JP2016540892A5 - - Google Patents

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Publication number
JP2016540892A5
JP2016540892A5 JP2016536676A JP2016536676A JP2016540892A5 JP 2016540892 A5 JP2016540892 A5 JP 2016540892A5 JP 2016536676 A JP2016536676 A JP 2016536676A JP 2016536676 A JP2016536676 A JP 2016536676A JP 2016540892 A5 JP2016540892 A5 JP 2016540892A5
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JP
Japan
Prior art keywords
chamber
line
deposition
arrangement
substrate
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JP2016536676A
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English (en)
Japanese (ja)
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JP2016540892A (ja
JP6647202B2 (ja
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Priority claimed from PCT/EP2013/075850 external-priority patent/WO2015082022A1/en
Publication of JP2016540892A publication Critical patent/JP2016540892A/ja
Publication of JP2016540892A5 publication Critical patent/JP2016540892A5/ja
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Publication of JP6647202B2 publication Critical patent/JP6647202B2/ja
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JP2016536676A 2013-12-06 2013-12-06 堆積アレンジメント、堆積装置、及びこれらの操作方法 Active JP6647202B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2013/075850 WO2015082022A1 (en) 2013-12-06 2013-12-06 Depositing arrangement, deposition apparatus and methods of operation thereof

Publications (3)

Publication Number Publication Date
JP2016540892A JP2016540892A (ja) 2016-12-28
JP2016540892A5 true JP2016540892A5 (https=) 2017-02-09
JP6647202B2 JP6647202B2 (ja) 2020-02-14

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ID=49886884

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016536676A Active JP6647202B2 (ja) 2013-12-06 2013-12-06 堆積アレンジメント、堆積装置、及びこれらの操作方法

Country Status (7)

Country Link
US (1) US20170022598A1 (https=)
EP (1) EP3077567B1 (https=)
JP (1) JP6647202B2 (https=)
KR (1) KR102137181B1 (https=)
CN (2) CN111441015A (https=)
TW (1) TWI652363B (https=)
WO (1) WO2015082022A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018103137A (ja) * 2016-12-28 2018-07-05 セイコーエプソン株式会社 液体吐出装置、方法およびコンピュータープログラム
US20210147975A1 (en) * 2018-04-18 2021-05-20 Applied Materials, Inc. Evaporation source for deposition of evaporated material on a substrate, deposition apparatus, method for measuring a vapor pressure of evaporated material, and method for determining an evaporation rate of an evaporated material
KR20210091342A (ko) * 2018-12-12 2021-07-21 어플라이드 머티어리얼스, 인코포레이티드 프리-스팬 코팅 시스템들 및 방법들
WO2020251696A1 (en) 2019-06-10 2020-12-17 Applied Materials, Inc. Processing system for forming layers
US11624113B2 (en) * 2019-09-13 2023-04-11 Asm Ip Holding B.V. Heating zone separation for reactant evaporation system
JP7080354B2 (ja) * 2019-10-21 2022-06-03 株式会社アルバック 成膜装置
CN115279935A (zh) * 2020-03-26 2022-11-01 应用材料公司 蒸发源、具有蒸发源的沉积设备及其方法
KR102859881B1 (ko) * 2020-11-18 2025-09-12 주식회사 엘지화학 유기발광다이오드의 증착장치
RU2765222C1 (ru) * 2020-12-30 2022-01-26 Тхе Баттериес Сп. з о.о. Способ формирования пленки LiCoO2 и устройство для его реализации
US12209303B2 (en) * 2021-01-15 2025-01-28 Applied Materials, Inc. Apparatus for providing a liquefied material, dosage system and method for dosing a liquefied material
CN113215535B (zh) * 2021-05-21 2022-11-22 泊肃叶科技(沈阳)有限公司 一种蒸发速率智能可调的蒸发镀膜机
WO2024091605A1 (en) * 2022-10-28 2024-05-02 Applied Materials, Inc. Porous media evaporator
CN119651320B (zh) * 2023-09-15 2026-01-30 中国科学院大连化学物理研究所 一种大流量碱金属原子蒸气生产装置

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US2664852A (en) * 1950-04-27 1954-01-05 Nat Res Corp Vapor coating apparatus
JPH01234560A (ja) * 1988-03-11 1989-09-19 Ulvac Corp 蒸着装置における低融点蒸発材の供給方法及び装置
US5135817A (en) * 1988-07-06 1992-08-04 Kabushiki Kaisha Kobe Seiko Sho Zn-Mg alloy vapor deposition plated metals of high corrosion resistance, as well as method of producing them
JPH02118064A (ja) * 1988-10-27 1990-05-02 Mitsubishi Heavy Ind Ltd 真空蒸着装置
JPH0372037A (ja) * 1989-08-14 1991-03-27 Toshiba Corp 金属蒸気発生装置
JPH06291040A (ja) * 1992-03-03 1994-10-18 Rintetsuku:Kk 液体気化供給方法と液体気化供給器
JPH06322501A (ja) * 1993-05-12 1994-11-22 Nippon Steel Corp スリットノズル溶融メッキ法における溶融金属の吐出量制御方法
US5492724A (en) * 1994-02-22 1996-02-20 Osram Sylvania Inc. Method for the controlled delivery of vaporized chemical precursor to an LPCVD reactor
AU9507298A (en) * 1997-09-26 1999-04-23 Advanced Technology Materials, Inc. Liquid reagent delivery system
JP4338246B2 (ja) * 1998-11-27 2009-10-07 キヤノンアネルバ株式会社 Ｃｕ−ＣＶＤプロセス用原料とＣｕ−ＣＶＤ装置
LV13383B (en) * 2004-05-27 2006-02-20 Sidrabe As Method and device for vacuum vaporization metals or alloys
KR101239776B1 (ko) * 2005-02-03 2013-03-06 어플라이드 머티어리얼스, 인코포레이티드 타깃에 인가되는 ｒｆ 소스 파워에 의한 물리 기상 증착플라즈마 반응기
FR2900070B1 (fr) * 2006-04-19 2008-07-11 Kemstream Soc Par Actions Simp Dispositif d'introduction ou d'injection ou de pulverisation d'un melange de gaz vecteur et de composes liquides et procede de mise en oeuvre dudit dispositif.
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AU2013242397B2 (en) * 2012-03-30 2017-06-15 Posco Method and apparatus for feeding liquid metal to an evaporator device

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