JP2016201536A5 - - Google Patents

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Publication number
JP2016201536A5
JP2016201536A5 JP2016065589A JP2016065589A JP2016201536A5 JP 2016201536 A5 JP2016201536 A5 JP 2016201536A5 JP 2016065589 A JP2016065589 A JP 2016065589A JP 2016065589 A JP2016065589 A JP 2016065589A JP 2016201536 A5 JP2016201536 A5 JP 2016201536A5
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JP
Japan
Prior art keywords
substrate
solvent
mask
solid ink
process according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016065589A
Other languages
English (en)
Japanese (ja)
Other versions
JP6639304B2 (ja
JP2016201536A (ja
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Publication date
Priority claimed from US14/684,746 external-priority patent/US9648752B2/en
Application filed filed Critical
Publication of JP2016201536A publication Critical patent/JP2016201536A/ja
Publication of JP2016201536A5 publication Critical patent/JP2016201536A5/ja
Application granted granted Critical
Publication of JP6639304B2 publication Critical patent/JP6639304B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2016065589A 2015-04-13 2016-03-29 固体インクマスク除去プロセス Expired - Fee Related JP6639304B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/684,746 US9648752B2 (en) 2015-04-13 2015-04-13 Solid ink mask removal process
US14/684,746 2015-04-13

Publications (3)

Publication Number Publication Date
JP2016201536A JP2016201536A (ja) 2016-12-01
JP2016201536A5 true JP2016201536A5 (https=) 2019-05-09
JP6639304B2 JP6639304B2 (ja) 2020-02-05

Family

ID=57112967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016065589A Expired - Fee Related JP6639304B2 (ja) 2015-04-13 2016-03-29 固体インクマスク除去プロセス

Country Status (2)

Country Link
US (1) US9648752B2 (https=)
JP (1) JP6639304B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112188741A (zh) * 2018-05-11 2021-01-05 张海根 下压式褶皱柔性pcb电子器件制备整机的制作方法
CN112170290B (zh) * 2020-09-29 2021-05-28 山西嘉华防水材料科技有限公司 一种沥青防水卷材加工制备系统
CN112588713A (zh) * 2020-12-30 2021-04-02 中国科学院宁波材料技术与工程研究所 接触通过式超声波清洁设备

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3764587A (en) * 1971-04-02 1973-10-09 Du Pont Acrylic interpolymers for flexographic inks
JPS60121668U (ja) * 1984-01-26 1985-08-16 東京化工機株式会社 レジスト回収装置
GB8531804D0 (en) * 1985-12-24 1986-02-05 Campbell P L Printing
US5011708A (en) * 1989-06-06 1991-04-30 University Of Virginia Alumni Patents Foundation Use of radioactive nickel-63 to inhibit microbially induced corrosion
US5460767A (en) * 1994-05-31 1995-10-24 Delco Electronics Corporation Hot melt masking materials
DE59611262D1 (de) * 1996-07-18 2005-09-29 Alcan Tech & Man Ag Verbundplatte
FR2775280B1 (fr) * 1998-02-23 2000-04-14 Saint Gobain Vitrage Procede de gravure d'une couche conductrice
US6803092B2 (en) * 2001-06-26 2004-10-12 3M Innovative Properties Company Selective deposition of circuit-protective polymers
WO2003024684A1 (en) * 2001-09-20 2003-03-27 Atlas Roofing Corporation Treating polystyrene foam
JP2003318512A (ja) * 2002-04-24 2003-11-07 Matsushita Electric Ind Co Ltd プリント配線板の製造方法及び製造装置
EP1626752A2 (de) * 2003-05-16 2006-02-22 Blue Membranes GmbH Biokompatibel beschichtete medizinische implantate
JP4450205B2 (ja) * 2004-12-24 2010-04-14 ブラザー工業株式会社 インクジェット記録装置
US20060182984A1 (en) * 2005-02-17 2006-08-17 Abele Wolfgang P Protected polycarbonate films having thermal and UV radiation stability, and method of making
KR20060116152A (ko) * 2005-05-09 2006-11-14 미쓰이 가가쿠 가부시키가이샤 오염이 적은 펠리클
US7367869B2 (en) * 2006-05-02 2008-05-06 U.S. Technology Corporation Method of masking and a hot melt adhesive for use therewith
GB0620955D0 (en) * 2006-10-20 2006-11-29 Speakman Stuart P Methods and apparatus for the manufacture of microstructures
US8628818B1 (en) * 2007-06-21 2014-01-14 Sri International Conductive pattern formation
TWI353808B (en) * 2008-04-28 2011-12-01 Ind Tech Res Inst Method for fabricating conductive pattern on flexi
KR101563764B1 (ko) * 2008-05-13 2015-10-27 미츠비시 가스 가가쿠 가부시키가이샤 굽힘가공 가능한 폴리카보네이트 수지 적층체 및 광투과형 전자파 차폐 적층체 및 그들의 제조방법
WO2012169998A1 (en) * 2010-01-20 2012-12-13 DESANTO, Ronald, F. High-definition demetalization process
JP5774686B2 (ja) * 2011-04-26 2015-09-09 日本メクトロン株式会社 透明プリント配線板の製造方法、および透明タッチパネルの製造方法
US8951427B2 (en) * 2012-05-10 2015-02-10 Oce Technologies B.V. Hot melt composition and a method and system for manufacturing electronic and/or optical components using such a hot melt composition

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