JP2016222848A - Adhesive sheet and method for producing semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive sheet in which, when a sheet is caught and stretched, the fracture and split of the sheet itself are hard to occur, and it is easy to be stretched, and a method for producing a semiconductor device.SOLUTION: Provided is an adhesive sheet 10 comprising: a first base material 13 provided with a base material film 11 and an adhesive layer 12, and in which the base material film 11 is at least adjacent to the adhesive layer 12; and a second base material 14 laminated on the face side opposite to the face facing the adhesive agent layer 12 in the first base material 13, where the first base material 13 is provided with a plurality of the first brittle parts 15, the second base material 14 is provided with a plurality of brittle parts 16, and the plurality of first brittle parts 15 provided at the first base material 13 and the plurality of second brittle parts 16 provided at the second base material 14 are provided at a region not superimposed each other in the plane view of the base material film 11.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an adhesive sheet and a method for manufacturing a semiconductor device.

  In recent years, electronic devices have been reduced in size, weight, and functionality. Semiconductor devices mounted on electronic devices are also required to be smaller, thinner, and higher in density. A semiconductor chip may be mounted in a package close to its size. Such a package may be referred to as a chip scale package (CSP). One of the processes for manufacturing a CSP is a wafer level package (WLP). In WLP, before dicing into individual pieces, external electrodes and the like are formed on the chip circuit formation surface, and finally a package containing the chips is diced into individual pieces. Examples of WLP include a fan-in type and a fan-out type. In a fan-out type WLP (hereinafter sometimes abbreviated as FO-WLP), a semiconductor chip sealing body is formed by covering a semiconductor chip with a sealing member so as to be an area larger than the chip size. The rewiring layer and the external electrode are formed not only on the circuit surface of the semiconductor chip but also on the surface region of the sealing member.

  For example, in Patent Document 1, an extended wafer is formed by enclosing a plurality of semiconductor chips separated from a semiconductor wafer, leaving a circuit formation surface thereof, and surrounding with a mold member, in a region outside the semiconductor chip. A method for manufacturing a semiconductor package formed by extending a rewiring pattern is described. In the manufacturing method described in Patent Document 1, before enclosing a plurality of individual semiconductor chips with a mold member, the semiconductor chip is replaced with an expandable wafer mount tape, and the wafer mount tape is spread to expand the plurality of semiconductor chips. The distance between them is expanding.

International Publication No. 2010/058646

  However, if an existing adhesive sheet such as a wafer mount tape is stretched to increase the interval between the plurality of semiconductor chips, the distance between the plurality of semiconductor chips may not be sufficiently increased. On the other hand, if the sheet for supporting a plurality of semiconductor chips is forcibly extended, the sheet may be broken or torn. As a result, the semiconductor chips on the sheet may be spaced apart from each other, or the semiconductor chips may be detached from the sheet, and the handling of the semiconductor chips may be reduced.

  An object of the present invention is to provide a pressure-sensitive adhesive sheet that is less likely to break or tear when the sheet is gripped and stretched, and to provide a method for manufacturing a semiconductor device using the pressure-sensitive adhesive sheet. That is.

According to one aspect of the present invention, a base film and a pressure-sensitive adhesive layer are provided, and the base film is at least a first base material adjacent to the pressure-sensitive adhesive layer, and the pressure-sensitive adhesive of the first base material. A second substrate laminated on the surface opposite to the surface facing the layer, the first substrate is provided with a plurality of first weakened portions, the second substrate, A plurality of second fragile portions are provided, and the plurality of first fragile portions provided on the first base material and the plurality of second fragile portions provided on the second base material are the base material The adhesive sheet provided in the area | region which does not mutually overlap in the planar view of a film can be provided.
According to one aspect of the present invention described above, the first base material is provided with a plurality of first weakened portions, and the second base material is provided with a plurality of second weakened portions. When the pressure-sensitive adhesive sheet of this embodiment is stretched, the stretching stress is concentrated on the first fragile portion and the second fragile portion, and the base materials are separated and separated along the first fragile portion and the second fragile portion. Spacing between areas increases. The first fragile portion and the second fragile portion are provided in a region that does not overlap with each other in plan view. Therefore, even if a crack occurs from the region separated along the first fragile portion and the region separated along the second fragile portion, the region separated along the first fragile portion and the second fragile portion The region separated along the line is connected by a crack, and a large break that reaches the thickness direction of the base film is unlikely to occur. Therefore, according to the above-described aspect of the present invention, it is possible to provide a pressure-sensitive adhesive sheet that is less likely to be broken or torn and is easy to stretch.
In the present specification, when the first fragile portion and the second fragile portion are provided in a region where they do not overlap each other in plan view of the base film, the first fragile portion and the second fragile portion do not overlap at all. It is not limited to the case where it is provided in the area. A region where the first fragile portion and the second fragile portion partially overlap with each other in a plan view may be formed. For example, the first fragile portion and the second fragile portion are formed along different directions, respectively, and in plan view, the first fragile portion and the second fragile portion intersect, A region in which a part of the two fragile portions partially overlaps may be formed.
The first fragile portion is formed larger than the second fragile portion, and the region where the first fragile portion is formed in a plan view includes most of the region where the second fragile portion is formed. In this case, it can be said that the first fragile portion and the second fragile portion are not provided in a region that does not overlap each other, but are determined to be provided in a region that overlaps each other.

In one aspect of the present invention, it is also preferable that at least one of the plurality of first fragile portions and the plurality of second fragile portions is formed in a direction orthogonal to a direction in which the adhesive sheet is stretched.
According to this aspect, at least one of the first fragile portion and the second fragile portion is formed in a direction orthogonal to the direction in which the adhesive sheet is stretched. If the weakened part is formed in a direction orthogonal to the direction in which the weakened part is stretched, the area where the stretching stress is concentrated increases in the area where the weakened part is formed. The tensile strength required to expand the gap between them decreases. Therefore, in this aspect, it is possible to provide an adhesive sheet that can be stretched with a small stretching force.

In one embodiment of the present invention, at least one of the plurality of first fragile portions and the plurality of second fragile portions is the first base material and the second base material in a plan view of the base film. It is also preferable that the weakened portions provided on any of the substrates are provided so as to intersect with each other to form a lattice shape.
According to this aspect, it is provided so that the weak parts provided in each base material may intersect to form a lattice shape. When the extending direction is two directions along a specific direction and a direction orthogonal to the specific direction, the extending direction of the pressure-sensitive adhesive sheet of this aspect and the direction of the fragile portions constituting the lattice shape are orthogonal to each other. Arrange to do. When the adhesive sheet is stretched in this manner, the stretching stress acts in a direction perpendicular to the direction of the weakened portions constituting the lattice shape, so that each substrate is separated along the weakened portions formed in the lattice shape. And the interval between the separated regions can be expanded with a small stretching force. Therefore, according to the said aspect, the adhesive sheet suitable for the method of each extending in two directions, a specific direction and the direction orthogonal to this specific direction, can be provided.

In one aspect of the present invention, in a plan view of the base film, at least one of the plurality of first fragile portions and the plurality of second fragile portions is centered on a central portion of the base film. It is also preferable that the plurality of substantially concentric circles having different distances from the center of the base film are provided.
According to this aspect, at least one of the first fragile portion and the second fragile portion is provided in a substantially concentric shape.
The pressure-sensitive adhesive sheet having the above-mentioned shape is suitable for use in an expanding process using, for example, an annular ring frame and a separation device provided with a substantially rectangular separation table.
Specifically, first, the area of the outer periphery of the adhesive sheet is held by an annular ring frame. Next, a separation table having a planar support surface is passed through the inside of the ring frame. When the ring frame is lowered and the height of the support surface of the separation table becomes relatively higher than the height of the ring frame, the inner area of the ring frame is pushed up to the separation table, and the adhesive sheet is It extends outward along a direction orthogonal to the direction.
When the pressure-sensitive adhesive sheet is stretched using the spacing device, the stretching stress acts in a direction perpendicular to the circumferential direction of the concentric circle, so that the separation of each base material along the weakened portion provided in a substantially concentric shape, and separation Expansion of the distance between the regions can be performed with a small pulling force. Therefore, according to the said aspect, the adhesive sheet suitable for the method of extending along the direction orthogonal to the circumferential direction can be provided.
In the present specification, when the pressure-sensitive adhesive sheet is substantially concentric, a state where two or more substantially circular shapes having a central portion at the same position, and two or more substantially circular shapes are separated by a predetermined interval. Means an existing state. In addition, substantially circular means the shape close | similar to circular concepts, such as circular and an ellipse, and those deformed shapes.

In one embodiment of the present invention, the first base material has a tear strength of 3 N / mm or more and 50 N / mm or less when a tear strength test is performed in the MD direction, and a tear strength in the CD direction. The tear strength when the thickness test is performed is 5 N / mm or more and 100 N / mm or less, and the second substrate has a tear strength of 50 N / mm when the tear strength test is performed in the MD direction. The tear strength when the tear strength test is performed in the CD direction is preferably 100 N / mm or more.
According to this aspect, if the tear strength of the first base material and the tear strength of the second base material are in the above ranges, the first weakened portion provided on the first base material and the first base material provided on the second base material are provided. Separation of the base materials along the two fragile portions and expansion of the interval between the separated regions can be performed with a small stretching force.
In addition, by using base materials with different tear strengths for the first base material and the second base material, when the adhesive sheet is stretched, the timing for separating and expanding the base material along the fragile part for each base material Can be shifted. Therefore, since the separation and expansion of each base material along each fragile portion is performed in stages, the first fragile portion and the second fragile portion are separated and expanded at the same timing, compared to the first fragile portion. The region separated along the portion and the region separated along the second fragile portion are connected by a crack, and a large break that reaches the thickness direction of the base film is less likely to occur. Moreover, according to the tear strength of each base material, the position and number of the weak parts provided in each base material can be adjusted suitably.

In one aspect of the present invention, the plurality of first fragile portions provided on the first base material are provided so as to penetrate the thickness direction of the first base material and provided on the second base material. It is also preferable that the plurality of second fragile portions thus formed are provided penetrating in the thickness direction of the second base material.
According to this aspect, the 1st weak part and the 2nd weak part have penetrated with respect to the base-material thickness direction. Since the fragile portion penetrating in the thickness direction of the base material is weaker in tensile strength than the fragile portion not penetrating, it is easy to separate and expand. Therefore, according to the said aspect, isolation | separation in the area | region in which the weak part is formed, and expansion of the space | interval between the isolate | separated area | regions can be performed with a small extending force.

1 aspect of this invention WHEREIN: These 1st weak parts provided in the said 1st base material are provided in groove shape with respect to the thickness direction of a said 1st base material, and provided in a said 2nd base material It is also preferable that the plurality of second weakened portions provided in a groove shape with respect to the thickness direction of the second base material.
According to this aspect, the 1st weak part and the 2nd weak part are provided in groove shape with respect to the base-material thickness direction. The fragile part provided in the groove shape has a higher tensile strength than the fragile part formed so as to penetrate through the thickness direction of the base material, so it can be separated or expanded before pulling the adhesive sheet It is hard to do. Therefore, according to the said aspect, when extending an adhesive sheet, it can reduce more that a base film itself fractures | ruptures or tears.

1 aspect of this invention WHEREIN: The some 1st weak part provided in said 1st base material is formed in the surface facing the said adhesive layer of said 1st base material, and is provided in said 2nd base material. It is also preferable that the plurality of second weakened portions are formed on a surface of the second base material facing the pressure-sensitive adhesive layer.
According to this aspect, the 1st weak part provided in the 1st base material and the 2nd weak part provided in the 2nd base material are each formed from the adhesive layer side. For example, when the first fragile portion and the second fragile portion are each formed in a groove shape, the first fragile portion and the second fragile portion are formed on different surfaces, so that the stretching force is the first. It disperse | distributes to the surface side which opposes the adhesive layer of one base material, and the surface side which opposes the adhesive layer of a 2nd base material, respectively. Therefore, compared to the first fragile portion and the second fragile portion formed at the interface between the first base material and the second base material, it is difficult to separate or expand the adhesive sheet before pulling. . Therefore, according to the said aspect, when extending an adhesive sheet, it can reduce more that a base film itself fractures | ruptures or tears.

1 aspect of this invention WHEREIN: The some 1st weak part provided in said 1st base material is formed in the surface facing the said adhesive layer of said 1st base material, and is provided in said 2nd base material. The plurality of second fragile portions are preferably formed on a surface of the second base material opposite to the surface facing the pressure-sensitive adhesive layer.
According to this aspect, the first fragile portion provided on the first base material is formed from the pressure-sensitive adhesive layer side, and the second fragile portion provided on the second base material faces the pressure-sensitive adhesive layer side. It is formed from the opposite side. That is, in this structure, the 1st weak part and the 2nd weak part are each formed in the surface side and back surface side of a base film. For example, when the first fragile portion and the second fragile portion are each formed in a groove shape, the adhesive sheet is stretched because the first fragile portion and the second fragile portion are formed at separate positions. Sometimes, the direction of the crack generated from the first fragile portion is hardly induced toward the second fragile portion, and similarly, the direction of the crack generated from the second fragile portion is also difficult to be guided toward the first fragile portion. Therefore, according to the said aspect, when extending an adhesive sheet, it can reduce more that a base film itself fractures | ruptures or tears.
Moreover, in this aspect, after forming the base film by laminating the first base material and the second base material, it is suitable for a manufacturing method in which the weakening treatment is performed on the front and back surfaces of the base film, The first fragile portion and the second fragile portion can be formed in one step.

In one aspect of the present invention, an adherend is stuck on the pressure-sensitive adhesive layer, and the plurality of first fragile portions provided on the first base material and the second base material provided on the second base material. It is also preferable that the plurality of second fragile portions are provided at least in a portion corresponding to a region where the adherend is attached.
According to this aspect, the 1st weak part and the 2nd weak part are provided in the site | part corresponding to the area | region where a to-be-adhered body is stuck.
When the adherend is a plurality of semiconductor chips, when the adhesive sheet is stretched, each along the first fragile portion and the second fragile portion provided in the portion corresponding to the region where the plurality of semiconductor chips are attached. A base material isolate | separates and the space | interval between the isolate | separated area | regions spreads. On the other hand, the 1st weak part and the 2nd weak part are not provided in the site | part corresponding to the area | region where the some semiconductor chip is not stuck. Therefore, even if the pressure-sensitive adhesive sheet is stretched, the region where the plurality of semiconductor chips are not attached does not greatly expand compared to the region where the plurality of semiconductor chips are attached. Thus, the space | interval of several semiconductor chips can be expanded greatly by setting it as the structure where the area | region where the several semiconductor chip was stuck is easy to extend.

According to one aspect of the present invention, a step of attaching a wafer to the adhesive sheet of the present invention, a step of dicing the wafer attached to the adhesive sheet by dicing, and forming a plurality of semiconductor chips, Extending the pressure-sensitive adhesive sheet, and widening the interval between the plurality of semiconductor chips attached to the first region.
In the method for manufacturing a semiconductor device according to one embodiment of the present invention, the above-described pressure-sensitive adhesive sheet according to one embodiment of the present invention is used.
The wafer bonded to the pressure-sensitive adhesive sheet is separated into pieces by dicing to form a plurality of semiconductor chips, and then the distance between the plurality of semiconductor chips can be greatly increased by stretching the pressure-sensitive adhesive sheet.
According to the method for manufacturing a semiconductor device of one embodiment of the present invention described above, a plurality of semiconductor chips formed by dicing are picked up, and a plurality of steps are performed without increasing the interval and rearranging the chips on the support member. The distance between the semiconductor chips can be greatly increased. Therefore, the above-described pressure-sensitive adhesive sheet according to one embodiment of the present invention is excellent in compatibility with the manufacturing process of WLP, and particularly excellent in compatibility with the manufacturing process of a fan-out type wafer level package.

In one aspect of the present invention, it is preferable that the method further includes a step of extending the pressure-sensitive adhesive sheet and expanding a space between the plurality of semiconductor chips, and then covering the circuit surfaces of the plurality of semiconductor chips with a sealing member. .
According to this aspect, it is possible to cover the plurality of semiconductor chips with the sealing member after greatly increasing the interval between the plurality of semiconductor chips. Moreover, according to this aspect, the separated semiconductor chips can be covered with the sealing member one by one without being rearranged from the adhesive sheet to another adhesive sheet or support by pick and place. it can. Therefore, according to this aspect, the steps of the WLP manufacturing process can be simplified.

The figure explaining the adhesive sheet which concerns on 1st embodiment. The figure explaining the adhesive sheet which concerns on 2nd embodiment. The figure explaining the adhesive sheet which concerns on 3rd embodiment. The figure explaining the adhesive sheet which concerns on 4th embodiment. The side view of the separation apparatus which concerns on 4th embodiment. The figure explaining the adhesive sheet which concerns on 5th embodiment. The figure explaining the adhesive sheet which concerns on 6th embodiment. The figure explaining the adhesive sheet which concerns on 6th embodiment following FIG. Sectional drawing explaining the manufacturing method of the semiconductor device which concerns on 7th embodiment. Sectional drawing explaining the manufacturing method of the semiconductor device which concerns on 7th embodiment following FIG. Sectional drawing explaining the manufacturing method of the semiconductor device which concerns on 7th embodiment following FIG. Sectional drawing explaining the manufacturing method of the semiconductor device which concerns on 7th embodiment following FIG. Sectional drawing explaining the manufacturing method of the semiconductor device which concerns on 7th embodiment following FIG. The figure explaining the adhesive sheet which concerns on the modification of embodiment. The figure explaining the adhesive sheet which concerns on the modification of embodiment. The figure explaining the adhesive sheet which concerns on the modification of embodiment.

[First embodiment]
Hereinafter, the pressure-sensitive adhesive sheet according to the first embodiment of the present invention will be described.
[Adhesive sheet]
FIG. 1A shows a cross-sectional view of the pressure-sensitive adhesive sheet 10 according to this embodiment, and FIG. 1B shows a plan view of the pressure-sensitive adhesive sheet 10. FIG. 1A is a cross-sectional view taken along line AA in FIG.
As shown in FIG. 1A, the pressure-sensitive adhesive sheet 10 of this embodiment includes a base film 11 and a pressure-sensitive adhesive layer 12. The pressure-sensitive adhesive layer 12 is laminated on the base film 11. The substrate film 11 includes a first substrate 13 and a second substrate 14. The first base material 13 is adjacent to the pressure-sensitive adhesive layer 12. The 2nd base material 14 is laminated | stacked on the surface side opposite to the surface facing the adhesive layer 12 of the 1st base material 13. As shown in FIG.
The first base material 13 is provided with a plurality of first fragile portions 15, and the second base material 14 is provided with a plurality of second fragile portions 16.
In FIG. 1B, in order to facilitate understanding of the present embodiment, the adhesive layer is not shown, and the positions of the plurality of first fragile portions 15 are indicated by solid lines, and the positions of the plurality of second fragile portions 16 are illustrated. Is indicated by a dotted line. As shown in FIG. 1B, the plurality of first fragile portions 15 and the plurality of second fragile portions 16 are provided in regions that do not overlap each other in plan view of the base film 11. .

[Base film]
The material of the 1st base material 13 and the 2nd base material 14 which comprise the base film 11 is not specifically limited. Examples of the material of the first base material 13 and the second base material 14 include polyvinyl chloride resin, polyester resin (polyethylene terephthalate, etc.), acrylic resin, polycarbonate resin, polyethylene resin, polypropylene resin, acrylonitrile / butadiene / styrene resin, Examples thereof include a polyimide resin, a polyurethane resin, and a polystyrene resin.
As for the thickness of the 1st base material 13, 10-100 micrometers is preferable. Further, the thickness of the second base material 14 is preferably 50 to 200 μm.
The first base material 13 has a tear strength of 3 N / mm or more and 50 N / mm or less when a tear strength test is performed in the MD direction, and a tear strength test is performed in the CD direction. The tear strength is preferably 5 N / mm or more and 100 N / mm or less.
The second base material 14 has a tear strength of 50 N / mm or more when a tear strength test is performed in the MD direction, and a tear strength when a tear strength test is performed in the CD direction. It is preferable that it is 100 N / mm or more.
In addition, it is preferable that the upper limit of the tear strength of the 2nd base material 14 is 300 N / mm or less both in MD direction and CD direction.

The tear strength test is performed in accordance with the trouser method according to JIS K 7128-1. When performing a tear strength test in the MD direction, the test piece has a long side direction in the longitudinal direction of the base film (MD direction) and a short side direction of the test piece in the width direction of the base film ( CD direction). Further, the test piece is provided with a slit along the MD direction at the center in the CD direction. In the case of performing a tear strength test in the CD direction, the test piece has a long side direction in the width direction (CD direction) of the base film, and a short side direction of the test piece in the longitudinal direction of the base film. Cut in the direction (MD direction). Further, the test piece is provided with a slit along the CD direction at the center in the MD direction. Using such a test piece, a tear strength test is performed at a test speed of 200 mm / min to determine the tear strength per unit thickness.
In this specification, the “MD direction” is used as a word indicating a direction parallel to the longitudinal direction of the original film giving the base film (the feed direction during the production of the original film). Are used as a word indicating a direction orthogonal to the MD direction, and the same applies to the following. In this specification, MD is an abbreviation for Machine Direction, and CD is an abbreviation for Cross Direction.

[First vulnerable part, second vulnerable part]
The plurality of first fragile portions 15 provided on the first base material 13 are provided in a groove shape with respect to the thickness direction of the first base material 13. Further, the plurality of second weakened portions 16 provided on the second base material 14 are provided in a groove shape with respect to the thickness direction of the second base material 14.
The plurality of first fragile portions 15 provided on the first base material 13 are formed on the surface of the first base material 13 facing the pressure-sensitive adhesive layer 12, and the plurality of second fragile portions provided on the second base material 14. The part 16 is formed on the surface of the second base material 14 facing the pressure-sensitive adhesive layer 12.
In this specification, the fragile portion is a region formed such that the tear strength is weaker than the tear strength with respect to the base material. For example, the weak part can be formed by performing a weakening process such as providing a groove, providing a hole, or forming a deteriorated layer. The tear strength is weaker than the tear strength with respect to the substrate in the region where the groove, hole, or altered layer is formed. In the case where a groove or a hole is provided as the fragile portion, it is preferable to perform tooth profile processing as the fragility imparting treatment, and in the case of forming a deteriorated layer, laser processing is preferably performed.
The first fragile portion 15 is formed by subjecting a desired fragile portion forming region of the first base material 13 to a fragility imparting process. The second fragile portion 16 is also formed by subjecting a desired fragile portion forming region of the second base material 14 to a weakness imparting process, similarly to the first base material 13.
In the present embodiment, the first fragile portion whose tear strength is weaker than the tear strength with respect to the first base material 13 by forming a groove by subjecting the desired fragile portion forming region of the first base material 13 to the weakening treatment. 15 is formed. Similarly, the second weakened portion 16 having a lower tear strength than the tear strength with respect to the second base material 14 can be obtained by forming a groove by subjecting the desired weakened portion forming region of the second base material 14 to the weakening. It is formed. In FIG. 1, the first fragile portion 15 and the second fragile portion 16 are formed in a plurality of vertically long rectangular grooves with a predetermined interval in a plan view. It may be formed.

[Adhesive layer]
The pressure-sensitive adhesive contained in the pressure-sensitive adhesive layer 12 is not particularly limited and can be widely applied. Examples of the pressure-sensitive adhesive contained in the pressure-sensitive adhesive layer 12 include rubber-based, acrylic-based, silicone-based, polyester-based, and urethane-based materials. In addition, the kind of adhesive is selected in consideration of the use, the kind of adherend to be attached, and the like.

  When the energy ray polymerizable compound is blended in the pressure-sensitive adhesive layer 12, the energy layer polymerizable compound is cured by irradiating the pressure-sensitive adhesive layer 12 with energy rays from the base film 11 side. When the energy beam polymerizable compound is cured, the cohesive force of the pressure-sensitive adhesive layer 12 is increased, and the pressure-sensitive adhesive force between the pressure-sensitive adhesive layer 12 and the adherend can be reduced or eliminated. Therefore, after dicing, the adherend can be easily peeled from the pressure-sensitive adhesive layer 12 by irradiating the pressure-sensitive adhesive layer 12 with energy rays. Examples of the energy rays include ultraviolet rays (UV) and electron beams (EB), and ultraviolet rays are preferable.

[Method for producing adhesive sheet]
The manufacturing method of the adhesive sheet 10 is not particularly limited.
For example, the adhesive sheet 10 is manufactured through the following processes.
First, the base material film 11 is formed by laminating the first base material 13 and the second base material 14. The base film 11 on which the first base material 13 and the second base material 14 are laminated is preferably formed by, for example, a coextrusion molding method using a T die. Specifically, using an extruder corresponding to the first base material 13 and the second base material 14, the resin extruded from each extruder is introduced into a multi-manifold T die, and each resin layer is formed into a flat sheet shape. It is manufactured by laminating. In addition, you may co-extrusion by the feed block system combined with the special block provided before the normal T die.
Next, a brittleness imparting process is performed on the obtained base film 11.
In the present embodiment, tooth profile processing is performed as the weakening process. In the tooth profile processing, the upper roll in which a plurality of fine convex portions are applied to the portion corresponding to the fragile portion forming region of the first base material 13 and the plurality of protrusions to the portion corresponding to the fragile portion forming region of the second base material 14. Use a lower roll with parts.
Then, the base film 11 is passed between the upper roll and the lower roll, and the base film 11 is narrowed with a predetermined pressure by the upper roll and the lower roll. A plurality of fine convex portions applied to the upper roll and the lower roll are pressed against the front and back surfaces of the base film 11, so that the front and back surfaces of the base film 11 are notched. With this weakening process, a plurality of first fragile portions 15 are formed on the first base material 13, and a plurality of second fragile portions 16 are formed on the second base material 14. In this tooth profile processing, the first fragile portion 15 and the second fragile portion 16 can be simultaneously formed on the base film 11 by using an upper roll and a lower roll provided with a plurality of fine convex portions. .
And an adhesive is apply | coated on the 1st base material 13 of the base film 11, and a coating film is formed. Next, this coating film is dried to form the pressure-sensitive adhesive layer 12. The adhesive sheet 10 is obtained through the above steps.

  According to the present embodiment, the first base material 13 is provided with a plurality of first fragile portions 15, and the second base material 14 is provided with a plurality of second fragile portions 16. When the pressure-sensitive adhesive sheet 10 is stretched, the stretching stress is concentrated on the first fragile portion 15 and the second fragile portion 16, and the first fragile portion 15 and the second fragile portion 16 are broken. After breaking the 1st weak part 15 and the 2nd weak part 16, the space | interval between the area | regions isolate | separated by the fracture | rupture expands. Moreover, the 1st weak part 15 and the 2nd weak part 16 are provided in the area | region which does not mutually overlap by planar view. Therefore, even if a crack occurs from the region separated by the breakage of the first fragile portion 15 and the region separated by the breakage of the second fragile portion 16, the separation region and the second fragile portion of the first fragile portion 15 The 16 separation regions are connected by cracks, and a large break that reaches the thickness direction of the base film 11 is unlikely to occur. Accordingly, it is possible to provide the pressure-sensitive adhesive sheet 10 that is less likely to break or tear the sheet itself and is easy to stretch.

Moreover, according to this aspect, the first base material 13 has a tear strength of 3 N / mm or more and 50 N / mm or less when a tear strength test is performed in the MD direction, and tears in the CD direction. The tear strength when the strength test is performed is 5 N / mm or more and 100 N / mm or less. The second base material 14 has a tear strength of 50 N / mm or more when a tear strength test is performed in the MD direction, and a tear strength when a tear strength test is performed in the CD direction. 100 N / mm or more.
If the tear strength of the first base material 13 and the tear strength of the second base material 14 are within the above ranges, the first fragile portion 15 provided in the first base material 13 and the second base material 14 provided in the second base material 14. The separation of each base material along the fragile portion 16 and the expansion of the interval between the separated regions can be performed with a small stretching force. Moreover, when the adhesive sheet 10 is stretched by using base materials having different tear strengths for the first base material 13 and the second base material 14, the timing for separating and expanding along the fragile portion is determined for each base material. Can be shifted. Separation and expansion along each fragile part is performed in stages, so the first fragile part and the second fragile part are separated along the first fragile part compared to separating and expanding at the same timing. The region and the region separated along the second fragile portion are connected by a crack, and a large break that reaches the thickness direction of the base film is less likely to occur. Moreover, according to the tear strength of each base material, the position and number of the weak parts provided in each base material can be adjusted suitably.

  According to this embodiment, the 1st weak part 15 and the 2nd weak part 16 are provided in groove shape with respect to the base-material thickness direction. Since the fragile portion provided in the groove shape has a higher tensile strength than the fragile portion formed so as to penetrate through the thickness direction of the base material, it is difficult to separate or expand before pulling. Therefore, according to the said aspect, when extending an adhesive sheet, it can reduce more that a base film itself fractures | ruptures or tears.

  The groove-shaped first fragile portion 15 provided on the first base material 13 and the groove-shaped second fragile portion 16 provided on the second base material 14 are respectively formed from the pressure-sensitive adhesive layer 12 side. Since the first fragile portion 15 and the second fragile portion 16 are formed on different surface sides, the surface of the first base material 13 facing the pressure-sensitive adhesive layer 12 and the second base material 14 have a stretching force. Dispersed on the side of the surface facing the pressure-sensitive adhesive layer 12. Therefore, compared with the first fragile portion 15 and the second fragile portion 16 being formed at the interface between the first base material 13 and the second base material 14, before separating the pressure-sensitive adhesive sheet 10, It is difficult to expand. Therefore, according to the said aspect, when the adhesive sheet 10 is extended, it can reduce more that the base film 11 itself fractures | ruptures or tears.

[Second Embodiment]
The second embodiment is different from the first embodiment in the arrangement of the groove-shaped first fragile portion and the groove-shaped second fragile portion. Since the second embodiment is the same as the first embodiment in other points, the description is omitted or simplified.
Hereinafter, the adhesive sheet according to the second embodiment of the present invention will be described.
FIG. 2 shows a plan view of the pressure-sensitive adhesive sheet 10A according to this embodiment. In FIG. 2, in order to facilitate understanding of the present embodiment, the adhesive layer is not shown, and the base film 11A (the first base 13A and the second base 14A) is shown. The positions of the plurality of first fragile portions 15A are indicated by solid lines, and the positions of the plurality of second fragile portions 16A are indicated by dotted lines. In FIG. 2, the extending direction is a first direction M1 and a second direction M2 orthogonal to the first direction M1.
As shown in FIG. 2, the pressure-sensitive adhesive sheet 10 </ b> A of the present embodiment has a plurality of first fragile portions 15 </ b> A and a plurality of second fragile portions 16 </ b> A, whichever of the first direction M <b> 1 and the second direction M <b> 2 stretch the pressure-sensitive adhesive sheet 10 </ b> A. It is formed in a direction orthogonal to the heel.
According to the present embodiment, when the weakened portion is formed in a direction orthogonal to the extending direction, the region where the stress of the stretching is concentrated in the region where the weakened portion is formed, so each base material along the weakened portion The tensile strength required for the separation and the expansion of the distance between the separated regions is reduced. Therefore, in this aspect, when the pressure-sensitive adhesive sheet 10A is stretched along the first direction M1 and the second direction M2, the base material is separated along the first fragile portion 15A and the second fragile portion 16A. The interval between the areas can be easily expanded. Therefore, the adhesive sheet which can be extended with a small extension force can be provided.

[Third embodiment]
The third embodiment is different from the first embodiment and the second embodiment in the arrangement of the groove-shaped first fragile portion and the groove-shaped second fragile portion. Since the third embodiment is the same as the first embodiment and the second embodiment in other points, the description is omitted or simplified.
Hereinafter, the pressure-sensitive adhesive sheet according to the third embodiment of the present invention will be described.
FIG. 3 shows a plan view of the pressure-sensitive adhesive sheet 10B according to this embodiment. In FIG. 3, in order to facilitate understanding of the present embodiment, the adhesive layer is not shown, and the base film 11B (first base 13B and second base 14B) is shown. The positions of the plurality of first fragile portions 15B are indicated by solid lines, and the positions of the plurality of second fragile portions 16B are indicated by dotted lines. In FIG. 3, the extending direction is a third direction M3 and a fourth direction M4 orthogonal to the third direction M3.
As shown in FIG. 3, in the pressure-sensitive adhesive sheet 10 </ b> B of the present embodiment, the first fragile portions 15 </ b> B provided on the first base material 13 </ b> B are a plurality of first fragile portions 15 </ b> B in a plan view of the base film 11 </ b> B. A grid shape 17A is formed so as to intersect.
The plurality of second fragile portions 16B are provided so that the second fragile portions 16B provided on the second base material 14B intersect with each other to form a lattice shape 17B in the plan view of the base film 11B. ing.

The adhesive sheet 10B has a third direction M3 and a fourth direction M4, and a plurality of first fragile portions 15B constituting the lattice shape 17A and a plurality of second fragile portions 16B constituting the lattice shape 17B, respectively. Arrange so that they are orthogonal.
With this arrangement, the adhesive sheet 10B is stretched along the third direction M3 and the fourth direction M4. Since stretching stress acts in a direction orthogonal to the direction of the weakened portions constituting the lattice shapes 17A and 17B, along the first weakened portion 15B constituting the lattice shape 17A and the second weakened portion 16B constituting the lattice shape 17B. In addition, separation of each base material and expansion of the interval between the separated regions can be performed with a small stretching force. Therefore, according to this embodiment, the adhesive sheet 10B suitable for the method of extending along the 3rd direction M3 and the 4th direction M4 orthogonal to the 3rd direction M3 can be provided.

[Fourth embodiment]
The fourth embodiment differs from the first to third embodiments in the arrangement of the groove-shaped first fragile portion and the groove-shaped second fragile portion. Since the fourth embodiment is the same as the first embodiment to the third embodiment in other points, the description is omitted or simplified.
Hereinafter, the adhesive sheet of 4th embodiment which concerns on this invention is demonstrated.
FIG. 4 shows a plan view of the pressure-sensitive adhesive sheet 10C according to this embodiment. In FIG. 4, in order to facilitate understanding of the present embodiment, the adhesive layer is not shown, and the base film 11 </ b> C (the first base 13 </ b> C and the second base 14 </ b> C) is shown. The positions of the plurality of first fragile portions 15C are indicated by solid lines, and the positions of the plurality of second fragile portions 16C are indicated by dotted lines.
As shown in FIG. 4, the pressure-sensitive adhesive sheet 10 </ b> C of the present embodiment includes a plurality of first fragile portions 15 </ b> C and a plurality of second fragile portions 16 </ b> C in the plan view of the substrate film 11 </ b> C. A plurality of substantially concentric circles with different distances from the central portion O of the base film 11C are provided with O as the center.

The pressure-sensitive adhesive sheet 10 </ b> C having the above shape is suitable for use in an expanding process using, for example, an annular ring frame RF and a separation device 50 including a substantially rectangular separation table 70 shown in FIG. 5. In this expanding step, a plurality of semiconductor chips CP are attached as adherends on the adhesive layer of the adhesive sheet 10C.
A spacing device 50 shown in FIG. 5 is a device that widens the interval between a plurality of semiconductor chips CP.
The separation device 50 includes a support means 60, a separation table 70, and a linear motion motor 80. The support means 60 supports the ring frame RF. The separation table 70 supports the plurality of semiconductor chips CP via the adhesive sheet 10C. The linear motion motor 80 moves the support means 60 and the separation table 70 relative to each other to apply tension to the adhesive sheet 10C.
The support means 60 has a groove 61A that can receive the ring frame RF. The support means 60 includes a pair of support members 61 that are supported by the output shaft 80A of the linear motor 80, respectively.
The spacing table 70 has a quadrangular outer shape in plan view, that is, viewed from above. The separation table 70 has a support surface 70 </ b> A that has a planar shape with substantially the same area as the region where the plurality of semiconductor chips CP are attached.

A procedure for increasing the mutual interval between the plurality of semiconductor chips CP in the spacing device 50 will be described.
First, as shown by a solid line in FIG. 5, the outer peripheral region of the adhesive sheet 10 </ b> C is held by an annular ring frame RF. The ring frame RF holding the adhesive sheet 10 </ b> C is inserted through the groove 61 </ b> A of the support member 61.
Next, the linear motion motor 80 is driven to lower the support member 61, and as shown by the two-dot chain line in FIG. 5, the separation table 70 is passed inside the ring frame RF. When the support member 61 is lowered and the height of the support surface 70A of the separation table 70 becomes relatively higher than the height of the ring frame RF, the region inside the ring frame RF is pushed up by the support surface 70A of the separation table 70. It is done. By this push-up, the pressure-sensitive adhesive sheet 10C is expanded in a direction toward the outside along a direction orthogonal to the thickness direction and orthogonal to the circumferential direction.
Thus, when the pressure-sensitive adhesive sheet 10C is stretched using the spacing device 50, the stress of stretching in the direction perpendicular to the first fragile portion 15C and the second fragile portion 16C constituting the plurality of concentric circles shown in FIG. Therefore, it is possible to separate the base materials along the fragile portion provided in a substantially concentric shape and to extend the interval between the separated regions with a small stretching force. Therefore, according to the said aspect, the adhesive sheet suitable for the method of extending along the direction orthogonal to the circumferential direction can be provided.

[Fifth embodiment]
The fifth embodiment is different from the first to fourth embodiments in the arrangement of the groove-shaped first fragile portion and the groove-shaped second fragile portion. Since the fifth embodiment is the same as the first embodiment to the fourth embodiment in other points, the description is omitted or simplified.
Hereinafter, the adhesive sheet according to the fifth embodiment of the present invention will be described.
FIG. 6 shows a cross-sectional view of the pressure-sensitive adhesive sheet 10D according to this embodiment.
As shown in FIG. 6, in the pressure-sensitive adhesive sheet 10 </ b> D of the present embodiment, the plurality of first fragile portions 15 </ b> D provided on the first base material 13 </ b> D are formed on the surface facing the pressure-sensitive adhesive layer 12 </ b> D of the first base material 13 </ b> D. Is done. In addition, the plurality of second weakened portions 16D provided on the second base material 14D are formed on the surface opposite to the surface facing the pressure-sensitive adhesive layer 12D of the second base material 14D.
In the pressure-sensitive adhesive sheet 10D of the present embodiment, the region where the first fragile portion 15D and the second fragile portion 16D are provided is from the first embodiment to the fourth embodiment in a plan view of the base film 11D. It can be applied to any area.

According to this embodiment, the groove-shaped first fragile portion 15D provided in the first base material 13D is formed from the pressure-sensitive adhesive layer 12D side, and the groove-shaped second fragile portion provided in the second base material 14D. 16D is formed from the opposite side to the surface facing the adhesive layer 12D side. That is, in this structure, the 1st weak part 15D and the 2nd weak part 16D are each formed in the surface side and back surface side of base film 11D. Thus, since the 1st weak part 15D and the 2nd weak part 16D are formed in the position which left | separated, when the adhesive sheet 10D is extended, the direction of the crack which arises from the 1st weak part 15D is the 1st. Similarly, it is difficult to be guided toward the second fragile portion 16D, and similarly, the direction of a crack generated from the second fragile portion 16D is also difficult to be guided toward the first fragile portion 15D. Therefore, according to the said aspect, when extending adhesive sheet 10D, it can reduce more that base film 11D itself fractures | ruptures or tears.
Moreover, in this aspect, after laminating | stacking 1st base material 13D and 2nd base material 14D, and forming base film 11D, in the manufacturing method which implements weakening provision with respect to the front and back of base film 11D The first fragile portion 15D and the second fragile portion 16D can be formed in one step.

[Sixth embodiment]
Hereinafter, the pressure-sensitive adhesive sheet according to the sixth embodiment of the present invention will be described.
FIG. 7A shows a plan view of the pressure-sensitive adhesive sheet 10E according to this embodiment, and FIG. 7B shows a cross-sectional view of the pressure-sensitive adhesive sheet 10E. FIG. 7B is a cross-sectional view taken along line BB in FIG.
As shown in FIGS. 7 (A) and 7 (B), in the pressure-sensitive adhesive sheet 10E of the present embodiment, the plurality of first fragile portions 15E and the second base material 14E provided on the first base material 13E are provided. The plurality of second fragile portions 16E are provided at least in a portion corresponding to a region where the adherend 19 is attached. The adherend 19 is stuck on the pressure-sensitive adhesive layer 12E. In the present embodiment, the adherend 19 is a plurality of semiconductor chips. An interval corresponding to the thickness of the dicing saw is formed between the plurality of semiconductor chips by dicing.

According to this embodiment, the 1st weak part 15E and the 2nd weak part 16E are provided in the site | part corresponding to the area | region where the to-be-adhered body 19 is affixed.
When the adherend 19 is a plurality of semiconductor chips, as shown in FIG. 8, when the adhesive sheet 10E is stretched, the first fragile portion provided at a portion corresponding to the region where the adherend 19 is attached. Each base material is separated along the 15E and the second fragile portion 16E, and the interval between the separated regions is expanded. On the other hand, the 1st weak part 15E and the 2nd weak part 16E are not provided in the site | part corresponding to the area | region where the to-be-adhered body 19 is not stuck. Therefore, even if the pressure-sensitive adhesive sheet 10E is stretched, the region where the adherend 19 is not attached does not expand significantly compared to the region where the adherend 19 is attached. Thus, by setting it as the structure where the area | region where the to-be-adhered body 19 was stuck is easy to extend, the space | interval of the to-be-adhered bodies 19 can be expanded greatly.

In addition, in this aspect, for example, in the stealth dicing method, it is suitable for use in a wafer dividing process in which an altered layer is formed as an adherend and an expanding process of a plurality of divided semiconductor chips. Yes. In the stealth dicing method, the altered layer is continuously formed by irradiating a pulsed laser beam having transparency to the wafer along the planned dividing lines arranged in a lattice pattern on the surface of the wafer. This is a method of dividing a semiconductor wafer along a division line that has been reduced in strength due to the formation of a layer.
In the stealth dicing division method, first, a wafer is attached to an adhesive sheet, and a pulsed laser beam having transparency is irradiated to the wafer along division lines arranged in a lattice pattern on the surface of the wafer. An altered layer is continuously formed inside the wafer by irradiation with a pulsed laser beam. Then, when the adhesive sheet is stretched, each base material is separated along the first fragile portion and the second fragile portion provided in the portion corresponding to the region where the wafer is adhered, and the interval between the separated regions is expanded. . By this expansion, the wafer is divided into a plurality of chips from the altered layer, and the interval between the plurality of semiconductor chips generated by the division can be greatly increased.

[Seventh embodiment]
The method for manufacturing a semiconductor device according to the seventh embodiment of the present invention will be described below.
In the present embodiment, the pressure-sensitive adhesive sheet of the above-described embodiment is used as a dicing sheet 100 on which the semiconductor wafer W is adhered when dicing.

FIG. 9A shows the semiconductor wafer W attached to the dicing sheet 100. The dicing sheet 100 includes a base film 101 and an adhesive layer 102 laminated on the base film 101. The base film 101 includes a first base material 103 adjacent to the pressure-sensitive adhesive layer 102, and a second base material 104 laminated on the surface of the first base material 103 opposite to the surface facing the pressure-sensitive adhesive layer 102. Have The first base material 103 is provided with a plurality of first fragile portions (not shown), and the second base material 104 is provided with a plurality of second fragile portions (not shown). The plurality of first fragile portions and the plurality of second fragile portions are provided in regions that do not overlap each other in plan view of the base film 101.
The semiconductor wafer W has a circuit surface W1, and a circuit W2 is formed on the circuit surface W1. The dicing sheet 100 is attached to the back surface W3 of the semiconductor wafer W opposite to the circuit surface W1.
The semiconductor wafer W may be, for example, a silicon wafer or a compound semiconductor wafer such as gallium / arsenic. Examples of a method for forming the circuit W2 on the circuit surface W1 of the semiconductor wafer W include a widely used method, and examples thereof include an etching method and a lift-off method.
The semiconductor wafer W is ground in advance to a predetermined thickness, and the back surface W3 is exposed to be adhered to the dicing sheet 100. The method for grinding the semiconductor wafer W is not particularly limited, and examples thereof include a known method using a grinder. When grinding the semiconductor wafer W, a surface protective sheet is adhered to the circuit surface W1 in order to protect the circuit W2. In the backside grinding of the wafer, the circuit surface W1 side of the semiconductor wafer W, that is, the surface protection sheet side is fixed by a chuck table or the like, and the backside where the circuit W2 is not formed is ground by a grinder. The thickness of the semiconductor wafer W after grinding is not particularly limited, and is usually 20 μm or more and 500 μm or less.

  The dicing sheet 100 may be attached to the semiconductor wafer W and the first ring frame. In this case, the first ring frame and the semiconductor wafer W are placed on the adhesive layer 102 of the dicing sheet 100, and these are lightly pressed and fixed.

[First dicing process]
FIG. 9B shows a plurality of semiconductor chips CP held on the dicing sheet 100.
The semiconductor wafer W held on the dicing sheet 100 is divided into pieces by dicing to form a plurality of semiconductor chips CP. A cutting means such as a dicing saw is used for dicing. The cutting depth at the time of dicing is set to a depth that takes into account the sum of the thickness of the semiconductor wafer W and the thickness of the adhesive layer 102 and the wear of the dicing saw.
Further, an interval corresponding to the thickness of a cutting means such as a dicing saw is formed between the plurality of semiconductor chips CP separated by dicing. In the present embodiment, the interval between the semiconductor chips CP generated by dicing is D.

  Irradiation of the energy beam to the pressure-sensitive adhesive layer 102 may be performed at any stage after the semiconductor wafer W is adhered to the dicing sheet 100 and before the dicing sheet 100 is peeled off. Irradiation of energy rays may be performed after dicing, for example, or may be performed after an expanding step described later. The energy rays may be irradiated in a plurality of times.

[Expanding process]
FIG. 9C shows a diagram illustrating a process of extending the dicing sheet 100 that holds a plurality of semiconductor chips CP (sometimes referred to as an expanding process).
In the expanding process, after dicing into a plurality of semiconductor chips CP, the dicing sheet 100 is stretched to widen the intervals between the plurality of semiconductor chips CP. When the dicing sheet 100 is stretched, the stretching stress concentrates on the first fragile portion and the second fragile portion, and the base materials are separated along the first fragile portion and the second fragile portion, and the distance between the separated regions Will spread. As a result, the dicing sheet 100 is stretched at a desired interval, and the interval between the plurality of semiconductor chips CP attached to the dicing sheet 100 is increased.
The method for extending the dicing sheet 100 in the expanding step is not particularly limited. Examples of the method of stretching the dicing sheet 100 include a method of stretching the dicing sheet 100 by pressing an annular or circular expander, a method of gripping and stretching the outer periphery of the dicing sheet 100 using a gripping member, and the like. It is done.
In the present embodiment, as shown in FIG. 9C, the interval between the semiconductor chips CP after the expanding process is D1. For example, the distance D1 is preferably 200 μm or more and 5000 μm or less.

[Transfer process]
FIG. 10A shows a diagram for explaining a process (sometimes referred to as a transfer process) of transferring a plurality of semiconductor chips CP to the transfer sheet 200 after the expanding process.
After the dicing sheet 100 is stretched to increase the distance D1 between the plurality of semiconductor chips CP, the transfer sheet 200 is attached to the circuit surface W1 of the semiconductor chip CP.

The transfer sheet 200 includes a first base film 203 and a first pressure-sensitive adhesive layer 204. The transfer sheet 200 is preferably attached so as to cover the circuit surface W <b> 1 with the first pressure-sensitive adhesive layer 204.
The material of the first base film 203 is not particularly limited. Examples of the material of the first base film 203 include polyvinyl chloride resin, polyester resin (polyethylene terephthalate, etc.), acrylic resin, polycarbonate resin, polyethylene resin, polypropylene resin, acrylonitrile / butadiene / styrene resin, polyimide resin, and polyurethane resin. And polystyrene resin.

The pressure-sensitive adhesive contained in the first pressure-sensitive adhesive layer 204 is not particularly limited and can be widely applied. Examples of the pressure-sensitive adhesive contained in the first pressure-sensitive adhesive layer 204 include rubber-based, acrylic-based, silicone-based, polyester-based, and urethane-based materials. In addition, the kind of adhesive is selected in consideration of the use, the kind of adherend to be attached, and the like.
FIG. 10B shows a plurality of semiconductor chips CP held on the transfer sheet 200 after the dicing sheet 100 is peeled off.
When the dicing sheet 100 is peeled off after the transfer sheet 200 is adhered, the back surfaces W3 of the plurality of semiconductor chips CP are exposed. Even after the dicing sheet 100 is peeled off, the distance D1 between the plurality of semiconductor chips CP, which is extended in the expanding process, is maintained.

[Sealing process]
FIG. 11 is a diagram illustrating a process of sealing a plurality of semiconductor chips CP using the sealing member 30 (sometimes referred to as a sealing process).
The sealing step is performed after the expanding step. The sealing body 3 is formed by covering the plurality of semiconductor chips CP with the sealing member 30 while leaving the circuit surface W1. A sealing member 30 is also filled between the plurality of semiconductor chips CP. In the present embodiment, since the circuit surface W1 and the circuit W2 are covered with the transfer sheet 200, it is possible to prevent the circuit surface W1 from being covered with the sealing member 30.

By the sealing process, the sealing body 3 in which a plurality of semiconductor chips CP separated by a predetermined distance are embedded in the sealing member is obtained. In the sealing step, the plurality of semiconductor chips CP are preferably covered with the sealing member 30 in a state where the distance D1 is maintained.
A method for covering the plurality of semiconductor chips CP with the sealing member 30 is not particularly limited. For example, a method is adopted in which a plurality of semiconductor chips CP are accommodated in a mold while the circuit surface W1 is covered with the transfer sheet 200, a fluid resin material is injected into the mold, and the resin material is cured. May be.
Further, a method of embedding the plurality of semiconductor chips CP in the sealing resin by placing the sheet-shaped sealing resin so as to cover the back surfaces W3 of the plurality of semiconductor chips CP and heating the sealing resin is adopted. May be. Examples of the material of the sealing member 30 include an epoxy resin. The epoxy resin used as the sealing member 30 may include, for example, a phenol resin, an elastomer, an inorganic filler, a curing accelerator, and the like.

After the sealing step, when the transfer sheet 200 is peeled off, the circuit surface W1 of the semiconductor chip CP and the surface 3A that has been in contact with the transfer sheet 200 of the sealing body 3 are exposed.
[Semiconductor package manufacturing process]
12 and 13 are views for explaining a process for manufacturing a semiconductor package using a plurality of semiconductor chips CP. The present embodiment preferably includes a manufacturing process of such a semiconductor package.

[Rewiring layer formation process]
FIG. 12A shows a cross-sectional view of the sealing body 3 after the transfer sheet 200 is peeled off. In this embodiment, it is preferable to further include a rewiring layer forming step of forming a rewiring layer on the sealing body 3 after the transfer sheet 200 is peeled off. In the rewiring layer forming step, rewirings connected to the circuits W2 of the plurality of exposed semiconductor chips CP are formed on the circuit surface W1 and the surface 3A of the sealing body 3. In forming the rewiring, first, an insulating layer is formed on the sealing body 3.

  FIG. 12B is a cross-sectional view illustrating a process of forming the first insulating layer 41 on the circuit surface W1 of the semiconductor chip CP and the surface 3A of the sealing body 3. A first insulating layer 41 including an insulating resin is formed on the circuit surface W1 and the surface 3A so as to expose the circuit W2 or the internal terminal electrode W4 of the circuit W2. Examples of the insulating resin include polyimide resin, polybenzoxazole resin, and silicone resin. The material of the internal terminal electrode W4 is not limited as long as it is a conductive material, and examples thereof include gold, silver, metals such as copper and aluminum, and alloys.

  FIG. 12C is a cross-sectional view illustrating a process of forming the rewiring 5 that is electrically connected to the semiconductor chip CP sealed in the sealing body 3. In the present embodiment, the rewiring 5 is formed following the formation of the first insulating layer 41. The material of the rewiring 5 is not limited as long as it is a conductive material, and examples thereof include gold, silver, metals such as copper and aluminum, and alloys. The rewiring 5 can be formed by a known method.

  FIG. 13A is a cross-sectional view illustrating a process of forming the second insulating layer 42 that covers the rewiring 5. The rewiring 5 has external electrode pads 5A for external terminal electrodes. The second insulating layer 42 is provided with an opening or the like to expose the external electrode pad 5A for the external terminal electrode. In the present embodiment, the external electrode pad 5A is exposed in the region of the semiconductor chip CP of the sealing body 3 (region corresponding to the circuit surface W1) and outside the region (region corresponding to the surface 3A on the sealing member 30). I am letting. The rewiring 5 is formed on the surface 3A of the sealing body 3 so that the external electrode pads 5A are arranged in an array. In the present embodiment, since the external electrode pad 5A is exposed outside the region of the semiconductor chip CP of the sealing body 3, a fan-out type WLP can be obtained.

[Connection process with external terminal electrode]
FIG. 13B is a cross-sectional view illustrating a process of connecting the external terminal electrode 6 to the external electrode pad 5A of the sealing body 3. The external terminal electrode 6 such as a solder ball is placed on the external electrode pad 5A exposed from the second insulating layer 42, and the external terminal electrode 6 and the external electrode pad 5A are electrically connected by solder bonding or the like. The material of the solder ball is not particularly limited, and examples thereof include lead-containing solder and lead-free solder.

[Second dicing process]
FIG. 13C shows a cross-sectional view for explaining a process of separating the sealing body 3 to which the external terminal electrode 6 is connected (sometimes referred to as a second dicing process). In this second dicing step, the sealing body 3 is separated into individual semiconductor chips CP. The method for dividing the sealing body 3 into individual pieces is not particularly limited. For example, the sealing body 3 can be separated into pieces by adopting a method similar to the method of dicing the semiconductor wafer W described above. The step of dividing the sealing body 3 into pieces may be performed by sticking the sealing body 3 to an adhesive sheet such as a dicing sheet.

  By separating the sealing body 3 into pieces, the semiconductor package 1 in units of the semiconductor chip CP is manufactured. As described above, the semiconductor package 1 in which the external terminal electrode 6 is connected to the external electrode pad 5A fanned out outside the region of the semiconductor chip CP is manufactured as a fan-out type wafer level package (FO-WLP).

[Mounting process]
In the present embodiment, it is also preferable to include a step of mounting the separated semiconductor package 1 on a printed wiring board or the like.

According to the present embodiment, the pressure-sensitive adhesive sheet of the above-described embodiment is used as the dicing sheet 100 on which the semiconductor wafer W is adhered when dicing.
The semiconductor wafer W adhered to the dicing sheet 100 is separated into pieces by dicing to form a plurality of semiconductor chips CP, and then the dicing sheet 100 is stretched by grasping the outer peripheral portion, thereby reducing the interval between the plurality of semiconductor chips CP. Can be greatly expanded.

[Modification of Embodiment]
The present invention is not limited to the above-described embodiment. The present invention includes a modification of the above-described embodiment as long as the object of the present invention can be achieved.
The position, shape, and number of the first fragile portions 15 and the second fragile portions 16 are not limited.
Moreover, although the 1st weak part 15 and the 2nd weak part 16 were formed in the vertically long rectangular shape by planar view of FIG. 1, it is not limited to this. For example, it may be formed in a vertically long elliptical shape.

Moreover, although it was set as the structure which provides a 1st weak part and a 2nd weak part in groove shape with respect to the base-material thickness direction, it is not limited to this. You may form so that either a 1st weak part and a 2nd weak part may be penetrated with respect to a base-material thickness direction.
FIG. 14 shows a plan view of an adhesive sheet 10F according to a modification.
As shown in FIG. 14, the pressure-sensitive adhesive sheet 10F according to the modification includes a base film 11F and a pressure-sensitive adhesive layer 12F. The pressure-sensitive adhesive layer 12F is laminated on the base film 11F. The substrate film 11F includes a first substrate 13F and a second substrate 14F. The first base material 13F is adjacent to the pressure-sensitive adhesive layer 12F. The second base material 14F is laminated on the surface of the first base material 13F opposite to the surface facing the pressure-sensitive adhesive layer 12F.
The first base material 13F is provided with a plurality of first fragile portions 15F penetrating in the thickness direction of the first base material 13F. The second base material 14F is provided with a second fragile portion 16F penetrating in the thickness direction of the second base material 14F.
According to this aspect, since the weak part formed so that it may penetrate with respect to the thickness direction of a base material becomes weak compared with the weak part which does not penetrate, such as groove shape, it is easy to isolate | separate and expand. Therefore, separation of each base material along the fragile portion and expansion of the interval between the separated regions can be performed with a small stretching force.
In FIG. 14, the first fragile portion 15 </ b> F and the second fragile portion 16 </ b> F have been described as an example in which the deteriorated layer is formed by penetrating in the base material thickness direction, but may be configured by a through hole.

Moreover, in the manufacturing method of the adhesive sheet of 1st embodiment, although the weakening provision process was performed after forming the base film 11, this invention is not limited to such an aspect. For example, after forming the 1st weak part 15 in the 1st base material 13 and the 2nd weak part 16 in the 2nd base material 14, respectively, after laminating | stacking the 1st base material 13 and the 2nd base material 14, a base film 11 may be formed.
Moreover, in the manufacturing method of the adhesive sheet of 1st embodiment, although the tooth profile process was implemented as a weakening provision process and the groove-shaped 1st weak part and the groove-shaped 2nd weak part were provided, it is not limited to this. For example, the altered layer may be formed by performing laser processing as the weakening treatment.
Laser processing is performed by irradiating the surface of the first base material 13 with a laser along the weakened portion forming region of the first base material 13. Moreover, it carries out by irradiating a laser with respect to the surface of the 2nd base material 14 along the weak part formation area | region of the 2nd base material 14. FIG. Laser processing is easier to cope with changes in the position of the fragile portions and changes in the number of fragile portions than the above tooth profile processing.

  Moreover, although 3rd embodiment demonstrated that the grid | lattice shape was formed in each of the 1st base material 13 and the 2nd base material 14, this invention is not limited to such an aspect. For example, a configuration in which a lattice shape is formed only on the first base material 13 or only on the second base material 14 may be adopted.

Further, in the concentric circles of the fourth embodiment, the interval between the weak portions provided along the concentric circles (first circles) located on the inner side is located on the outer side of the inner concentric circles (first circle). You may narrower than the space | interval of the weak parts provided along the concentric circle (2nd circle).
FIG. 15 shows a plan view of an adhesive sheet 10G according to a modification. In FIG. 15, in order to facilitate understanding of the present modification, the adhesive layer is not shown, and the base film 11G (first base material 13G and second base material 14G) is shown. Moreover, only the 1st weak part is shown and illustration of the 2nd weak part is abbreviate | omitted. Further, the position of the first circle C1 located inside is indicated by a solid line, and the position of the second circle C2 located outside is indicated by a dotted line. Furthermore, the first fragile portion provided along the first circle C1 is represented by 18A, and the first fragile portion provided along the second circle C2 is represented by 18B.
As shown in FIG. 15, the interval P1 between the first weakened portions 18A provided along the first circle C1 located on the inner side is a second value located outside the first inner circle C1. It is narrower than the interval P2 between the first fragile portions 18B provided along the circle C2.
Note that FIG. 15 shows an example in which two concentric circles (first circle C1 and second circle C2) are formed, but the present invention is also applicable to the case where three or more concentric circles are formed. Is done. For example, the interval between the weak portions provided along the concentric circle provided on the innermost side is the narrowest, and the interval between the weak portions provided along the concentric circle provided on the outermost side is formed widest. In the concentric circle provided between the concentric circle provided on the innermost side and the concentric circle provided on the outermost side, the interval between the fragile portions provided along the concentric circle is increased from the outer edge side of the adhesive sheet toward the central portion. It is formed so that the interval becomes narrower in order.
According to this aspect, the interval P1 between the first fragile portions 18A provided along the first circle C1 is narrower than the first fragile portion provided along the second circle C2. The tensile strength is weaker than the interval P2 between the portions 18B. Therefore, the first fragile portion 18A that constitutes the first circle C1 is easier to break than the first fragile portion 18B that constitutes the second circle C2. On the other hand, the interval P2 is difficult to break because the interval between the fragile portions is wide. For this reason, when the pressure-sensitive adhesive sheet 10G is stretched along the direction orthogonal to the circumferential direction, the first fragile portion 18A provided along the first circle C1 located inside and the interval P1 between the fragile portions. Breaks first, and the first fragile portion 18B provided along the second circle C2 located on the outside and the interval P2 between the fragile portions break later.

Further, in the concentric circles of the fourth embodiment, a plurality of concentric circles (a third circle, a fourth circle, and a fifth circle) may be formed so that the radial dimension increases for each predetermined dimension.
FIG. 16 shows a plan view of an adhesive sheet 10H according to a modification. In FIG. 16, in order to facilitate understanding of the present modification, the adhesive layer is not shown, and the base film 11H (the first base 13H and the second base 14H) is shown. Moreover, only the 1st weak part is shown and illustration of the 2nd weak part is abbreviate | omitted. The positions of the third circle C3, the fourth circle C4, and the fifth circle C5 are indicated by solid lines. Furthermore, the first fragile portion provided along the third circle C3 is 18C, the first fragile portion provided along the fourth circle C4 is 18D, and the first fragile portion provided along the fifth circle C5 is provided. One vulnerable part is represented by 18E.
As shown in FIG. 16, the radial dimension differences ΔD between the adjacent third circle C3, fourth circle C4, and fifth circle C5 are formed to be constant. Since the adjacent concentric circles are formed at equal intervals, the pressure-sensitive adhesive sheet 10H is stretched to form a plurality of concentric circles (third circle C3, fourth circle C4, and fifth circle C5). Since the fragile portions 18C, 18D, and 18E are separated and expanded, the adhesive sheet can be separated and expanded at equal intervals.

  The present invention can be used for a pressure-sensitive adhesive sheet and a method for manufacturing a semiconductor device.

DESCRIPTION OF SYMBOLS 1 ... Semiconductor package, 3 ... Sealing body, 3A ... surface, 5 ... Rewiring, 5A ... External electrode pad, 6 ... External terminal electrode, 10, 10A, 10B, 10C, 10D, 10E, 10F, 10G, 10H ... Adhesive sheet, 11, 11A, 11B, 11C, 11D, 11F, 11G, 11H, 101 ... base film, 12, 12D, 12E, 12F, 102 ... adhesive layer, 13, 13A, 13B, 13C, 13D, 13E , 13F, 13G, 13H, 103 ... first base material, 14, 14A, 14B, 14C, 14D, 14E, 14F, 14G, 14H, 104 ... second base material, 15, 15A, 15B, 15C, 15D , 15E, 15F, 18A, 18B, 18C, 18D, 18E ... first fragile portion, 16, 16A, 16B, 16C, 16D, 16E, 16F ... second fragile portion, 17 , 17B ... lattice shape, 19 ... adherend, 30 ... sealing member, 41 ... first insulating layer, 42 ... second insulating layer, 50 ... spacing device, 60 ... support means, 61 ... support member, 61A ... groove , 70: separation table, 70A: support surface, 80 ... linear motion motor, 80A ... output shaft, 100 ... dicing sheet, 200 ... transfer sheet, 203 ... first base film, 204 ... first adhesive layer, C1 ... 1st circle, C2 ... 2nd circle, C3 ... 3rd circle, C4 ... 4th circle, C5 ... 5th circle, CP ... Semiconductor chip, D, D1, P1, P2 ... Interval, M1 ... 1st direction, M2 ... 2nd direction, M3 ... 3rd direction, M4 ... 4th direction, O ... Center part, RF ... Ring frame, W ... Semiconductor wafer, W1 ... Circuit surface, W2 ... Circuit, W3 ... Back surface , W4... Internal terminal electrode, ΔD.

Claims (12)

A base film and an adhesive layer are provided,
The base film includes at least a first base material adjacent to the pressure-sensitive adhesive layer, and a second base material laminated on a surface of the first base material opposite to the surface facing the pressure-sensitive adhesive layer. Have
The first base material is provided with a plurality of first fragile portions,
The second base material is provided with a plurality of second weak parts,
The plurality of first fragile portions provided on the first substrate and the plurality of second fragile portions provided on the second substrate do not overlap with each other in plan view of the substrate film. Adhesive sheet provided in At least one of the plurality of first fragile portions and the plurality of second fragile portions are formed in a direction orthogonal to a direction in which the adhesive sheet is stretched,
The pressure-sensitive adhesive sheet according to claim 1. At least one of the plurality of first fragile portions and the plurality of second fragile portions is provided on any one of the first base material and the second base material in a plan view of the base film. Provided so that the fragile parts were crossed to form a lattice shape,
The pressure-sensitive adhesive sheet according to claim 1 or claim 2. In a plan view of the base film, at least one of the plurality of first fragile portions and the plurality of second fragile portions is centered on the center portion of the base film from the center portion of the base film. Provided in a plurality of substantially concentric circles with different distances,
The pressure-sensitive adhesive sheet according to claim 1 or claim 2. The first base material has a tear strength of 3 N / mm or more and 50 N / mm or less when a tear strength test is performed in the MD direction, and a tear strength test is performed in the CD direction. The tear strength is 5 N / mm or more and 100 N / mm or less,
The second substrate has a tear strength of 50 N / mm or more when a tear strength test is performed in the MD direction, and a tear strength when a tear strength test is performed in the CD direction. 100 N / mm or more,
The pressure-sensitive adhesive sheet according to any one of claims 1 to 4. The plurality of first fragile portions provided on the first base material are provided penetrating with respect to the thickness direction of the first base material,
The plurality of second weakened portions provided on the second base material are provided penetrating with respect to the thickness direction of the second base material,
The pressure-sensitive adhesive sheet according to any one of claims 1 to 5. The plurality of first fragile portions provided on the first base material are provided in a groove shape with respect to the thickness direction of the first base material,
The plurality of second weakened portions provided on the second base material are provided in a groove shape with respect to the thickness direction of the second base material.
The pressure-sensitive adhesive sheet according to any one of claims 1 to 6. The plurality of first fragile portions provided on the first base material is formed on a surface of the first base material facing the pressure-sensitive adhesive layer,
A plurality of second weakened portions provided on the second base material are formed on a surface of the second base material facing the pressure-sensitive adhesive layer.
The pressure-sensitive adhesive sheet according to claim 7. The plurality of first fragile portions provided on the first base material is formed on a surface of the first base material facing the pressure-sensitive adhesive layer,
The plurality of second weakened portions provided on the second base material are formed on a surface opposite to the surface facing the pressure-sensitive adhesive layer of the second base material,
The pressure-sensitive adhesive sheet according to claim 7. An adherend is stuck on the adhesive layer,
The plurality of first fragile portions provided on the first base material and the plurality of second fragile portions provided on the second base material correspond to at least a region where the adherend is attached. Provided in the site,
The pressure-sensitive adhesive sheet according to any one of claims 1 to 9. The process of sticking a wafer to the pressure sensitive adhesive sheet according to any one of claims 1 to 10,
Separating the wafer attached to the adhesive sheet by dicing and forming a plurality of semiconductor chips;
Stretching the pressure-sensitive adhesive sheet, and widening the interval between the plurality of semiconductor chips attached to the first region.
A method for manufacturing a semiconductor device. The method further includes a step of extending the pressure-sensitive adhesive sheet and expanding the interval between the plurality of semiconductor chips, and then covering the sealing surfaces with the circuit surfaces of the plurality of semiconductor chips.
A method for manufacturing a semiconductor device according to claim 11.

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