JP2017005131A5 - - Google Patents

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Publication number
JP2017005131A5
JP2017005131A5 JP2015118116A JP2015118116A JP2017005131A5 JP 2017005131 A5 JP2017005131 A5 JP 2017005131A5 JP 2015118116 A JP2015118116 A JP 2015118116A JP 2015118116 A JP2015118116 A JP 2015118116A JP 2017005131 A5 JP2017005131 A5 JP 2017005131A5
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JP
Japan
Prior art keywords
hole
pedestal
printed board
screwing
electronic device
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JP2015118116A
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English (en)
Japanese (ja)
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JP6501638B2 (ja
JP2017005131A (ja
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Priority to JP2015118116A priority Critical patent/JP6501638B2/ja
Priority claimed from JP2015118116A external-priority patent/JP6501638B2/ja
Priority to CN201610391060.XA priority patent/CN106255308B/zh
Priority to DE102016209903.5A priority patent/DE102016209903A1/de
Priority to US15/175,732 priority patent/US9769916B2/en
Publication of JP2017005131A publication Critical patent/JP2017005131A/ja
Publication of JP2017005131A5 publication Critical patent/JP2017005131A5/ja
Application granted granted Critical
Publication of JP6501638B2 publication Critical patent/JP6501638B2/ja
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JP2015118116A 2015-06-11 2015-06-11 電子装置 Active JP6501638B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015118116A JP6501638B2 (ja) 2015-06-11 2015-06-11 電子装置
CN201610391060.XA CN106255308B (zh) 2015-06-11 2016-06-03 印刷基板和电子装置
DE102016209903.5A DE102016209903A1 (de) 2015-06-11 2016-06-06 Leiterplatte und Elektronikvorrichtung
US15/175,732 US9769916B2 (en) 2015-06-11 2016-06-07 Printed circuit board and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015118116A JP6501638B2 (ja) 2015-06-11 2015-06-11 電子装置

Publications (3)

Publication Number Publication Date
JP2017005131A JP2017005131A (ja) 2017-01-05
JP2017005131A5 true JP2017005131A5 (enExample) 2018-04-05
JP6501638B2 JP6501638B2 (ja) 2019-04-17

Family

ID=57395422

Family Applications (1)

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JP2015118116A Active JP6501638B2 (ja) 2015-06-11 2015-06-11 電子装置

Country Status (4)

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US (1) US9769916B2 (enExample)
JP (1) JP6501638B2 (enExample)
CN (1) CN106255308B (enExample)
DE (1) DE102016209903A1 (enExample)

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CN108347820B (zh) * 2017-01-25 2020-09-15 奥特斯(中国)有限公司 容纳部件的基底结构上的高导热涂层
US11406004B2 (en) * 2018-08-13 2022-08-02 Leonardo Electronics Us Inc. Use of metal-core printed circuit board (PCB) for generation of ultra-narrow, high-current pulse driver
DE102018213639A1 (de) * 2018-08-14 2020-02-20 Te Connectivity Germany Gmbh Verfahren zum Anbringen wenigstens eines insbesondere stiftförmigen Kontaktelements auf einer Leiterbahn einer Leiterplatte, Stiftleiste zur Anbringung auf einer Leiterplatte, Verbindungsanordnung
US20220068757A1 (en) * 2019-07-09 2022-03-03 Juliano Anflor Thermal Coupling Between Transistor And Audio Drivers With Heat Sink
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CN110519912B (zh) * 2019-09-19 2020-11-06 生益电子股份有限公司 一种内嵌导热体的pcb制作方法及pcb
JP6873217B1 (ja) * 2019-12-05 2021-05-19 三菱電機株式会社 電力変換装置
JP7469944B2 (ja) * 2020-04-03 2024-04-17 株式会社小糸製作所 プリント基板

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