EP2947182A4 - Method and system for producing electrolytic copper foil by using reverse flow of copper sulfate solution - Google Patents

Method and system for producing electrolytic copper foil by using reverse flow of copper sulfate solution

Info

Publication number
EP2947182A4
EP2947182A4 EP13872242.6A EP13872242A EP2947182A4 EP 2947182 A4 EP2947182 A4 EP 2947182A4 EP 13872242 A EP13872242 A EP 13872242A EP 2947182 A4 EP2947182 A4 EP 2947182A4
Authority
EP
European Patent Office
Prior art keywords
reverse flow
sulfate solution
producing electrolytic
copper foil
copper sulfate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13872242.6A
Other languages
German (de)
French (fr)
Other versions
EP2947182A1 (en
Inventor
Chin Tsai Cheng
Chor Kwan Yeung
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FUJIAN CLEAR VIEW COPPER FOILS CO Ltd
Original Assignee
FUJIAN CLEAR VIEW COPPER FOILS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FUJIAN CLEAR VIEW COPPER FOILS CO Ltd filed Critical FUJIAN CLEAR VIEW COPPER FOILS CO Ltd
Publication of EP2947182A1 publication Critical patent/EP2947182A1/en
Publication of EP2947182A4 publication Critical patent/EP2947182A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
EP13872242.6A 2013-01-21 2013-12-19 Method and system for producing electrolytic copper foil by using reverse flow of copper sulfate solution Withdrawn EP2947182A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201310021021.7A CN103060882B (en) 2013-01-21 2013-01-21 The method and system of electrolytic copper foil are produced in a kind of copper-bath countercurrent flow
PCT/CN2013/089959 WO2014110958A1 (en) 2013-01-21 2013-12-19 Method and system for producing electrolytic copper foil by using reverse flow of copper sulfate solution

Publications (2)

Publication Number Publication Date
EP2947182A1 EP2947182A1 (en) 2015-11-25
EP2947182A4 true EP2947182A4 (en) 2016-09-28

Family

ID=48103766

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13872242.6A Withdrawn EP2947182A4 (en) 2013-01-21 2013-12-19 Method and system for producing electrolytic copper foil by using reverse flow of copper sulfate solution

Country Status (5)

Country Link
EP (1) EP2947182A4 (en)
JP (1) JP6165880B2 (en)
KR (1) KR20150110728A (en)
CN (1) CN103060882B (en)
WO (1) WO2014110958A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103060882B (en) * 2013-01-21 2015-11-04 福建清景铜箔有限公司 The method and system of electrolytic copper foil are produced in a kind of copper-bath countercurrent flow
CN103233249A (en) * 2013-05-09 2013-08-07 南京顺捷机械设备有限公司 Upper-electrolyte-inlet copper foil all-in-one equipment
CN103510106B (en) * 2013-09-22 2015-10-21 中南大学 A kind of copper electrolysis additive and using method thereof
CN104313668B (en) * 2014-09-30 2017-03-15 苏州芯航元电子科技有限公司 Electronics producing line electrochemical processing cell
KR20180040754A (en) * 2016-10-12 2018-04-23 케이씨에프테크놀로지스 주식회사 Easily Handleable Electrolytic Copper Foil, Electrode Comprising The Same, Secondary Battery Comprising The Same, and Method for Manufacturing The Same
KR102096448B1 (en) * 2017-01-02 2020-05-28 한양대학교 에리카산학협력단 Method and apparatus for manufacturing copper foil coated with graphene
JP6632739B2 (en) * 2017-04-25 2020-01-22 古河電気工業株式会社 Surface treated copper foil
CN108642780A (en) * 2018-05-24 2018-10-12 武汉纺织大学 It is a kind of using yarn dyeing roller as the Electrochemical Dyeing device and method of cathode
CN109440170A (en) * 2018-11-28 2019-03-08 灵宝华鑫铜箔有限责任公司 A kind of molten copper system system of energy-saving and environment-friendly electrolytic copper foil and molten process for copper
CN112899740B (en) * 2019-11-15 2022-04-19 源秩科技（上海）有限公司 Electrochemical-based processing apparatus and method
CN113011001B (en) * 2021-02-20 2021-09-14 广东嘉元科技股份有限公司 Method for calculating high value and low value of washing flow, storage medium and raw foil machine
CN113546885A (en) * 2021-07-23 2021-10-26 江西铜博科技有限公司 Automatic cleaning device of copper foil electrolytic cell
CN113802156B (en) * 2021-11-05 2022-06-03 广东嘉元科技股份有限公司 Electrolytic copper foil production equipment with cleaning assembly and production process thereof
CN115216813B (en) * 2022-07-15 2024-04-16 福建紫金铜箔科技有限公司 Method for regulating and controlling transverse thickness of copper foil

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1555458A (en) * 1976-07-19 1979-11-07 British Steel Corp Method and apparatus for producing metal strip
US20010042686A1 (en) * 2000-05-18 2001-11-22 Mitsui Mining & Smelting Co., Ltd. Electrodeposition apparatus for producing electrodeposited copper foil and electrodeposited copper foil produced by use of the apparatus
US20050158574A1 (en) * 2003-11-11 2005-07-21 Furukawa Circuit Foil Co., Ltd. Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5339941A (en) * 1976-09-25 1978-04-12 Toppan Printing Co Ltd High speed electrocasting apparatus
JPS6026689A (en) * 1983-07-26 1985-02-09 Sumitomo Metal Ind Ltd Method and device for producing metallic foil by electrodeposition
DD238707A3 (en) * 1984-02-20 1986-09-03 Lokomotivbau Elektrotech ANODENCORB FOR ELECTROLYTE FILTRATION IN COPPER FILM PRODUCTION PLANTS
JPS63149390A (en) * 1986-12-12 1988-06-22 Furukawa Saakitsuto Fuoiru Kk Method and apparatus for producing metallic foil by electrolysis
DD279697A1 (en) * 1989-02-01 1990-06-13 Beimler Lokomotivbau METHOD AND ARRANGEMENT FOR THE EQUAL CHEMICAL DEPOSITION OF A THIN METAL PAVEMENT
JPH1036991A (en) * 1996-07-19 1998-02-10 Japan Energy Corp Production of electrolytic copper foil
US5863410A (en) * 1997-06-23 1999-01-26 Circuit Foil Usa, Inc. Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby
MY124018A (en) * 1999-06-08 2006-06-30 Mitsui Mining & Smelting Co Ltd Manufacturing method of electrodeposited copper foil, electrodeposited copper foil, copper-clad laminate and printed wiring board
JP2001011685A (en) * 1999-06-30 2001-01-16 Mitsui Mining & Smelting Co Ltd Electrolytic copper foil and its production
JP2004325201A (en) * 2003-04-24 2004-11-18 Mitsui Mining & Smelting Co Ltd Electrode potential measuring probe and continuous electrolyzation apparatus of metal foil with the same
JP4217786B2 (en) * 2004-03-12 2009-02-04 古河電気工業株式会社 Ultra-thin copper foil with carrier and wiring board using ultra-thin copper foil with carrier
JP4430020B2 (en) * 2005-02-21 2010-03-10 古河電気工業株式会社 Copper foil for flexible printed wiring board, manufacturing method thereof and flexible printed wiring board
TWI396779B (en) * 2005-02-21 2013-05-21 Copper foil and its manufacturing method, and flexible printed circuit board
CN102277597B (en) * 2011-08-12 2013-07-31 合肥铜冠国轩铜材有限公司 Preparation of double-sided photoelectrolytic copper foil for special lithium battery
CN203049057U (en) * 2013-01-21 2013-07-10 福建清景铜箔有限公司 Device for producing electrolytic copper foil
CN103060882B (en) * 2013-01-21 2015-11-04 福建清景铜箔有限公司 The method and system of electrolytic copper foil are produced in a kind of copper-bath countercurrent flow

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1555458A (en) * 1976-07-19 1979-11-07 British Steel Corp Method and apparatus for producing metal strip
US20010042686A1 (en) * 2000-05-18 2001-11-22 Mitsui Mining & Smelting Co., Ltd. Electrodeposition apparatus for producing electrodeposited copper foil and electrodeposited copper foil produced by use of the apparatus
US20050158574A1 (en) * 2003-11-11 2005-07-21 Furukawa Circuit Foil Co., Ltd. Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2014110958A1 *

Also Published As

Publication number Publication date
WO2014110958A1 (en) 2014-07-24
JP2016507652A (en) 2016-03-10
CN103060882A (en) 2013-04-24
KR20150110728A (en) 2015-10-02
CN103060882B (en) 2015-11-04
JP6165880B2 (en) 2017-07-19
EP2947182A1 (en) 2015-11-25

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