JP2016534005A - 多孔質セラミックスのための迅速な焼成方法 - Google Patents
多孔質セラミックスのための迅速な焼成方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000010304 firing Methods 0.000 title claims abstract description 35
- 238000010438 heat treatment Methods 0.000 claims abstract description 157
- 239000000758 substrate Substances 0.000 claims abstract description 68
- 239000011148 porous material Substances 0.000 claims abstract description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 6
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 33
- 229910052760 oxygen Inorganic materials 0.000 claims description 33
- 239000001301 oxygen Substances 0.000 claims description 33
- 239000003575 carbonaceous material Substances 0.000 claims description 2
- 241000264877 Hippospongia communis Species 0.000 description 84
- 238000005336 cracking Methods 0.000 description 13
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 229910052878 cordierite Inorganic materials 0.000 description 6
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 6
- 229920002472 Starch Polymers 0.000 description 5
- 239000010439 graphite Substances 0.000 description 5
- 229910002804 graphite Inorganic materials 0.000 description 5
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- 229910010293 ceramic material Inorganic materials 0.000 description 1
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- B29D24/005—Producing articles with hollow walls formed with structures, e.g. cores placed between two plates or sheets, e.g. partially filled the structure having joined ribs, e.g. honeycomb
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Abstract
Description
実施形態では、焼成方法の第1のステージは、セラミックハニカム素地を室温から約300℃の第1の温度まで加熱するステップを含んでよい。本明細書において使用される場合、室温は特に制限されておらず、焼成方法の第1のステージの開始前のセラミック本体及び/又は加熱装置のいずれの周囲温度を含んでよいことが理解されるべきである。
実施形態では、焼成方法の第2のステージは、セラミックハニカム素地を、第1のステージにおいて到達した最高温度から約800℃以上の第2の温度まで加熱するステップを含んでよい。いくつかの実施形態では、本焼成方法の第2のステージは、セラミックハニカム素地を、第1のステージにおいて到達した最高温度から約1000℃以下の第2の温度まで加熱するステップを含んでよい。いくつかの実施形態では、本方法の第2のステージは、セラミックハニカム素地を、第1のステージにおいて到達した最高温度から約900℃の温度まで加熱するステップを含んでよい。
実施形態では、本明細書に記載される焼成方法の第3のステージは、セラミックハニカム素地を、第2のステージにおいて到達した最高温度から第3の温度まで加熱するステップを含んでよい。第3の温度は、1050℃以上、又は約1100℃以上でさえあってよい。実施形態では、第3の温度は約1200℃であってよい。
実施形態では、焼成方法の第4のステージは、セラミックハニカム本体を、第3のステージにおける最高温度から最高ソーク温度まで加熱するステップを含む。最高ソーク温度は、約1200℃超、又は約1300℃超でさえあってよい。いくつかの実施形態では、最高ソーク温度は約1400℃超であってよい。セラミックハニカム本体を、所定の長さの時間に亘って、最高ソーク温度に保持してよい。最高ソーク温度に保持する期間は特に制限されず、適切な特性を形成するのに必要な長さであってよい。セラミックハニカム本体が最高ソーク温度まで加熱された後、セラミックハニカム本体を周囲条件において室温まで冷却してよい。この冷却は、加熱装置からセラミックハニカム本体を取り外すことによって、又は周囲空気が炉内に流入する及び/若しくは炉を通って流れることができるようにすることによって実施してよい。
以下の実施例では、以下の表1に示した直径を有する円筒形セラミックハニカム本体を、炉内において図1に示した加熱速度で加熱する。更に、各ステージにおいて使用される酸素の量、及び使用される細孔形成剤の量を表1に列挙する。実施例1〜6はそれぞれ、コージエライト組成物である。
本明細書に記載される様々な実施形態の修正例及び変形例を包含することが意図されている。
Claims (10)
- セラミックハニカム素地を焼成する方法であって、
前記セラミックハニカム素地を室温から約300℃の第1の温度まで加熱するステップ;及び
前記セラミックハニカム素地を、前記第1の温度から約800℃以上の第2の温度まで、約90℃/hr以上の加熱速度で加熱するステップ
を有してなり、
前記セラミックハニカム素地は、約4.0インチ(10.16cm)以上〜約9.0インチ(22.86cm)以下の直径を有し、
前記セラミックハニカム素地は、炭素系細孔形成剤を約10重量%以上〜約45重量%以下の濃度で含む、方法。 - 前記セラミックハニカム素地を室温から前記第1の温度まで加熱する前記ステップは:
前記セラミックハニカム素地を、室温から約215℃〜約250℃の温度まで加熱するステップ;及び
前記セラミックハニカム素地を、前記約215℃〜約250℃の温度から前記第1の温度まで、約90℃/hr以上の加熱速度で加熱するステップ
を含む、請求項1に記載の方法。 - 前記セラミックハニカム素地を、室温から前記約215℃〜約250℃の温度まで加熱する前記ステップは:
前記セラミックハニカム素地を、室温から約150℃〜約205℃の温度まで、約60℃/hr以上〜約80℃/hr以下の加熱速度で加熱するステップ;及び
前記セラミックハニカム素地を、前記約150℃〜約205℃の温度から前記約215℃〜約250℃の温度まで、約20℃/hr以下の加熱速度で加熱するステップ
を含む、請求項2に記載の方法。 - 前記セラミックハニカム素地を室温から前記第1の温度まで加熱する前記ステップは:約90℃/hr以上、例えば約90℃/hr以上〜約150℃/hr以下の加熱速度で加熱するステップを含む、請求項1〜3のいずれか1項に記載の方法。
- 前記セラミックハニカム素地を、前記第1の温度から前記第2の温度まで加熱する前記ステップは、約150℃/hr以下の加熱速度、例えば約90℃/hr以上〜約125℃/hr以下の加熱速度で加熱するステップを含む、請求項1〜4のいずれか1項に記載の方法。
- 前記第2の温度は約1000℃以下であり、
前記方法は更に、前記セラミックハニカム素地が前記第2の温度まで加熱された後に、前記セラミックハニカム素地中に残っている炭素質材料を除去するのに十分な加熱速度で、前記セラミックハニカム素地を前記第2の温度から約1050℃以上の第3の温度まで加熱するステップを含む、請求項1〜5のいずれか1項に記載の方法。 - 前記セラミックハニカム素地は、前記第2の温度から前記第3の温度まで、約20℃/hr以下の加熱速度で加熱される、請求項6に記載の方法。
- 前記セラミックハニカム素地は、前記第2の温度から前記第3の温度まで、約60℃/hr以上の加熱速度で加熱される、請求項6に記載の方法。
- 室温から前記第1の温度まで前記セラミックハニカム素地を加熱する間に存在する雰囲気の酸素含有量は、約5%〜約8%である、請求項1〜8のいずれか1項に記載の方法。
- 前記第1の温度から前記第2の温度まで前記セラミックハニカム素地を加熱する間に存在する雰囲気の酸素含有量は、約7%〜約13%である、請求項1〜9のいずれか1項に記載の方法。
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US13/951,802 US9446560B2 (en) | 2013-07-26 | 2013-07-26 | Fast firing method for high porosity ceramics |
US13/951,802 | 2013-07-26 | ||
PCT/US2014/047713 WO2015013346A1 (en) | 2013-07-26 | 2014-07-23 | Fast firing method for high porosity ceramics |
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JP2016534005A true JP2016534005A (ja) | 2016-11-04 |
JP6273007B2 JP6273007B2 (ja) | 2018-01-31 |
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EP (1) | EP3024798B1 (ja) |
JP (1) | JP6273007B2 (ja) |
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