JP2016213227A - 電界効果トランジスタ - Google Patents
電界効果トランジスタ Download PDFInfo
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- 230000005669 field effect Effects 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 69
- 239000004065 semiconductor Substances 0.000 claims abstract description 29
- 229910002704 AlGaN Inorganic materials 0.000 claims description 4
- 230000006866 deterioration Effects 0.000 abstract description 8
- 230000003071 parasitic effect Effects 0.000 description 16
- 230000000694 effects Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000004904 shortening Methods 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000002109 crystal growth method Methods 0.000 description 1
- 230000005685 electric field effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000005533 two-dimensional electron gas Effects 0.000 description 1
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Abstract
Description
図1は、本発明の実施の形態1に係る電界効果トランジスタを示す平面図である。図2は、本発明の実施の形態1に係る電界効果トランジスタを示す断面図である。半導体基板1は、高抵抗Si基板2とその上に順に成長されたGaN系バッファ層3、GaN層4、及びAlGaN層5とを有する。
図6は、本発明の実施の形態2に係る電界効果トランジスタを示す平面図である。複数のゲート電極8とショットキー電極13が導体17を介して電気的に接続されている。これにより、ドレイン領域12と半導体基板1との間に生ずる寄生容量の低減効果は実施の形態1よりも小さくなるが、ショットキー電極13の電圧制御を実施の形態1のように別の電源電圧で行うことを要しない。RF動作の際に印加されるゲート電極8へのゲート電圧がショットキー電極13にも印加されるため、2DEGチャネル層の電子濃度は空乏層による変調を受けて、ショットキー電極13を形成しない場合よりも寄生容量を低減することができる。
図7は、本発明の実施の形態3に係る電界効果トランジスタを示す平面図である。共通パッド18が複数のゲート電極8及びショットキー電極13に電気的に接続されている。第1の抵抗19aが複数のゲート電極8と共通パッド18の間に接続されている。第2の抵抗19bがショットキー電極13と共通パッド18の間に接続されている。
Claims (8)
- 主面を有する半導体基板と、
前記半導体基板の前記主面にオーミック接合され、互いに交互に配置された複数のソース電極及び複数のドレイン電極と、
前記半導体基板の前記主面にショットキー接合され、前記複数のソース電極と前記複数のドレイン電極の間にそれぞれ配置された複数のゲート電極と、
前記半導体基板の前記主面にショットキー接合されたショットキー電極とを備え、
前記複数のドレイン電極の各々は、互いに分割された第1及び第2の部分を有し、
前記ドレイン電極の前記第1及び第2の部分の合計電極幅は一本の前記ソース電極の幅よりも狭く、
前記ショットキー電極が前記ドレイン電極の前記第1の部分と前記第2の部分の間に配置されていることを特徴とする電界効果トランジスタ。 - 前記ショットキー電極に電気的に接続されたパッドを更に備え、
前記ショットキー電極は前記複数のゲート電極に電気的に接続されていないことを特徴とする請求項1に記載の電界効果トランジスタ。 - 前記ショットキー電極は前記複数のゲート電極に電気的に接続されていることを特徴とする請求項1に記載の電界効果トランジスタ。
- 前記複数のゲート電極及び前記ショットキー電極に電気的に接続された共通パッドと、
前記複数のゲート電極と前記共通パッドの間に接続された第1の抵抗と、
前記ショットキー電極と前記共通パッドの間に接続された第2の抵抗とを更に備えることを特徴とする請求項3に記載の電界効果トランジスタ。 - 前記ドレイン電極上に設けられ、前記ショットキー電極の上方に張り出した庇状となっている電極層を更に備えることを特徴とする請求項1〜4の何れか1項に記載の電界効果トランジスタ。
- 前記ドレイン電極上に設けられ、前記半導体基板及び前記ショットキー電極に接触することなく中空で前記第1及び第2の部分に接続されたエアブリッジ構造となっている電極層を更に備えることを特徴とする請求項1〜4の何れか1項に記載の電界効果トランジスタ。
- 前記半導体基板はSi基板と前記Si基板上に成長されたGaN系エピタキシャル層を有することを特徴とする請求項1〜6の何れか1項に記載の電界効果トランジスタ。
- 前記GaN系エピタキシャル層はAlGaN/GaNHEMT構造を有することを特徴とする請求項7に記載の電界効果トランジスタ。
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JP2015092654A JP6299665B2 (ja) | 2015-04-30 | 2015-04-30 | 電界効果トランジスタ |
US15/002,748 US9716185B2 (en) | 2015-04-30 | 2016-01-21 | Field effect transistor |
DE102016207054.1A DE102016207054B4 (de) | 2015-04-30 | 2016-04-26 | Feldeffekttransistor |
CN201610281369.3A CN106098757B (zh) | 2015-04-30 | 2016-04-29 | 场效应晶体管 |
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JP2020098839A (ja) * | 2018-12-17 | 2020-06-25 | 信越半導体株式会社 | 窒化物半導体ウェーハの製造方法および窒化物半導体ウェーハ |
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DE112017007395T5 (de) * | 2017-04-04 | 2019-12-12 | Mitsubishi Electric Corporation | Halbleitervorrichtung und Verfahren zum Herstellen derselben |
US10529802B2 (en) | 2017-09-14 | 2020-01-07 | Gan Systems Inc. | Scalable circuit-under-pad device topologies for lateral GaN power transistors |
US10218346B1 (en) * | 2017-09-14 | 2019-02-26 | Gan Systems Inc. | High current lateral GaN transistors with scalable topology and gate drive phase equalization |
US11929408B2 (en) * | 2020-05-14 | 2024-03-12 | Macom Technology Solutions Holdings, Inc. | Layout techniques and optimization for power transistors |
JP7476062B2 (ja) | 2020-09-15 | 2024-04-30 | 株式会社東芝 | 半導体装置 |
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JP2011204984A (ja) * | 2010-03-26 | 2011-10-13 | Renesas Electronics Corp | 電界効果トランジスタ |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01293649A (ja) | 1988-05-23 | 1989-11-27 | Matsushita Electron Corp | 半導体集積回路 |
US5994727A (en) * | 1997-09-30 | 1999-11-30 | Samsung Electronics Co., Ltd. | High performance gaas field effect transistor structure |
US7265399B2 (en) * | 2004-10-29 | 2007-09-04 | Cree, Inc. | Asymetric layout structures for transistors and methods of fabricating the same |
JP4800084B2 (ja) * | 2006-03-31 | 2011-10-26 | 住友電工デバイス・イノベーション株式会社 | 半導体装置およびその製造方法 |
US8791503B2 (en) * | 2007-09-18 | 2014-07-29 | International Rectifier Corporation | III-nitride semiconductor device with reduced electric field between gate and drain and process for its manufacture |
JP5468286B2 (ja) * | 2009-04-07 | 2014-04-09 | 株式会社東芝 | 半導体装置およびその製造方法 |
US8969973B2 (en) * | 2010-07-02 | 2015-03-03 | Win Semiconductors Corp. | Multi-gate semiconductor devices |
JP5712516B2 (ja) * | 2010-07-14 | 2015-05-07 | 住友電気工業株式会社 | 半導体装置 |
JP2012028441A (ja) | 2010-07-21 | 2012-02-09 | Sumitomo Electric Ind Ltd | 半導体装置 |
US9018683B2 (en) * | 2010-12-03 | 2015-04-28 | Tohoku University | Terahertz electromagnetic wave conversion device |
JP5866773B2 (ja) * | 2011-02-25 | 2016-02-17 | 富士通株式会社 | 化合物半導体装置及びその製造方法 |
US9166009B2 (en) * | 2011-04-25 | 2015-10-20 | Renesas Electronics Corporation | Semiconductor apparatus and method for making semiconductor apparatus |
US8723227B2 (en) * | 2012-09-24 | 2014-05-13 | Analog Devices, Inc. | Heterojunction compound semiconductor protection clamps and methods of forming the same |
US9401079B2 (en) | 2013-09-06 | 2016-07-26 | Immersion Corporation | Method and apparatus of converting control tracks for providing haptic feedback |
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