JP6639304B2 - 固体インクマスク除去プロセス - Google Patents

固体インクマスク除去プロセス Download PDF

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Publication number
JP6639304B2
JP6639304B2 JP2016065589A JP2016065589A JP6639304B2 JP 6639304 B2 JP6639304 B2 JP 6639304B2 JP 2016065589 A JP2016065589 A JP 2016065589A JP 2016065589 A JP2016065589 A JP 2016065589A JP 6639304 B2 JP6639304 B2 JP 6639304B2
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JP
Japan
Prior art keywords
solid ink
ink mask
mask
solvent
flexible substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2016065589A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016201536A (ja
JP2016201536A5 (https=
Inventor
ポール・マクコンビル
ジェフリー・ジェイ・フォルキンス
ジェームズ・アール・ラーソン
アレクサンダー・ジェイ・フィオラヴァンティ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xerox Corp
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xerox Corp filed Critical Xerox Corp
Publication of JP2016201536A publication Critical patent/JP2016201536A/ja
Publication of JP2016201536A5 publication Critical patent/JP2016201536A5/ja
Application granted granted Critical
Publication of JP6639304B2 publication Critical patent/JP6639304B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/02—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D9/00—Chemical paint or ink removers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/041—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B08B3/123—Cleaning travelling work, e.g. webs, articles on a conveyor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2016065589A 2015-04-13 2016-03-29 固体インクマスク除去プロセス Expired - Fee Related JP6639304B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/684,746 US9648752B2 (en) 2015-04-13 2015-04-13 Solid ink mask removal process
US14/684,746 2015-04-13

Publications (3)

Publication Number Publication Date
JP2016201536A JP2016201536A (ja) 2016-12-01
JP2016201536A5 JP2016201536A5 (https=) 2019-05-09
JP6639304B2 true JP6639304B2 (ja) 2020-02-05

Family

ID=57112967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016065589A Expired - Fee Related JP6639304B2 (ja) 2015-04-13 2016-03-29 固体インクマスク除去プロセス

Country Status (2)

Country Link
US (1) US9648752B2 (https=)
JP (1) JP6639304B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112188741A (zh) * 2018-05-11 2021-01-05 张海根 下压式褶皱柔性pcb电子器件制备整机的制作方法
CN112170290B (zh) * 2020-09-29 2021-05-28 山西嘉华防水材料科技有限公司 一种沥青防水卷材加工制备系统
CN112588713A (zh) * 2020-12-30 2021-04-02 中国科学院宁波材料技术与工程研究所 接触通过式超声波清洁设备

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3764587A (en) * 1971-04-02 1973-10-09 Du Pont Acrylic interpolymers for flexographic inks
JPS60121668U (ja) * 1984-01-26 1985-08-16 東京化工機株式会社 レジスト回収装置
GB8531804D0 (en) * 1985-12-24 1986-02-05 Campbell P L Printing
US5011708A (en) * 1989-06-06 1991-04-30 University Of Virginia Alumni Patents Foundation Use of radioactive nickel-63 to inhibit microbially induced corrosion
US5460767A (en) * 1994-05-31 1995-10-24 Delco Electronics Corporation Hot melt masking materials
DE59611262D1 (de) * 1996-07-18 2005-09-29 Alcan Tech & Man Ag Verbundplatte
FR2775280B1 (fr) * 1998-02-23 2000-04-14 Saint Gobain Vitrage Procede de gravure d'une couche conductrice
US6803092B2 (en) * 2001-06-26 2004-10-12 3M Innovative Properties Company Selective deposition of circuit-protective polymers
WO2003024684A1 (en) * 2001-09-20 2003-03-27 Atlas Roofing Corporation Treating polystyrene foam
JP2003318512A (ja) * 2002-04-24 2003-11-07 Matsushita Electric Ind Co Ltd プリント配線板の製造方法及び製造装置
EP1626752A2 (de) * 2003-05-16 2006-02-22 Blue Membranes GmbH Biokompatibel beschichtete medizinische implantate
JP4450205B2 (ja) * 2004-12-24 2010-04-14 ブラザー工業株式会社 インクジェット記録装置
US20060182984A1 (en) * 2005-02-17 2006-08-17 Abele Wolfgang P Protected polycarbonate films having thermal and UV radiation stability, and method of making
KR20060116152A (ko) * 2005-05-09 2006-11-14 미쓰이 가가쿠 가부시키가이샤 오염이 적은 펠리클
US7367869B2 (en) * 2006-05-02 2008-05-06 U.S. Technology Corporation Method of masking and a hot melt adhesive for use therewith
GB0620955D0 (en) * 2006-10-20 2006-11-29 Speakman Stuart P Methods and apparatus for the manufacture of microstructures
US8628818B1 (en) * 2007-06-21 2014-01-14 Sri International Conductive pattern formation
TWI353808B (en) * 2008-04-28 2011-12-01 Ind Tech Res Inst Method for fabricating conductive pattern on flexi
KR101563764B1 (ko) * 2008-05-13 2015-10-27 미츠비시 가스 가가쿠 가부시키가이샤 굽힘가공 가능한 폴리카보네이트 수지 적층체 및 광투과형 전자파 차폐 적층체 및 그들의 제조방법
WO2012169998A1 (en) * 2010-01-20 2012-12-13 DESANTO, Ronald, F. High-definition demetalization process
JP5774686B2 (ja) * 2011-04-26 2015-09-09 日本メクトロン株式会社 透明プリント配線板の製造方法、および透明タッチパネルの製造方法
US8951427B2 (en) * 2012-05-10 2015-02-10 Oce Technologies B.V. Hot melt composition and a method and system for manufacturing electronic and/or optical components using such a hot melt composition

Also Published As

Publication number Publication date
US20160302310A1 (en) 2016-10-13
JP2016201536A (ja) 2016-12-01
US9648752B2 (en) 2017-05-09

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