JP2016507652A - Method and system for producing electrolytic copper foil by backflow of copper sulfate solution - Google Patents

Abstract

The present invention relates to a method and system for producing electrolytic copper foil by backflow of a copper sulfate solution, including a cathode roll and an anode tank, and upper end ports on both sides of the anode tank are on both sides of the cathode roll. There is a flowing copper sulfate solution, a part of the outer surface of the cathode roll is immersed in the copper sulfate solution, and as the cathode roll rotates, the copper foil plated on the cathode roll is wound while being peeled off, and the copper sulfate solution Is a method of flowing into the anode tank from at least the upper end port of the anode tank on one side of the cathode roll. The present invention has a simpler structure than the traditional raw foil system, and completely overturns the history that only the additive can control the mass of the copper foil surface, by controlling the flow rate of the copper sulfate solution on the cathode roll surface. The roughness of the copper foil surface and the copper ion plating density of the copper foil are controlled. The present invention simplifies the production process, simplifies the control process, makes it easier to operate, reduces production costs, reduces pollutant emissions, is environmentally friendly, has significant economic and social effects. is there. [Selection] Figure 1

Description

  The present invention belongs to the field of electrolytic copper foil production technology, and particularly relates to a method and system for producing electrolytic copper foil by backflow of a copper sulfate solution. The traditional method of flowing the copper sulfate solution in the anode tank from bottom to top can be changed to flow from top to bottom, and the copper foil surface quality can be controlled by changing the direction and flow rate of the copper sulfate solution. It has an unexpected effect on production, and has escaped from the history of controlling the mass of the copper foil surface only with additives.

  Currently, the production of electrolytic copper foil is not environmentally friendly, and instead of a lead anode that is susceptible to erosion, a titanium iridium anode with a conductive layer coated on the surface is used. However, regardless of whether you use a lead anode or a titanium iridium anode, the production process is basically the same, and the copper sulfate solution in the anode tank always flows in from the bottom of the anode tank and flows out from the upper end of the anode tank. And then back flow into the copper melting apparatus. In traditional production facilities and processes, copper foil is produced in such a manner that the concentration of copper flowing in the anode tank below the axis of the cathode roll with surface roughness Ra ≦ 0.4 μm is 70-110 g / L, A cathode immersed in a flowing copper sulfate solution according to the principle of plating when immersed in a copper sulfate solution having a concentration of 80-130 g / L and a temperature of 40-65 ° C. and passing a current between the cathode roll and the anode. Copper crystal particles are plated on the surface of the roll. According to the plating constant: 1.186 g / A-h, the thickness of the copper foil plated on the surface of the cathode roll is determined by the time during which the cathode roll is immersed in the copper sulfate solution in a situation where the current is constant. The thickness of the copper foil plated on the surface of the cathode roll can be changed by rotating the cathode roll and changing the rotation speed of the cathode roll in the copper sulfate solution. The copper foil with different thickness is obtained by peeling off the copper foil. The side of the copper foil attached to the surface of the cathode roll is called the light surface, and the plated layer side is called the rough surface. Due to the polarization effect of the plating process, irregular copper crystal particles such as peaks are formed on the rough surface of the copper foil, and the thicker the copper foil, the larger the copper crystal particles and the larger the roughness. In the production process, an additive (gelatin, modified gelatin, thiourea, etc.) is added to control the roughness Rz of the copper foil. However, since the production process is complicated and very difficult to control, it has become a bottleneck in copper foil production, a unique technology kept secret by each copper foil manufacturer, and a large amount of addition in the copper sulfate solution When the copper sulfate solution flows back into the copper dissolution apparatus, it is necessary to filter the additive in order to improve the quality of the copper sulfate solution. Therefore, it is necessary to increase the number of filtration facilities, and therefore the filter Increase the burden of. Further, oxygen is released during the process in which copper ions in the copper sulfate solution are plated on the surface of the cathode roll, and a large amount of bubbles are generated, which also affects the plating effect. Since the copper sulfate solution flows upward, the bubbles are taken out from the upper end of the anode tank by the copper sulfate solution to generate sulfuric acid smoke and oxidize the copper foil surface just peeled off from the cathode roll. In order to solve this problem, by installing an exhaust port with a large displacement at the mouth of the anode tank, equipment for producing copper foil becomes complicated and control becomes difficult.

  Since 1955 when electrolytic copper foil was commercialized by Yates, the production process has remained essentially unchanged, and the solution has always been produced in a way that enters from the bottom and overflows from the top. There was no good way to solve the hydrodynamic problem in the tank, mainly by maintaining the concentration of copper ions and additives in the solution.

  Even if the copper sulfate solution is supplied to the production of the electrolytic copper foil by using either a high-level tank or an acid-resistant pump, the flow rate is generally 0.5 meters / second or less, and the obtained copper foil crystals are rod-shaped. Even though the crystal structure and physical properties at room temperature can be changed by the addition of light additive, it is very unstable at high temperature and the tensile strength is greatly attenuated. Defects are generated by using the crystal lattice, so that pinholes and warping are likely to occur, and such a copper foil is not suitable for use in high-quality circuit boards and lithium batteries.

  In the copper foil production process, copper atoms are deposited on the surface of the cathode, oxygen bubbles are generated on the anode surface, and are connected to the solution entering from the bottom to arrive at the liquid surface. Because the copper foil surface and the operator are seriously damaged, the workplace must be kept clean with strong ventilation.

  The solution entering from below generates a large turbulent flow near the liquid inlet, and the Renault number exceeds 2000. Many manufacturers have struggled with the design of liquid injection tubes, but they still cannot solve the phenomenon of thickness imbalance. Although the thickness must be adjusted using a liquid injection valve or shield, such adjustment methods are temporary and very unstable and need to be adjusted once a day or twice a day. The shield can only be used once or twice, and the cost is surprisingly high, making continuous production difficult.

  There are two types of solutions that enter from the bottom, the closed type and the open type, with the former being 100 percent new solution and the latter using the old and new solutions at the same time. However, the flow rate of the anodes on both the left and right sides cannot be accurately controlled by any method. There is no choice but to assume that both have half the flow rate, and the controllability for the flow rate is quite low.

  The biggest drawback of the solution entering from below is that the solution at the outlet of the copper sulfate solution outlet of the anode tank is the old solution after electrolysis, the concentration of copper ions and additives is low, and many bubbles accumulate on the surface. Thus, the resistance of the liquid level increases. After mixing both, the current density at the liquid level is lower than below the liquid level. Such a phenomenon is disadvantageous for the formation of crystal nuclei when the cathode roll is placed on the liquid surface. In severe situations, it can be a major cause of pinholes and warping in the copper foil.

  The object of the present invention is to provide a technical solution of a method and system for producing electrolytic copper foil by reverse flow of copper sulfate solution to the above problems, and to flow the copper sulfate solution from the bottom to the top of the anode tank. Improved the method of flowing from top to bottom, increased the flow rate, had a surprising effect on the production of copper foil, and thoroughly escaped from the history of controlling the surface quality of copper foil only with additives.

The technical solution of the present invention for realizing the above object is as follows:
A method for producing electrolytic copper foil by backflow of a copper sulfate solution, comprising: a cathode roll; an arcuate anode; and an anode tank formed by a gap installed between the cathode roll and the arcuate anode; The upper end is on both sides of the cathode roll, one side is the foil production side, there is a flowing copper sulfate solution in the anode tank, the cathode roll rotates in the anode tank, and part of the cathode roll The outer surface of the copper foil is immersed in a copper sulfate solution, a current is passed between the cathode roll and the anode, and as the cathode roll rotates, the copper foil plated on the cathode roll is wound up while being peeled off. The copper solution flows into the anode cell from the upper end of the anode cell on at least one side of the cathode roll.

  A more preferable method is that the copper sulfate solution flows into the anode tank from the upper end of the anode tank on the cathode roll foil production side.

  A more preferable method is that the copper sulfate solution flows into the anode tank from the upper end of the anode tank on the cathode roll foil production side, and flows out from the bottom of the anode tank. It is taken out from the bottom of the tank.

  Further preferably, when the roughness of the surface of the copper foil ridge layer is larger than the set value, the above method increases the flow rate of the copper sulfate solution formed on the surface of the cathode roll into which the surface of the copper foil ridge layer is formed. If the roughness is smaller than the set value, it includes reducing the flow rate formed by the copper sulfate solution on the surface of the cathode roll into which it flows.

  Further preferred method is that, under the conditions of the electrolytic copper foil production process, the flow rate of the copper sulfate solution formed on the surface of the cathode roll is at least 0.5 meter / second, and the electrolytic copper foil production process conditions Has a copper content of 70-110 g / L, an acid concentration of 80-130 g / L, a temperature of 40-65 ° C., and an anode of 50 amperes-85 amperes per square decimeter Including the current density.

  More preferably, the copper sulfate solution is a mixed solution of a primary copper sulfate solution and a secondary copper sulfate solution, and the primary copper sulfate solution is a copper sulfate stock solution provided directly from a copper dissolving apparatus, and the secondary copper sulfate solution Is a copper sulfate solution after flowing out of the anode tank and plating.

  In a more preferred method, the ratio of the primary copper sulfate solution to the secondary copper sulfate solution in the mixed solution is ≧ 1: 2.

  A system for realizing a method for producing electrolytic copper foil by backflow of a copper sulfate solution, comprising a cathode roll, an arcuate anode, and a copper melting device, wherein the cathode roll is rotatably installed in the arcuate anode, The anode tank is formed by a gap installed between the arcuate anodes, and the anode tank is provided with an upper groove for transporting the copper sulfate solution to the anode tank. The upper ends of both sides of the anode tank are located on both sides of the cathode roll. One side is the foil generation side, and the anode tank is provided with an inlet and an outlet for the copper sulfate solution, and the copper dissolving device communicates with the liquid inlet in the upper groove via a conveying pipe. In addition, a receiver tank of the copper sulfate solution that flows backward is installed, the outlet of the copper sulfate solution in the anode tank communicates with the receiver tank, the receiver tank communicates with the copper dissolving device, and the receiver tank is composed of the copper sulfate solution. auxiliary Communication with the liquid inlet of the upper groove through the pump, the liquid outlet of the upper groove is upper opening communicating with the anode chamber in one side of at least the cathode roller through a copper sulfate solution transport pipe.

  In a more preferred method, a total flow control valve is installed in a pipe that communicates the upper groove and the copper sulfate solution inlet of the anode tank, and a pipe that communicates the copper sulfate solution outlet of the anode tank and the receiver tank. A flow rate control valve for adjusting the flow rate of the copper sulfate solution in the anode tank is installed therein, and a control valve for the flow rate of the copper sulfate solution that flows backward is installed in the pipe communicating between the auxiliary pump for the copper sulfate solution and the upper groove. .

  In a more preferred method, the upper end opening of the anode tank on one side of the cathode roll is the upper end opening of the anode tank on the foil forming side of the cathode roll.

  In a more preferred method, the liquid discharge port of the upper groove communicates with the upper end port of the anode tank on both sides of the cathode roll via the copper sulfate solution transport pipe, and the copper sulfate solution outlet of the anode tank is the bottom of the anode tank. Installed.

  More preferably, the length of the copper sulfate solution outlet at the bottom of the anode tank is the length of the cathode roll, and the width of the outlet is at least twice the gap between the cathode roll and the arcuate anode.

  A more preferred method is that the upper end port of the anode tank is connected to a conversion port for a copper sulfate solution flowing in the same width as the upper end port of the anode cell, and a baffle plate that can control the flow direction of the copper sulfate solution is installed at the conversion port. The

Compared with the existing technology, the present invention has the following advantages.
1. Roughly overturning the production process in which the mass of the copper foil surface can only be controlled with additives, the roughness of the copper foil surface by changing the direction of the copper sulfate solution and controlling the flow rate of the copper sulfate solution on the cathode roll surface, And controlling the copper ion plating density of the copper foil, thereby reducing the requirements for filtration equipment, simplifying the production process, simplifying the control process and making it easier to operate.

  2. The present invention reduces the need for filtration equipment, is simpler than traditional foil production equipment, and reduces production costs.

  3. The production process of the present invention reduces pollutant emissions, is environmentally friendly and has significant economic and social benefits.

  Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings and examples.

Content of the Invention Here is a description paragraph in the technical field.

The schematic diagram of the flow of the production process of this invention. The schematic diagram of the system structure of this invention. The schematic diagram of the conversion port structure of the copper sulfate solution which flows into the anode tank upper end port of this invention.

Specific Embodiment Example 1
It is an Example of the production method of the electrolytic copper foil by the backflow of a copper sulfate solution, and includes the anode tank formed by the clearance gap installed between the cathode roll 1 and the curved semi-arc shaped anode like FIG. The distance between the anode and the cathode roll is usually maintained between 8-15 mm, and the upper end openings on both sides of the anode cell are located on both sides of the cathode roll (ie, two vertically separated along the central axis of the cathode roll). Side), one side of which is the foil production side, the anode tank has a flowing copper sulfate solution 4, the cathode roll rotates in the anode tank, and the outer surface below the axis of the cathode roll is copper. The content is 70-110 g / L, the concentration of acid is 80-130 g / L, the temperature is 40-65 ° C., immersed in an anode tank containing a copper sulfate solution, and a current between the cathode roll and the anode. As the cathode roll rotates, Copper foil 5, which is plated to a role more and more is peeled off, the wound in the take-up roll 7 through the peeling roll 6. Among them, the copper sulfate solution flows into the anode tank from at least the upper end of the anode tank on one side of the cathode roll, so that the copper sulfate solution forms an impact force with a downward flow velocity on the inflow side surface of the cathode roll ( That is, the copper sulfate solution forms an impact force at a constant flow rate that is the opposite direction to the movement of bubbles, that is, an impact force at a flow rate that carries the bubbles downward).

  A preferred form 1 of this embodiment is that the upper end of the anode tank on one side is the upper end of the anode tank on the cathode roll foil production side, that is, the copper sulfate solution is on the cathode roll foil production side. It is flowing into the anode tank from the upper end port 3-1 of the anode tank.

  In the preferred form 2 of the present embodiment, the copper sulfate solution flows from at least the upper end of the anode tank on one side of the cathode roll, so that the copper sulfate solution can flow out of the anode tank from the bottom of the anode tank, It may be from the upper end opening of the anode tank on the other side of the roll. In the process of plating the surface of the cathode roll with copper ions in the copper sulfate solution, in order to prevent a large amount of bubbles from being generated due to the release of oxygen and released from the upper end of the anode tank, the preferred mode and the above method The difference is that the copper sulfate solution flows into the anode tank from the upper end of the anode tank on both sides of the cathode roll, and flows out from the bottom of the anode tank. Is taken out from the bottom of the anode tank. The copper sulphate solution that flows fast down takes bubbles quickly, reducing the effect of bubbles on the copper foil quality and eliminating it.

  In the above embodiment, when the roughness of the copper foil surface is larger than the set value, the speed of the copper sulfate solution flowing out from the bottom of the anode tank is increased, that is, the flow rate of the copper sulfate solution on the cathode roll surface is increased. I'll give you. When the roughness of the copper foil surface is smaller than the set value, the speed of the copper sulfate solution flowing out from the bottom of the anode tank is lowered, that is, the flow rate of the acid copper solution on the surface of the sulfur cathode roll is lowered. The set value of the roughness of the copper foil plating layer surface, that is, the roughness of the rough surface varies depending on the product, but is usually controlled to Rz ≦ 2.5 μm.

In the above form, the electrolytic copper foil production process conditions to improve the polarization effect of the plating process, solve the influence of bubbles on the copper foil quality, and improve the copper foil surface roughness and copper foil crystal particle density The flow rate of the copper sulfate solution formed on the cathode roll surface is at least 0.5 meter / second, usually 0.5-0.9 meter / second, and the production process conditions for the electrolytic copper foil are copper sulfate The copper content of the solution is 70-110 g / L, the acid concentration is 80-130 g / L, the temperature is 40-65 ° C., and the anode current density is 50 amperes-85 amperes per square decimeter. Including that. Among them, when the anode current density is 70 / dm ² ampere, it is preferable to control the flow rate of the copper sulfate solution to 0.7 meter / second in order to quickly take out the generated bubbles.

  In traditional processes, the copper sulfate solution flows from bottom to top in the anode cell so that the flow rate of the copper sulfate solution formed on the cathode roll surface is always less than 0.5 meters / second if 0.5 When the speed is higher than the meter / second, a large amount of sulfuric acid smoke is taken out from the upper end of the anode tank and a copper sulfate solution is also ejected, so that the flow rate cannot be increased. On the other hand, this example realized that the flow rate of the copper sulfate solution formed on the cathode roll surface was at least 0.5 meter / second by changing the transport direction of the copper sulfate solution in the anode tank, and By controlling the flow rate of the copper sulfate solution on the surface of the cathode roll, the roughness of the copper foil surface is controlled. When the roughness of the copper foil surface is larger than the set value, the speed of the copper sulfate solution flowing out of the anode tank is controlled. Increase, that is, increase the flow rate of the copper sulfate solution. When the roughness of the copper foil surface is smaller than the set value, the speed of the copper sulfate solution flowing out from the bottom of the anode tank is reduced, that is, the flow rate of the copper sulfate solution is lowered. The set value of the roughness of the copper foil surface, that is, the roughness of the rough surface varies depending on the product, but is usually controlled to Rz ≦ 2.5 μm.

Example 2
It is another Example of the production method of the electrolytic copper foil by the backflow of a copper sulfate solution, and a present Example is improved based on Example 1, The same part of Example 1 and Example 2 in a present Example is the same part. The contents disclosed in Example 1 and Example 2 should be understood with reference to the contents, and the contents disclosed in Example 1 and Example 2 should be the contents of this example.

  In the above embodiment, since the flow rate of the copper sulfate solution formed on the surface of the cathode roll is increased, the need for the copper sulfate stock solution is increased, thereby increasing the need for the copper dissolving apparatus, and thus increasing the input to the equipment. In order to solve this problem, in this example, the copper sulfate solution is a mixed solution of a primary copper sulfate solution and a secondary copper sulfate solution, and the primary copper sulfate solution is a copper sulfate stock solution that flows out directly from the copper dissolving apparatus. The secondary copper sulfate solution is a copper sulfate solution after plating that flows out of the anode tank. Among them, since the change in the copper content in the copper sulfate solution does not affect the effect of the original production process, the ratio of the primary copper sulfate solution to the secondary copper sulfate solution in the mixed solution according to this example is ≧ 1: 2. 7: 3 is most preferable. That is, in a 100% copper sulfate solution, 70% is a primary copper sulfate solution and 30% is a secondary copper sulfate solution.

Example 3
As shown in FIG. 1 and FIG. 2, the system is based on a method for producing electrolytic copper foil by backflow of the copper sulfate solution of Example 1 and Example 2. The cathode roll 1 includes a semicircular arc anode 2 and a copper melting device 12. The cathode roll is installed so as to be able to rotate in the arcuate anode, and an anode tank 3 is formed by a gap installed between the cathode roll and the arcuate anode. The distance between the anode and the cathode roll is usually maintained between 8-15 mm, and an upper tank 13 for conveying the copper sulfate solution into the anode tank is installed at the upper part of the anode tank, and the copper sulfate solution is placed in the anode tank. An upper groove 13 for conveying to the anode cell is provided, and upper end ports on both sides of the anode cell are respectively located on both sides of the cathode roll (that is, the upper surface of the anode cell on the two side surfaces separated vertically along the central axis). End)), one of the radial sides of the cathode roll is the foil generation side. The anode tank is provided with a copper sulfate solution inlet and an outlet, and the copper dissolving device communicates with the liquid inlet of the upper groove through the transfer pipe 18. The outlet of the copper sulfate solution in the anode tank is in communication with the receiver tank, the receiver tank is in communication with a copper dissolving device, and the receiver tank is infused with liquid in the upper groove via an auxiliary pump 9 for the copper sulfate solution. The liquid discharge port of the upper groove communicates with the upper end port of the anode tank on at least one side of the cathode roll through the copper sulfate solution transport pipe.

  The copper melting device is a traditional system device currently used by the copper foil factory, and includes a copper melting tank, heat exchanger, filter and storage tank. The copper melting device is connected to the liquid inlet of the upper groove by a conveying pipe. In communication, that is, the storage tank of the copper melting device communicates with the liquid inlet of the upper groove through a pump and a pipe.

  As a preferred embodiment 1, the one side of the cathode roll according to this example means the production side of the cathode roll foil, that is, the upper end of the anode tank on one side of the cathode roll is the anode on the production side of the cathode roll foil. This is the upper end of the tank.

  As a preferred form 2, since the copper sulfate solution inlet of the anode tank is at least the upper end of the anode tank on one side of the cathode roll, the copper sulfate solution outlet of the anode tank may be at the bottom of the anode tank. It may be at the upper end of the anode tank on the other side of the cathode roll. In order to overcome the large amount of air bubbles generated by the release of oxygen during the process of plating the copper ions in the copper sulfate solution on the surface of the cathode roll, The upper groove form discharge port communicates with the upper end port of the anode tank on both sides of the cathode roll by a copper sulfate solution transport pipe, and the copper sulfate solution outlet of the anode tank is installed at the bottom of the anode tank. (In other words, a full-length notch is installed along the axial direction at the bottom of the arcuate anode).

  Among them, in order to control the flow rate of the copper sulfate solution in the anode tank, the length of the copper sulfate solution outlet at the bottom of the anode tank is the same as the length of the cathode roll, and the outlet width 19 is at least Double the gap between the cathode roll and the arcuate anode.

  In the embodiment, a total flow control valve 15 is installed in the pipe 14 that communicates the upper groove and the copper sulfate solution inlet of the anode tank, and the pipe 10 that communicates the copper sulfate solution outlet of the anode tank and the receiver tank is provided in the pipe 10. A control valve 11 for the flow rate of the copper sulfate solution in the anode tank is installed, and a control valve 17 for adjusting the flow rate of the copper sulfate solution flowing backward is installed in the pipe 16 communicating with the replenishment pump for the copper sulfate solution and the upper groove. Yes.

Example 4
The present embodiment is an improvement based on the third embodiment, and the same parts as the third embodiment in the present embodiment are understood with reference to the contents disclosed in the third embodiment, and the contents disclosed in the second embodiment are also included. It should be the contents of this embodiment.

  The upper end port of the anode tank according to the present embodiment is connected to the inflowing copper sulfate solution conversion port 20 having the same width as the upper end port of the anode cell, and the baffle plate that can adjust the flow direction of the copper sulfate solution in the conversion port. 21 is installed. By controlling the direction of the baffle, the uniformity of the thickness of the cross section of the copper foil can be adjusted.

Claims (13)

  Including an anode tank formed by a gap installed between the cathode roll and the arcuate anode, the upper end ports on both sides of the anode tank are on both sides of the cathode roll, one side is the foil generation side, There is a flowing copper sulfate solution, the cathode roll rotates in the anode tank, a part of the outer surface of the cathode roll is immersed in the copper sulfate solution, current flows between the cathode roll and the anode, and the cathode roll rotates. The copper sulfate solution is characterized in that the copper foil plated on the cathode roll is wound while being peeled off and the copper sulfate solution flows into the anode tank from the upper end of the anode tank on at least one side of the cathode roll. A method for producing electrolytic copper foil by backflow.   The said copper sulfate solution flows into an anode tank from the upper end port of the anode tank of the production | generation side of the foil of a cathode roll, The production method of the electrolytic copper foil by the reverse flow of the copper sulfate solution of Claim 1 characterized by the above-mentioned.   The copper sulfate solution flows into the anode tank from the upper end of the anode tank on the production side of the cathode roll foil, flows out from the bottom of the anode tank, and bubbles formed during plating, the copper sulfate solution flowing out from the bottom of the anode tank The method for producing an electrolytic copper foil by reverse flow of the copper sulfate solution according to claim 1, wherein the copper copper solution is taken out.   The method further increases the flow rate of the copper sulfate solution formed on the surface of the cathode roll into which the roughness of the surface of the copper foil is larger than the set value, and the roughness of the surface of the copper foil on the surface of the copper foil exceeds the set value. 2. The method for producing electrolytic copper foil by reverse flow of a copper sulfate solution according to claim 1, wherein the flow rate at which the copper sulfate solution forms on the surface of the cathode roll into which the cathode roll flows is reduced.   Under the conditions of the electrolytic copper foil production process, the flow rate formed by the copper sulfate solution on the surface of the cathode roll is at least 0.5 meter / second, and the electrolytic copper foil production process condition is the inclusion of copper. Includes copper sulfate solution with an amount of 70-110 g / L, acid concentration of 80-130 g / L, temperature of 40-65 ° C., and anode current density of 50 amps-85 amps per square decimeter. The method for producing an electrolytic copper foil by backflow of the copper sulfate solution according to any one of claims 1 to 4.   The copper sulfate solution is a mixed solution of a primary copper sulfate solution and a secondary copper sulfate solution, the primary copper sulfate solution is a copper sulfate stock solution provided directly from a copper dissolving device, and the secondary copper sulfate solution is from an anode tank. It is a copper sulfate solution after flowing out and plating, The production method of the electrolytic copper foil by the backflow of the copper sulfate solution of any one of Claims 1-4 characterized by the above-mentioned.   The method for producing an electrolytic copper foil by backflow of a copper sulfate solution according to claim 6, wherein the ratio of the primary copper sulfate solution to the secondary copper sulfate solution in the mixed solution is ≧ 1: 2.   A cathode roll, an arcuate anode, and a copper melting device are included. The cathode roll is installed so as to be rotatable in the arcuate anode, and an anode tank is formed by a gap installed between the cathode roll and the arcuate anode. An upper end tank for transporting the copper solution to the anode tank is provided, and the upper ends on both sides of the anode tank are located on both sides of the cathode roll, respectively, one side of which is the foil generation side, and the anode tank contains the copper sulfate solution. An inflow port and an outflow port are installed, the copper dissolving device communicates with the liquid inlet in the upper groove via a transport pipe, and a receiver tank for the backflowed copper sulfate solution is installed, and the copper sulfate in the anode tank The outlet of the solution communicates with the receiver tank, the receiver tank communicates with a copper dissolving device, the receiver tank communicates with the liquid inlet of the upper groove via an auxiliary pump of the copper sulfate solution, and the liquid outlet of the upper groove Is copper sulfate System method for producing an electrolytic copper foil by backflow of copper sulfate solution according to claim 1, characterized in that the upper opening in communication with the anode chamber in one side of at least the cathode roll through the liquid conveying pipe   A total flow control valve is installed in the pipe that communicates the upper groove and the copper sulfate solution inlet of the anode tank, and the anode tank has a pipe that communicates the copper sulfate solution outlet of the anode tank and the receiver tank. A flow rate control valve for adjusting the flow rate of the copper sulfate solution is installed, and a control valve for the flow rate of the copper sulfate solution flowing back is installed in the pipe communicating between the auxiliary pump for the copper sulfate solution and the upper groove. The system of the production method of the electrolytic copper foil by the backflow of the copper sulfate solution of Claim 8   10. The electrolytic copper foil by reverse flow of the copper sulfate solution according to claim 8, wherein the upper end port of the anode tank on one side of the cathode roll is the upper end port of the anode tank on the production side of the foil of the cathode roll. Production method system   The liquid discharge port of the upper groove communicates with the upper end port of the anode tank on both sides of the cathode roll through the copper sulfate solution transport pipe, and the copper sulfate solution outlet of the anode tank is installed at the bottom of the anode tank. A system for producing electrolytic copper foil by backflow of a copper sulfate solution according to claim 8 or 9,   The length of the copper sulfate solution outlet at the bottom of the anode tank is the length of the cathode roll, and the width of the outlet is at least twice the gap between the cathode roll and the arcuate anode. Item 11. System for producing electrolytic copper foil by backflow of copper sulfate solution according to item 11   The anode tank upper end port is connected to a copper sulfate solution conversion port having the same width as the anode cell upper end port, and the conversion port is provided with a baffle plate capable of controlling the flow direction of the copper sulfate solution. A system for producing electrolytic copper foil by backflow of a copper sulfate solution according to claim 11

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