WO2009075213A1 - Printed wiring board, method for manufacturing electronic component, insulating resin material, and method for manufacturing printed wiring board - Google Patents

Printed wiring board, method for manufacturing electronic component, insulating resin material, and method for manufacturing printed wiring board Download PDF

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Publication number
WO2009075213A1
WO2009075213A1 PCT/JP2008/071973 JP2008071973W WO2009075213A1 WO 2009075213 A1 WO2009075213 A1 WO 2009075213A1 JP 2008071973 W JP2008071973 W JP 2008071973W WO 2009075213 A1 WO2009075213 A1 WO 2009075213A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
printed wiring
manufacturing
electronic component
resin material
Prior art date
Application number
PCT/JP2008/071973
Other languages
French (fr)
Japanese (ja)
Inventor
Kanji Shimoohsako
Takashi Ito
Toshio Yamanaka
Shigeru Tanaka
Original Assignee
Kaneka Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corporation filed Critical Kaneka Corporation
Publication of WO2009075213A1 publication Critical patent/WO2009075213A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0713—Plating poison, e.g. for selective plating or for preventing plating on resist

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Disclosed is a printed wiring board having excellent formability of fine wiring and excellent insulation reliability. Also disclosed are a method for manufacturing an electronic component, an insulating resin material, and a method for manufacturing a printed wiring board. Specifically disclosed is a printed wiring board wherein a catalytically active portion and a catalytically inactive portion are formed by using a catalyst poison.
PCT/JP2008/071973 2007-12-13 2008-12-03 Printed wiring board, method for manufacturing electronic component, insulating resin material, and method for manufacturing printed wiring board WO2009075213A1 (en)

Applications Claiming Priority (18)

Application Number Priority Date Filing Date Title
JP2007322436 2007-12-13
JP2007-322436 2007-12-13
JP2008071079 2008-03-19
JP2008-071079 2008-03-19
JP2008-081846 2008-03-26
JP2008081846 2008-03-26
JP2008-103779 2008-04-11
JP2008103780 2008-04-11
JP2008103779 2008-04-11
JP2008-103780 2008-04-11
JP2008149548 2008-06-06
JP2008-149548 2008-06-06
JP2008-177935 2008-07-08
JP2008177937 2008-07-08
JP2008177935 2008-07-08
JP2008-177938 2008-07-08
JP2008-177937 2008-07-08
JP2008177938 2008-07-08

Publications (1)

Publication Number Publication Date
WO2009075213A1 true WO2009075213A1 (en) 2009-06-18

Family

ID=40755457

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/071973 WO2009075213A1 (en) 2007-12-13 2008-12-03 Printed wiring board, method for manufacturing electronic component, insulating resin material, and method for manufacturing printed wiring board

Country Status (1)

Country Link
WO (1) WO2009075213A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015087876A1 (en) * 2013-12-10 2015-06-18 アルプス電気株式会社 Electroless plating method
JP2017160518A (en) * 2016-03-11 2017-09-14 日立マクセル株式会社 Producing method of plating part, plating part, catalytic activity disturbing agent, and electroless plating compound material
JP2020007646A (en) * 2019-10-21 2020-01-16 マクセルホールディングス株式会社 Method for manufacturing plated component
JP2021080566A (en) * 2019-10-21 2021-05-27 マクセルホールディングス株式会社 Method for manufacturing plated component

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0864934A (en) * 1994-08-25 1996-03-08 Matsushita Electric Works Ltd Manufacture of printed wiring board
JPH10275980A (en) * 1997-03-28 1998-10-13 Tokyo Ohka Kogyo Co Ltd Manufacture of multilayer wiring board and multilayer wiring board
JP2006165254A (en) * 2004-12-07 2006-06-22 Sony Corp Electronic device, semiconductor device, and method of manufacturing them

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0864934A (en) * 1994-08-25 1996-03-08 Matsushita Electric Works Ltd Manufacture of printed wiring board
JPH10275980A (en) * 1997-03-28 1998-10-13 Tokyo Ohka Kogyo Co Ltd Manufacture of multilayer wiring board and multilayer wiring board
JP2006165254A (en) * 2004-12-07 2006-06-22 Sony Corp Electronic device, semiconductor device, and method of manufacturing them

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015087876A1 (en) * 2013-12-10 2015-06-18 アルプス電気株式会社 Electroless plating method
EP3428313A4 (en) * 2016-03-11 2019-10-30 Maxell Holdings, Ltd. Method for producing plated component, plated component, catalytic activity inhibitor and composite material for electroless plating
TWI699454B (en) * 2016-03-11 2020-07-21 日商麥克賽爾控股股份有限公司 Manufacturing method of plated parts, plated parts, catalyst activity inhibitors and composite materials for electroless plating
CN108699695A (en) * 2016-03-11 2018-10-23 麦克赛尔控股株式会社 Manufacturing method, coated parts, the catalytic activity of coated parts interfere agent and electroless plating composite material
KR20180119583A (en) * 2016-03-11 2018-11-02 맥셀 홀딩스 가부시키가이샤 METHOD OF MANUFACTURING PLATED PARTS, PLATED PARTS, CATALYST ACTIVITY INTERRUPTIBLE AND COMPOSITE MATER
US20190008051A1 (en) * 2016-03-11 2019-01-03 Maxell Holdings, Ltd. Method for producing plated component, plated component, catalytic activity inhibitor and composite material for electroless plating
JP2017160518A (en) * 2016-03-11 2017-09-14 日立マクセル株式会社 Producing method of plating part, plating part, catalytic activity disturbing agent, and electroless plating compound material
KR102613934B1 (en) * 2016-03-11 2023-12-15 맥셀 주식회사 Manufacturing method of plated parts, plated parts, catalytic activity hinderers and composite materials for electroless plating
WO2017154470A1 (en) * 2016-03-11 2017-09-14 日立マクセル株式会社 Method for producing plated component, plated component, catalytic activity inhibitor and composite material for electroless plating
CN108699695B (en) * 2016-03-11 2020-08-21 麦克赛尔控股株式会社 Method for producing plated member, catalyst activity inhibitor, and composite material for electroless plating
CN111979533A (en) * 2016-03-11 2020-11-24 麦克赛尔控股株式会社 Method for producing plated member, catalyst activity inhibitor, and composite material for electroless plating
US11013125B2 (en) 2016-03-11 2021-05-18 Maxell Holdings, Ltd. Method for producing plated component, plated component, catalytic activity inhibitor and composite material for electroless plating
US11310918B2 (en) 2016-03-11 2022-04-19 Maxell, Ltd. Method for producing plated component, plated component, catalytic activity inhibitor and composite material for electroless plating
JP2021080566A (en) * 2019-10-21 2021-05-27 マクセルホールディングス株式会社 Method for manufacturing plated component
JP2020007646A (en) * 2019-10-21 2020-01-16 マクセルホールディングス株式会社 Method for manufacturing plated component

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