JP2017024074A5 - - Google Patents
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- Publication number
- JP2017024074A5 JP2017024074A5 JP2015212063A JP2015212063A JP2017024074A5 JP 2017024074 A5 JP2017024074 A5 JP 2017024074A5 JP 2015212063 A JP2015212063 A JP 2015212063A JP 2015212063 A JP2015212063 A JP 2015212063A JP 2017024074 A5 JP2017024074 A5 JP 2017024074A5
- Authority
- JP
- Japan
- Prior art keywords
- mass
- solder
- elements
- solder wire
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims 3
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- 229910052745 lead Inorganic materials 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 229910052714 tellurium Inorganic materials 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
Claims (1)
- 前記はんだワイヤは、８０質量％以上のＰｂと、Ｓｎ、Ａｇ、Ｃｕ、Ｉｎ、Ｔｅ、およびＰからなる群から選択される１種以上の第２元素とを含有し、かつ、Ｐｂと第２元素との含有量が、合計で９５質量％以上のはんだ合金からなる、請求項１〜３のいずれかに記載の被覆はんだワイヤ。
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2016/070135 WO2017018155A1 (ja) | 2015-07-27 | 2016-07-07 | 被覆はんだワイヤおよびその製造方法 |
| EP16830260.2A EP3330039A4 (en) | 2015-07-27 | 2016-07-07 | Coated solder wire and method for manufacturing same |
| CN201680040706.8A CN107848076A (zh) | 2015-07-27 | 2016-07-07 | 包覆焊料线及其制造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015147436 | 2015-07-27 | ||
| JP2015147436 | 2015-07-27 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017024074A JP2017024074A (ja) | 2017-02-02 |
| JP2017024074A5 true JP2017024074A5 (ja) | 2017-12-14 |
| JP6471676B2 JP6471676B2 (ja) | 2019-02-20 |
Family
ID=57944738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015212063A Expired - Fee Related JP6471676B2 (ja) | 2015-07-27 | 2015-10-28 | 被覆はんだワイヤおよびその製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP3330039A4 (ja) |
| JP (1) | JP6471676B2 (ja) |
| CN (1) | CN107848076A (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018199147A (ja) * | 2017-05-26 | 2018-12-20 | 住友金属鉱山株式会社 | 被覆はんだ材料の製造方法 |
| DE102018100683A1 (de) * | 2018-01-12 | 2019-07-18 | EMIL OTTO Flux- und Oberflächentechnik GmbH | Verfahren zur Herstellung eines Lotmittels |
| CN115743687B (zh) * | 2023-01-10 | 2023-04-11 | 昆明金方金属制品有限公司 | 一种镀铜焊丝生产装置 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995032809A1 (en) * | 1994-05-26 | 1995-12-07 | Electrostatic Technology, Inc. | Vertical electrostatic coater having vortex effect |
| JPH10166177A (ja) * | 1996-12-10 | 1998-06-23 | Tanaka Denshi Kogyo Kk | 被覆半田材料及びその製造方法 |
| JP2004339583A (ja) * | 2003-05-16 | 2004-12-02 | Sony Corp | 錫又は錫合金材の表面処理剤、錫又は錫合金材及びその表面処理方法、錫合金系はんだ材料及びこれを用いたはんだペースト、錫合金系はんだ材料の製造方法、電子部品、プリント配線板、並びに電子部品の実装構造 |
| CN1235718C (zh) * | 2003-07-25 | 2006-01-11 | 南昌大学 | 一种锡锌基无铅钎料合金及其制备工艺 |
| JP2006255762A (ja) * | 2005-03-18 | 2006-09-28 | Uchihashi Estec Co Ltd | 電子部品用線状はんだ |
| US20070251602A1 (en) * | 2005-11-10 | 2007-11-01 | Gagnon Paul J Jr | Brazing material with continuous length layer of elastomer containing a flux |
| JP2013123741A (ja) * | 2011-12-15 | 2013-06-24 | Sumitomo Metal Mining Co Ltd | 塑性変形性に優れたＰｂフリーはんだ合金 |
| JP6160498B2 (ja) * | 2013-03-08 | 2017-07-12 | 住友金属鉱山株式会社 | 被覆はんだ材料およびその製造方法 |
| CN106211763B (zh) * | 2014-03-25 | 2019-08-27 | 住友金属矿山株式会社 | 包覆焊料材料及其制造方法 |
| EP3133188A4 (en) * | 2014-04-15 | 2017-08-30 | Sumitomo Metal Mining Co., Ltd. | Coating film, method for forming coating film, and light-emitting diode device |
| CN103990916A (zh) * | 2014-05-21 | 2014-08-20 | 李佛妹 | 一种抑制气孔产生的电焊条 |
| JP6455187B2 (ja) * | 2015-01-29 | 2019-01-23 | 住友金属鉱山株式会社 | 被覆はんだワイヤおよびその製造方法 |
-
2015
- 2015-10-28 JP JP2015212063A patent/JP6471676B2/ja not_active Expired - Fee Related
-
2016
- 2016-07-07 CN CN201680040706.8A patent/CN107848076A/zh active Pending
- 2016-07-07 EP EP16830260.2A patent/EP3330039A4/en not_active Withdrawn
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