JP2016197033A - 探傷装置、及び探傷装置による傷部検出方法 - Google Patents
探傷装置、及び探傷装置による傷部検出方法 Download PDFInfo
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Abstract
【解決手段】被検査物10の表面を撮像する撮像装置16と、撮像装置16によって撮像された原画像を処理して、表面における傷部を検出する検出装置30と、を備える磁粉探傷装置1において、検出装置30は、原画像を第1の閾値で二値化処理して第1の傷候補部40を抽出する第1の抽出部31と、第1の傷候補部40が含まれるように検査領域42を生成する検査領域生成部32と、検査領域41を第2の閾値で二値化処理して第2の傷候補部42を抽出する第2の抽出部33と、第2の傷候補部42を膨張処理して傷部を検出する傷判定部34と、を備える。
【選択図】図2
Description
10 被検査物
16 撮像装置
30 検出装置
31 第1の抽出部
32 検査領域生成部
33 第2の抽出部
34 傷判定部
40 第1の傷候補部
41 検査領域
42 第2の傷候補部
Claims (8)
- 被検査物の表面を撮像する撮像装置と、
前記撮像装置によって撮像された原画像を処理して、前記表面における傷部を検出する検出装置と、
を備える探傷装置において、
前記検出装置は、
前記原画像を第1の閾値で二値化処理して第1の傷候補部を抽出する第1の抽出部と、
前記第1の傷候補部が含まれるように検査領域を生成する検査領域生成部と、
前記検査領域を第2の閾値で二値化処理して第2の傷候補部を抽出する第2の抽出部と、
前記第2の傷候補部を膨張処理して前記傷部を検出する傷判定部と、
を備えることを特徴とする、探傷装置。 - 前記第2の閾値は、前記第1の閾値よりも小であることを特徴とする、
請求項1に記載の探傷装置。 - 前記検査領域は、前記第1の傷候補部が含まれる最小の矩形を、所定の幅だけ拡大させた矩形によって囲われる領域であることを特徴とする、
請求項1または2に記載の探傷装置。 - 前記膨張処理は、前記第2の傷候補部をそれぞれの長軸方向へ膨張させる処理であることを特徴とする、
請求項1乃至3のいずれか1項に記載の探傷装置。 - 撮像装置が、被検査物の表面を撮像し、
検出装置が、前記撮像装置によって撮像された原画像を処理して、前記表面における傷部を検出する探傷装置による傷部検出方法において、
前記検出装置が、
前記原画像を第1の閾値で二値化処理して第1の傷候補部を抽出し、
前記第1の傷候補部が含まれるように検査領域を生成し、
前記検査領域を第2の閾値で二値化処理して第2の傷候補部を抽出し、
前記第2の傷候補部を膨張処理して前記傷部を検出することを特徴とする、探傷装置による傷部検出方法。 - 前記第2の閾値は、前記第1の閾値よりも小であることを特徴とする、
請求項5に記載の探傷装置による傷部検出方法。 - 前記検査領域は、前記第1の傷候補部が含まれる最小の矩形を、所定の幅だけ拡大させた矩形によって囲われる領域であることを特徴とする、
請求項5または6に記載の探傷装置による傷部検出方法。 - 前記膨張処理は、前記第2の傷候補部をそれぞれの長軸方向へ膨張させる処理であることを特徴とする、
請求項5乃至7のいずれか1項に記載の探傷装置による傷部検出方法。
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JP2015076333A JP6596188B2 (ja) | 2015-04-02 | 2015-04-02 | 探傷装置、及び探傷装置による傷部検出方法 |
KR1020160033396A KR102518378B1 (ko) | 2015-04-02 | 2016-03-21 | 탐상 장치, 및 탐상 장치에 의한 상처부 검출 방법 |
CN201610202357.7A CN106053593B (zh) | 2015-04-02 | 2016-04-01 | 探伤装置以及利用探伤装置的伤部检测方法 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108844965A (zh) * | 2018-07-04 | 2018-11-20 | 武汉黎赛科技有限责任公司 | 缺陷图像采集显示系统、方法、装置、计算机和存储介质 |
CN111562273A (zh) * | 2020-06-05 | 2020-08-21 | 大连工业大学 | 基于高光谱的鱼水射流除鳞轻微损伤可视化方法 |
CN115082431A (zh) * | 2022-07-20 | 2022-09-20 | 惠州威尔高电子有限公司 | 一种pcb板表面缺陷检测方法 |
US20220383608A1 (en) * | 2017-07-07 | 2022-12-01 | Canon Kabushiki Kaisha | Image processing apparatus, image processing method, and program for detecting defect from image |
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JP6697302B2 (ja) * | 2016-03-25 | 2020-05-20 | マークテック株式会社 | 探傷装置、及び探傷装置による欠陥検出方法 |
CN109799240A (zh) * | 2019-02-01 | 2019-05-24 | 信阳舜宇光学有限公司 | 一种表面缺陷检测方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000002523A (ja) * | 1998-06-18 | 2000-01-07 | Ohbayashi Corp | 構造物表面のひび割れ計測方法 |
JP2003168114A (ja) * | 2001-12-04 | 2003-06-13 | Olympus Optical Co Ltd | 欠陥分類装置 |
JP2007335602A (ja) * | 2006-06-14 | 2007-12-27 | Renesas Technology Corp | 半導体不良解析装置、不良解析方法、及び不良解析プログラム |
US20120230579A1 (en) * | 2009-11-18 | 2012-09-13 | Honda Motor Co., Ltd. | Surface inspection device and surface inspection method |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3440569B2 (ja) * | 1994-09-13 | 2003-08-25 | 住友金属工業株式会社 | 磁粉探傷方法及びその装置 |
JPH10304196A (ja) * | 1997-04-30 | 1998-11-13 | Nippon Telegr & Teleph Corp <Ntt> | 濃淡画像情報の二値化装置および二値化方法 |
JP4009409B2 (ja) * | 1999-10-29 | 2007-11-14 | 株式会社日立製作所 | パターン欠陥検査方法及びその装置 |
JP2001330567A (ja) * | 2000-05-19 | 2001-11-30 | Shimadzu Corp | X線検査装置 |
JP2008082860A (ja) * | 2006-09-27 | 2008-04-10 | Ntn Corp | クラック検査方法及びその検査装置 |
JP2009145285A (ja) * | 2007-12-18 | 2009-07-02 | Dainippon Screen Mfg Co Ltd | 欠陥検出方法および欠陥検出装置 |
JP2011013007A (ja) | 2009-06-30 | 2011-01-20 | Kobe Steel Ltd | 磁粉探傷装置 |
CN104062354A (zh) * | 2013-03-18 | 2014-09-24 | 宝山钢铁股份有限公司 | 钢管磁粉探伤荧光图像检测装置及检测方法 |
KR101492336B1 (ko) * | 2013-09-24 | 2015-02-11 | 서울여자대학교 산학협력단 | 금속품의 크랙 자동 검출 시스템 및 그 검출 방법 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000002523A (ja) * | 1998-06-18 | 2000-01-07 | Ohbayashi Corp | 構造物表面のひび割れ計測方法 |
JP2003168114A (ja) * | 2001-12-04 | 2003-06-13 | Olympus Optical Co Ltd | 欠陥分類装置 |
JP2007335602A (ja) * | 2006-06-14 | 2007-12-27 | Renesas Technology Corp | 半導体不良解析装置、不良解析方法、及び不良解析プログラム |
US20120230579A1 (en) * | 2009-11-18 | 2012-09-13 | Honda Motor Co., Ltd. | Surface inspection device and surface inspection method |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220383608A1 (en) * | 2017-07-07 | 2022-12-01 | Canon Kabushiki Kaisha | Image processing apparatus, image processing method, and program for detecting defect from image |
CN108844965A (zh) * | 2018-07-04 | 2018-11-20 | 武汉黎赛科技有限责任公司 | 缺陷图像采集显示系统、方法、装置、计算机和存储介质 |
CN111562273A (zh) * | 2020-06-05 | 2020-08-21 | 大连工业大学 | 基于高光谱的鱼水射流除鳞轻微损伤可视化方法 |
CN115082431A (zh) * | 2022-07-20 | 2022-09-20 | 惠州威尔高电子有限公司 | 一种pcb板表面缺陷检测方法 |
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