JP2016517167A5 - - Google Patents
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- Publication number
- JP2016517167A5 JP2016517167A5 JP2016500304A JP2016500304A JP2016517167A5 JP 2016517167 A5 JP2016517167 A5 JP 2016517167A5 JP 2016500304 A JP2016500304 A JP 2016500304A JP 2016500304 A JP2016500304 A JP 2016500304A JP 2016517167 A5 JP2016517167 A5 JP 2016517167A5
- Authority
- JP
- Japan
- Prior art keywords
- ring
- ring body
- disposed
- trench
- dome
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 12
- 230000002093 peripheral effect Effects 0.000 claims 7
- 239000012530 fluid Substances 0.000 claims 6
- 229910000831 Steel Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 229910001220 stainless steel Inorganic materials 0.000 claims 2
- 239000010935 stainless steel Substances 0.000 claims 2
- 239000010959 steel Substances 0.000 claims 2
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361780447P | 2013-03-13 | 2013-03-13 | |
| US61/780,447 | 2013-03-13 | ||
| US201361781960P | 2013-03-14 | 2013-03-14 | |
| US61/781,960 | 2013-03-14 | ||
| US13/846,355 US9322097B2 (en) | 2013-03-13 | 2013-03-18 | EPI base ring |
| US13/846,355 | 2013-03-18 | ||
| PCT/US2014/017200 WO2014163809A1 (en) | 2013-03-13 | 2014-02-19 | Epi base ring |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018109219A Division JP2018170514A (ja) | 2013-03-13 | 2018-06-07 | Ｅｐｉベースリング |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016517167A JP2016517167A (ja) | 2016-06-09 |
| JP2016517167A5 true JP2016517167A5 (enExample) | 2017-03-30 |
| JP6353026B2 JP6353026B2 (ja) | 2018-07-04 |
Family
ID=51521626
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016500304A Active JP6353026B2 (ja) | 2013-03-13 | 2014-02-19 | Ｅｐｉベースリング |
| JP2018109219A Pending JP2018170514A (ja) | 2013-03-13 | 2018-06-07 | Ｅｐｉベースリング |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018109219A Pending JP2018170514A (ja) | 2013-03-13 | 2018-06-07 | Ｅｐｉベースリング |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US9322097B2 (enExample) |
| JP (2) | JP6353026B2 (enExample) |
| KR (2) | KR101931541B1 (enExample) |
| CN (3) | CN105810610B (enExample) |
| SG (1) | SG11201505674SA (enExample) |
| TW (2) | TWI607113B (enExample) |
| WO (1) | WO2014163809A1 (enExample) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012128783A1 (en) * | 2011-03-22 | 2012-09-27 | Applied Materials, Inc. | Liner assembly for chemical vapor deposition chamber |
| US9512520B2 (en) * | 2011-04-25 | 2016-12-06 | Applied Materials, Inc. | Semiconductor substrate processing system |
| US9499905B2 (en) * | 2011-07-22 | 2016-11-22 | Applied Materials, Inc. | Methods and apparatus for the deposition of materials on a substrate |
| US20140116336A1 (en) * | 2012-10-26 | 2014-05-01 | Applied Materials, Inc. | Substrate process chamber exhaust |
| US9814099B2 (en) * | 2013-08-02 | 2017-11-07 | Applied Materials, Inc. | Substrate support with surface feature for reduced reflection and manufacturing techniques for producing same |
| WO2016036497A1 (en) * | 2014-09-05 | 2016-03-10 | Applied Materials, Inc. | Upper dome for epi chamber |
| US20180249580A1 (en) * | 2015-02-06 | 2018-08-30 | Ushio Denki Kabushiki Kaisha | Optical processing device and optical processing method |
| JP6299635B2 (ja) * | 2015-03-12 | 2018-03-28 | 信越半導体株式会社 | 気相成長装置及び気相成長装置に用いるリフレクタ |
| GB201513339D0 (en) * | 2015-07-29 | 2015-09-09 | Pilkington Group Ltd | Coating apparatus |
| CN105118803B (zh) * | 2015-08-21 | 2019-01-22 | 京东方科技集团股份有限公司 | 顶针机构及支撑装置 |
| US10325790B2 (en) * | 2016-04-29 | 2019-06-18 | Applied Materials, Inc. | Methods and apparatus for correcting substrate deformity |
| CN116190216A (zh) | 2016-10-03 | 2023-05-30 | 应用材料公司 | 多通道流量比例控制器与处理腔室 |
| US10934620B2 (en) * | 2016-11-29 | 2021-03-02 | Applied Materials, Inc. | Integration of dual remote plasmas sources for flowable CVD |
| KR102408720B1 (ko) * | 2017-06-07 | 2022-06-14 | 삼성전자주식회사 | 상부 돔을 포함하는 반도체 공정 챔버 |
| TWI811284B (zh) * | 2018-01-24 | 2023-08-11 | 美商應用材料股份有限公司 | 腔室入口組件、入口構件及包括此腔室入口組件的基板處理系統 |
| KR102848536B1 (ko) * | 2018-08-06 | 2025-08-21 | 어플라이드 머티어리얼스, 인코포레이티드 | 처리 챔버를 위한 라이너 |
| WO2020046567A1 (en) * | 2018-08-29 | 2020-03-05 | Applied Materials, Inc. | Chamber injector |
| US10995419B2 (en) * | 2019-04-16 | 2021-05-04 | Applied Materials, Inc. | Methods and apparatus for gallium nitride deposition |
| US11032945B2 (en) * | 2019-07-12 | 2021-06-08 | Applied Materials, Inc. | Heat shield assembly for an epitaxy chamber |
| WO2021055768A1 (en) * | 2019-09-19 | 2021-03-25 | Applied Materials, Inc. | Apparatus and methods for motor shaft and heater leveling |
| CN110854044B (zh) * | 2019-11-20 | 2022-05-27 | 北京北方华创微电子装备有限公司 | 半导体设备及其加热装置 |
| FI129610B (en) * | 2020-01-10 | 2022-05-31 | Picosun Oy | SUBSTRATE PROCESSING EQUIPMENT AND METHOD |
| US12037701B2 (en) | 2020-04-20 | 2024-07-16 | Applied Materials, Inc. | Multi-thermal CVD chambers with shared gas delivery and exhaust system |
| JP7698042B2 (ja) * | 2020-10-13 | 2025-06-24 | チュソン エンジニアリング カンパニー，リミテッド | 基板処理装置｛ｓｕｂｓｔｒａｔｅ ｐｒｏｃｅｓｓｉｎｇ ａｐｐａｒａｔｕｓ｝ |
| US12188148B2 (en) | 2020-12-22 | 2025-01-07 | Applied Materials, Inc. | Multi-layer EPI chamber body |
| CN112831771A (zh) * | 2020-12-30 | 2021-05-25 | 上海埃原半导体设备有限公司 | 一种化学气相沉积用的非金属反应腔 |
| CN114686849B (zh) | 2020-12-31 | 2023-12-01 | 拓荆科技股份有限公司 | 制造半导体薄膜的装置和方法 |
| EP4337814A4 (en) * | 2021-05-11 | 2025-10-08 | Applied Materials Inc | GAS INJECTOR FOR EPITAXY AND CHEMICAL VAPOR DEPOSITION CHAMBER |
| CN117758237A (zh) * | 2022-09-23 | 2024-03-26 | 中微半导体设备(上海)股份有限公司 | 角度调节方法、可调节支架及其薄膜处理装置 |
| US20240141488A1 (en) * | 2022-10-27 | 2024-05-02 | Applied Materials, Inc. | Coated substrate support assembly for substrate processing in processing chambers |
| CN118773580A (zh) * | 2023-04-06 | 2024-10-15 | 中微半导体设备(上海)股份有限公司 | 基环组件及基片处理设备 |
| US20250215566A1 (en) * | 2023-12-27 | 2025-07-03 | Applied Materials, Inc. | Process chamber gas supply improvement |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2674811B2 (ja) * | 1988-11-25 | 1997-11-12 | 富士通株式会社 | 半導体装置の成長膜形成炉 |
| US5085887A (en) * | 1990-09-07 | 1992-02-04 | Applied Materials, Inc. | Wafer reactor vessel window with pressure-thermal compensation |
| US5346578A (en) * | 1992-11-04 | 1994-09-13 | Novellus Systems, Inc. | Induction plasma source |
| US5578132A (en) * | 1993-07-07 | 1996-11-26 | Tokyo Electron Kabushiki Kaisha | Apparatus for heat treating semiconductors at normal pressure and low pressure |
| DE69433656T2 (de) | 1993-07-30 | 2005-02-17 | Applied Materials, Inc., Santa Clara | Verfahren zum Einleiten reaktiven Gases in eine Substratbearbeitungsvorrichtung |
| US5597439A (en) | 1994-10-26 | 1997-01-28 | Applied Materials, Inc. | Process gas inlet and distribution passages |
| DE69815163T2 (de) | 1997-01-24 | 2004-05-06 | Applied Materials, Inc., Santa Clara | Verfahren und Vorrichtung zur Abscheidung von Titanschichten |
| US5879459A (en) * | 1997-08-29 | 1999-03-09 | Genus, Inc. | Vertically-stacked process reactor and cluster tool system for atomic layer deposition |
| US6153260A (en) * | 1997-04-11 | 2000-11-28 | Applied Materials, Inc. | Method for heating exhaust gas in a substrate reactor |
| US6406543B1 (en) * | 1998-07-23 | 2002-06-18 | Applied Materials, Inc. | Infra-red transparent thermal reactor cover member |
| EP1036988A3 (en) | 1999-02-26 | 2001-05-16 | R. Jan Mowill | Gas turbine engine fuel/air premixers with variable geometry exit and method for controlling exit velocities |
| US6245149B1 (en) * | 1999-07-01 | 2001-06-12 | Applied Materials, Inc. | Inert barrier for high purity epitaxial deposition systems |
| US6307184B1 (en) * | 1999-07-12 | 2001-10-23 | Fsi International, Inc. | Thermal processing chamber for heating and cooling wafer-like objects |
| US6635117B1 (en) * | 2000-04-26 | 2003-10-21 | Axcelis Technologies, Inc. | Actively-cooled distribution plate for reducing reactive gas temperature in a plasma processing system |
| US6344631B1 (en) * | 2001-05-11 | 2002-02-05 | Applied Materials, Inc. | Substrate support assembly and processing apparatus |
| JP4060684B2 (ja) * | 2002-10-29 | 2008-03-12 | 日本発条株式会社 | ステージ |
| JP2004311550A (ja) * | 2003-04-03 | 2004-11-04 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| JP4689969B2 (ja) * | 2003-04-05 | 2011-06-01 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | Ｉｖａ族およびｖｉａ族化合物の調製 |
| KR100439276B1 (ko) | 2003-11-24 | 2004-07-30 | 코닉 시스템 주식회사 | 급속열처리 장치 |
| US7794667B2 (en) | 2005-10-19 | 2010-09-14 | Moore Epitaxial, Inc. | Gas ring and method of processing substrates |
| KR20090083404A (ko) * | 2006-10-24 | 2009-08-03 | 어플라이드 머티어리얼스, 인코포레이티드 | 원자 층 증착을 위한 보텍스 챔버 리드 |
| JP5074741B2 (ja) | 2006-11-10 | 2012-11-14 | 株式会社日立ハイテクノロジーズ | 真空処理装置 |
| JP2008235830A (ja) * | 2007-03-23 | 2008-10-02 | Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 | 気相成長装置 |
| JP2009049047A (ja) * | 2007-08-13 | 2009-03-05 | Shin Etsu Handotai Co Ltd | 気相成長装置及び気相成長方法 |
| US8394229B2 (en) * | 2008-08-07 | 2013-03-12 | Asm America, Inc. | Susceptor ring |
| JP5267366B2 (ja) * | 2009-07-16 | 2013-08-21 | 株式会社Ｓｕｍｃｏ | シリコンウェーハの処理装置 |
| WO2012054206A2 (en) | 2010-10-19 | 2012-04-26 | Applied Materials, Inc. | Quartz showerhead for nanocure uv chamber |
| WO2012128783A1 (en) * | 2011-03-22 | 2012-09-27 | Applied Materials, Inc. | Liner assembly for chemical vapor deposition chamber |
| US9499905B2 (en) | 2011-07-22 | 2016-11-22 | Applied Materials, Inc. | Methods and apparatus for the deposition of materials on a substrate |
| US8960235B2 (en) | 2011-10-28 | 2015-02-24 | Applied Materials, Inc. | Gas dispersion apparatus |
| US20130160948A1 (en) * | 2011-12-23 | 2013-06-27 | Lam Research Corporation | Plasma Processing Devices With Corrosion Resistant Components |
-
2013
- 2013-03-18 US US13/846,355 patent/US9322097B2/en active Active
-
2014
- 2014-02-19 JP JP2016500304A patent/JP6353026B2/ja active Active
- 2014-02-19 CN CN201610052064.5A patent/CN105810610B/zh active Active
- 2014-02-19 CN CN201711105746.9A patent/CN108034931B/zh active Active
- 2014-02-19 WO PCT/US2014/017200 patent/WO2014163809A1/en not_active Ceased
- 2014-02-19 CN CN201480008331.8A patent/CN104995717B/zh active Active
- 2014-02-19 KR KR1020177019408A patent/KR101931541B1/ko active Active
- 2014-02-19 KR KR1020157029118A patent/KR101759818B1/ko active Active
- 2014-02-19 SG SG11201505674SA patent/SG11201505674SA/en unknown
- 2014-03-04 TW TW103107226A patent/TWI607113B/zh active
- 2014-03-04 TW TW106135971A patent/TWI643266B/zh active
-
2016
- 2016-04-22 US US15/136,119 patent/US10119192B2/en active Active
-
2018
- 2018-06-07 JP JP2018109219A patent/JP2018170514A/ja active Pending
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