JP2017020000A5 - - Google Patents

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Publication number
JP2017020000A5
JP2017020000A5 JP2016111352A JP2016111352A JP2017020000A5 JP 2017020000 A5 JP2017020000 A5 JP 2017020000A5 JP 2016111352 A JP2016111352 A JP 2016111352A JP 2016111352 A JP2016111352 A JP 2016111352A JP 2017020000 A5 JP2017020000 A5 JP 2017020000A5
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JP
Japan
Prior art keywords
monomers
polymer
formula
dimers
polymerized units
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016111352A
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English (en)
Japanese (ja)
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JP2017020000A (ja
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Publication date
Priority claimed from US14/739,402 external-priority patent/US9442377B1/en
Application filed filed Critical
Publication of JP2017020000A publication Critical patent/JP2017020000A/ja
Publication of JP2017020000A5 publication Critical patent/JP2017020000A5/ja
Pending legal-status Critical Current

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JP2016111352A 2015-06-15 2016-06-02 湿式剥離性シリコン含有反射防止剤 Pending JP2017020000A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/739,402 US9442377B1 (en) 2015-06-15 2015-06-15 Wet-strippable silicon-containing antireflectant
US14/739,402 2015-06-15

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018128294A Division JP6643411B2 (ja) 2015-06-15 2018-07-05 湿式剥離性シリコン含有反射防止剤

Publications (2)

Publication Number Publication Date
JP2017020000A JP2017020000A (ja) 2017-01-26
JP2017020000A5 true JP2017020000A5 (enExample) 2017-10-19

Family

ID=56881349

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016111352A Pending JP2017020000A (ja) 2015-06-15 2016-06-02 湿式剥離性シリコン含有反射防止剤
JP2018128294A Expired - Fee Related JP6643411B2 (ja) 2015-06-15 2018-07-05 湿式剥離性シリコン含有反射防止剤

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2018128294A Expired - Fee Related JP6643411B2 (ja) 2015-06-15 2018-07-05 湿式剥離性シリコン含有反射防止剤

Country Status (5)

Country Link
US (2) US9442377B1 (enExample)
JP (2) JP2017020000A (enExample)
KR (1) KR101849638B1 (enExample)
CN (1) CN106243357B (enExample)
TW (1) TWI600724B (enExample)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102439087B1 (ko) * 2014-11-19 2022-09-01 닛산 가가쿠 가부시키가이샤 습식제거가 가능한 실리콘함유 레지스트 하층막 형성 조성물
US10043162B1 (en) 2015-03-31 2018-08-07 Square, Inc. Open ticket payment handling with bill splitting
US10528945B1 (en) 2015-03-31 2020-01-07 Square, Inc. Open ticket payment handling with incremental authorization
US10658191B2 (en) * 2015-09-04 2020-05-19 Taiwan Semiconductor Manufacturing Company, Ltd. Conformal middle layer for a lithography process
US10410883B2 (en) * 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10311420B1 (en) 2016-06-17 2019-06-04 Square, Inc. Synchronizing open ticket functionality with kitchen display systems
US10580062B1 (en) 2016-06-28 2020-03-03 Square, Inc. Integrating predefined templates with open ticket functionality
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
US10007184B2 (en) * 2016-09-01 2018-06-26 Rohm And Haas Electronic Materials Llc Silicon-containing underlayers
US20180164685A1 (en) * 2016-12-14 2018-06-14 Rohm And Haas Electronic Materials Llc Method using silicon-containing underlayers
US11506979B2 (en) 2016-12-14 2022-11-22 Rohm And Haas Electronic Materials Llc Method using silicon-containing underlayers
TWI842671B (zh) * 2017-03-31 2024-05-21 日商日產化學工業股份有限公司 具有羰基結構的含矽抗蝕下層膜形成組成物
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US11281104B2 (en) 2017-07-06 2022-03-22 Nissan Chemical Corporation Alkaline developer soluable silicon-containing resist underlayer film-forming composition
US11360387B2 (en) 2017-08-04 2022-06-14 Rohm And Haas Electronic Materials Llc Silicon-containing underlayers
US10761423B2 (en) 2017-08-30 2020-09-01 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical composition for tri-layer removal
US10943311B1 (en) 2017-09-29 2021-03-09 Square, Inc. Order fulfillment and tracking systems and methods
US20190146343A1 (en) * 2017-11-10 2019-05-16 Rohm And Haas Electronic Materials Llc Silicon-containing underlayers
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
US11138680B1 (en) 2018-11-21 2021-10-05 Square, Inc. Updating menus based on predicted efficiencies
US10915905B1 (en) 2018-12-13 2021-02-09 Square, Inc. Batch-processing transactions in response to an event
WO2020196563A1 (ja) * 2019-03-28 2020-10-01 日産化学株式会社 膜形成用組成物
JP7342953B2 (ja) * 2019-07-29 2023-09-12 Jsr株式会社 組成物、ケイ素含有膜、ケイ素含有膜の形成方法及び半導体基板の処理方法
WO2021081482A1 (en) * 2019-10-24 2021-04-29 Brewer Science, Inc. High-silicon-content wet-removable planarizing layer
JP7637070B2 (ja) * 2020-01-15 2025-02-27 株式会社カネカ 樹脂組成物、その製造方法、及び、多液型硬化性樹脂組成物
KR20220162140A (ko) * 2020-03-31 2022-12-07 닛산 가가쿠 가부시키가이샤 막 형성용 조성물
WO2021221171A1 (ja) * 2020-04-30 2021-11-04 日産化学株式会社 レジスト下層膜形成用組成物

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03100021A (ja) * 1989-09-14 1991-04-25 Nippon Telegr & Teleph Corp <Ntt> ポリシロキサン
JP4096138B2 (ja) 1999-04-12 2008-06-04 Ｊｓｒ株式会社 レジスト下層膜用組成物の製造方法
US6268457B1 (en) 1999-06-10 2001-07-31 Allied Signal, Inc. Spin-on glass anti-reflective coatings for photolithography
US6890448B2 (en) 1999-06-11 2005-05-10 Shipley Company, L.L.C. Antireflective hard mask compositions
US6420088B1 (en) 2000-06-23 2002-07-16 International Business Machines Corporation Antireflective silicon-containing compositions as hardmask layer
US6730454B2 (en) 2002-04-16 2004-05-04 International Business Machines Corporation Antireflective SiO-containing compositions for hardmask layer
US6740469B2 (en) 2002-06-25 2004-05-25 Brewer Science Inc. Developer-soluble metal alkoxide coatings for microelectronic applications
JP3951124B2 (ja) 2002-12-06 2007-08-01 Ｊｓｒ株式会社 絶縁膜
KR101156200B1 (ko) 2003-05-23 2012-06-18 다우 코닝 코포레이션 습식 에치율이 높은 실록산 수지계 반사 방지 피막 조성물
US7270887B2 (en) 2004-10-13 2007-09-18 Shin-Etsu Chemical Co., Ltd. Antireflective coating, coating composition, and antireflective coated article
EP1762895B1 (en) 2005-08-29 2016-02-24 Rohm and Haas Electronic Materials, L.L.C. Antireflective Hard Mask Compositions
US7678529B2 (en) 2005-11-21 2010-03-16 Shin-Etsu Chemical Co., Ltd. Silicon-containing film forming composition, silicon-containing film serving as etching mask, substrate processing intermediate, and substrate processing method
WO2007066597A1 (ja) 2005-12-06 2007-06-14 Nissan Chemical Industries, Ltd. 光架橋硬化のレジスト下層膜を形成するためのケイ素含有レジスト下層膜形成組成物
JP4421566B2 (ja) 2005-12-26 2010-02-24 チェイル インダストリーズ インコーポレイテッド フォトレジスト下層膜用ハードマスク組成物及びこれを利用した半導体集積回路デバイスの製造方法
KR101523393B1 (ko) * 2007-02-27 2015-05-27 이엠디 퍼포먼스 머티리얼스 코프. 규소를 주성분으로 하는 반사 방지 코팅 조성물
JP5078475B2 (ja) * 2007-07-11 2012-11-21 旭化成イーマテリアルズ株式会社 ポリオルガノシロキサン
JP2009265595A (ja) * 2007-09-07 2009-11-12 Sekisui Chem Co Ltd 感光性組成物及びパターン膜の製造方法
JP5369553B2 (ja) * 2007-09-07 2013-12-18 東レ株式会社 シロキサン樹脂組成物、硬化物およびこれを用いた光半導体
JP5581225B2 (ja) * 2008-03-04 2014-08-27 ダウ・コーニング・コーポレイション シルセスキオキサン樹脂
JP2010039056A (ja) * 2008-08-01 2010-02-18 Sekisui Chem Co Ltd 感光性組成物及びパターン膜の製造方法
JP2010039051A (ja) * 2008-08-01 2010-02-18 Sekisui Chem Co Ltd 感光性組成物及びパターン膜の製造方法
US7955782B2 (en) 2008-09-22 2011-06-07 Honeywell International Inc. Bottom antireflective coatings exhibiting enhanced wet strip rates, bottom antireflective coating compositions for forming bottom antireflective coatings, and methods for fabricating the same
JP5015892B2 (ja) * 2008-10-02 2012-08-29 信越化学工業株式会社 ケイ素含有膜形成用組成物、ケイ素含有膜形成基板及びパターン形成方法
WO2010068336A1 (en) 2008-12-10 2010-06-17 Dow Corning Corporation Silsesquioxane resins
CN102257435B (zh) 2008-12-19 2014-01-22 日产化学工业株式会社 含有具有阴离子基的硅的抗蚀剂下层膜形成用组合物
US9217921B2 (en) 2009-06-02 2015-12-22 Nissan Chemical Industries, Ltd. Resist underlayer film forming composition containing silicon having sulfide bond
JP5534250B2 (ja) 2009-09-16 2014-06-25 日産化学工業株式会社 スルホンアミド基を有するシリコン含有レジスト下層膜形成組成物
TWI432895B (zh) * 2010-12-01 2014-04-01 Chi Mei Corp 感光性聚矽氧烷組成物及其所形成之基材保護膜
JP5785121B2 (ja) 2011-04-28 2015-09-24 信越化学工業株式会社 パターン形成方法
WO2013031985A1 (ja) * 2011-08-31 2013-03-07 旭化成イーマテリアルズ株式会社 感光性アルカリ可溶シリコーン樹脂組成物
US9011591B2 (en) 2011-09-21 2015-04-21 Dow Global Technologies Llc Compositions and antireflective coatings for photolithography
TWI432898B (zh) * 2011-12-05 2014-04-01 Chi Mei Corp 彩色濾光片用藍色感光性樹脂組成物及其應用
WO2014080908A1 (ja) * 2012-11-26 2014-05-30 東レ株式会社 ネガ型感光性樹脂組成物
US9348228B2 (en) 2013-01-03 2016-05-24 Globalfoundries Inc. Acid-strippable silicon-containing antireflective coating
JP6201984B2 (ja) * 2013-02-14 2017-09-27 東レ株式会社 ネガ型感光性着色組成物、硬化膜、タッチパネル用遮光パターン及びタッチパネルの製造方法
JP5830044B2 (ja) 2013-02-15 2015-12-09 信越化学工業株式会社 レジスト下層膜形成用組成物及びパターン形成方法
TWI490653B (zh) 2013-09-10 2015-07-01 Chi Mei Corp 正型感光性樹脂組成物及其圖案形成方法
JP6690239B2 (ja) * 2014-09-30 2020-04-28 東レ株式会社 感光性樹脂組成物、硬化膜、硬化膜を具備する素子及び半導体装置の製造方法

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