CN114381792B - Method for stably controlling electroplating solution - Google Patents

Method for stably controlling electroplating solution Download PDF

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CN114381792B
CN114381792B CN202111339377.6A CN202111339377A CN114381792B CN 114381792 B CN114381792 B CN 114381792B CN 202111339377 A CN202111339377 A CN 202111339377A CN 114381792 B CN114381792 B CN 114381792B
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control
electroplating
zinc
plating solution
liquid
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CN114381792A (en
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董蓓
陈圆林
刘渊媛
王安辉
魏星
余立
陈明
黄全伟
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Wuhan Iron and Steel Co Ltd
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Wuhan Iron and Steel Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation
    • C25D21/14Controlled addition of electrolyte components
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/22Electroplating: Baths therefor from solutions of zinc

Abstract

The invention discloses a method for stably controlling electroplating liquid, which comprises the following steps: 1) Calculating the amount of water, sulfuric acid and zinc required by a tank of plating solution by taking the designed plating solution formula as a target value; 2) Adding calculated water quantity and concentrated sulfuric acid in sequence, heating and melting zinc; preliminarily preparing a required electroplating solution; 3) Titrating the plating solution, and adjusting components deviating from the target concentration in the plating solution; 4) Determining key control parameters of an electroplating process in the electroplating process, and carrying out linkage adjustment on a corresponding control process in an electroplating solution control system in the electroplating process; realizes the stable control of the electroplating solution. The invention adopts the means of accurate control of plating solution parameters based on the core control factor linkage regulation technology and the high-efficiency treatment means after abnormality occurrence, can effectively improve the stability of the electrogalvanizing process, greatly reduce the quality improvement of field production, and simultaneously realize the rapid and high-efficiency correction and adjustment of a plating solution system; the related process is simple, the operation is convenient, and the method is suitable for popularization and application.

Description

Method for stably controlling electroplating solution
Technical Field
The invention belongs to the technical field of surface treatment, and particularly relates to a method for stably controlling electroplating liquid.
Background
Gravity plating is one of the vertical plating processes, and the plating tank is not filled with plating solution during plating, the plating solution only exists between the anode box and the strip steel, and the flow of the plating solution is accelerated by the gravity of the plating solution. For high-speed electrogalvanizing production, stable control of the plating solution is a core link of the production; mainly comprises three aspects of stability, namely plating solution components (acid content and zinc ion concentration), temperature and volume. Stable bath control is a necessary condition for producing high quality electroplated panels, and is a key factor of uniformity of zinc layer thickness distribution, zinc layer crystallization thickness and product surface finish. Such as zinc sulfate concentration, temperature, etc., have a great influence on the surface quality of the electrogalvanized layer. The production shows that: the apparent brightness of the coating is reduced due to the increase of the current density, the increase of the pH value, the decrease of the temperature and the increase of the zinc ion concentration; this is because the above conditions make it difficult to diffuse zinc ions, and the plating layer is coarsely crystallized. How well the stability of the parameters of the plating solution is controlled is of great importance.
According to the traditional plating solution production process, the defects of whitening, floating ash, darkness, coarse plating crystallization and the like of the steel plate are found in the electrogalvanizing production process, so that a great amount of improvement is caused. The defect is found to be strongly related to the fluctuation of the plating solution parameters through production adjustment. When the parameters of the plating solution are abnormal, the means for adjusting the unit are often more than one, so that the adjustment means selected by different operators are also greatly different, and the adjustment time and the risk faced by the operators are also greatly different. Such problems plague steel mills for ten years, and how to thoroughly solve the problem of rapidly obtaining a stably controlled electroplating solution, reduce the occurrence of defects of a coating structure and partial surface quality defects, and reduce and judge the defects.
The plating solution control system generally comprises four circulating systems, namely an electroplating circulating system, a zinc dissolving system, an evaporating system and a sulfuric acid circulating system; the components and functions contained therein include: 1) Electroplating circulation system: the device comprises a rectifier, a filter, a plating solution circulating tank and a plating solution storage tank, and has the main functions of ensuring the thickness of a plating layer on the surface of a steel plate; 2) Zinc dissolution system: a zinc dissolving station; the main function is to increase the zinc ion concentration of the plating solution; 3) Evaporation system: temperature control and evaporation; the main functions are to maintain the plating solution temperature and stabilize the plating solution concentration; 4) Sulfuric acid circulation system: an acid adding device and a sulfuric acid circulating tank; the main function is to maintain the free acid concentration and pH value of the plating solution.
When the plating solution is abnormal, the traditional means is to use a single adjustment method aiming at different problems, for example: zinc ions with lower or higher concentration are removed by a zinc dissolving system or water is added into the plating solution; the free acid is lower or higher, and acid or water is added into the plating solution through a sulfuric acid circulating system; the temperature is lower or higher, and the heating or cooling is carried out through an evaporation system; the liquid level and the pH value are lower or higher, and the water, acid or discharge mode is adopted; the concentration of iron ions is higher, and the plating solution is discharged. Such a situation not only causes fluctuation and instability of plating solution parameters for a long period of time, but also causes a great waste of cost, and brings a series of environmental protection treatment problems. The problems plague steel mills for ten years, how to thoroughly solve the problems of fast, accurate and stable control of electroplating liquid, reduce the occurrence of defects of a coating structure and partial surface quality, and reduce and judge the defects.
Disclosure of Invention
Aiming at the problems and defects of the traditional original electrogalvanizing process, the invention provides a means for accurately controlling the parameters of the plating solution based on the core control factor linkage regulation technology and a high-efficiency processing means after abnormality; the method can effectively improve the stability of the electrogalvanizing process, greatly reduce the quality improvement of on-site production, and realize the rapid and efficient correction adjustment of a plating solution system; the related process is simple, the operation is convenient, and the method is suitable for popularization and application.
In order to realize the scheme, the invention adopts the following technical scheme:
a method for stabilizing and controlling electroplating liquid, comprising the following steps:
1) Calculating the amount of water, sulfuric acid and zinc required by a tank of plating solution by taking the designed plating solution formula as a target value;
2) Adding calculated water quantity and concentrated sulfuric acid in sequence, heating and melting zinc; preliminarily preparing a required electroplating solution;
3) Titrating the plating solution, and adjusting components deviating from the target concentration in the plating solution;
4) Determining electroplating process control parameters in an electroplating process, and carrying out linkage adjustment on corresponding control parameters in an electroplating circulation system, a zinc dissolving system, an evaporation system and a sulfuric acid circulation system of an electroplating liquid control system in the electroplating process; realizes the stable control of the electroplating solution.
In the above-described scheme, the zinc mass=the effective volume of the plating solution circulation tank×the zinc ion concentration; sulfuric acid mass = zinc particle weight x H 2 SO 4 The relative molecular weight/(the relative molecular weight of Zn. Times. The sulfuric acid utilization coefficient).
In the above scheme, the preparation process of the electroplating solution comprises: firstly adding water to the position of 65-70% of the liquid level of the plating solution circulating tank, then adding sulfuric acid, opening a heat exchanger of an evaporator part, and heating the plating solution to 45-50 ℃.
In the above embodiment, the titration step includes Zn 2+ Titration of concentration and free acid concentration.
In the above scheme, the Zn 2+ The titration step of the concentration includes: accurately transferring 1mL of electroplating solution into a 250mL conical flask, and supplementing 30mL of deionized water; 10ml of an ammonia buffer solution was added (the specific configuration steps include: 54g NH 4 Dissolving Cl in water, adding 400mL of ammonia water with the concentration of 25wt% for mixing, adding water for dilution to 1000mL for shaking uniformly, adding 2-3 drops of chrome black T indicator, and slowly titrating a sample with 0.1mol/L EDTA standard solution until the color of the solution changes from red to blue-green; recording the consumed EDTA solution volume (mL); calculation of Zn according to I 2+ Is the concentration of (1):
wherein: c is the mass concentration and mol/L of the substance of the EDTA standard solution; v (V) 1 To consume the volume of EDTA standard solution, mL; v (V) 0 The volume of the sample is mL;65.38 is the molar mass, g/mol, of zinc; the specific calculation formula is as follows:
in the above scheme, the step of titrating the concentration of the free acid comprises:
placing 10mL of an electroplating solution sample in a 250mL conical flask, adding 30mL of deionized water, and adding 3-4 drops of methyl orange-blue carmine indicator (mixed by 0.1wt% methyl orange aqueous solution and 0.25wt% indigo carmine aqueous solution according to a mass ratio of 3:2); titrating with 0.1mol/L NaOH standard solution (when the free acid content is more than 50g/L, titrating with 1mol/L NaOH standard solution instead of 0.1mol/L NaOH), at the moment, changing the solution from purple to light green, stopping titrating, and recording the volume milliliters of the standard solution consumed; the concentration of free acid is calculated according to formula II:
wherein: v (V) 1 The volume of the NaOH standard solution consumed for titration of the test solution is mL; v (V) 0 The amount of the plating solution sample is mL; c is the concentration of NaOH standard solution; 49.0 isG/mol; the specific calculation formula is as follows:
by adopting the titration steps, the problems of inaccurate titration color development and the like in the traditional titration process can be effectively avoided; since there is a lot of acid in electroplating, such as: acid washing, electroplating, conductive roller cleaning, double-sided post-plating cleaning, single-sided post-plating cleaning, and the like, and the titration of these acid solutions typically uses bromocresol green-methyl red indicators; however, in the electroplating, the color development of the bromocresol green-methyl red indicator is found to deviate due to low concentration of free acid in the plating solution, so that methyl orange-blue carmine is particularly selected as the indicator for precise control.
In the above scheme, the (key) control parameters of the electroplating process include zinc ion concentration, sulfuric acid concentration, pH value, plating solution temperature, iron ion concentration and plating solution level, and the specific control conditions include: the temperature of the plating solution is 48-53 ℃; the concentration of zinc ions is 90-140 g/L; the concentration of sulfuric acid is 2-12 g/L; the pH value is 1.2-1.8; iron ion concentration is less than 3g/L; plating solution level is 60-80%; the preferred target values are: the temperature of the plating solution is 50 ℃; the concentration of zinc ions is 115g/L; sulfuric acid concentration 7g/L; the pH value is 1.5; iron ion concentration 0g/L; the plating solution level was 70%. Wherein, the control parameters of the traditional electroplating process are mainly as follows: the temperature of the plating solution is 37-53 ℃; the concentration of zinc ions is 70-120 g/L; the concentration of sulfuric acid is 2-8 g/L; the pH value is 0.9-1.5.
In the above scheme, in the process of controlling the temperature of the plating solution, the traditional plating solution temperature control means is mainly controlled by an evaporator system; when the temperature is higher, the heating device of the evaporation system is turned off, and when the temperature is lower, the heating device of the evaporation system is turned on, but the process is long in time consumption and high in energy consumption; in the temperature control process of the plating solution, total current is regulated according to the thickness requirement of the zinc plating, the temperature difference is compensated to 48-53 ℃ through an evaporator according to the degree of the temperature rise of the plating solution at different times of the total current; in addition, the increase of the current density not only improves the temperature of the plating solution, but also improves the cathode polarization, thereby being beneficial to forming a fine-grain plating layer; wherein the calculation formula of the total galvanization current is shown in a formula III;
wherein G is the zinc plating amount (G/m 2 ) The method comprises the steps of carrying out a first treatment on the surface of the I is the total galvanization current (A); b is the width (m) of the strip steel; v is the speed (m/min) of the strip steel; η is current efficiency (in 95%).
In the above scheme, the plating solution concentration, the pH value and the plating solution liquid level are controlled by adopting linkage adjustment steps, including more than two of electroplating rate control, evaporation control, zinc dissolution control, acid addition control and liquid guide control between the plating solution and the storage tank (the traditional regulation and control process only needs to consider the control of a certain system singly);
the specific adjustment measures are as follows:
TABLE 1 plating solution conditions and corresponding adjustment measures
Note 1: the mode of accelerating electroplating and minimum instant zinc is preferred, and a certain time is needed for gradually improving the plating solution. If the machine unit is stopped, part of the plating solution in the circulating tank is directly pumped into the storage tank, and then the circulating tank is supplemented with water to reduce the concentration of zinc ions.
And (2) injection: the plating solution is preferably drained, but if the storage tank has no liquid level, condensed water is needed to replace the plating solution to raise the liquid level.
In the above adjustment measures, the parameter adjustment involved in the electroplating rate control, evaporation control, zinc dissolution control, acid addition control and liquid guiding control process between the plating solution and the storage tank is regulated and controlled on the basis of the existing technological parameter conditions corresponding to the specific plating solution working condition.
In the above scheme, the control parameters included in the electroplating circulation system include: the plating bath current regulation and control range of each plating bath in the 16 plating baths is 0-50 kA, and the total current density regulation and control range is 0-90A/dm 2 The method comprises the steps of carrying out a first treatment on the surface of the The speed and flow regulation range of the plating solution circulating pump is 0-500 m 3 /h; control parameters included in the zinc dissolution system include: the speed and flow regulation range of the zinc dissolving pump is 0-1000 kg/h; the control parameters included in the evaporation system include: the evaporation capacity regulating and controlling range is 0-800 m 3 /h; the control parameters included in the sulfuric acid circulation system include: the speed and flow regulation range of the acid adding pump is 0-100 m 3 /h。
In the above scheme, in the iron ion control process, the traditional process is controlled by adding condensed water after discharging the plating solution, so that a great deal of cost waste and environmental protection treatment problems are caused; the regulating means of the invention is to remove high concentration Fe in the galvanization plating solution 2+ 、Fe 3+ The waste acid can be easily removed only through oxidation-reduction reaction and flocculation precipitation, so that the consumption of acid is reduced, and the quality and corrosion resistance of the plate surface are improved; the method comprises the following specific steps:
1) Fe in the galvanization liquid by using strong oxidant (hydrogen peroxide) 2+ Oxidation to Fe 3+
2) By adjusting pH (pH regulator including zinc oxide or zinc carbonate or alkali)The pH value of the galvanization liquid is 3.6-3.9, so that Fe 3+ Form ferric hydroxide precipitate and Zn 2+ No precipitate is formed, thereby realizing Fe 2+ And Fe (Fe) 3+ Is selectively removed;
3) Flocculant (PAM) was added to filter the precipitate off.
4) The pH value is adjusted back to 1.2-1.8 by sulfuric acid for production.
The whole process flow can effectively and selectively remove metal impurity ions in the plating solution to reduce the waste of the plating solution, reduce the production and operation cost, and does not introduce new impurity ions which have influence on the quality of the galvanized sheet
Compared with the prior art, the invention has the beneficial effects that:
1) The invention provides a linkage adjustment mechanism based on four circulation systems of an electroplating circulation system, a zinc dissolution system, an evaporation system and a sulfuric acid circulation system for the first time, and finds out the key control parameters of the plating solution which influence the structure and the surface quality of an electroplating layer; the single electroplating four-system control is adjusted to find linkage key points among the electroplating four-system control, so that the components of the plating solution can be controlled more accurately, and severe parameter fluctuation is avoided; when the abnormal working condition is met, the correction adjustment of the plating solution system can be completed at the highest speed; quality improvement of field production is greatly reduced;
2) The process can improve the stability of the process, and effectively improve the defects of blushing, floating ash, darkness, coarse plating crystallization and the like which are easily found in the steel plate in the electrogalvanizing production process;
3) The invention improves the titration process and optimizes the indicator; the number of manual titration is reduced from the previous general detection of numerous times to one titration per shift.
Drawings
FIG. 1 is a graph of (a) the micro-morphology and (b) the macro-morphology of the zinc coating obtained in example 1;
FIG. 2 is a graph showing (a) the micro-morphology and (b) the macro-morphology of the zinc coating obtained in comparative example 1.
Detailed Description
The present invention will be described in further detail with reference to the following examples in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention. In the following embodiments, the method for stabilizing and controlling the plating solution includes the following steps:
1) Firstly, calculating the amount of water, sulfuric acid and zinc required by a tank of plating solution according to a target value;
2) Adding calculated water quantity and concentrated sulfuric acid in sequence, heating and melting zinc; preliminarily preparing a required electroplating solution; in the specific configuration process, water is added firstly and then acid is added, the water is added to the position of 65-70% of the liquid level of a plating solution circulating tank by volume, then the required sulfuric acid is added, a heat exchanger of an evaporator part is opened, and the plating solution is heated to 45-50 ℃; filling zinc particles into a zinc dissolving tank, and opening a zinc dissolving pump to dissolve the zinc particles until the pH value is 1.5; wherein the mass of the zinc mass is the effective volume of the plating solution circulating tank multiplied by the zinc ion concentration (240 m 3 X 90 g/l=21600 kg); the mass of the sulfuric acid is zinc particle weight multiplied by H 2 SO 4 Relative molecular weight/(Zn relative molecular weight×sulfuric acid utilization coefficient) (21600 kg×98/(65.4×0.96) = 33716 kg); after the preparation, the circulation system is opened, and the temperature is raised to 45-50 ℃.
3) After the solution is prepared, the free acid and zinc ions are titrated, and the concentration of the solution is verified; in the production process, 8 hours are also needed for one test titration; adjusting the components in the electroplating solution deviating from the target concentration;
4) Determining electroplating process control parameters in an electroplating process, and carrying out linkage adjustment on corresponding control parameters in an electroplating circulation system, a zinc dissolving system, an evaporation system and a sulfuric acid circulation system of an electroplating liquid control system in the electroplating process; realizing stable control of the electroplating solution;
5) By controlling the technological process of zinc ion concentration, acid concentration, temperature, liquid level, etc. of the plating solution, various coating structure defects and partial surface defects after electroplating can be thoroughly solved, and the production speed can reach 100-120 m/min.
6) Once an exception problem occurs, processing may be performed as per the exception handling described in Table 1.
Note that: in the following embodiments, the plating solutions are all existing solutions in the actual plating process in the plating solution control system; the solution is only re-prepared when a series of problems of serious solution leakage, a large amount of impurities entering the solution and the like, which cannot guarantee the production of the solution, occur.
Example 1
A method for stably controlling electroplating liquid aims at the working conditions that: the production speed is 110m/min, the plating solution temperature is 50 ℃, the zinc ion concentration is 85g/L, the sulfuric acid concentration is 2g/L, the pH value is 2.0, the iron ion concentration is 2g/L, and the plating solution liquid level is 85%; the problems of thick crystallization, uneven size, dark gray surface layer, uneven color, heavier side dendrites and the like of the plating layer are caused;
the specific plating solution stability control process comprises the following steps:
1) Performing titration detection on the electroplating solution to determine accurate values of all process parameters;
2) The production speed, the total current and the plating solution pump speed are kept unchanged, and the evaporation is accelerated to 150m 3 Accelerating a zinc dissolving pump by 50%, starting an acid adding pump to 2L/min, and introducing 10% of plating solution in the electroplating circulating tank into a storage tank;
3) Titration detection is carried out after half an hour, and each process parameter value is determined; the detection result shows that the production speed after stable control can be increased to 120m/min, the plating solution temperature is 51 ℃, the zinc ion concentration is 110g/L, the sulfuric acid concentration is 6g/L, the pH value is 1.6, the iron ion concentration is 2g/L, and the plating solution liquid level is 70%; the obtained plating layer has compact crystallization, uniform size, gray plate surface, uniform color and no side dendrite, and is shown in figure 1;
4) Titration was performed after 8 hours, and all parameters were still within normal ranges.
Example 2
A method for stably controlling electroplating liquid aims at the working conditions that: the production speed is 120m/min, the plating solution temperature is 49 ℃, the zinc ion concentration is 80g/L, the sulfuric acid concentration is 10g/L, the pH value is 1.1, the iron ion concentration is 1.5g/L, and the plating solution liquid level is 59%; the problems of coarse crystallization, uneven size, grey white surface layer, uneven color, floating ash on the surface and the like of the plating layer are caused; the specific electroplating solution stability control process comprises the following steps:
1) Performing titration detection on the electroplating solution to determine accurate values of all process parameters;
2) The production speed, the total current and the plating solution pump speed are unchanged, the evaporation system is closed, the zinc dissolving pump speed is increased by 50%, the acid adding pump speed is closed, and the plating solution with the liquid level of 10% in the storage tank is led into the electroplating circulating tank;
3) Titration detection is carried out after half an hour, and each process parameter value is determined; the detection result shows that the production speed after stable control can be increased to 130m/min, the plating solution temperature is 49 ℃, the zinc ion concentration is 100g/L, the sulfuric acid concentration is 6g/L, the pH value is 1.5, the iron ion concentration is 1.6g/L, and the plating solution liquid level is 70%; the obtained plating layer has compact crystallization, uniform size, gray plate surface, uniform color and no floating ash;
4) Titration was performed after 8 hours, and all parameters were still within normal ranges.
Comparative example 1
A method for stably controlling electroplating liquid aims at the working conditions that: the production speed is 100m/min, the plating solution temperature is 50 ℃, the zinc ion concentration is 70g/L, the sulfuric acid concentration is 13g/L, the pH value is 1.0, the iron ion concentration is 2.0g/L, and the plating solution liquid level is 82%;
the specific regulation and control steps comprise the following steps:
to reduce zinc consumption, the production speed is reduced to 60m/min; the flow of a zinc dissolving pump of a zinc dissolving station is increased to 500kg/h, and a sulfuric acid pump is started to add acid to dissolve zinc; after 1 hour, the liquid level rises to 83%, the plating solution temperature is 49 ℃, the sulfuric acid concentration is 11g/L, the pH value is 1.1, the iron ion concentration is 2.2g/L, and the zinc ion concentration is 85g/L; after 2 hours, the liquid level rises by 84%, the temperature of the plating solution is reduced to 48 ℃, the sulfuric acid concentration is 10g/L, the pH value is 1.3, the iron ion concentration is 2.3g/L, and the zinc ion concentration is 90g/L.
In the regulation and control process, a great amount of zinc is added to cause the agglomeration phenomenon of zinc particles in a zinc dissolving station, and sediment is arranged at the bottom of a plating solution circulating tank. Zinc particles can only be turned over at the top of the zinc dissolving station manually, so that the agglomerated zinc particles are prevented from suddenly falling into a tank of the zinc dissolving station, and sparks are generated by friction, so that hydrogen explosion is caused. The sediment at the bottom of the plating solution can be solved only by discharging the plating solution, which causes a great deal of waste of the plating solution and environmental protection. And the plate surface coating is still crystallized, coarse and loose in size, the plate surface is in an off-white color, and uneven spots exist on the surface of the steel plate due to plating solution sediments (see figure 2).
The above examples are presented for clarity of illustration only and are not limiting of the embodiments. Other variations and modifications of the above description will be apparent to those of ordinary skill in the art, and it is not necessary or exhaustive of all embodiments, and thus all obvious variations or modifications that come within the scope of the invention are desired to be protected.

Claims (5)

1. A method for stabilizing and controlling electroplating liquid, which is characterized by comprising the following steps:
1) Calculating the amount of water, sulfuric acid and zinc required by a tank of plating solution by taking the designed plating solution formula as a target value;
2) Adding calculated water quantity and concentrated sulfuric acid in sequence, heating and dissolving zinc; preliminarily preparing a required electroplating solution;
3) Titrating the plating solution, and adjusting components deviating from the target concentration in the plating solution;
4) Determining key control parameters of an electroplating process in an electroplating process, and carrying out linkage adjustment on control processes corresponding to an electroplating circulation system, a zinc dissolving system, an evaporation system and a sulfuric acid circulation system in an electroplating solution control system in the electroplating process; realizing stable control of the electroplating solution;
the key control parameters of the electroplating process comprise zinc ion concentration, sulfuric acid concentration, pH value, plating solution temperature, iron ion concentration and plating solution liquid level;
the zinc ion concentration, sulfuric acid concentration, pH value and plating solution liquid level control adopts linkage adjustment means, wherein the corresponding control process of the electroplating circulating system is electroplating rate control; the corresponding control step of the zinc dissolution system is zinc dissolution control; the control process corresponding to the evaporation system is evaporation control; the corresponding control process of the sulfuric acid circulating system is acid adding control; wherein the linkage adjustment comprises more than two of electroplating rate control, zinc dissolution control, evaporation control, acid addition control and liquid guide control between the electroplating liquid and an external storage tank;
the linkage control means for the zinc ion concentration, the sulfuric acid concentration, the pH value and the plating solution liquid level comprises:
when the liquid level of the circulating tank is more than 80%, the pH value is more than 1.8, and the zinc ion concentration is more than 140g/L; the electroplating rate control includes increasing the total current by 20-30A/dm 2 And the plating solution pump speed is improved by 10-20 percent; the evaporation control includes turning on evaporation to 50m 3 /h; the zinc dissolution control comprises the step of closing a zinc dissolution pump; the acid adding control comprises 10-30% of the speed reduction of an acid adding pump; the liquid guiding control between the electroplating liquid and the externally added storage tank comprises the steps of leading the electroplating liquid into the externally added storage tank for 5-20% unchanged;
when the liquid level of the circulating tank is more than 80%, the pH value is more than 1.8, and the zinc ion concentration is less than 90g/L; the plating rate control remains unchanged; the evaporation control comprises accelerating evaporation by 100-200m 3 /h; the zinc dissolution control comprises 30-50% acceleration of a zinc dissolution pump; the acid adding control comprises the steps of starting an acid adding pump to 2L/min; the liquid guiding control between the electroplating liquid and the externally added storage tank comprises the steps of leading the electroplating liquid into the externally added storage tank for 5-20% unchanged;
when the liquid level of the circulating tank is more than 80 percent, the pH value is less than 1.2, and the zinc ion concentration is more than 140g/L; the electroplating rate control includes increasing the total current by 30-50A/dm 2 And the plating solution pump speed is improved by 10-20 percent; the evaporation control includes turning on evaporation to 50m 3 /h; the zinc dissolution control comprises the minimum instant zinc; the acid adding control comprises stopping acid adding; the liquid guiding control between the electroplating liquid and the externally added storage tank comprises the steps of leading the electroplating liquid into the externally added storage tank for 5-20% unchanged;
when the liquid level of the circulating tank is more than 80%, the pH value is less than 1.2, and the zinc ion concentration is less than 90g/L; the plating rate control remains unchanged; the evaporation control comprises accelerating evaporation by 100-200m 3 /h; the zinc dissolution control comprises 30-50% acceleration of a zinc dissolution pump; the acid adding control comprises stopping acid adding; the liquid guiding control between the electroplating liquid and the externally added storage tank comprises the steps of leading the electroplating liquid into the externally added storage tank for 5-20% unchanged;
when the liquid level of the circulating tank is less than 60%, the pH value is more than 1.8, and the zinc ion concentration is more than 140g/L; the electroplating rate control includes increasing the total current by 20-30A/dm 2 And the plating solution pump speed is improved by 10-20 percent; the evaporation control includes turning off the evaporation function; the zinc dissolution control comprises the minimum instant zinc; the acid adding control comprises 10-30% of the speed reduction of an acid adding pump; the liquid guiding control between the electroplating liquid and the externally added storage tank comprises 10-20% of the electroplating liquid being led out from the storage tank;
when the liquid level of the circulating tank is less than 60%, the pH value is more than 1.8, and the zinc ion concentration is less than 90g/L; the plating rate control remains unchanged; the evaporation control includes reducing evaporation by 10-50m 3 /h; the zinc dissolution control comprises 30-50% acceleration of a zinc dissolution pump; the acid adding control comprises the steps of starting an acid adding pump to 2L/min; the liquid guiding control between the electroplating liquid and the externally added storage tank comprises 10-20% of the electroplating liquid being led out from the storage tank;
when the liquid level of the circulating tank is less than 60%, the pH value is less than 1.2, and the zinc ion concentration is more than 140g/L; the electroplating rate control includes increasing the total current by 30-50A/dm 2 And the plating solution pump speed is improved by 10-20 percent; the evaporation control includes turning off the evaporation function; the zinc dissolution control comprises the minimum instant zinc; the acid adding control comprises stopping acid adding; the liquid guiding control between the electroplating liquid and the externally added storage tank comprises the steps of leading out 10-20% of the electroplating liquid from the storage tank or adding 10-20% of condensed water;
when the liquid level of the circulating tank is less than 60%, the pH value is less than 1.2, and the zinc ion concentration is less than 90g/L; the plating rate control remains unchanged; the evaporation control includes turning off the evaporation function; the zinc dissolution control comprises 30-50% acceleration of a zinc dissolution pump; the acid adding control comprises stopping acid adding; the liquid guiding control between the electroplating liquid and the externally added storage tank comprises the step of guiding 10-20% of the electroplating liquid from the storage tank or adding 10-20% of condensed water.
2. The method of claim 1, wherein the titrating step includes Zn 2+ Titration of concentration and free acid concentration.
3. The method of claim 1, wherein the plating process critical control parameters include: the temperature of the plating solution is 48-53 ℃; the concentration of zinc ions is 90-140 g/L; the concentration of sulfuric acid is 2-12 g/L; the pH value is 1.2-1.8; iron ion concentration is less than 3g/L; the liquid level of the plating solution is 60-80%.
4. The method of claim 1, wherein the plating solution temperature control step comprises: firstly, regulating the total current according to the requirements of the galvanization thickness, and compensating the temperature difference to 48-53 ℃ through an evaporator according to the heating condition of the plating solution corresponding to the total current.
5. The method of claim 1, wherein the control parameters included in the plating circulation system include: the plating bath current regulation and control range of the plating bath is 0-50 kA, and the total current density regulation and control range is 0-90A/dm 2 The method comprises the steps of carrying out a first treatment on the surface of the Plating solution circulating pump speed and flow regulation range is 0-500 m 3 /h; control parameters included in the zinc dissolution system include: the speed and flow regulation range of the zinc dissolving pump is 0-1000 kg/h; the control parameters included in the evaporation system include: the evaporation capacity regulating and controlling range is 0-800 m 3 /h; the control parameters included in the sulfuric acid circulation system include: the speed and flow regulation range of the acid adding pump is 0-100 m 3 /h。
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