KR20220002258A - A semiconductor device having a dolmen structure, a method for manufacturing the same, and a laminated film for forming a support piece and a method for manufacturing the same - Google Patents

Abstract

The multilayer film for forming a support piece according to the present disclosure includes a base film, an adhesive layer, and a film for forming a support piece in this order, and the film for forming a support piece at least includes a resin layer having a tensile modulus of 8.0 MPa or more. have a structure This laminated film for support piece formation is supported by the board|substrate, the 1st chip arrange|positioned on the board|substrate, the some support piece on the board|substrate and arrange|positioned around the 1st chip|tip, and the some support piece, and is a 1st It is applied to a manufacturing process of a semiconductor device having a dolmen structure including a second chip disposed so as to cover the chip.

Description

A semiconductor device having a dolmen structure, a method for manufacturing the same, and a laminated film for forming a support piece and a method for manufacturing the same

The present disclosure provides a substrate, a first chip disposed on the substrate, a plurality of support pieces on the substrate and disposed around the first chip, supported by the plurality of support pieces and arranged to cover the first chip The present invention relates to a semiconductor device having a dolmen structure including a second chip. Moreover, this indication relates to the manufacturing method of the semiconductor device which has a dolmen structure, and the laminated|multilayer film for support piece formation, and its manufacturing method. In addition, a dolmen is a type of stone tomb, and includes a plurality of pilasters and a plate-shaped rock placed thereon. In a semiconductor device having a dolmen structure, the support piece corresponds to a "stallite" and the second chip corresponds to a "plate-shaped rock".

In recent years, in the field of semiconductor devices, high integration, miniaturization, and high speed are required. As an aspect of a semiconductor device, a structure in which a semiconductor chip is stacked on a controller chip disposed on a substrate is attracting attention. For example, Patent Document 1 discloses a semiconductor die assembly including a controller die and a memory die supported by a support member on the controller die. The semiconductor assembly 100 illustrated in FIG. 1A of Patent Document 1 may have a dolmen structure. That is, the semiconductor assembly 100 includes a package substrate 102 , a controller die 103 disposed on a surface thereof, memory dies 106a and 106b disposed above the controller die 103 , and a memory die. Support members 130a and 130b for supporting the 106a are provided.

Patent Document 1: Japanese Patent Publication No. 2017-515306

Patent Document 1 discloses that a semiconductor material such as silicon can be used as a support member (support piece), and more specifically, a fragment of a semiconductor material obtained by dicing a semiconductor wafer can be used. (See [0012], [0014] and FIG. 2 of Patent Document 1). In order to manufacture the support piece for dolmen structures using a semiconductor wafer, the following each process is required similarly to manufacture of a normal semiconductor chip, for example.

(1) The step of pasting the backgrind tape on the semiconductor wafer

(2) Backgrinding the semiconductor wafer

(3) A step of affixing a film having an adhesive layer and an adhesive layer (a dicing and die-bonding integrated film) to the dicing ring and the backgrinded semiconductor wafer disposed therein

(4) Step of peeling the backgrind tape from the semiconductor wafer

(5) The process of dividing the semiconductor wafer into pieces

(6) A step of picking up a support piece made of a laminate of a semiconductor chip and an adhesive piece from the adhesive layer

(7) Step of crimping the plurality of support pieces to predetermined positions of the substrate

The present disclosure provides a method for manufacturing a semiconductor device that can simplify the process of manufacturing a support piece in a manufacturing process of a semiconductor device having a dolmen structure, and can achieve excellent pick-up properties of the support piece. Moreover, this indication provides the semiconductor device which has a dolmen structure, the laminated|multilayer film for support piece formation, and its manufacturing method.

One aspect of the present disclosure relates to a method of manufacturing a semiconductor device having a dolmen structure. This manufacturing method includes the following steps.

(A) Process of preparing laminated|multilayer film provided with a base film, an adhesion layer, and the film for support piece formation in this order

(B) The process of forming a some support piece on the surface of an adhesion layer by separating the film for support piece formation into pieces

(C) The step of picking up the support piece from the adhesive layer

(D) Step of arranging the first chip on the substrate

(E) a step of arranging a plurality of support pieces on a substrate and around the first chip or around the area where the first chip is to be placed

(F) Step of preparing a chip with an adhesive piece comprising a second chip and an adhesive piece provided on one surface of the second chip

(G) Step of constructing a dolmen structure by arranging chips with adhesive pieces on the surfaces of the plurality of support pieces

The film for forming a support piece has a multilayer structure including at least a resin layer having a tensile modulus of 8.0 MPa or more. When the tensile modulus of elasticity of the resin layer which the film for support piece formation has is 8.0 Mpa or more, the outstanding pick-up property of the support piece obtained by separating the film for support piece formation into pieces can be achieved. The film for support piece formation may also contain the thermosetting resin layer comprised with the material other than the resin layer, for example from a resin layer. In the present disclosure, the tensile modulus means a value measured under the following conditions based on the method described in JIS K7127:1999 (Plastic-Tensile Property Test Method-Part 3: Film and Sheet Test Conditions).

· Specimen dimensions: 10 mm × 40 mm

·Chuck spacing: 30mm

Tensile speed: 300mm/min

The (D) process and the (E) process may be implemented first either. When (D) process is performed first, in (E) process, it is on a board|substrate and what is necessary is just to arrange|position a some support piece around a 1st chip|tip. On the other hand, when step (E) is performed first, in step (E), a plurality of support pieces are arranged on the substrate around the area where the first chip is to be placed, and then, in step (D) In this case, the first chip may be disposed in the region.

In the said manufacturing method which concerns on this indication, the support piece obtained by breaking the film for support piece formation into pieces is used. Thereby, compared with the conventional manufacturing method using the fragment of the semiconductor material obtained by dicing a semiconductor wafer as a support piece, the process of manufacturing a support piece can be simplified. That is, since the film for support piece formation does not contain a semiconductor wafer to what conventionally required the process of (1)-(7) mentioned above, (1), (2) regarding the backgrind of a semiconductor wafer ) and (4) may be omitted. Moreover, compared with a resin material, since expensive semiconductor wafer is not used, cost can also be reduced.

(A) Pressure-sensitive type may be sufficient as the adhesion layer of laminated|multilayer film prepared at a process, and an ultraviolet curing type may be sufficient as it. That is, the adhesive layer may or may not be cured by irradiation with ultraviolet rays, and in other words, may or may not contain a resin having a carbon-carbon double bond having photoreactivity. Further, the pressure-sensitive adhesive layer may contain a resin having a carbon-carbon double bond having photoreactivity. For example, the adhesive layer may have the adhesive layer lowered by irradiating ultraviolet rays to the predetermined area, and for example, a resin having a photoreactive carbon-carbon double bond may remain. When an adhesive layer is an ultraviolet curing type, the adhesiveness of an adhesive layer can be reduced by performing the process of irradiating an ultraviolet-ray to an adhesive layer between (B) process and (C) process.

When the film for forming the support piece includes a thermosetting resin layer, the step of curing the thermosetting resin layer or the adhesive piece by heating the film or the support piece for forming the support piece may be performed at an appropriate timing, for example, (G) It should be carried out before the process. In the step of arranging the chip with the adhesive piece so as to be in contact with the surfaces of the plurality of support pieces, it is possible to suppress deformation of the support piece according to the arrangement of the chip with the adhesive piece because the thermosetting resin layer has already been cured. Moreover, since the thermosetting resin layer has adhesiveness with respect to another member (for example, a board|substrate), it is not necessary to provide an adhesive bond layer etc. separately for a support piece.

One aspect of the present disclosure relates to a semiconductor device having a dolmen structure. That is, the semiconductor device is supported by a substrate, a first chip disposed on the substrate, a plurality of support pieces on the substrate and disposed around the first chip, and the first chip supported by the plurality of support pieces. It has a dolmen structure including a second chip disposed so as to cover it, and a support piece has a multilayer structure including at least a resin piece having a tensile modulus of 8.0 MPa or more.

The semiconductor device according to the present disclosure may further include an adhesive piece provided on one surface of the second chip and held between the second chip and the plurality of support pieces. In this case, the said 1st chip|tip may be spaced apart from the adhesive bond piece, and may be in contact with the adhesive bond piece. This adhesive piece is provided so that at least the area|region which faces the 1st chip|tip in a 2nd chip|tip may be covered, for example. The adhesive piece may extend continuously from the region of the second chip to the peripheral side of the second chip, and may be sandwiched by the second chip and the plurality of support pieces. That is, one said adhesive bond piece may cover the said area|region of a 2nd chip|tip, and may adhere|attach a 2nd chip|tip and a some support piece.

One aspect of the present disclosure relates to a laminated film for forming a support piece. This laminated|multilayer film is equipped with a base film, an adhesion layer, and the film for support piece formation in this order, The film for support piece formation has a multilayer structure containing at least the resin layer of 8.0 Mpa or more of tensile elasticity modulus. This resin layer is a polyimide layer, for example. The film for support piece formation may also contain the thermosetting resin layer comprised with the material other than the resin layer other than a resin layer. When the film for forming a support piece has a plurality of layers made of different materials, functions can be shared among each layer, and for example, higher functionalization of the film can be achieved compared to that made of a plurality of layers of the same material. can do. By separating the film of such a multilayer structure into pieces, a support piece suitable for the dolmen structure can be obtained. Such a support piece includes a resin piece (one in which the resin layer is divided into pieces) and an adhesive piece (one in which the thermosetting resin layer is divided into pieces) provided on one side of the resin piece, and the resin piece is made of a material different from that of the adhesive piece. Consists of. Such a support piece may include a three-layer structure of a resin piece and a pair of adhesive pieces holding the resin piece, and the resin piece may be composed of a material different from the pair of adhesive pieces.

The thickness of the said film for support piece formation is 5-180 micrometers, for example. When the thickness of the film for forming a support piece is within this range, it is possible to construct a dolmen structure having an appropriate height with respect to a first chip (eg, a controller chip). The film for support piece formation may also contain a thermosetting resin layer. It is preferable that a thermosetting resin layer contains an epoxy resin, and contains an elastomer, for example. When the thermosetting resin layer constituting the support piece contains the elastomer, the stress in the semiconductor device can be relieved.

One aspect of the present disclosure relates to a method of manufacturing a laminated film for forming a support piece. This manufacturing method includes the process of preparing the adhesive film which has a base film and the adhesive layer formed on the one side, and the process of laminating|stacking the film for support piece formation on the surface of the adhesive layer, Support piece formation The film for use has a multilayer structure including at least a resin layer having a tensile modulus of 8.0 MPa or more.

The laminated film for support piece formation which has a thermosetting resin layer and a resin layer can be manufactured as follows, for example. That is, the manufacturing method of this laminated|multilayer film for support piece formation is the process of preparing the laminated|multilayer film provided with a base film, an adhesion layer, and a thermosetting resin layer in this order, On the surface of a thermosetting resin layer, tensile modulus of elasticity 8.0 MPa The process of bonding the above resin layers together is included.

ADVANTAGE OF THE INVENTION According to this indication, while being able to simplify the process of manufacturing a support piece in the manufacturing process of the semiconductor device which has a dolmen structure, the manufacturing method of the semiconductor device which can achieve the outstanding pick-up property of a support piece is provided. Moreover, according to this indication, the semiconductor device which has a dolmen structure, the laminated|multilayer film for support piece formation, and its manufacturing method are provided.

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows typically 1st Embodiment of the semiconductor device which concerns on this indication.
FIG.2(a) and FIG.2(b) are top views which show typically the example of the positional relationship of a 1st chip|tip and a some support piece.
Fig.3 (a) is a top view which shows typically one Embodiment of the laminated|multilayer film for support piece formation, (b) is sectional drawing in the line bb of Fig.3 (a).
It is sectional drawing which shows typically the process of bonding an adhesion layer and the film for support piece formation.
5(a) to 5(d) are cross-sectional views schematically illustrating the manufacturing process of the support piece.
6 is a cross-sectional view schematically showing a state in which a plurality of support pieces are disposed on a substrate and around the first chip.
7 is a cross-sectional view schematically showing an example of a chip with an adhesive piece.
8 is a cross-sectional view schematically showing a dolmen structure formed on a substrate.
9 is a cross-sectional view schematically showing a second embodiment of a semiconductor device according to the present disclosure.
It is sectional drawing which shows typically other embodiment of the laminated|multilayer film for support piece formation.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this indication is described in detail, referring drawings. However, this invention is not limited to the following embodiment. In addition, in this specification, "(meth)acrylic acid" means acrylic acid or methacrylic acid, and "(meth)acrylate" means an acrylate or a methacrylate corresponding thereto. "A or B" may include any one of A and B, and may include both.

As used herein, the term "layer" includes a structure of a shape formed in a part in addition to a structure of a shape formed on the entire surface when viewed as a plan view. In addition, in this specification, the term "process" is included in this term as long as the desired action of the process is achieved even if it cannot be clearly distinguished from an independent process as well as other processes. In addition, the numerical range indicated using "-" shows the range which includes the numerical value described before and after "-" as a minimum value and a maximum value, respectively.

In the present specification, the content of each component in the composition means the total amount of the plurality of substances present in the composition, unless otherwise specified, when a plurality of substances corresponding to each component exist in the composition. In addition, unless otherwise indicated, an example material may be used independently and may be used in combination of 2 or more type. In addition, in the numerical range described step by step in this specification, the upper limit or lower limit of the numerical range of a predetermined step may be substituted with the upper limit or lower limit of the numerical range of another step. In addition, in the numerical range described in this specification, you may substitute the upper limit or lower limit of the numerical range with the value shown in an Example.

<First embodiment>

(Semiconductor device)

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows typically the semiconductor device which concerns on this embodiment. The semiconductor device 100 shown in this figure includes a substrate 10 , a chip T1 (first chip) disposed on the surface of the substrate 10 , and a chip T1 on the surface of the substrate 10 . a plurality of support pieces Dc disposed around the chip T1, a chip T2 (second chip) disposed above the chip T1, and the chip T2 and the plurality of support pieces Dc The adhesive piece Tc, the chips T3 and T4 laminated on the chip T2, and the electrodes (not shown) on the surface of the substrate 10 and the chips T1 to T4 are electrically connected to each other. A plurality of wires w and a sealing material 50 filled with a gap between the chip T1 and the chip T2 and the like are provided.

In the present embodiment, a plurality of support pieces Dc, a chip T2, and an adhesive piece Tc positioned between the support pieces Dc and the chip T2 are placed on the substrate 10 for dolmen structure is made up. The chip T1 is separated from the adhesive piece Tc. By appropriately setting the thickness of the support piece Dc, a space for the wire w connecting the upper surface of the chip T1 and the substrate 10 can be secured. Since the chip T1 is spaced apart from the adhesive piece Tc, it is possible to prevent a short circuit of the wire w due to the upper portion of the wire w connected to the chip T1 coming into contact with the chip T2. Further, since there is no need to embed a wire in the adhesive piece Tc in contact with the chip T2, there is an advantage that the adhesive piece Tc can be made thin.

As shown in FIG. 1 , the adhesive piece Tc between the chip T1 and the chip T2 covers the region R of the chip T2 that faces the chip T1 and is a region It extends continuously from (R) to the peripheral edge side of the chip (T2). That is, one adhesive piece Tc is interposed between the chip T2 and a plurality of support pieces while covering the region R of the chip T2 to adhere them. In addition, in FIG. 1, the aspect provided so that the adhesive bond piece Tc might cover the whole of one surface (lower surface) of the chip|tip T2 was shown. However, since the adhesive piece Tc may shrink in the manufacturing process of the semiconductor device 100, it may cover substantially the whole of one side (lower surface) of the chip T2, for example For example, there may be a portion not covered with the adhesive piece Tc in a part of the peripheral edge of the chip T2. The lower surface of the chip T2 in Fig. 1 corresponds to the rear surface of the chip. The back surface of a recent chip|tip often has the unevenness|corrugation formed. By covering substantially the entire back surface of the chip T2 with the adhesive piece Tc, it is possible to suppress the occurrence of cracks or cracks in the chip T2.

The substrate 10 may be an organic substrate or a metal substrate such as a lead frame. From the viewpoint of suppressing warpage of the semiconductor device 100 , the thickness of the substrate 10 is, for example, 90 to 300 µm, and may be 90 to 210 µm.

The chip T1 is, for example, a controller chip, is adhered to the substrate 10 with an adhesive piece T1c, and is electrically connected to the substrate 10 with a wire w. The shape of the chip T1 in plan view is, for example, a quadrangle (square or rectangle). The length of one side of the chip T1 is, for example, 5 mm or less, and may be 2 to 5 mm or 1 to 5 mm. The thickness of the chip T1 is, for example, 10 to 150 µm, and may be 20 to 100 µm.

The chip T2 is, for example, a memory chip, and is adhered on the support piece Dc via an adhesive piece Tc. The chip T2 has a larger size than the chip T1 in plan view. The shape of the chip T2 in plan view is, for example, a quadrangle (square or rectangle). The length of one side of the chip T2 is, for example, 20 mm or less, and may be 4 to 20 mm or 4 to 12 mm. The thickness of the chip T2 is, for example, 10 to 170 µm, and may be 20 to 120 µm. Further, the chips T3 and T4 are, for example, memory chips, and are adhered on the chip T2 via an adhesive piece Tc. The length of one side of the chips T3 and T4 may be the same as that of the chip T2 , and the thickness of the chips T3 and T4 may also be the same as that of the chip T2 .

The support piece Dc serves as a spacer that forms a space around the chip T1. The support piece Dc is comprised by the two adhesive bond pieces 5c and the resin piece 6p clamped by these. The adhesive piece 5c consists of a hardened|cured material of a thermosetting resin composition (adhesive piece 5p). The resin piece 6p is made of a resin (for example, polyimide) having a tensile modulus of 8.0 MPa or more. The resin piece 6p is made of a material different from the adhesive piece 5c. When the support piece Dc has a plurality of layers made of different materials, functions can be shared on each layer, and the support piece can be improved in functionality as compared with the case where the support piece Dc has a plurality of layers made of the same material.

In addition, as shown in FIG.2(a), two support pieces Dc (shape: rectangle) may be arrange|positioned at the position where both sides of the chip|tip T1 are separated, and, as shown in FIG.2(b), Similarly, one support piece Dc (shape: square, total of four) may be arrange|positioned at the position corresponding to the edge of the chip|tip T1, respectively. The length of one side of the support piece Dc in a planar view is 20 mm or less, for example, and 1-20 mm or 1-12 mm may be sufficient as it. The thickness (height) of the support piece Dc is, for example, 10-180 µm, and may be 20-120 µm.

The ratio of the sum of the thicknesses of the two adhesive pieces 5c and 5c to the thickness of the support piece Dc is preferably 0.1 to 0.9, more preferably 0.2 to 0.8, still more preferably 0.2 to 0.7. . When this ratio is 0.1 or more, the role (for example, support of the chip|tip T2 and position shift prevention of the resin piece 6p) of the adhesive bond piece 5c can be made further higher. On the other hand, when the ratio is 0.9 or less, since the resin piece 6p has a sufficient thickness, the resin piece 6p acts like a spring plate, so that better pick-up properties can be achieved (Fig. 5(d)). ) Reference). From these viewpoints, the thickness of the resin piece 6p is, for example, 10-80 micrometers, and 20-60 micrometers may be sufficient as it. The thickness of the adhesive piece 5c (one layer) is 5-120 micrometers, for example, and 10-60 micrometers may be sufficient as it.

(Manufacturing method of support piece)

An example of the manufacturing method of a support piece is demonstrated. In addition, the support piece Dc shown in FIG. 1 is a thing after the adhesive bond piece (thermosetting resin composition) contained in this is hardened|cured. On the other hand, the support piece Da is in a state before the adhesive piece (thermosetting resin composition) contained in this is completely hardened (for example, refer FIG.5(b)).

First, the laminated|multilayer film 20 for support piece formation shown to FIG.3(a) and FIG.3(b) (Hereinafter, it is called "laminated film 20" in some cases.) is prepared. The laminated|multilayer film 20 is equipped with the base film 1, the adhesion layer 2, and the film D for support piece formation. The base film 1 is a polyethylene terephthalate film (PET film), for example. The adhesive layer 2 is formed circularly by punching etc. (refer FIG.3(a)). The adhesive layer 2 consists of an ultraviolet curing adhesive. That is, the adhesive layer 2 has a property that the adhesiveness is lowered by irradiation with ultraviolet rays. The film D for support piece formation is formed circularly by punching etc., and has a smaller diameter than the adhesion layer 2 (refer FIG.3(a)). The film D for support piece formation is comprised by the two thermosetting resin layers 5 and the resin layer 6 clamped by these.

The thickness of the thermosetting resin layer 5 may be 5-180 micrometers, for example, and 10-170 micrometers or 15-160 micrometers may be sufficient as it. The thickness of the two thermosetting resin layers 5 may be the same or different. The resin layer 6 is a polyimide layer, for example. The thermosetting resin layer 5 consists of a thermosetting resin composition. The thermosetting resin composition can be in a fully cured product (C stage) state through a semi-cured (B-stage) state and subsequent curing treatment. A thermosetting resin composition contains an epoxy resin, a hardening|curing agent, and an elastomer (for example, an acrylic resin), and also contains an inorganic filler, a hardening accelerator, etc. as needed. The composition of the two thermosetting resin layers 5 may be the same or different. The detail of the thermosetting resin composition which comprises the thermosetting resin layer 5 is mentioned later.

The thickness of the resin layer 6 may be 5-100 micrometers, for example, and 10-90 micrometers or 20-80 micrometers may be sufficient as it. The tensile modulus of elasticity of the resin layer 6 is 8.0 MPa or more, and may be 9.0 MPa or more or 10.0 MPa or more. When the tensile modulus of elasticity of the resin layer 6 is 8.0 MPa or more, in the step of picking up the support piece Da (refer to FIG. 5(d) ), the resin piece 6p acts like a spring plate, Pick-up performance can be achieved. In addition, the upper limit of the tensile elasticity modulus of the resin layer 6 is about 15 Mpa from the point of the easiness of acquisition of a material. As a material which comprises the resin layer 6, polyimide and polyethylene terephthalate (PET) are mentioned, for example. The resin layer 6 may be a layer made of a thermosetting resin composition or a photocurable resin composition that has been cured so that the tensile modulus of elasticity is within the above range.

The laminated film 20 is, for example, the base film 1 and the 1st laminated|multilayer film which has the adhesive layer 2 on the surface, the cover film 3, and the film for support piece formation on the surface ( It is producible by bonding together the 2nd laminated|multilayer film which has D) (refer FIG. 4). A 1st laminated|multilayer film is obtained through the process of forming an adhesion layer by coating on the surface of the base film 1, and the process of processing an adhesion layer into a predetermined shape (for example, circular) by punching etc. . The 2nd laminated|multilayer film includes the process of forming the thermosetting resin layer 5 by coating on the surface of the cover film 3 (for example, PET film or a polyethylene film), The thermosetting resin layer 5 on the surface of The process of forming the resin layer 6, the process of forming the thermosetting resin layer 5 by coating on the surface of the resin layer 6, The film for support piece formation formed through these processes is predetermined|prescribed by punching etc. It is obtained through a process of processing into a shape (eg, a circle). In using the laminated film 20, the cover film 3 is peeled off at an appropriate timing.

As shown in FIG. 5( a ), a dicing ring DR is affixed to the laminated film 20 . That is, the dicing ring DR is affixed to the adhesion layer 2 of the laminated|multilayer film 20, and let the film D for support piece formation be arrange|positioned inside the dicing ring DR. The film (D) for support piece formation is diced into pieces (refer FIG.5(b)). Thereby, many support pieces Da are obtained from the film D for support piece formation. The support piece Da is constituted by two adhesive pieces 5p and a resin piece 6p sandwiched therebetween. Then, by irradiating an ultraviolet-ray with respect to the adhesive layer 2, the adhesive force between the adhesive layer 2 and the support piece Da is reduced. After ultraviolet irradiation, as shown in FIG.5(c), by expanding the base film 1, the support piece Da is mutually spaced apart. As shown in Fig. 5(d), the support piece Da is pushed up with the push-up jig 42 to peel the support piece Da from the adhesive layer 2, and with a suction collet 44 The support piece Da is picked up by suction. In addition, you may advance hardening reaction of a thermosetting resin by heating the film (D) for support piece formation before dicing, or the support piece Da before pickup. When picking up, the outstanding pick-up property can be achieved because the support piece Da is hardened|cured appropriately. It is preferable that the incision for fragmentation is formed up to the outer edge of the film (D) for support piece formation. The diameter of the film (D) for support piece formation may be 300-310 mm or 300-305 mm, for example. The shape in plan view of the film D for support piece formation is not limited to the circle shown to Fig.3 (a), A rectangle (square or rectangle) may be sufficient.

Preferably the ratio of the sum total of the thickness of the two thermosetting resin layers 5 and 5 with respect to the thickness of the film (D) for support piece formation is 0.1-0.9, More preferably, it is 0.2-0.8, More preferably, 0.2 to 0.7. When this ratio is 0.1 or more, as mentioned above, the role (for example, support of the chip|tip T2 and position shift prevention of the resin piece 6p) of the adhesive bond piece 5c can be made further higher. On the other hand, when the ratio is 0.9 or less, since the resin piece 6p has a sufficient thickness, the resin piece 6p acts like a spring plate, so that better pick-up properties can be achieved (Fig. 5(d)). ) Reference). From these viewpoints, the thickness of the resin layer 6 may be 10-80 micrometers, and 20-60 micrometers may be sufficient, for example. The thickness of the thermosetting resin layer 5 (one layer) is 5-120 micrometers, for example, and 10-60 micrometers may be sufficient as it.

(Method for manufacturing semiconductor device)

A method of manufacturing the semiconductor device 100 will be described. The manufacturing method which concerns on this embodiment includes the process of the following (A)-(H).

(A) The process of preparing the laminated|multilayer film 20 (refer FIG. 4)

(B) Step of forming a plurality of support pieces Da on the surface of the adhesive layer 2 by separating the film (D) for forming a support piece into pieces (refer to Fig. 5(b))

(C) Step of picking up the support piece Da from the pressure-sensitive adhesive layer 2 (see Fig. 5(d))

(D) A process of arranging the first chip T1 on the substrate 10 .

(E) A step of arranging a plurality of support pieces Da on the substrate 10 and around the first chip T1 (refer to FIG. 6 )

(F) A step of preparing a chip T2a with an adhesive piece T2a comprising a second chip T2 and an adhesive piece Ta provided on one surface of the second chip T2 (refer to FIG. 7 )

(G) Step of constructing a dolmen structure by arranging the chips T2a with adhesive pieces on the surfaces of the plurality of support pieces Dc (refer to Fig. 8)

(H) Step of sealing the gap between the chip T1 and the chip T2 with the sealing material 50 (refer to FIG. 1 )

(A)-(C) process is a process of producing the some support piece Da, It is as having already demonstrated. Steps (D) to (H) are processes for constructing a dolmen structure on the substrate 10 using a plurality of support pieces Da. Hereinafter, steps (D) to (H) will be described with reference to FIGS. 6 to 8 .

[(D) Process]

Step (D) is a step of disposing the first chip T1 on the substrate 10 . For example, first, the chip T1 is disposed at a predetermined position on the substrate 10 with the adhesive layer T1c interposed therebetween. Then, the chip T1 is electrically connected to the substrate 10 with a wire w. Step (D) may be a step performed before step (E), before step (A), between step (A) and step (B), between step (B) and step (C), or It may be between (C) process and (E) process.

[(E) process]

Step (E) is a step of disposing a plurality of support pieces Da on the substrate 10 and around the first chip T1 . Through this process, the structure 30 shown in FIG. 6 is produced. The structure 30 includes a substrate 10 , a chip T1 disposed on the surface thereof, and a plurality of support pieces Da. What is necessary is just to arrange|position the support piece Da by crimping|compression-bonding process. It is preferable to perform crimping|compression-bonding process over 0.5 to 3.0 second on the conditions of 80-180 degreeC and 0.01-0.50 MPa, for example. In addition, as for the support piece Da, the adhesive bond piece 5p contained in this may be fully hardened|cured at the time of the (E) process, and it may become the support piece Dc, and it does not need to be fully hardened at this point. The adhesive piece 5p contained in the support piece Da may be fully hardened|cured before the start of the (G) process, and may become the adhesive bond piece 5c.

[(F) Process]

Step (F) is a step of preparing the chip T2a with an adhesive piece shown in FIG. 7 . The chip|tip T2a with an adhesive bond piece is equipped with the chip|tip T2 and the adhesive bond piece Ta provided in the one surface. The chip T2a with an adhesive piece can be obtained through a dicing process and a pick-up process using, for example, a semiconductor wafer and a dicing die-bonding integrated film.

[(G) Process]

(G) Process is a process of arrange|positioning the chip|tip T2a with an adhesive bond piece above the chip|tip T1 so that the adhesive bond piece Ta may contact with the upper surface of the some support piece Dc. Specifically, the chip T2 is pressed onto the upper surface of the support piece Dc with the adhesive piece Ta interposed therebetween. It is preferable to implement this crimping|compression-bonding process over 0.5 to 3.0 second on the conditions of 80-180 degreeC and 0.01-0.50 MPa, for example. Next, the adhesive piece Ta is hardened by heating. It is preferable to perform this hardening process over 5 minutes or more on conditions of 60-175 degreeC and 0.01-1.0 MPa, for example. Thereby, the adhesive bond piece Ta is hardened|cured and it becomes the adhesive bond piece Tc. Through this process, a dolmen structure is constructed on the substrate 10 (refer to FIG. 8).

After the step (G) and before the step (H), the chip T3 is disposed on the chip T2 with an adhesive piece interposed therebetween, and the chip T4 is disposed on the chip T3 with the adhesive piece interposed therebetween. The adhesive piece may just be the same thermosetting resin composition as the above-mentioned adhesive piece Ta, and it will become the adhesive bond piece Tc by heat-hardening (refer FIG. 1). On the other hand, the chips T2 , T3 , and T4 and the substrate 10 are electrically connected to each other with wires w . In addition, the number of chips laminated|stacked above the chip|tip T1 is not limited to three of this embodiment, What is necessary is just to set suitably.

[(H) process]

Step (H) is a step of sealing the gap between the chip T1 and the chip T2 with the sealing material 50 . Through this process, the semiconductor device 100 shown in FIG. 1 is completed.

(thermosetting resin composition)

As mentioned above, the thermosetting resin composition which comprises the thermosetting resin layer 5 contains an epoxy resin, a hardening|curing agent, and an elastomer, and also contains an inorganic filler, a hardening accelerator, etc. as needed. According to examination by the present inventors, it is preferable that the support piece Da and the support piece Dc after hardening have the following characteristics.

Characteristic 1: When the support piece Da is thermocompression-bonded at a predetermined position on the substrate 10, position shift is unlikely to occur (melt viscosity of the adhesive piece 5p at 120°C is, for example, 4300 to 50000 Pa·s or 5000 to 40000 Pa·s)

Characteristic 2: The adhesive piece 5c exhibits stress relaxation properties in the semiconductor device 100 (the thermosetting resin composition contains an elastomer (rubber component))

Characteristic 3: The adhesive strength of the chip with the adhesive piece with the adhesive piece Tc is sufficiently high (the die shear strength of the adhesive piece 5c with respect to the adhesive piece Tc is, for example, 2.0 to 7.0 Mpa or 3.0~6.0Mpa)

Characteristic 4: Shrinkage rate due to curing is sufficiently small

-Characteristic 5: Good visibility of the support piece Da by a camera in a pick-up process (The thermosetting resin composition contains a coloring agent, for example)

Characteristic 6: The adhesive piece 5c has sufficient mechanical strength

[Epoxy Resin]

The epoxy resin is not particularly limited as long as it is cured and has an adhesive action. Bifunctional epoxy resins, such as a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, and a bisphenol S type epoxy resin, a novolak type epoxy resin, such as a phenol novolak type epoxy resin, and a cresol novolak type epoxy resin, etc. can be used. Moreover, a generally known thing, such as a polyfunctional epoxy resin, a glycidylamine type epoxy resin, a heterocyclic-containing epoxy resin, or an alicyclic epoxy resin, is applicable. These may be used individually by 1 type, and may use 2 or more types together.

[hardener]

As a hardening|curing agent, a phenol resin, an ester compound, an aromatic amine, an aliphatic amine, and an acid anhydride are mentioned, for example. Among these, a phenol resin is preferable from a viewpoint of achieving high die shear strength. As a commercial item of a phenol resin, For example, DIC Co., Ltd. product LF-4871 (trade name, BPA novolak type phenol resin), Air Water Co., Ltd. product HE-100C-30 (trade name, phenyl aralkyl type phenol) resin), DIC Co., Ltd. Phenolite KA and TD series, Mitsui Chemicals Co., Ltd. Milex XLC-series and XL series (eg, Milex XLC-LL), Air Water Co., Ltd. HE series (for example, HE100C-30) made by Meiwa Kasei Co., Ltd. MEHC-7800 series (for example, MEHC-7800-4S), and JDPP series made by JEF Chemicals Co., Ltd. are mentioned. . These may be used individually by 1 type, and may use 2 or more types together.

From the viewpoint of achieving high die shear strength, the compounding amount of the epoxy resin and the phenol resin is preferably 0.6 to 1.5, more preferably 0.7 to 1.4, and 0.8 to 1.3, respectively, of the equivalent ratio of the epoxy equivalent and the hydroxyl equivalent. more preferably. When a compounding ratio is in the said range, it is easy to achieve both sclerosis|hardenability and fluidity|liquidity at a sufficiently high level.

[Elastomer]

As the elastomer, for example, acrylic resin, polyester resin, polyamide resin, polyimide resin, silicone resin, polybutadiene, acrylonitrile, epoxy-modified polybutadiene, maleic anhydride-modified polybutadiene , phenol-modified polybutadiene, and carboxy-modified acrylonitrile.

From the viewpoint of achieving high die shear strength, an acrylic resin is preferable as the elastomer, and a functional monomer having an epoxy group or a glycidyl group such as glycidyl acrylate or glycidyl methacrylate as a crosslinkable functional group is polymerized. Acrylic resins, such as an epoxy-group containing (meth)acrylic copolymer obtained by making it, are more preferable. Among the acrylic resins, an epoxy group-containing (meth)acrylic acid ester copolymer and an epoxy group-containing acrylic rubber are preferable, and an epoxy group-containing acrylic rubber is more preferable. The epoxy group-containing acrylic rubber has an acrylic acid ester as a main component, and is mainly composed of a copolymer such as butyl acrylate and acrylonitrile, a copolymer such as ethyl acrylate and acrylonitrile, and the like, and is a rubber having an epoxy group. Moreover, acrylic resin may have crosslinkable functional groups, such as not only an epoxy group but alcoholic or phenolic hydroxyl group, and a carboxyl group.

Examples of commercially available acrylic resins include SG-70L, SG-708-6, WS-023 EK30, SG-280 EK23, SG-P3 solvent-modified products manufactured by Nagase Chemtech Co., Ltd. (trade name, acrylic rubber, weight average molecular weight: 80 However, Tg: 12 degreeC, the solvent is cyclohexanone) etc. are mentioned.

It is preferable that it is -50-50 degreeC, and, as for the glass transition temperature (Tg) of an acrylic resin, it is more preferable that it is -30-30 degreeC from a viewpoint of achieving high die shear strength. From a viewpoint of achieving high die shear strength, it is preferable that it is 100,000-3 million, and, as for the weight average molecular weight (Mw) of an acrylic resin, it is more preferable that it is 500,000-2 million. Here, Mw means the value measured by gel permeation chromatography (GPC) and converted using the calibration curve by standard polystyrene. Moreover, there exists a tendency which can form a highly elastic adhesive bond piece by using an acrylic resin with a narrow molecular weight distribution.

The amount of the acrylic resin contained in the thermosetting resin composition is preferably 10 to 200 parts by mass, more preferably 20 to 100 parts by mass, based on 100 parts by mass in total of the epoxy resin and the epoxy resin curing agent, from the viewpoint of achieving high die shear strength. desirable.

[Inorganic Filler]

As the inorganic filler, for example, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whisker, boron nitride and crystalline silica, non Qualitative silica etc. are mentioned. These may be used individually by 1 type, and may use 2 or more types together.

From a viewpoint of achieving high die shear strength, 0.005 micrometers - 1.0 micrometers are preferable, and, as for the average particle diameter of an inorganic filler, 0.05-0.5 micrometers are more preferable. It is preferable that the surface of an inorganic filler is chemically modified from a viewpoint of achieving high die shear strength. As a material for chemically modifying the surface, a silane coupling agent is exemplified. As a kind of functional group of a silane coupling agent, a vinyl group, an acryloyl group, an epoxy group, a mercapto group, an amino group, a diamino group, an alkoxy group, and an ethoxy group are mentioned, for example.

It is preferable that it is 20-200 mass parts, and, as for content of an inorganic filler, it is more preferable that it is 30-100 mass parts with respect to 100 mass parts of resin components of a thermosetting resin composition from a viewpoint of achieving high die shear strength.

[curing accelerator]

Examples of the curing accelerator include imidazoles and derivatives thereof, organophosphorus compounds, secondary amines, tertiary amines, and quaternary ammonium salts. From the viewpoint of achieving high dicer strength, an imidazole-based compound is preferable. Examples of the imidazoles include 2-methylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, and the like. can be heard These may be used individually by 1 type, and may use 2 or more types together.

The content of the curing accelerator in the thermosetting resin composition is preferably 0.04 to 3 parts by mass, more preferably 0.04 to 0.2 parts by mass relative to 100 parts by mass in total of the epoxy resin and the epoxy resin curing agent from the viewpoint of achieving high die shear strength. do.

<Second embodiment>

9 is a cross-sectional view schematically showing a semiconductor device according to a second embodiment. In the semiconductor device 100 according to the first embodiment, the chip T1 is separated from the adhesive piece Tc, whereas in the semiconductor device 200 according to the present embodiment, the chip T1 is the adhesive piece ( Tc) is in contact. That is, the adhesive piece Tc is in contact with the upper surface of the chip T1 and the upper surface of the support piece Dc. For example, by setting the thickness of the film D for support piece formation suitably, the position of the upper surface of the chip|tip T1 and the position of the upper surface of the support piece Dc can be made to match.

In the semiconductor device 200 , the chip T1 is flip-chip connected to the substrate 10 rather than by wire bonding. In addition, when the wire w is embedded in the adhesive piece Ta, even in an embodiment in which the chip T1 is wire-bonded to the substrate 10, the chip T1 is in contact with the adhesive piece Tc. can The adhesive piece Ta together with the chip|tip T2 constitutes the chip|tip T2a with an adhesive bond piece (refer FIG. 8).

As shown in FIG. 9 , the adhesive piece Tc between the chip T1 and the chip T2 covers the region R of the chip T2 that faces the chip T1 and is a region It extends continuously from (R) to the peripheral edge side of the chip (T2). This single adhesive piece Tc is interposed between the chip T2 and the plurality of support pieces while covering the region R of the chip T2 to adhere them. The lower surface of the chip T2 in Fig. 9 corresponds to the rear surface. As described above, the back surface of recent chips is often formed with concavities and convexities. Since substantially the entire back surface of the chip T2 is covered with the adhesive piece Tc, cracks or cracks can be suppressed from occurring in the chip T2 even when the upper surface of the chip T1 is in contact with the adhesive piece Tc. have.

As mentioned above, although preferred embodiment of this indication was described in detail, this invention is not limited to the said embodiment. For example, in the said embodiment, although the laminated|multilayer film 20 which has the adhesive layer 2 of an ultraviolet curing type were illustrated, the pressure-sensitive adhesive layer 2 may be sufficient.

In the said embodiment, although the laminated|multilayer film 20 for support piece formation provided with the film D for support piece formation of a three-layer structure was illustrated as shown to FIG.3(b), lamination|stacking for support piece formation was illustrated. Two layers may be sufficient as a film, and four or more layers may be sufficient as it. The laminated|multilayer film 20A for support piece formation shown in FIG. 10 has the thermosetting resin layer 5 and the two-layer film D2 (film for support piece formation) which has the resin layer 6 . That is, in 20 A of laminated|multilayer film for support piece formation, the thermosetting resin layer 5 is arrange|positioned between the adhesion layer 2 and the resin layer 6 of an outermost surface.

The ratio of the thickness of the thermosetting resin layer 5 with respect to the thickness of the two-layer film D2 becomes like this. Preferably it is 0.1-0.8, More preferably, it is 0.2-0.7, More preferably, it is 0.2-0.6. When this ratio is 0.1 or more, the role of the adhesive bond pieces 5p and 5c (for example, support of the chip|tip T2 and position shift prevention of the resin piece 6p) can be made further higher. On the other hand, when the ratio is 0.8 or less, since the resin piece 6p has a sufficient thickness, the resin piece 6p acts like a spring plate, so that more excellent pickup properties can be achieved (Fig. 5(d)). ) Reference). From these viewpoints, the thickness of the resin layer 6 is, for example, 20 to 80 µm, and may be 20 to 60 µm. The thickness of the thermosetting resin layer 5 is 5-120 micrometers, for example, and 10-60 micrometers may be sufficient as it.

In addition, in the laminated|multilayer film 20 and 20A for support piece formation, instead of the resin layer 6, you may employ|adopt a metal layer (for example, a copper layer or an aluminum layer) of 8.0 Mpa or more of tensile elasticity modulus. The thickness of the metal layer is, for example, 5 to 100 µm, and may be 10 to 90 µm or 20 to 80 µm. When the laminated film 20, 20A for support piece formation contains the metal layer, in addition to the outstanding pick-up property, the outstanding visibility of the support piece can be achieved in a pick-up process by the optical contrast of a resin material and a metal material.

20 A of laminated|multilayer film for support piece formation can be manufactured through the following processes, for example.

- Process of preparing laminated|multilayer film provided with the base film 1, the adhesion layer 2, and the thermosetting resin layer 5 in this order

- The process of bonding the resin layer 6 together on the surface of the said laminated|multilayer film

Example

Hereinafter, although an Example demonstrates this indication, this invention is not limited to these Examples.

(Preparation of varnish A)

The varnish A for forming the thermosetting resin layer of the film for support piece formation was prepared using the following materials.

・Epoxy resin 1: YDCN-700-10: (trade name, manufactured by Shin-Nittetsu Sumikin Chemical Co., Ltd., cresol novolak-type epoxy resin, solid at 25°C) 5.4 parts by mass

・Epoxy resin 2: YDF-8170C: (trade name, manufactured by Shin-Nittetsu Sumikin Chemical Co., Ltd., liquid bisphenol F-type epoxy resin, liquid at 25°C) 16.2 parts by mass

·Phenolic resin (curing agent): LF-4871: (trade name, manufactured by DIC Corporation, BPA novolak-type phenolic resin) 13.3 parts by mass

·Inorganic filler: SC2050-HLG: (trade name, manufactured by Admatex Co., Ltd., silica filler dispersion, average particle diameter 0.50 μm) 49.8 parts by mass

・Elastomer: SG-P3 solvent modified product (trade name, manufactured by Nagase Chemtex Co., Ltd., acrylic rubber, weight average molecular weight: 800,000, Tg: 12°C, solvent: cyclohexanone) 14.9 parts by mass

Coupling agent 1: A-189: (trade name, GE Toshiba Co., Ltd. product, γ-mercaptopropyl trimethoxysilane) 0.1 parts by mass

Coupling agent 2: A-1160: (trade name, manufactured by GE Toshiba Co., Ltd., γ-ureidopropyltriethoxysilane) 0.3 parts by mass

- Hardening accelerator: Qazole 2PZ-CN: (trade name, Shikoku Kasei Kogyo Co., Ltd. product, 1-cyanoethyl-2-phenylimidazole) 0.05 mass part

·Solvent: cyclohexane

(Preparation of varnish B)

The varnish B for forming the thermosetting resin layer of the film for support piece formation was prepared using the following materials.

・Epoxy resin: YDCN-700-10: (trade name, manufactured by Shin-Nittetsu Sumikin Chemical Co., Ltd., cresol novolak-type epoxy resin, solid at 25°C) 13.2 parts by mass

・Phenolic resin (curing agent): HE-100C-30: (trade name, manufactured by Air Water Co., Ltd., phenyl aralkyl type phenol resin) 11.0 parts by mass

·Inorganic filler: Aerosil R972: (trade name, manufactured by Nippon Aerosil Co., Ltd., silica, average particle diameter 0.016 µm) 7.8 parts by mass

・Elastomer: SG-P3 solvent modified product (trade name, manufactured by Nagase Chemtex Co., Ltd., acrylic rubber, weight average molecular weight: 800,000, Tg: 12°C, solvent is cyclohexanone) 66.4 parts by mass

-Coupling agent 1: A-189: (trade name, GE Toshiba Co., Ltd. product, gamma-mercaptopropyl trimethoxysilane) 0.4 mass part

Coupling agent 2: A-1160: (trade name, GE Toshiba Co., Ltd. product, γ-ureidopropyltriethoxysilane) 1.15 parts by mass

-Cure accelerator: Qazole 2PZ-CN: (trade name, Shikoku Kasei Kogyo Co., Ltd. product, 1-cyanoethyl-2-phenylimidazole) 0.03 mass part

·Solvent: cyclohexane

<Example 1>

As mentioned above, cyclohexanone was used as a solvent, and it adjusted so that the solid content ratio of the varnish A might be set to 40 mass %. The varnish A was filtered and vacuum defoamed with a 100-mesh filter. As a film to which the varnish A is apply|coated, the polyethylene terephthalate (PET) film (38 micrometers in thickness) to which the mold release process was given was prepared. The varnish A after vacuum defoaming was apply|coated on the surface to which the release process of PET film was given. The apply|coated varnish A was heat-dried at 90 degreeC for 5 minutes, then, at 140 degreeC for 5 minutes, two steps. In this way, the thermosetting resin layer of the B-stage state (semi-cured state) was formed on the surface of the PET film. By affixing a polyimide film (thickness: 25 µm, tensile modulus: 46.4 MPa) to the surface of the thermosetting resin layer on a hot plate at 70°C, a film for forming a support piece having the same configuration as the two-layer film (D2) shown in FIG. It produced on the surface of a PET film.

A laminated film (dicing tape) having an ultraviolet curing adhesive layer was produced in the following procedure. First, 83 parts by mass of 2-ethylhexyl acrylate, 15 parts by mass of 2-hydroxyethyl acrylate, and 2 parts by mass of methacrylic acid were used as raw materials, and ethyl acetate was used as a solvent to obtain a copolymer by solution radical polymerization. With respect to this acrylic copolymer, 12 mass parts of 2-methacryloyloxyethyl isocyanate was made to react, and the ultraviolet irradiation type acrylic copolymer which has a carbon-carbon double bond was synthesize|combined. In said reaction, 0.05 part of hydroquinone monomethyl ether was used as a polymerization inhibitor. When the weight average molecular weight of the synthesize|combined acrylic copolymer was measured by GPC, it was 300,000-700,000. The acrylic copolymer thus obtained, 2.0 parts in terms of solid content of a polyisocyanate compound (manufactured by Nippon Polyurethane Co., Ltd., trade name: Coronate L) as a curing agent, and 1-hydroxycyclo as a photopolymerization initiator 0.5 parts of hexylphenyl ketones were mixed, and the ultraviolet irradiation type adhesive solution was prepared. This ultraviolet irradiation type adhesive solution was apply|coated and dried so that the thickness after drying might be set to 10 micrometers on the polyethylene terephthalate peeling film (thickness: 38 micrometers). Then, the polyolefin film (thickness: 90 micrometers) to which the corona discharge process was given to the adhesive layer was pasted together. The obtained laminated|multilayer film was aged in a 40 degreeC thermostat for 72 hours, and the dicing tape was produced.

A film for forming a support piece (a two-layer film of a thermosetting resin layer and a polyimide film) is placed on the pressure-sensitive adhesive layer of the dicing tape, and the side having the thermosetting resin layer of the film for forming a support piece is opposite to the pressure-sensitive adhesive layer at 70° C. It was bonded together using a rubber roll on the hot plate of Thereby, the laminated body of the film for support piece formation and a dicing tape was obtained. The thickness of the thermosetting resin layer was 25 µm.

<Example 2>

Except having used the varnish B instead of the varnish A, it carried out similarly to Example 1, and obtained the laminated body of the film for support piece formation, and a dicing tape.

<Comparative Examples 1 and 2>

Comparative Example 1 and Comparative Example 1 and Example 2 except that the thickness of the thermosetting resin layer was 50 µm instead of 25 µm, and the polyimide film was not affixed on the surface of the thermosetting resin layer. A laminate according to Comparative Example 2 was obtained.

The following evaluation was performed about the film for support piece formation of an Example and a comparative example.

(1) Peel strength

The laminated body containing the film for support piece formation which concerns on an Example and a comparative example was cut to the length of 25 mm in width and 100 mm in length, respectively, and the test piece was produced. Then, the ultraviolet-ray was irradiated from the dicing tape side on the conditions of 80 mW/cm<^2> , 200mJ/cm<^{2> with a halogen lamp.} The peeling strength (peel angle: 180 degrees, peeling speed: 300 mm/min) of the interface of the adhesion layer of ultraviolet irradiation and the film for support piece formation was measured. For each Example and each comparative example, the measurement is performed 3 times, and the average value is shown below.

・Example 1… 0.04N/25mm

・Example 2… 0.05N/25mm

・Comparative example 1... 0.09N/25mm

・Comparative example 2... 0.05N/25mm

(2) Pick-up

A laminate of the film for forming a support piece (shape: circular with a diameter of 320 mm) according to an Example and a comparative example and the dicing tape (shape: circular with a diameter of 335 mm) was prepared. The dicing ring was laminated on the dicing tape of this laminated body on condition of 70 degreeC. The film for support piece formation was divided into pieces on condition of 55 micrometers in height using the dicer. Thereby, the size obtained the support piece of 10 mm x 10 mm. It irradiated with the ultraviolet-ray from the dicing tape side on the conditions of ^{80 mW/cm<2>} , 200mJ/cm<^{2> with} a halogen lamp toward the adhesion layer of a support piece. Then, the support piece was picked up in the state expanded with the die bonder (expand amount: 3 mm). A three-stage push-up stage was used as a push-up jig|tool, and the conditions were made into 10 mm/sec of a push-up speed|rate, and 1200 micrometers of a push-up height. For each example and each comparative example, pick-up was attempted with respect to 6 support pieces. As a result, all of the six support pieces were able to be picked up about Examples 1 and 2. On the other hand, about the comparative examples 1 and 2, the pick-up piece was two or less among the six support pieces.

Industrial Applicability

ADVANTAGE OF THE INVENTION According to this indication, while being able to simplify the process of manufacturing a support piece in the manufacturing process of the semiconductor device which has a dolmen structure, the manufacturing method of the semiconductor device which can achieve the outstanding pick-up property of a support piece is provided. Moreover, according to this indication, the semiconductor device which has a dolmen structure, the laminated|multilayer film for support piece formation, and its manufacturing method are provided.

One… base film
2… adhesive layer
5… thermosetting resin layer
5c… Adhesive piece (hardened product)
5p… adhesive piece
6… resin layer
6p… resin piece
10… Board
20, 20A… Laminated film for forming a support piece
50… sealant
100, 200… semiconductor device
D… Film for forming support piece
D2… Two-layer film (film for forming a support piece)
Da, Dc… support
R… area
T1… first chip
T2… second chip
T2a… Chip with adhesive piece
Ta, Tc... adhesive piece

Claims (20)

a substrate, a first chip disposed on the substrate, a plurality of support pieces on the substrate and disposed around the first chip, supported by the plurality of support pieces and covering the first chip A method of manufacturing a semiconductor device having a dolmen structure including a second chip disposed thereon, the method comprising:
(A) The process of preparing the laminated|multilayer film provided with a base film, an adhesion layer, and the film for support piece formation in this order;
(B) the step of forming a plurality of support pieces on the surface of the pressure-sensitive adhesive layer by separating the film for forming the support pieces into pieces;
(C) picking up the support piece from the adhesive layer;
(D) disposing the first chip on the substrate;
(E) disposing a plurality of the support pieces on the substrate and around the first chip or around a region where the first chip is to be disposed;
(F) a step of preparing a chip with an adhesive piece comprising a second chip and an adhesive piece provided on one surface of the second chip;
(G) a step of constructing a dolmen structure by arranging the chip with the adhesive piece on the surfaces of the plurality of support pieces;
The method for manufacturing a semiconductor device, wherein the film for forming a support piece has a multilayer structure including at least a resin layer having a tensile modulus of 8.0 MPa or more. The method according to claim 1,
The adhesive layer is UV-curable,
The manufacturing method of a semiconductor device including the process of irradiating an ultraviolet-ray to the said adhesion layer between (B) process and (C) process. The method according to claim 1 or 2,
The film for forming the support piece includes a thermosetting resin layer,
(G) The manufacturing method of a semiconductor device including the process of heating the said support piece formation film or the said support piece before a process. board and
a first chip disposed on the substrate;
a plurality of support pieces on the substrate and disposed around the first chip;
has a dolmen structure supported by the plurality of support pieces and including a second chip disposed to cover the first chip,
The semiconductor device wherein the support piece has a multilayer structure including at least a resin piece having a tensile modulus of 8.0 MPa or more. 5. The method according to claim 4,
The support piece includes the resin piece and an adhesive piece provided on one surface of the resin piece,
The semiconductor device, wherein the resin piece is composed of a material different from that of the adhesive piece. 5. The method according to claim 4,
The support piece includes a three-layer structure of the resin piece and a pair of adhesive pieces holding the resin piece,
The semiconductor device, wherein the resin piece is made of a material different from that of the pair of adhesive pieces. 7. The method of claim 6,
The ratio of the sum of the thickness of the said adhesive bond piece with respect to the thickness of the said three-layer structure is 0.1-0.9. 8. The method according to any one of claims 4 to 7,
an adhesive piece provided so as to at least cover a region of the second chip facing the first chip;
The semiconductor device wherein the first chip is separated from the adhesive piece. 9. The method of claim 8,
The adhesive piece extends continuously from the region of the second chip to a peripheral edge side of the second chip and is sandwiched by the second chip and the plurality of support pieces. 8. The method according to any one of claims 4 to 7,
an adhesive piece provided so as to at least cover a region of the second chip facing the first chip;
The semiconductor device, wherein the first chip is in contact with the adhesive piece. 10. The method of claim 9,
The adhesive piece extends continuously from the region of the second chip to a peripheral edge side of the second chip and is sandwiched by the second chip and the plurality of support pieces. a substrate, a first chip disposed on the substrate, a plurality of support pieces on the substrate and disposed around the first chip, supported by the plurality of support pieces and covering the first chip A laminated film for forming a support piece used in a manufacturing process of a semiconductor device having a dolmen structure including an disposed second chip, comprising:
a base film;
adhesive layer,
A film for forming a support piece is provided in this order,
The laminated film for support piece formation in which the said film for support piece formation has a multilayer structure containing at least the resin layer of 8.0 MPa or more of tensile elasticity modulus. 13. The method of claim 12,
The laminated|multilayer film for support piece formation whose said resin layer is a polyimide layer. 14. The method of claim 12 or 13,
The thickness of the film for forming a support piece is 5-180 μm, the laminated film for forming a support piece. 15. The method according to any one of claims 12 to 14,
The laminated film for forming a support piece, wherein the pressure-sensitive adhesive layer is a pressure-sensitive or UV-curable type. 16. The method according to any one of claims 12 to 15,
The film for forming the support piece includes a thermosetting resin layer,
The laminated film for support piece formation in which the said thermosetting resin layer is comprised by the material different from the said resin layer. 17. The method of claim 16,
The laminated|multilayer film for support piece formation in which the said thermosetting resin layer contains an epoxy resin. 18. The method of claim 16 or 17,
The laminated film for support piece formation in which the said thermosetting resin layer contains an elastomer. a substrate, a first chip disposed on the substrate, a plurality of support pieces on the substrate and disposed around the first chip, supported by the plurality of support pieces and covering the first chip A method for manufacturing a laminated film for forming a support piece used in a manufacturing process of a semiconductor device having a dolmen structure including an arranged second chip, the method comprising:
The process of preparing the adhesive film which has a base film and the adhesive layer formed on the one surface;
and laminating a film for forming a support piece on the surface of the adhesive layer,
The manufacturing method of the laminated|multilayer film for support piece formation in which the said film for support piece formation has a multilayer structure containing at least the resin layer of 8.0 Mpa or more of tensile elasticity modulus. a substrate, a first chip disposed on the substrate, a plurality of support pieces on the substrate and disposed around the first chip, supported by the plurality of support pieces and covering the first chip A method for manufacturing a laminated film for forming a support piece used in a manufacturing process of a semiconductor device having a dolmen structure including an arranged second chip, the method comprising:
A step of preparing a laminated film comprising a base film, an adhesion layer, and a thermosetting resin layer in this order;
The manufacturing method of the laminated|multilayer film for support piece formation including the process of bonding together the resin layer of 8.0 Mpa or more of tensile elasticity modulus on the surface of the said thermosetting resin layer.

Images