CN104166307A - 一种石墨烯薄膜的图形化方法、功能器件及其用途 - Google Patents
一种石墨烯薄膜的图形化方法、功能器件及其用途 Download PDFInfo
- Publication number
- CN104166307A CN104166307A CN201410401347.7A CN201410401347A CN104166307A CN 104166307 A CN104166307 A CN 104166307A CN 201410401347 A CN201410401347 A CN 201410401347A CN 104166307 A CN104166307 A CN 104166307A
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- graphene
- plasma etching
- graphic method
- thin film
- protective seam
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 59
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 59
- 238000000034 method Methods 0.000 title claims abstract description 37
- 239000010409 thin film Substances 0.000 title abstract 5
- 238000001020 plasma etching Methods 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 16
- 239000003513 alkali Substances 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 5
- 238000000576 coating method Methods 0.000 claims abstract description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 31
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 16
- 239000003822 epoxy resin Substances 0.000 claims description 14
- 229920000647 polyepoxide Polymers 0.000 claims description 14
- 230000001681 protective effect Effects 0.000 claims description 14
- 239000000243 solution Substances 0.000 claims description 11
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 9
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 8
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 claims description 5
- 238000007590 electrostatic spraying Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 claims description 3
- 229910001864 baryta Inorganic materials 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- -1 acryl Chemical group 0.000 claims description 2
- 239000012670 alkaline solution Substances 0.000 claims description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 2
- 229910000030 sodium bicarbonate Inorganic materials 0.000 claims description 2
- 235000017557 sodium bicarbonate Nutrition 0.000 claims description 2
- 235000017550 sodium carbonate Nutrition 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 abstract description 6
- 239000011241 protective layer Substances 0.000 abstract 4
- 239000011248 coating agent Substances 0.000 abstract 2
- 230000004807 localization Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 8
- 239000010949 copper Substances 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 229910001882 dioxygen Inorganic materials 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000002127 nanobelt Substances 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000002585 base Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000609 electron-beam lithography Methods 0.000 description 2
- 229920002521 macromolecule Polymers 0.000 description 2
- 230000005355 Hall effect Effects 0.000 description 1
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 150000002605 large molecules Chemical class 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- Carbon And Carbon Compounds (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410401347.7A CN104166307A (zh) | 2014-08-14 | 2014-08-14 | 一种石墨烯薄膜的图形化方法、功能器件及其用途 |
Applications Claiming Priority (1)
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CN201410401347.7A CN104166307A (zh) | 2014-08-14 | 2014-08-14 | 一种石墨烯薄膜的图形化方法、功能器件及其用途 |
Publications (1)
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CN104166307A true CN104166307A (zh) | 2014-11-26 |
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CN201410401347.7A Pending CN104166307A (zh) | 2014-08-14 | 2014-08-14 | 一种石墨烯薄膜的图形化方法、功能器件及其用途 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107622961A (zh) * | 2016-07-15 | 2018-01-23 | 延世大学校产学协力团 | 利用二维纳米物质的半导体器件的制造装置及方法 |
CN107934951A (zh) * | 2018-01-02 | 2018-04-20 | 京东方科技集团股份有限公司 | 图案化石墨烯的制备方法 |
CN113526498A (zh) * | 2021-06-08 | 2021-10-22 | 松山湖材料实验室 | 图案化石墨烯的制备方法及生物传感器的制造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120056161A1 (en) * | 2010-09-07 | 2012-03-08 | International Business Machines Corporation | Graphene transistor with a self-aligned gate |
US20120181507A1 (en) * | 2011-01-19 | 2012-07-19 | International Business Machines Corporation | Semiconductor structure and circuit including ordered arrangment of graphene nanoribbons, and methods of forming same |
CN102623310A (zh) * | 2012-03-31 | 2012-08-01 | 中国科学院微电子研究所 | 一种制备金属与石墨烯欧姆接触的方法 |
CN102751179A (zh) * | 2012-06-21 | 2012-10-24 | 北京大学 | 一种制备石墨烯器件的方法 |
CN103889158A (zh) * | 2014-03-17 | 2014-06-25 | 深圳市宇顺电子股份有限公司 | 一种石墨烯精细线路的制备方法 |
-
2014
- 2014-08-14 CN CN201410401347.7A patent/CN104166307A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120056161A1 (en) * | 2010-09-07 | 2012-03-08 | International Business Machines Corporation | Graphene transistor with a self-aligned gate |
US20120181507A1 (en) * | 2011-01-19 | 2012-07-19 | International Business Machines Corporation | Semiconductor structure and circuit including ordered arrangment of graphene nanoribbons, and methods of forming same |
CN102623310A (zh) * | 2012-03-31 | 2012-08-01 | 中国科学院微电子研究所 | 一种制备金属与石墨烯欧姆接触的方法 |
CN102751179A (zh) * | 2012-06-21 | 2012-10-24 | 北京大学 | 一种制备石墨烯器件的方法 |
CN103889158A (zh) * | 2014-03-17 | 2014-06-25 | 深圳市宇顺电子股份有限公司 | 一种石墨烯精细线路的制备方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107622961A (zh) * | 2016-07-15 | 2018-01-23 | 延世大学校产学协力团 | 利用二维纳米物质的半导体器件的制造装置及方法 |
CN107622961B (zh) * | 2016-07-15 | 2021-05-25 | 延世大学校产学协力团 | 二维纳米物质的处理装置及其方法 |
CN107934951A (zh) * | 2018-01-02 | 2018-04-20 | 京东方科技集团股份有限公司 | 图案化石墨烯的制备方法 |
CN113526498A (zh) * | 2021-06-08 | 2021-10-22 | 松山湖材料实验室 | 图案化石墨烯的制备方法及生物传感器的制造方法 |
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Effective date of registration: 20151112 Address after: 518106 Gongming City, Guangdong province Guangming New District Office of the West community high and New Technology Industrial Park, building eighth, Applicant after: Shenzhen BTR New Energy Material Co., Ltd. Address before: 518106 Guangming District, Guangdong City, Gongming province Shenzhen office, West Tian community, Shenzhen Industrial Science and Technology Co., Ltd. Applicant before: Shenzhen Battery Nanotechnology Co., Ltd. Applicant before: Shenzhen BTR New Energy Material Co., Ltd. |
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Application publication date: 20141126 |