JP6652337B2 - 半導体装置の実装状態の検査方法および実装基板に実装された半導体装置 - Google Patents

半導体装置の実装状態の検査方法および実装基板に実装された半導体装置 Download PDF

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Publication number
JP6652337B2
JP6652337B2 JP2015131486A JP2015131486A JP6652337B2 JP 6652337 B2 JP6652337 B2 JP 6652337B2 JP 2015131486 A JP2015131486 A JP 2015131486A JP 2015131486 A JP2015131486 A JP 2015131486A JP 6652337 B2 JP6652337 B2 JP 6652337B2
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Japan
Prior art keywords
semiconductor device
heat radiating
radiating portion
resistance
mounting
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2015131486A
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English (en)
Japanese (ja)
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JP2017015519A (ja
JP2017015519A5 (enExample
Inventor
聖明 門井
聖明 門井
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Ablic Inc
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Ablic Inc
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Priority to JP2015131486A priority Critical patent/JP6652337B2/ja
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Publication of JP2017015519A5 publication Critical patent/JP2017015519A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Tests Of Electronic Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
JP2015131486A 2015-06-30 2015-06-30 半導体装置の実装状態の検査方法および実装基板に実装された半導体装置 Expired - Fee Related JP6652337B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015131486A JP6652337B2 (ja) 2015-06-30 2015-06-30 半導体装置の実装状態の検査方法および実装基板に実装された半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015131486A JP6652337B2 (ja) 2015-06-30 2015-06-30 半導体装置の実装状態の検査方法および実装基板に実装された半導体装置

Publications (3)

Publication Number Publication Date
JP2017015519A JP2017015519A (ja) 2017-01-19
JP2017015519A5 JP2017015519A5 (enExample) 2018-06-21
JP6652337B2 true JP6652337B2 (ja) 2020-02-19

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Family Applications (1)

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JP2015131486A Expired - Fee Related JP6652337B2 (ja) 2015-06-30 2015-06-30 半導体装置の実装状態の検査方法および実装基板に実装された半導体装置

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JP (1) JP6652337B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023209856A1 (ja) * 2022-04-27 2023-11-02 日立Astemo株式会社 車載制御装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5594234A (en) * 1994-11-14 1997-01-14 Texas Instruments Incorporated Downset exposed die mount pad leadframe and package
JP2003297965A (ja) * 2002-03-29 2003-10-17 Toyota Motor Corp 半導体装置およびその製造方法
JP2004325363A (ja) * 2003-04-28 2004-11-18 Matsushita Electric Ind Co Ltd 実装済みプリント基板の検査方法およびプリント基板
JP2008166403A (ja) * 2006-12-27 2008-07-17 Toshiba Corp プリント配線板、プリント回路板、およびプリント回路板の接合部検査方法
US8823407B2 (en) * 2012-03-01 2014-09-02 Integrated Device Technology, Inc. Test assembly for verifying heat spreader grounding in a production test
US20150037575A1 (en) * 2012-03-30 2015-02-05 Showa Denko K.K. Curable heat radiation composition
JP6121692B2 (ja) * 2012-11-05 2017-04-26 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法

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