JP2016503387A5 - - Google Patents

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Publication number
JP2016503387A5
JP2016503387A5 JP2015544122A JP2015544122A JP2016503387A5 JP 2016503387 A5 JP2016503387 A5 JP 2016503387A5 JP 2015544122 A JP2015544122 A JP 2015544122A JP 2015544122 A JP2015544122 A JP 2015544122A JP 2016503387 A5 JP2016503387 A5 JP 2016503387A5
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JP
Japan
Prior art keywords
bonded
zircon
component
substrate
refractory
Prior art date
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Granted
Application number
JP2015544122A
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English (en)
Japanese (ja)
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JP6246226B2 (ja
JP2016503387A (ja
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Publication date
Priority claimed from US13/685,149 external-priority patent/US8956484B2/en
Application filed filed Critical
Publication of JP2016503387A publication Critical patent/JP2016503387A/ja
Publication of JP2016503387A5 publication Critical patent/JP2016503387A5/ja
Application granted granted Critical
Publication of JP6246226B2 publication Critical patent/JP6246226B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015544122A 2012-11-26 2013-11-21 ジルコン基板を結合させる方法 Expired - Fee Related JP6246226B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/685,149 2012-11-26
US13/685,149 US8956484B2 (en) 2012-11-26 2012-11-26 Method for bonding zircon substrates
PCT/US2013/071119 WO2014081904A1 (en) 2012-11-26 2013-11-21 Method for bonding zircon substrates

Publications (3)

Publication Number Publication Date
JP2016503387A JP2016503387A (ja) 2016-02-04
JP2016503387A5 true JP2016503387A5 (cg-RX-API-DMAC7.html) 2017-09-14
JP6246226B2 JP6246226B2 (ja) 2017-12-13

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015544122A Expired - Fee Related JP6246226B2 (ja) 2012-11-26 2013-11-21 ジルコン基板を結合させる方法

Country Status (7)

Country Link
US (1) US8956484B2 (cg-RX-API-DMAC7.html)
EP (1) EP2923351B1 (cg-RX-API-DMAC7.html)
JP (1) JP6246226B2 (cg-RX-API-DMAC7.html)
KR (1) KR20150089068A (cg-RX-API-DMAC7.html)
CN (1) CN105122333A (cg-RX-API-DMAC7.html)
TW (1) TWI588103B (cg-RX-API-DMAC7.html)
WO (1) WO2014081904A1 (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12356512B2 (en) * 2016-04-07 2025-07-08 Materion Corporation Beryllium oxide integral resistance heaters
GB2560130B (en) * 2016-10-21 2021-10-20 Cummins Emission Solutions Inc Catalyst substrate and filter structure including plates and method of forming same
KR102069422B1 (ko) * 2017-12-19 2020-01-22 주식회사 티씨케이 유체 흐름이 가능한 유로가 형성된 접합 세라믹 및 이의 제조방법
KR102069423B1 (ko) * 2017-12-19 2020-01-22 주식회사 티씨케이 접합 세라믹 및 이의 제조방법

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3338696A (en) 1964-05-06 1967-08-29 Corning Glass Works Sheet forming apparatus
BE757057A (fr) 1969-10-06 1971-04-05 Corning Glass Works Procede et appareil de controle d'epaisseur d'une feuille de verre nouvellement etiree
US4925608A (en) * 1988-09-27 1990-05-15 Norton Company Joining of SiC parts by polishing and hipping
JPH08118467A (ja) * 1994-10-21 1996-05-14 Matsushita Electric Ind Co Ltd スクリーン印刷用グリーンシート
JP4370624B2 (ja) * 1997-09-22 2009-11-25 嘉信 本橋 アルミナ部材の接合方法
TW508600B (en) * 2000-03-30 2002-11-01 Taiyo Yuden Kk Laminated ceramic capacitor and its manufacturing method
CN102992592A (zh) * 2000-12-01 2013-03-27 康宁股份有限公司 熔融法生产平板玻璃所用的等静压板的下沉控制
US7722731B2 (en) * 2001-08-07 2010-05-25 Uchicago Argonne, Llc Joining of advanced materials by plastic deformation
EP1829846A4 (en) 2004-11-29 2011-04-20 Kyocera Corp CERAMIC COMPOSITE BODY, MANUFACTURING METHOD, MICROCHEMICAL CHIP AND REFORMER
JP2007119262A (ja) * 2005-10-25 2007-05-17 Hideaki Inoue アルミナセラミックス物品の製造方法
CN2874389Y (zh) * 2006-01-07 2007-02-28 段红 一种氮窑用承烧板
CN101108775B (zh) 2007-08-27 2010-10-13 中钢集团洛阳耐火材料研究院有限公司 一种氧化锆制品的制造方法
KR20100108358A (ko) 2007-11-29 2010-10-06 코닝 인코포레이티드 유리 제조 시스템에서 사용되는 크립 저항성 다층 내화물
US7988804B2 (en) * 2008-05-02 2011-08-02 Corning Incorporated Material and method for bonding zircon blocks
WO2009142695A2 (en) 2008-05-20 2009-11-26 Corning Incorporated Low-strain-rate modified zircon material and articles
JP5841329B2 (ja) * 2009-12-25 2016-01-13 株式会社日本セラテック セラミックス接合体の製造方法
CN102762362B (zh) * 2010-02-24 2015-05-06 康宁股份有限公司 通过深海中等静压制来制造致密体的方法
TWI535672B (zh) * 2010-05-28 2016-06-01 康寧公司 複合隔離管
US8652281B2 (en) * 2011-01-31 2014-02-18 The United States Of America, As Represented By The Secretary Of The Navy Spinel ceramics via edge bonding
TWI565668B (zh) 2011-04-29 2017-01-11 康寧公司 用於製造玻璃物件的設備與方法

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