JP2017015519A5 - - Google Patents
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- Publication number
- JP2017015519A5 JP2017015519A5 JP2015131486A JP2015131486A JP2017015519A5 JP 2017015519 A5 JP2017015519 A5 JP 2017015519A5 JP 2015131486 A JP2015131486 A JP 2015131486A JP 2015131486 A JP2015131486 A JP 2015131486A JP 2017015519 A5 JP2017015519 A5 JP 2017015519A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- heat dissipation
- mounting
- heat
- resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 claims 18
- 239000004065 semiconductor Substances 0.000 claims 17
- 239000000725 suspension Substances 0.000 claims 14
- 239000000758 substrate Substances 0.000 claims 10
- 239000011347 resin Substances 0.000 claims 9
- 229920005989 resin Polymers 0.000 claims 9
- 239000000523 sample Substances 0.000 claims 9
- 238000007789 sealing Methods 0.000 claims 9
- 238000005259 measurement Methods 0.000 claims 7
- 229910000679 solder Inorganic materials 0.000 claims 7
- 238000000034 method Methods 0.000 claims 6
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015131486A JP6652337B2 (ja) | 2015-06-30 | 2015-06-30 | 半導体装置の実装状態の検査方法および実装基板に実装された半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015131486A JP6652337B2 (ja) | 2015-06-30 | 2015-06-30 | 半導体装置の実装状態の検査方法および実装基板に実装された半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017015519A JP2017015519A (ja) | 2017-01-19 |
| JP2017015519A5 true JP2017015519A5 (enExample) | 2018-06-21 |
| JP6652337B2 JP6652337B2 (ja) | 2020-02-19 |
Family
ID=57830224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015131486A Expired - Fee Related JP6652337B2 (ja) | 2015-06-30 | 2015-06-30 | 半導体装置の実装状態の検査方法および実装基板に実装された半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6652337B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023209856A1 (ja) * | 2022-04-27 | 2023-11-02 | 日立Astemo株式会社 | 車載制御装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5594234A (en) * | 1994-11-14 | 1997-01-14 | Texas Instruments Incorporated | Downset exposed die mount pad leadframe and package |
| JP2003297965A (ja) * | 2002-03-29 | 2003-10-17 | Toyota Motor Corp | 半導体装置およびその製造方法 |
| JP2004325363A (ja) * | 2003-04-28 | 2004-11-18 | Matsushita Electric Ind Co Ltd | 実装済みプリント基板の検査方法およびプリント基板 |
| JP2008166403A (ja) * | 2006-12-27 | 2008-07-17 | Toshiba Corp | プリント配線板、プリント回路板、およびプリント回路板の接合部検査方法 |
| US8823407B2 (en) * | 2012-03-01 | 2014-09-02 | Integrated Device Technology, Inc. | Test assembly for verifying heat spreader grounding in a production test |
| JP6022546B2 (ja) * | 2012-03-30 | 2016-11-09 | 昭和電工株式会社 | 硬化性放熱組成物 |
| JP6121692B2 (ja) * | 2012-11-05 | 2017-04-26 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
-
2015
- 2015-06-30 JP JP2015131486A patent/JP6652337B2/ja not_active Expired - Fee Related
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