JP2016527665A - ポリマー厚膜銅導体組成物の光焼結 - Google Patents

ポリマー厚膜銅導体組成物の光焼結 Download PDF

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Publication number
JP2016527665A
JP2016527665A JP2016519553A JP2016519553A JP2016527665A JP 2016527665 A JP2016527665 A JP 2016527665A JP 2016519553 A JP2016519553 A JP 2016519553A JP 2016519553 A JP2016519553 A JP 2016519553A JP 2016527665 A JP2016527665 A JP 2016527665A
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JP
Japan
Prior art keywords
thick film
polymer thick
weight
conductor composition
copper conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016519553A
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English (en)
Japanese (ja)
Other versions
JP2016527665A5 (cg-RX-API-DMAC7.html
Inventor
ディー．サマーズ ジョン
ディー．サマーズ ジョン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JP2016527665A publication Critical patent/JP2016527665A/ja
Publication of JP2016527665A5 publication Critical patent/JP2016527665A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Inorganic Chemistry (AREA)
JP2016519553A 2013-06-13 2014-06-06 ポリマー厚膜銅導体組成物の光焼結 Pending JP2016527665A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/916,759 2013-06-13
US13/916,759 US9190188B2 (en) 2013-06-13 2013-06-13 Photonic sintering of polymer thick film copper conductor compositions
PCT/US2014/041196 WO2015050589A2 (en) 2013-06-13 2014-06-06 Photonic sintering of polymer thick film copper conductor compositions

Publications (2)

Publication Number Publication Date
JP2016527665A true JP2016527665A (ja) 2016-09-08
JP2016527665A5 JP2016527665A5 (cg-RX-API-DMAC7.html) 2017-07-20

Family

ID=52018433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016519553A Pending JP2016527665A (ja) 2013-06-13 2014-06-06 ポリマー厚膜銅導体組成物の光焼結

Country Status (5)

Country Link
US (2) US9190188B2 (cg-RX-API-DMAC7.html)
EP (1) EP3008735B1 (cg-RX-API-DMAC7.html)
JP (1) JP2016527665A (cg-RX-API-DMAC7.html)
CN (1) CN105264614B (cg-RX-API-DMAC7.html)
WO (1) WO2015050589A2 (cg-RX-API-DMAC7.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018169012A1 (ja) * 2017-03-16 2018-09-20 旭化成株式会社 分散体並びにこれを用いた導電性パターン付構造体の製造方法及び導電性パターン付構造体
WO2019022230A1 (ja) * 2017-07-27 2019-01-31 旭化成株式会社 酸化銅インク及びこれを用いた導電性基板の製造方法、塗膜を含む製品及びこれを用いた製品の製造方法、導電性パターン付製品の製造方法、並びに、導電性パターン付製品
US11109492B2 (en) 2017-07-18 2021-08-31 Asahi Kasei Kabushiki Kaisha Structure including electroconductive pattern regions, method for producing same, stack, method for producing same, and copper wiring
US11328835B2 (en) 2017-03-16 2022-05-10 Asahi Kasei Kabushiki Kaisha Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5275498B1 (ja) * 2012-07-03 2013-08-28 石原薬品株式会社 導電膜形成方法及び焼結進行剤
JP5941588B2 (ja) * 2014-09-01 2016-06-29 Ｄｏｗａエレクトロニクス株式会社 接合材およびそれを用いた接合方法
WO2016060838A1 (en) * 2014-10-14 2016-04-21 Sun Chemical Corporation Thermoformable conductive inks and coatings and a process for fabrication of a thermoformed device
US9649730B2 (en) * 2015-08-12 2017-05-16 E I Du Pont De Nemours And Company Paste and process for forming a solderable polyimide-based polymer thick film conductor
US20170044382A1 (en) * 2015-08-12 2017-02-16 E I Du Pont De Nemours And Company Process for forming a solderable polyimide-based polymer thick film conductor
US9637647B2 (en) * 2015-08-13 2017-05-02 E I Du Pont De Nemours And Company Photonic sintering of a polymer thick film copper conductor composition
US9637648B2 (en) * 2015-08-13 2017-05-02 E I Du Pont De Nemours And Company Photonic sintering of a solderable polymer thick film copper conductor composition
JP6505572B2 (ja) * 2015-09-30 2019-04-24 日東電工株式会社 加熱接合用シート及びダイシングテープ付き加熱接合用シート
JP6509770B2 (ja) * 2016-03-31 2019-05-08 Ｊｘ金属株式会社 導電性金属粉ペースト
EP3282453B1 (en) 2016-08-11 2023-07-12 Henkel AG & Co. KGaA Improved processing of polymer based inks and pastes
WO2018092598A1 (ja) * 2016-11-17 2018-05-24 日本化学工業株式会社 亜酸化銅粒子、その製造方法、光焼結型組成物、それを用いた導電膜の形成方法及び亜酸化銅粒子ペースト
TWI652695B (zh) * 2017-08-16 2019-03-01 昇貿科技股份有限公司 Liquid composition
JP7099867B2 (ja) * 2018-05-16 2022-07-12 日本化学工業株式会社 光焼結型組成物及びそれを用いた導電膜の形成方法
JP7110410B2 (ja) * 2018-06-26 2022-08-01 アルファ・アセンブリー・ソリューションズ・インコーポレイテッド 焼結ダイアタッチ及び類似した用途のためのナノ銅ペースト及びフィルム
CN112437706B (zh) 2018-08-08 2024-01-02 三井金属矿业株式会社 接合用组合物以及导电体的接合结构及其制造方法
CN111867264B (zh) * 2019-04-30 2021-10-22 云谷（固安）科技有限公司 导电线的制造方法、可拉伸显示器件以及可拉伸显示器件的制造方法
JP7766900B2 (ja) 2021-02-05 2025-11-11 株式会社マテリアル・コンセプト 銅ペースト
CN115642000B (zh) * 2022-12-23 2023-04-07 西北工业大学 一种可光子烧结的导电铜浆制备方法
CN117820898B (zh) * 2023-12-25 2025-10-17 之江实验室 一种硼化锆浆料的制备方法及硼化锆薄膜

Citations (2)

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Publication number Priority date Publication date Assignee Title
JPH11217522A (ja) * 1998-02-04 1999-08-10 Sumitomo Rubber Ind Ltd 導電性ペーストとそれを用いたプリント基板、ならびにその製造方法
WO2013077448A1 (ja) * 2011-11-24 2013-05-30 昭和電工株式会社 導電パターン形成方法及び光照射またはマイクロ波加熱による導電パターン形成用組成物

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US4663079A (en) * 1984-07-31 1987-05-05 Mitsubishi Petrochemical Co., Ltd. Copper-type conductive coating composition
JPH064791B2 (ja) * 1985-09-30 1994-01-19 タツタ電線株式会社 導電塗料
US4687597A (en) * 1986-01-29 1987-08-18 E. I. Du Pont De Nemours And Company Copper conductor compositions
DE3782522T2 (de) 1986-03-31 1993-06-03 Tatsuta Densen Kk Leitfaehige kupferpastenzusammensetzung.
JPS62230869A (ja) * 1986-03-31 1987-10-09 Tatsuta Electric Wire & Cable Co Ltd 半田付可能な導電塗料
JPS6420276A (en) * 1987-07-15 1989-01-24 Mitsubishi Petrochemical Co Copper-containing electroconductive coating composition
US5064469A (en) * 1989-10-03 1991-11-12 Akzo N.V. Preparation of oxidation resistant metal powder
JPH0412595A (ja) * 1990-05-02 1992-01-17 Mitsubishi Petrochem Co Ltd 導電性ペースト組成物
JP2006117959A (ja) * 2004-10-19 2006-05-11 Fukuda Metal Foil & Powder Co Ltd 電子材料用銅粉
JP5408878B2 (ja) * 2004-11-24 2014-02-05 エヌシーシー ナノ， エルエルシー ナノ材料組成物の電気的使用、めっき的使用および触媒的使用
KR101145566B1 (ko) * 2005-04-20 2012-05-22 피브로-테크, 인코포레이티드 미립자 구리 분말의 제조 방법
US8945686B2 (en) 2007-05-24 2015-02-03 Ncc Method for reducing thin films on low temperature substrates
US8506849B2 (en) 2008-03-05 2013-08-13 Applied Nanotech Holdings, Inc. Additives and modifiers for solvent- and water-based metallic conductive inks
US20110180137A1 (en) 2010-01-25 2011-07-28 Hitachi Chemical Company, Ltd. Paste composition for electrode and photovoltaic cell
WO2011114747A1 (ja) * 2010-03-18 2011-09-22 古河電気工業株式会社 導電性ペースト、及び該ペーストから得られる導電接続部材
US8419981B2 (en) * 2010-11-15 2013-04-16 Cheil Industries, Inc. Conductive paste composition and electrode prepared using the same
WO2013081664A1 (en) 2011-12-02 2013-06-06 E. I. Du Pont De Nemours And Company Conductive metal composition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11217522A (ja) * 1998-02-04 1999-08-10 Sumitomo Rubber Ind Ltd 導電性ペーストとそれを用いたプリント基板、ならびにその製造方法
WO2013077448A1 (ja) * 2011-11-24 2013-05-30 昭和電工株式会社 導電パターン形成方法及び光照射またはマイクロ波加熱による導電パターン形成用組成物

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018169012A1 (ja) * 2017-03-16 2018-09-20 旭化成株式会社 分散体並びにこれを用いた導電性パターン付構造体の製造方法及び導電性パターン付構造体
US11270809B2 (en) 2017-03-16 2022-03-08 Asahi Kasei Kabushiki Kaisha Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern
US11328835B2 (en) 2017-03-16 2022-05-10 Asahi Kasei Kabushiki Kaisha Dispersing element, method for manufacturing structure with conductive pattern using the same, and structure with conductive pattern
US11109492B2 (en) 2017-07-18 2021-08-31 Asahi Kasei Kabushiki Kaisha Structure including electroconductive pattern regions, method for producing same, stack, method for producing same, and copper wiring
WO2019022230A1 (ja) * 2017-07-27 2019-01-31 旭化成株式会社 酸化銅インク及びこれを用いた導電性基板の製造方法、塗膜を含む製品及びこれを用いた製品の製造方法、導電性パターン付製品の製造方法、並びに、導電性パターン付製品
JPWO2019022230A1 (ja) * 2017-07-27 2020-05-28 旭化成株式会社 酸化銅インク及びこれを用いた導電性基板の製造方法、塗膜を含む製品及びこれを用いた製品の製造方法、導電性パターン付製品の製造方法、並びに、導電性パターン付製品
JP2022008655A (ja) * 2017-07-27 2022-01-13 旭化成株式会社 酸化銅インク及びこれを用いた導電性基板の製造方法、塗膜を含む製品及びこれを用いた製品の製造方法、導電性パターン付製品の製造方法、並びに、導電性パターン付製品
US11760895B2 (en) 2017-07-27 2023-09-19 Asahi Kasei Kabushiki Kaisha Copper oxide ink and method for producing conductive substrate using same, product containing coating film and method for producing product using same, method for producing product with conductive pattern, and product with conductive pattern
JP7403512B2 (ja) 2017-07-27 2023-12-22 旭化成株式会社 酸化銅インク及びこれを用いた導電性基板の製造方法、塗膜を含む製品及びこれを用いた製品の製造方法、導電性パターン付製品の製造方法、並びに、導電性パターン付製品
US12202996B2 (en) 2017-07-27 2025-01-21 Asahi Kasei Kabushiki Kaisha Copper oxide ink and method for producing conductive substrate using same, product containing coating film and method for producing product using same, method for producing product with conductive pattern, and product with conductive pattern

Also Published As

Publication number Publication date
EP3008735A2 (en) 2016-04-20
CN105264614B (zh) 2018-01-16
US9190188B2 (en) 2015-11-17
WO2015050589A3 (en) 2015-06-04
US20140367619A1 (en) 2014-12-18
EP3008735B1 (en) 2017-12-27
US20160035455A1 (en) 2016-02-04
CN105264614A (zh) 2016-01-20
WO2015050589A2 (en) 2015-04-09

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