JP2016528739A5 - - Google Patents

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Publication number
JP2016528739A5
JP2016528739A5 JP2016536104A JP2016536104A JP2016528739A5 JP 2016528739 A5 JP2016528739 A5 JP 2016528739A5 JP 2016536104 A JP2016536104 A JP 2016536104A JP 2016536104 A JP2016536104 A JP 2016536104A JP 2016528739 A5 JP2016528739 A5 JP 2016528739A5
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JP
Japan
Prior art keywords
processing chamber
fluid line
gas
epitaxial
dopant
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JP2016536104A
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English (en)
Japanese (ja)
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JP2016528739A (ja
JP6456956B2 (ja
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Priority claimed from PCT/US2014/048506 external-priority patent/WO2015026491A1/en
Publication of JP2016528739A publication Critical patent/JP2016528739A/ja
Publication of JP2016528739A5 publication Critical patent/JP2016528739A5/ja
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Publication of JP6456956B2 publication Critical patent/JP6456956B2/ja
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JP2016536104A 2013-08-19 2014-07-28 不純物が積層したエピタキシーのための装置 Active JP6456956B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361867385P 2013-08-19 2013-08-19
US61/867,385 2013-08-19
PCT/US2014/048506 WO2015026491A1 (en) 2013-08-19 2014-07-28 Apparatus for impurity layered epitaxy

Publications (3)

Publication Number Publication Date
JP2016528739A JP2016528739A (ja) 2016-09-15
JP2016528739A5 true JP2016528739A5 (enExample) 2017-09-07
JP6456956B2 JP6456956B2 (ja) 2019-01-23

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JP2016536104A Active JP6456956B2 (ja) 2013-08-19 2014-07-28 不純物が積層したエピタキシーのための装置

Country Status (6)

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US (1) US9856580B2 (enExample)
JP (1) JP6456956B2 (enExample)
KR (1) KR102076087B1 (enExample)
CN (1) CN105493229B (enExample)
TW (1) TWI649465B (enExample)
WO (1) WO2015026491A1 (enExample)

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US9856580B2 (en) * 2013-08-19 2018-01-02 Applied Materials, Inc. Apparatus for impurity layered epitaxy
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US10446420B2 (en) * 2016-08-19 2019-10-15 Applied Materials, Inc. Upper cone for epitaxy chamber
KR102408720B1 (ko) 2017-06-07 2022-06-14 삼성전자주식회사 상부 돔을 포함하는 반도체 공정 챔버
CN111602235B (zh) * 2018-01-29 2025-03-14 应用材料公司 用于在pvd处理中减少颗粒的处理配件几何形状
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US11032945B2 (en) * 2019-07-12 2021-06-08 Applied Materials, Inc. Heat shield assembly for an epitaxy chamber
CN119465090A (zh) 2020-04-20 2025-02-18 应用材料公司 具有共用的气体输送和排气系统的多个热cvd腔室
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