 1st Embodiment of this invention, as above-mentioned, the catalyst deactivation process P13 is simultaneously performed by shaping | molding process PH4 with a deformation | transformation of the base material 11. FIG. Thereby, the wiring board 101 having a three-dimensional shape can be easily manufactured without increasing the number of steps.

  Further, since the film 12 used in the first embodiment of the present invention has good adhesion to the catalyst 52, even if the film 12 is in direct contact with the mold in this molding step PH4, the falling off of the catalyst 52 is extremely small. For this reason, in the wiring pattern formation process P15 for forming the next electroless plating film, even if the interval between the catalysts 52 is increased by the molding process PH4, the electroless plating film can be formed uniformly.

  Next, a wiring pattern forming process P15 for forming the wiring layer L44 of the electroless plating film is performed. The wiring pattern forming process P15 includes an electroless plating process PM5 for forming an electroless plating film and a peeling process PR5 for removing the ink pattern 11R.

  In the electroless plating step PM5 of the wiring pattern forming step P15, first, the base material 11 having a three-dimensional shape is immersed in an electroless copper plating solution of copper sulfate containing Rochelle salt. Thereby, by the action of the catalyst 52 existing on the base material 11 not covered with the ink pattern 11R shown in FIG. 3D, the catalyst 52 in that portion is omitted in the portion other than the ink pattern 11R (FIG. 3E). The copper in the electroless copper plating solution is deposited and deposited on the film 12) to form an electroless plating film. And after immersing the base material 11 until the electroless plating film has a desired film thickness, the base material 11 is pulled up from the electroless copper plating solution, washed and dried, as shown in FIG. A wiring layer L44 of an electroless plating film is formed on the substrate 11.

  In the peeling step PR5 of the wiring pattern forming step P15, first, a peeling solution for dissolving the ink pattern 11R is prepared, and the base material 11 on which the electroless plating film is formed is immersed in this peeling solution. Then, when the ink pattern 11R is dissolved, the palladium of the catalyst 52 carried on the ink pattern 11R is removed, and the wiring in which the pattern of the electroless plating film as shown in FIG. 3 (f) is formed. A pattern 14P is obtained.

  Thus, since the wiring pattern forming process P15 is performed after the molding process PH4, the electroless plating film in the wiring layer L44 of the three-dimensional shape is damaged by the thermal deformation processing of the base material 11 in the molding process PH4. There is no. That is, the manufacturing method is such that disconnection of the wiring layer L44 does not occur in principle.

  In addition, since the coating 12 used in the first embodiment of the present invention is a very thin film and has good adhesion to the base material 11, the base material 11 is heated and molded into a three-dimensional shape. No cracks or the like are generated in the film 12. For this reason, the wiring layer L44 of the electroless plating film formed on the film 12 has very good adhesion to the base material 11.

  Next, an overcoat forming step P16 for forming the overcoat layer 16 is performed. In this overcoat forming step P16, first, an insulating ink containing a synthetic resin as a main component is used to sequentially apply to the front and back of the substrate 11 so as to cover the entire surface of the wiring pattern 14P. Thereafter, drying is performed to cure the insulating ink, thereby forming an overcoat layer 16 as shown in FIG.

  Finally, an outer shape processing step PF9 for cutting off the outer shape of the substrate 11 is performed. The outer shape processing step PF9 is a step for forming the outer shape shown in FIG. 1, and performs cutting using a mold. In this way, the wiring board 101 having a three-dimensional shape as shown in FIG.

  The effects of the electroless plating method for the wiring board 101 according to the first embodiment of the present invention configured as described above will be described below.

  Since the electroless plating method for the wiring substrate 101 according to the first embodiment of the present invention includes the pattern forming step P11 for forming the ink pattern 11R using the screen printing method or the like on the plane of the base material 11, A pattern can be easily formed and a finer pattern can be produced. Further, since the catalyst 52 applied on the ink pattern 11R can be deactivated by heating the substrate 11, the activated portion of the catalyst 52 can be left on the substrate 11 with a simple process, and the ink pattern 11R. A plating film can be formed on portions other than the above. As a result, the wiring pattern 14P can be reliably formed by a simple process.

  Further, the substrate 11 can be simultaneously deformed in the catalyst deactivation step P13 in which the catalyst 52 is deactivated by heating the substrate 11. Thereby, the wiring board 101 having a three-dimensional shape can be easily manufactured without increasing the number of steps.

  Further, since the component contained in the ink is a carboxylic acid ester, the catalyst 52 can be reliably deactivated. The reason why the catalyst 52 is deactivated is not clear at present, but the carboxylic acid ester contained in the ink is hydrolyzed when heated, and the generated carboxylic acid acts on the catalyst particles to cause the ink surface. The catalyst 52 is considered to be inactivated.

  Further, since the carboxylic acid ester is a benzoic acid ester, it is a generally used plasticizer and can be easily contained in the ink. As a result, the wiring substrate 101 can be easily manufactured.

  In addition, since the adhesive layer forming step PA1 for forming the film 12 made of the triazine compound is provided before the catalyst application step P12, the adhesion between the substrate 11 and the catalyst 52 is strengthened by the film 12 made of the triazine compound. It is possible to prevent the catalyst 52 from falling off during the process after the catalyst application process P12. As a result, the electroless plating film is reliably formed in the wiring pattern forming step P15, and the wiring pattern 14P can be more reliably formed.

[Second Embodiment]
FIG. 4 is a perspective view for explaining the wiring board 102 using the electroless plating method of the second embodiment of the present invention. Further, the wiring board 102 using the electroless plating method of the second embodiment is different from the first embodiment in that the molded body J4 is provided. In addition, about the same structure as 1st Embodiment, the same code | symbol is attached | subjected and detailed description is abbreviate | omitted.

  As shown in FIG. 4, the wiring board 102 manufactured using the electroless plating method of the second embodiment of the present invention is integrated with the three-dimensional shape of the molded body J4 and the three-dimensional shape of the molded body J4. The substrate 21 is provided, and the wiring 25 is laid on the upper surface 21 a of the substrate 21. In addition, the wiring board 102 having a three-dimensional shape includes a terminal portion 25t laid for electrical connection with an external electric device. As in the first embodiment, no wiring is laid on the lower surface 21u of the base material 21 (see FIG. 5B described later).

  The molded body J4 of the wiring board 102 is formed by an injection molding method using a synthetic resin material such as polybutylene terephthalate (PBT), and as shown in FIG. And a plate-like pedestal J4d provided extending from the base J4k.

  As the base material 21 of the wiring board 102, a sheet base material such as polyethylene phthalate (Poly Ethylene Naphthalate) of a synthetic resin is used, and is arranged along the three-dimensional shape of the molded body J4 as shown in FIG. Yes.

  The wiring 25 of the wiring substrate 102 is made of nickel or a nickel alloy material. Also, as shown in FIG. 4, the wiring 25 laid on the upper surface 21a of the base member 21 includes a land portion 25r on which various electronic components are mounted or disposed, a connection line 25c connected to the land portion 25r, The wiring pattern 25P has a terminal portion 25t provided on one end side of the connection line 25c. As shown in FIG. 4, the wiring pattern 25P is a pattern that continues from the curved portion of the base portion J4k to the flat portion of the pedestal portion J4d.

  The wiring board 102 configured as described above is connected to an external device via the terminal portion 25t.

  Next, the manufacturing method of the wiring board 102 concerning 2nd Embodiment of this invention is demonstrated using FIG. FIG. 5 is a process diagram for explaining a manufacturing method of the wiring board 102 using the electroless plating method of the second embodiment of the present invention, and FIG. 5 (b) is a diagram showing the pattern formation step P21 after, FIG. 5 (c) is a diagram after the catalyst application step P22, and FIG. 5 (d) is after the molding step PJ4. FIG. 5 (e) is a diagram showing the electroless plating process PM5 after the wiring pattern forming process P15, and FIG. 5 (f) is a diagram after the peeling process PR5 of the wiring pattern forming process P15. FIG. In FIG. 5, the thickness of the film 12, the catalyst 52, and the like are greatly different from actual ones for easy understanding.

  As shown in FIG. 5, the method of manufacturing the wiring substrate 102 was applied on the ink pattern 21 </ b> R, the pattern forming step P <b> 21 for forming the ink pattern 21 </ b> R on the base material 21, the catalyst applying step P <b> 22 for applying the catalyst 52, and the ink pattern 21 </ b> R. An electroless plating method having a catalyst deactivation step P23 for deactivating the catalyst 52 and a wiring pattern formation step P15 for forming an electroless plating film is used. In addition, the method for manufacturing the wiring board 102 includes an adhesive layer forming step PA1 for forming the film 12 performed before the pattern forming step P21, and a forming step PJ4 for insert-molding the base material 21. The catalyst deactivation process P23 of the electroless plating method according to the second embodiment of the invention is performed during the molding process PJ4.

  First, the flat base material 21 is prepared, and the adhesive layer forming process PA1 for forming the film 12 on the upper surface 21a on one side of the base material 21 is performed. As in the first embodiment, this adhesive layer forming step PA1 uses a triazine compound having a chemical structure as shown in the example of (Chemical Formula 1). First, a certain amount of organic solvent such as ethyl alcohol is used. The triazine compound is dissolved, and this solution is applied to the upper surface 21 a of the substrate 21. Thereafter, drying is performed to evaporate the organic solvent as a solvent, and as shown in FIG. 5 (a), a monomolecular layer or several molecular layer coating 12 of the triazine compound is formed.

  Next, a pattern forming step P21 for forming an ink pattern 21R on the base material 21 on which the film 12 is formed is performed. In this pattern forming step P21, ink containing a predetermined component is used, and this ink is first patterned and printed on the substrate 21 by a screen printing method. Thereafter, drying is performed to cure the ink, and a patterned ink pattern 21R is formed on the substrate 21 as shown in FIG. Thereby, the pattern formation process P21 can be performed on the plane of the base material 21 using a screen printing method or the like, and a pattern can be easily formed, and a finer pattern can be produced.

  In the electroless plating method of the second embodiment of the present invention, a carboxylic acid ester is used as the predetermined component, and in particular, an adipic acid ester is used. The adipic acid ester of this carboxylic acid ester is a plasticizer that is generally widely used, and can be easily contained in the ink.

  Next, a catalyst applying step P22 for applying the catalyst 52 to the region where the ink pattern 21R is formed is performed. In this catalyst application step P22, palladium (Pd) is used as the catalyst 52. First, palladium fine particles, which are nanoparticles, are mixed in an organic solvent such as ethyl alcohol, and this mixture is used as a base material on which the film 12 is formed. Apply to 21. Thereafter, drying is performed to evaporate the organic solvent, and the palladium of the catalyst 52 is supported on the film 12 as shown in FIG. For this reason, the adhesion between the base material 21 and the catalyst 52 can be strengthened by the coating 12 made of the triazine compound. This can prevent the catalyst 52 from falling off during the process after the catalyst application process P22.

  Next, a molding process PJ4 for insert-molding the base material 21 is performed. In the molding step PJ4, first, the base material 21 provided with the ink pattern 21R and the catalyst 52 is set in a mold. Next, a synthetic resin material such as polybutylene terephthalate is injection molded to produce a molded body J4. At this time, the base material 21 is deformed along the outer shape of the molded body J4 by the heat and pressure of the molten synthetic resin material in the injection molding. In this way, a film-integrated substrate in which the base material 21 is welded to the molded body J4 having a three-dimensional shape as shown in FIG. 5D is obtained. In this process, since the base material 21 is heated by the heat from the heated mold and the synthetic resin material, the catalyst deactivation process P23 is performed simultaneously with the molding process PJ4. Then, the component 52 contained in the ink, that is, the catalyst 52 (shown in black in FIG. 5D) to which the adipic acid ester of carboxylic acid ester is applied on the ink pattern 21R is deactivated. Thereby, the activated part of the catalyst 52 (indicated by white in FIG. 5D) can be left on the base material 21 by a simple process. The reason why the catalyst 52 is deactivated is not clear at present. However, the carboxylic acid ester contained in the ink is hydrolyzed when heated, and the generated carboxylic acid acts on the catalyst 52, so that the ink It is considered that the catalyst 52 on the surface is inactivated.

  Further, in the second embodiment of the present invention, as described above, the catalyst deactivation step P23 is simultaneously performed in the molding step PJ4 for insert molding the base material 21, so that the molded body J4 does not increase the number of steps. The wiring board 102 integrated with can be easily manufactured. Furthermore, since the base material 21 is deformed in the molding step PJ4 in which the catalyst deactivation step P23 is performed at the same time, the wiring board 102 having a three-dimensional shape can be easily manufactured without increasing the number of steps.

  In addition, since the coating 12 used in the second embodiment of the present invention has good adhesion to the catalyst 52, even if the coating 12 is in direct contact with the mold in the molding step PJ4, the catalyst 52 is very little dropped. For this reason, in the wiring pattern formation process P15 which forms the next electroless plating film, even if the space | interval of the catalyst 52 spreads by the shaping | molding process PJ4, uniform formation of an electroless plating film can be performed reliably.

  Finally, a wiring pattern forming process P15 for forming the wiring layer M44 of the electroless plating film is performed. This wiring pattern forming process P15 includes an electroless plating process PM5 for forming an electroless plating film, and a peeling process PR5 for removing the ink pattern 21R.

  In the electroless plating process PM5 of the wiring pattern forming process P15, first, the base material 21 having a three-dimensional shape is immersed in an electroless nickel plating solution mainly composed of nickel sulfate or sodium hypophosphite. Accordingly, the catalyst 52 existing on the base material 21 not covered with the ink pattern 21R shown in FIG. 5D causes the portion other than the ink pattern 21R (the catalyst 52 in that portion is omitted in FIG. 5E). In this case, nickel in the electroless nickel plating solution is deposited and deposited on the film 12) to form an electroless plating film. And after immersing the base material 21 until the electroless plating film has a desired film thickness, the base material 21 is pulled up from the electroless nickel plating solution, washed and dried, as shown in FIG. A wiring layer M44 of an electroless plating film is formed on the substrate 21.

  In the peeling step PR5 of the wiring pattern forming step P15, first, a peeling solution for dissolving the ink pattern 21R is prepared, and the base material 21 on which the electroless plating film is formed is immersed in this peeling solution. Then, as shown in FIG. 5 (f), when the ink pattern 21R is dissolved, the palladium of the catalyst 52 carried on the ink pattern 21R is removed, and the wiring on which the pattern of the electroless plating film is formed. A pattern 25P is obtained. In this way, the wiring board 102 integrated with the molded body J4 having a three-dimensional shape as shown in FIG.

  Thus, since the wiring pattern formation process P15 is performed after the molding process PJ4, the electroless plating film in the wiring layer M44 in the three-dimensional shape is damaged by the thermal deformation processing of the substrate 21 in the molding process PJ4. There is no. That is, the manufacturing method is such that disconnection of the wiring layer M44 does not occur in principle.

  Moreover, since the film 12 used in the second embodiment of the present invention is a very thin film and has good adhesion to the base material 21, the film 12 is cracked even in the molding step PJ4 for insert-molding the base material 21. Etc. have not occurred. For this reason, the wiring layer M44 of the electroless plating film formed on the film 12 has very good adhesion to the base material 21.

  The effects of the method for electroless plating of the wiring board 102 according to the second embodiment of the present invention configured as described above will be described below.

  Since the electroless plating method for the wiring substrate 102 according to the second embodiment of the present invention includes the pattern forming step P21 for forming the ink pattern 21R using a screen printing method or the like on the plane of the base material 21, A pattern can be easily formed and a finer pattern can be produced. Further, since the catalyst 52 applied on the ink pattern 21R can be deactivated by heating the substrate 21, the activated portion of the catalyst 52 can be left on the substrate 21 with a simple process, and the ink pattern 21R. A plating film can be formed on portions other than the above. Thereby, the wiring pattern 25P can be reliably formed by a simple process.

  Since the base material 21 is heated in the molding step PJ4 for insert-molding the base material 21, the catalyst 52 applied on the ink is deactivated, and as a result, the catalyst deactivation step P23 is performed. . Thereby, the wiring board 102 integrated with the molded body J4 can be easily manufactured without increasing the number of steps.

  Furthermore, since the base material 21 can be deformed in the catalyst deactivation step P23 performed simultaneously with the molding step PJ4, the wiring board 102 having a three-dimensional shape can be easily manufactured without increasing the number of steps. it can.

  Further, since the component contained in the ink is a carboxylic acid ester, the catalyst 52 can be reliably deactivated. The reason why the catalyst 52 is deactivated is not clear at present, but the carboxylic acid ester contained in the ink is hydrolyzed when heated, and the generated carboxylic acid acts on the catalyst particles to cause the ink surface. The catalyst 52 is considered to be inactivated.

  Further, since the carboxylic acid ester is an adipic acid ester, it is a commonly used plasticizer and can be easily contained in the ink. As a result, the wiring board 102 can be easily manufactured.

  Further, since the adhesive layer forming step PA1 for forming the film 12 made of the triazine compound is provided before the catalyst application step P22, the adhesion between the base material 21 and the catalyst 52 is strengthened by the film 12 made of the triazine compound. It is possible to prevent the catalyst 52 from falling off during the process after the catalyst application process P22. As a result, the electroless plating film is reliably formed in the wiring pattern forming step P15, and the wiring pattern 25P can be more reliably formed.

[Third Embodiment]
FIG. 6 is a perspective view illustrating a wiring board 103 using the electroless plating method of the third embodiment of the present invention. Further, the wiring board 103 using the electroless plating method of the third embodiment is different from the first embodiment in that the base material 31 has a flat plate shape. In addition, about the same structure as 1st Embodiment, the same code | symbol is attached | subjected and detailed description is abbreviate | omitted.

  As shown in FIG. 6, the wiring board 103 produced by using the electroless plating method of the third embodiment of the present invention has a rectangular and flat base material 31, and the front and back surfaces (upper surface 31 a and lower surface) of the base material 31. 31u) and a wiring 34 and a wiring (not shown) respectively. In addition, the wiring board 103 includes a terminal portion 34t laid for electrical connection with an external electric device and a terminal portion (not shown). In FIG. 6, the area where the wiring 34 on the upper surface 31 a of the base material 31 is laid is shown by shading, and detailed patterns are omitted, and the wiring and terminals of the lower surface 31 u of the base material 31 are not shown. Not shown. In addition, an overcoat layer is provided in portions other than the terminal portion (including the terminal portion 34t) in order to improve environmental resistance, but the overcoat layer is omitted for easy understanding. .

  As the base material 31 of the wiring substrate 103, a plate-like base material such as an epoxy resin containing a glass filler is used, and as shown in FIG. And wiring (in FIG. 6, wiring 34) and a terminal part (in FIG. 6, terminal part 34t) are laid by the front and back (upper surface 31a and lower surface 31u) of the base material 31. FIG.

  The wiring and terminal portions of the wiring substrate 103 are made of copper or a copper alloy material, and form a wiring pattern 34P. Although not shown, the wiring 34 and the terminal portion 34t are electrically connected, and the wiring and the terminal portion not shown are also electrically connected.

  The wiring board 103 configured as described above is connected to an external device via a terminal portion.

  Next, a manufacturing method of the wiring board 103 according to the third embodiment of the present invention will be described with reference to FIG. FIG. 7 is a process diagram for explaining a method of manufacturing the wiring substrate 103 using the electroless plating method of the third embodiment of the present invention, and FIG. 7A is a diagram showing the process after the adhesive layer forming process PA1. 7 (b) is a diagram showing the pattern forming step P31 and after, FIG. 7 (c) is a diagram showing the catalyst applying step P32, and FIG. 7 (d) is the catalyst deactivation. FIG. 7E is a diagram illustrating the process after the process P33, FIG. 7E is a diagram illustrating the process after the electroless plating process PM5 of the wiring pattern formation process P15, and FIG. 7F is a peeling process PR5 of the wiring pattern formation process P15. FIG. FIG. 7 (g) is a diagram illustrating after the overcoat forming step P16 and the outer shape processing step PF9. In FIG. 7, the thickness of the film 12, the catalyst 52, and the like are greatly different from actual ones for easy understanding.

  As shown in FIG. 7, the method of manufacturing the wiring substrate 103 is applied on the ink pattern 31 </ b> R, a pattern forming step P <b> 31 for forming the ink pattern 31 </ b> R on the base material 31, a catalyst applying step P <b> 32 for applying the catalyst 52, and An electroless plating method having a catalyst deactivation step P33 for inactivating the catalyst 52 and a wiring pattern formation step P15 for forming an electroless plating film is used. In addition, the method for manufacturing the wiring substrate 103 includes an adhesive layer forming step PA1 for forming the film 12 performed before the pattern forming step P31.

  First, the flat base material 31 is prepared, and the adhesive layer forming process PA1 for forming the film 12 on the upper surface 31a and the lower surface 31u of the base material 31 is performed. As in the first embodiment, this adhesive layer forming step PA1 uses a triazine compound having a chemical structure as shown in the example of (Chemical Formula 1). First, a certain amount of organic solvent such as ethyl alcohol is used. The triazine compound is dissolved, and this solution is applied to the upper surface 31 a of the substrate 31. Thereafter, drying is performed to evaporate the organic solvent as a solvent, and as shown in FIG. Similarly, a film 12 of a monomolecular layer or several molecular layers of a triazine compound is also formed on the lower surface 31 u of the base material 31.

  Next, a pattern forming process P31 for forming the ink pattern 31R on the base material 31 on which the film 12 is formed is performed. In this pattern forming step P31, ink containing a predetermined component is used, and first, this ink is patterned and printed on the upper surface 31a of the substrate 31 by a screen printing method. Thereafter, drying is performed to cure the ink, and a patterned ink pattern 31R is formed on the upper surface 31a of the substrate 31 as shown in FIG. Similarly, the ink pattern 31R is formed on the lower surface 31u of the base material 31. Thereby, the pattern formation process P31 can be performed on the plane of the base material 31 by using a screen printing method or the like, and a pattern can be easily formed and a finer pattern can be produced.

  In the electroless plating method of the third embodiment of the present invention, as in the first embodiment, a carboxylic acid ester is used as the predetermined component, and in particular, a benzoic acid ester is used. The benzoic acid ester of this carboxylic acid ester is a plasticizer that is generally widely used and can be easily contained in the ink.

  Next, a catalyst applying step P32 for applying the catalyst 52 to the region where the ink pattern 31R is formed is performed. In the catalyst application step P32, palladium (Pd) is used as the catalyst 52. First, palladium fine particles, which are nanoparticles, are mixed in an organic solvent such as ethyl alcohol, and this mixed solution is used as a base material on which the film 12 is formed. Apply to front and back of 31. Thereafter, drying is performed to evaporate the organic solvent, and the palladium of the catalyst 52 is supported on the film 12 as shown in FIG. For this reason, the adhesion between the substrate 31 and the catalyst 52 can be strengthened by the coating 12 made of the triazine compound. This can prevent the catalyst 52 from falling off during the process after the catalyst application process P32. In the third embodiment of the present invention, the solution and the mixed solution are applied to the front and back of the substrate 31, but the substrate 31 is immersed in the solution or the mixed solution and dissolved on the front and back of the substrate 31. A liquid or a mixed liquid may be applied.

  Next, as shown in FIG. 7D, a catalyst deactivation step P33 for deactivating the catalyst 52 applied on the ink pattern 31R is performed. In the catalyst deactivation step P33, the base material 31 is heated using a drying furnace or a hot plate. This inactivates the catalyst 52 (shown in black in FIG. 7D) to which the component contained in the ink, that is, the benzoic acid ester of the carboxylic acid ester is applied on the ink pattern 31R. For this reason, the activated part of the catalyst 52 (shown in white in FIG. 7D) can be left on the substrate 31 by a simple process. The reason why the catalyst 52 is deactivated is not clear at present. However, the carboxylic acid ester contained in the ink is hydrolyzed when heated, and the generated carboxylic acid acts on the catalyst 52, so that the ink It is considered that the catalyst 52 on the surface is inactivated.

  Next, a wiring pattern forming step P15 for forming the wiring layer N44 of the electroless plating film is performed. This wiring pattern forming process P15 includes an electroless plating process PM5 for forming an electroless plating film and a peeling process PR5 for removing the ink pattern 31R.

  In the electroless plating process PM5 of the wiring pattern forming process P15, first, the base material 31 provided with the catalyst 52 is immersed in an electroless copper plating solution of copper sulfate containing Rochelle salt. Accordingly, the catalyst 52 existing on the base material 31 that is not covered with the ink pattern 31R shown in FIG. 7D causes the portion other than the ink pattern 31R (the catalyst 52 in that portion is omitted in FIG. 7E). The copper in the electroless copper plating solution is deposited and deposited on the film 12) to form an electroless plating film. And after immersing the base material 31 until the electroless plating film has a desired film thickness, the base material 31 is pulled up from the electroless copper plating solution, washed and dried, as shown in FIG. A wiring layer N44 of an electroless plating film is formed on the substrate 31. As described above, since the electroless plating film is formed on the very thin film 12 with good adhesion to the base material 31, the wiring layer N44 has very good adhesion to the base material 31. It has become.

  In the peeling step PR5 of the wiring pattern forming step P15, first, a peeling solution for dissolving the ink pattern 31R is prepared, and the base material 31 on which the electroless plating film is formed is immersed in this peeling solution. Then, as shown in FIG. 7 (f), when the ink pattern 31R is dissolved, the palladium of the catalyst 52 carried on the ink pattern 31R is dropped off, and the electroless plating film pattern is formed. A pattern 34P is obtained.

  Next, an overcoat forming step P16 for forming the overcoat layer 16 is performed. In this overcoat forming step P16, first, an insulating ink containing a synthetic resin as a main component is used to sequentially apply to the front and back of the substrate 31 so as to cover the entire surface of the wiring pattern 34P. Thereafter, drying is performed to cure the insulating ink, thereby forming an overcoat layer 16 as shown in FIG.

  Finally, an outer shape processing step PF9 for cutting off the outer shape of the base material 31 is performed. This outer shape processing step PF9 is a step for forming the outer shape shown in FIG. 6, and performs cutting using a mold. In this way, a rectangular wiring substrate 103 as shown in FIG.

  The effects of the electroless plating method for the wiring board 103 according to the third embodiment of the present invention configured as described above will be described below.

  Since the electroless plating method for the wiring board 103 according to the third embodiment of the present invention includes the pattern forming step P31 for forming the ink pattern 31R using a screen printing method or the like on the plane of the base material 31, A pattern can be easily formed and a finer pattern can be produced. Further, since the catalyst 52 applied on the ink pattern 31R can be deactivated by heating the substrate 31, the activated portion of the catalyst 52 can be left on the substrate 31 with a simple process, and the ink pattern 31R. A plating film can be formed on portions other than the above. Thus, the wiring pattern 34P can be reliably formed by a simple process.

  Further, since the component contained in the ink is a carboxylic acid ester, the catalyst 52 can be reliably deactivated. The reason why the catalyst 52 is deactivated is not clear at present, but the carboxylic acid ester contained in the ink is hydrolyzed when heated, and the generated carboxylic acid acts on the catalyst particles to cause the ink surface. The catalyst 52 is considered to be inactivated.

  Further, since the carboxylic acid ester is a benzoic acid ester, it is a generally used plasticizer and can be easily contained in the ink. As a result, the wiring substrate 103 can be easily manufactured.

  In addition, since the adhesive layer forming step PA1 for forming the film 12 made of the triazine compound is provided before the catalyst application step P32, the adhesion between the base material 31 and the catalyst 52 is strengthened by the film 12 made of the triazine compound. It is possible to prevent the catalyst 52 from falling off during the process after the catalyst application process P32. Thus, the electroless plating film is reliably formed in the wiring pattern forming step P15, and the wiring pattern 34P can be more reliably formed.

  In addition, this invention is not limited to the said embodiment, For example, it can deform | transform and implement as follows, These embodiments also belong to the technical scope of this invention.

<Modification 1>
In the said 1st Embodiment and 2nd Embodiment, although it had and comprised with the convex-shaped simple dome shape, it does not restrict to this shape.

<Modification 2>
A configuration in which an electroplating process is further performed after the electroless plating process PM5 of the above embodiment to form an electroplating film on the electroless plating film may be employed. Thereby, since the resistance value of the wiring can be further reduced, the wiring width can be narrowed, and if the wiring width is the same, it can be suitably applied to a product in which a large current value is passed.

<Modification 3>
In the above embodiment, the electroless plating of copper or nickel is performed. However, the present invention is not limited to this, and other electroless plating may be used.

  The present invention is not limited to the above-described embodiment, and can be modified as appropriate without departing from the scope of the object of the present invention.

11, 21, 31 Substrate 11R, 21R, 31R Ink pattern 12 Film 52 Catalyst P11, P21, P31 Pattern formation process P12, P22, P32 Catalyst application process P13, P23, P33 Catalyst deactivation process P15 Wiring pattern formation process PA1 Adhesive layer formation process

Claims (6)

A pattern forming step of forming an ink pattern on a substrate with ink containing a predetermined component;
A catalyst application step of applying a catalyst to the region where the ink pattern is formed;
A catalyst deactivation step of deactivating the catalyst applied to the ink pattern by a component contained in the ink by heating the substrate;
A wiring pattern forming step of immersing the base material in an electroless plating solution to form an electroless plating film on a portion other than the ink pattern;
An electroless plating method comprising:   The electroless plating method according to claim 1, wherein the catalyst deactivation step involves deformation of the base material.   The electroless plating method according to claim 1, wherein the catalyst deactivation step is a step of insert-molding the base material.   The electroless plating method according to any one of claims 1 to 3, wherein the component is a carboxylic acid ester.   The electroless plating method according to claim 4, wherein the carboxylic acid ester is a benzoic acid ester or an adipic acid ester.   6. The electroless plating method according to claim 1, further comprising an adhesive layer forming step of forming a film made of a triazine compound before the catalyst applying step.