JP2016506623A - 自動集積回路分析を行うための方法および装置 - Google Patents

自動集積回路分析を行うための方法および装置 Download PDF

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Publication number
JP2016506623A
JP2016506623A JP2015547965A JP2015547965A JP2016506623A JP 2016506623 A JP2016506623 A JP 2016506623A JP 2015547965 A JP2015547965 A JP 2015547965A JP 2015547965 A JP2015547965 A JP 2015547965A JP 2016506623 A JP2016506623 A JP 2016506623A
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integrated circuit
laser
under test
images
circuit under
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JP2016506623A5 (enExample
Inventor
デイヴィッド・エス・ストーカー
エリック・フランク・マトリン
モティラル・アグラワル
ジェームズ・アール・ポットハスト
ニール・ウィリアム・トロイ
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SRI International Inc
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SRI International Inc
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302Contactless testing
    • G01R31/308Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/30Circuit design
    • G06F30/39Circuit design at the physical level
    • G06F30/398Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2015547965A 2012-12-14 2013-11-21 自動集積回路分析を行うための方法および装置 Pending JP2016506623A (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201261737516P 2012-12-14 2012-12-14
US61/737,516 2012-12-14
US201361772712P 2013-03-05 2013-03-05
US61/772,712 2013-03-05
US14/066,111 US10180402B2 (en) 2012-12-14 2013-10-29 Method and apparatus for conducting automated integrated circuit analysis
US14/066,111 2013-10-29
PCT/US2013/071231 WO2014105304A2 (en) 2012-12-14 2013-11-21 Method and apparatus for conducting automated integrated circuit analysis

Publications (2)

Publication Number Publication Date
JP2016506623A true JP2016506623A (ja) 2016-03-03
JP2016506623A5 JP2016506623A5 (enExample) 2017-01-12

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JP2015547965A Pending JP2016506623A (ja) 2012-12-14 2013-11-21 自動集積回路分析を行うための方法および装置

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US (1) US10180402B2 (enExample)
EP (1) EP2932283A4 (enExample)
JP (1) JP2016506623A (enExample)
SG (1) SG11201504585QA (enExample)
WO (1) WO2014105304A2 (enExample)

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JP6281193B2 (ja) * 2013-05-30 2018-02-21 ソニー株式会社 レーザー走査型顕微鏡システム
JP2016109673A (ja) * 2014-10-16 2016-06-20 ディーシージー システムズ、 インコーポレイテッドDcg Systems Inc. レーザボルテージイメージングのシステム及び方法
US10386409B2 (en) 2015-09-15 2019-08-20 International Business Machines Corporation Non-destructive determination of components of integrated circuits
US10282510B2 (en) * 2017-04-07 2019-05-07 Fei Company Alignment of CAD data to images in high resolution optical fault analysis
US10768211B2 (en) * 2017-08-25 2020-09-08 Oracle International Corporation System and method for current sense resistor compensation
CN108613967B (zh) * 2018-08-09 2020-12-08 江苏师范大学 一种拉曼光谱测试系统
KR102594414B1 (ko) * 2018-10-24 2023-10-30 삼성전자주식회사 프로브 장치 및 이를 포함하는 테스트 장치
JP7173937B2 (ja) 2019-08-08 2022-11-16 株式会社日立ハイテク 荷電粒子線装置
JP7159128B2 (ja) 2019-08-08 2022-10-24 株式会社日立ハイテク 荷電粒子線装置
JP7189103B2 (ja) * 2019-08-30 2022-12-13 株式会社日立ハイテク 荷電粒子線装置
CN113030713B (zh) * 2021-03-05 2021-11-09 中国科学院国家空间科学中心 一种激光探测集成电路内部电平状态的系统
WO2022191958A1 (en) 2021-03-12 2022-09-15 Battelle Memorial Institute Systems and methods for backside optical carrier injection into microelectronic devices
WO2022260923A1 (en) 2021-06-08 2022-12-15 Battelle Memorial Institute High resolution imaging of microelectronic devices

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JP6054984B2 (ja) * 2011-11-16 2016-12-27 ディーシージー システムズ、 インコーポレイテッドDcg Systems Inc. 偏光ダイバーシティ撮像およびアライメントのための装置および方法

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JP2006319193A (ja) * 2005-05-13 2006-11-24 Nec Electronics Corp 検査装置及び方法

Also Published As

Publication number Publication date
US10180402B2 (en) 2019-01-15
WO2014105304A2 (en) 2014-07-03
WO2014105304A3 (en) 2014-10-23
EP2932283A2 (en) 2015-10-21
SG11201504585QA (en) 2015-07-30
US20140172345A1 (en) 2014-06-19
EP2932283A4 (en) 2016-08-24

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